|
2025
|
Invention
|
3d vertical interconnection packaging structure and preparation method therefor. The present inve... |
|
|
Invention
|
Packaging structure and manufacturing method therefor. Provided in the present invention are a pa... |
|
|
Invention
|
Optoelectronic packaging structure and manufacturing method therefor. Provided in the present inv... |
|
|
Invention
|
Hybrid bonding packaging structure and manufacturing method therefor. The present invention provi... |
|
|
Invention
|
Hybrid bonding packaging structure and preparation method therefor. The present invention provide... |
|
|
Invention
|
3d vertical interconnection packaging structure and preparation method therefor. Provided in the ... |
|
2024
|
Invention
|
Heat dissipating semiconductor package structure and preparation method therefor. Provided are a ... |
|
|
Invention
|
Preparation method for semiconductor packaging structure capable of avoiding cu diffusion. The pr... |
|
|
Invention
|
Photoelectric packaging structure and manufacturing method therefor. The present invention provid... |
|
|
Invention
|
Optoelectronic integrated semiconductor packaging structure and preparation method therefor. The ... |
|
|
Invention
|
Grating-based semiconductor photoelectric packaging structure and manufacturing method therefor. ... |
|
|
Invention
|
Double-sided optoelectronic interconnection packaging structure and preparation method therefor. ... |
|
|
Invention
|
Optoelectronic interconnection packaging structure and preparation method therefor. The present i... |
|
|
Invention
|
Grating-based semiconductor photoelectric packaging structure and preparation method therefor. Pr... |
|
|
Invention
|
Photoelectric integrated semiconductor packaging structure and manufacturing method therefor. Pro... |
|
|
Invention
|
Photoelectric integrated semiconductor packaging structure and manufacturing method therefor. The... |
|
|
Invention
|
2.5d photoelectric integrated semiconductor package structure and manufacturing method therefor. ... |
|
|
Invention
|
Photoelectric integrated semiconductor packaging structure and preparation method therefor. Provi... |
|
2023
|
Invention
|
Semiconductor packaging structure and preparation method therefor. The present invention provides... |
|
|
Invention
|
Chip packaging structure for backside power delivery, and preparation method therefor. The presen... |
|
|
Invention
|
2.5d packaging structure capable of improving power supply signal transmission, and preparation m... |
|
|
Invention
|
2.5d packaging structure for improving power source signal transmission, and preparation method f... |
|
|
Invention
|
System integrated 3dfo structure. Provided in the present application is a system integrated 3DFO... |
|
|
Invention
|
Three-dimensional radio-frequency module system packaging structure. Provided in the present appl... |
|
|
Invention
|
Thermally conductive semiconductor packaging structure and method for preparing same.
A thermall... |
|
|
Invention
|
Fan-out packaging unit used in pop packaging and method for manufacturing same.
A fan-out packag... |
|
|
Invention
|
Fan-out system-level packaging structure and packaging method.
A method of fabricating a fan-out... |
|
|
Invention
|
System-level fan-out packaging structure and method for manufacturing same.
A system-level fan-o... |
|
|
Invention
|
Packaging structure having organic interposer layer and method for manufacturing same.
A packagi... |
|
|
Invention
|
Fan-out packaging structure and method for manufacturing same.
A fan-out packaging structure and... |
|
|
Invention
|
Wafer-level packaging structure and method for preparing same.
A wafer-level packaging structure... |
|
|
Invention
|
Method for preparing optoelectronic integrated semiconductor packaging structure.
A method for p... |
|
|
Invention
|
Photoelectric integrated semiconductor encapsulation structure and preparation method. The presen... |
|
|
Invention
|
Chip package structure and manufacturing method therefor. The present invention provides a chip p... |
|
|
Invention
|
Three-dimensional stacked fan-out package structure and preparation method therefor. A three-dime... |
|
|
Invention
|
Method for preparing three-dimensional stacked optoeletronic packaging structure.
A method for p... |
|
|
Invention
|
Three-dimensional stacked photoelectric packaging structure and manufacturing method. The present... |
|
|
Invention
|
Integrated circuit package structure and manufacturing method. The present invention relates to a... |
|
|
Invention
|
Chip packaging structure and preparation method. Provided in the present invention are a chip pac... |
|
|
Invention
|
Chip packaging structure and preparation method. The present invention relates to a chip packagin... |
|
|
Invention
|
2.5d packaging structure and preparation method. Provided in the present invention are a 2.5D pac... |
|
|
Invention
|
System-in-package structure and preparation method therefor. A system-in-package structure (10) a... |
|
|
Invention
|
System integrated 2.5d structure. Provided is a system integrated 2.5D structure. A system integr... |
|
|
Invention
|
Preparation method for semiconductor interconnect structure. Provided in the present invention is... |
|
|
Invention
|
Fan-out system-in-package structure, and manufacturing method therefor. The present disclosure pr... |
|
|
Invention
|
Three-dimensional packaging structure and manufacturing method therefor. A three-dimensional pack... |
|
|
Invention
|
Preparation method for polyimide via and wafer level semiconductor packaging structure. The prese... |
|
|
Invention
|
3d fan-out packaging structure of interconnection system with ultra-high density and method for m... |
|
|
Invention
|
Fan-out wafer-level packaging structure and method for manufacturing same.
A fan-out wafer-level... |
