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2019
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Invention
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Air jet substrate cleaning apparatus.
A substrate cleaning apparatus for cleaning debris from a ... |
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2018
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Invention
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Plasma chemical processing of wafer dies.
A method of processing wafer dies at least partially s... |
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Invention
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Display panel fabricated on a routable substrate.
A display panel including a routable substrate... |
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G/S
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Electronic circuit substrate; substrates for integrated circuits |
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Invention
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System and method for detecting defects in an electronic device.
Defects in an electronic device... |
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2017
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Invention
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Premolded substrate for mounting a semiconductor die and a method of fabrication thereof.
A meth... |
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Invention
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Laser-cutting using selective polarization.
A method of cutting a semiconductor wafer by selecti... |
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Invention
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Radiative wafer cutting using selective focusing depths.
Semiconductor wafer cutting is optimise... |
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Invention
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Clog-resistant nozzle assembly.
A nozzle assembly having a nozzle body with nozzle bore extendin... |
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Invention
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Three-dimensional integrated fan-out wafer level package.
An integrated fan-out wafer level pack... |
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Invention
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Apparatus and method of determining a bonding position of a die. The invention provides an appara... |
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Invention
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Substrate cutting control and inspection.
During a wafer cutting process, the wafer substrate is... |
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2016
|
Invention
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Dual-feed test handling system.
A test handler for testing electronic components comprises a rot... |
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Invention
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Molding apparatus including a compressible structure.
The invention provides a molding apparatus... |
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Invention
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Atomization mechanism for cooling a bond head. An atomization mechanism for cooling a bond head c... |
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Invention
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Method and apparatus for aligning probe pins with respect to positions of electronic devices. A m... |
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2014
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Invention
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Apparatus and method for holding a workpiece.
The present invention relates to an apparatus for ... |
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Invention
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Apparatus for molding electronic component.
A molding apparatus for an electronic device compris... |
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Invention
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Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices ... |
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Invention
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Fluid dispenser with self-aligning nozzle.
Disclosed is a fluid dispenser, comprising a main bod... |
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2013
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Invention
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Die attachment apparatus and method utilizing activated forming gas. A die attachment apparatus f... |
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Invention
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Chemical vapour deposition injector.
Disclosed is a chemical vapour deposition injector 100, com... |
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2012
|
Invention
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Pre-plated lead frame for copper wire bonding.
A pre-plated lead frame comprises a substrate com... |
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Invention
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Apparatus and method for real-time alignment and lamination of substrates. Real-time alignment of... |
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Invention
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Apparatus and method of interconnecting a plurality of solar cells.
Disclosed is an apparatus fo... |
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Invention
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Apparatus for transferring a solar wafer or solar cell during its fabrication. An apparatus for t... |
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2011
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Invention
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Belt conveyor for conveying solar wafers during fabrication.
Disclosed is a belt conveyor, which... |
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Invention
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Apparatus for laminating a photovoltaic layup, and a method of laminating the same.
Disclosed is... |
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Invention
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Bond line thickness control for die attachment.
A semiconductor die is attached onto a substrate... |
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2010
|
Invention
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Wire feeding apparatus for wire bonders.
A wire bonder comprises a bonding tool for forming wire... |
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2009
|
Invention
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System for maintaining thermal stability of a motion stage. A system for maintaining thermal stab... |
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2008
|
Invention
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Direct die attach utilizing heated bond head. A method is provided for bonding a die comprising a... |
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Invention
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Transfer molding method and system for electronic devices. A method and system for molding an ele... |
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Invention
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Assembly for reducing oxidation of semiconductor devices. An assembly for reducing oxidation of a... |
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Invention
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Method of bonding semiconductor devices utilizing solder balls. A method for bonding a semiconduc... |
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Invention
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Multi-layer thermal insulation for a bonding system. A thermal insulation system is provided for ... |
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Invention
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Temperature control of a bonding stage. A bonding apparatus is provided comprising a bonding stag... |
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2007
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Invention
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Dispensing solder for mounting semiconductor chips. A method for mounting a semiconductor chip on... |
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Invention
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Electronic device handler for a bonding apparatus. A large electronic device having a bonding are... |
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Invention
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Pre-molded lead frame and process for manufacturing the same.
A lead frame and a method of manuf... |
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Invention
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Thermal insulation for a bonding tool. A bonding apparatus comprising a bond arm and a wire bondi... |
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Invention
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Vacuum molding apparatus. A molding apparatus is provided for molding a leadframe, the molding ap... |
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Invention
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Soft touch clamp actuation mechanism. A clamping mechanism having clamping jaws is provided for h... |
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2006
|
Invention
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Apparatus for delivering shielding gas during wire bonding. An apparatus is provided for supplyin... |
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Invention
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Electronic device handler for a bonding apparatus. A bonding apparatus is provided which includes... |
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Invention
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Linear motor having dual coil configuration. A linear motor is provided that includes a magnetic ... |
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Invention
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Memory card molding apparatus and process. A molding system for provided which is configured for ... |
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Invention
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Movable electronic flame-off device for a bonding apparatus.
A bonding apparatus is provided tha... |
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Invention
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Direct drive robotic manipulator. A direct drive robotic manipulator is provided which includes a... |
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Invention
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Image capturing for pattern recognition of electronic devices. An image capturing method and appa... |
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Invention
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Automatic level adjustment for die bonder. A die bonding apparatus and method is provided to auto... |
