|
2023
|
Invention
|
Die lamination module and method for manufacturing die lamination module. Provided is a die lamin... |
|
|
Invention
|
Memory module. Provided is a memory module that expands the bandwidth of an input/output signal o... |
|
|
Invention
|
Computation system and semiconductor integrated circuit module. To provide a computation system t... |
|
|
Invention
|
Computation system and semiconductor integrated circuit module. Provided is a semiconductor integ... |
|
2022
|
Invention
|
Ic bridge, ic module, and method for manufacturing ic module. Provide is an IC bridge that facili... |
|
|
Invention
|
Semiconductor memory devices and controller including adjustable strobe delay. A semiconductor de... |
|
|
Invention
|
Semiconductor device. A semiconductor device according to an embodiment of the present invention,... |
|
|
Invention
|
Semiconductor module and method for manufacturing same.
A method for manufacturing a semiconduct... |
|
|
Invention
|
Semiconductor module and method for manufacturing same. Provided are: a semiconductor module the ... |
|
2021
|
Invention
|
Semiconductor module and stacked module. The present invention provides a semiconductor module an... |
|
|
Invention
|
Semiconductor module and semiconductor package.
A semiconductor module includes: a reference pan... |
|
|
Invention
|
Semiconductor module and semiconductor package. To provide a semiconductor module for which warpi... |
|
|
Invention
|
Module and method for manufacturing same.
A module including a stack of a plurality of dies and ... |
|
|
Invention
|
Module and method for manufacturing same. The present invention provides a module in which a plur... |
|
|
Invention
|
Stacked memory and manufacturing method therefor.
Provided is a stacked memory with an improved ... |
|
|
Invention
|
Stacked memory and manufacturing method therefor. Provided is a stacked memory with an improved y... |
|
|
Invention
|
Module and method for manufacturing same.
A method for manufacturing a module including a predet... |
|
|
Invention
|
Module and method for manufacturing same. Provided are a module and a method for manufacturing th... |
|
|
Invention
|
Semiconductor device. A semiconductor device includes a plurality of memory chips laminated to ea... |
|
2020
|
Invention
|
Communication device.
A communication device uses a magnetic field to enable communication betwe... |
|
|
Invention
|
Communication device. Provided is a communication device that suppresses an increase in chip cost... |
|
|
Invention
|
Semiconductor device and method for manufacturing same.
A semiconductor device is provided with:... |
|
|
Invention
|
Semiconductor device and method for manufacturing same. Provided are a semiconductor device havin... |
|
|
Invention
|
Semiconductor module. a with the connection unit 40 therebetween, and is also disposed along the ... |
|
|
Invention
|
Semiconductor device, and manufacturing method for same.
A semiconductor device has laminated th... |
|
|
Invention
|
Semiconductor device, and manufacturing method for same. Provided are: a semiconductor device tha... |
|
|
Invention
|
Semiconductor device. Provided is a semiconductor device that enables the intensity of a receptio... |
|
|
Invention
|
Memory unit, semiconductor module, dimm module, and manufacturing method for same.
A memory unit... |
|
|
Invention
|
Memory unit, semiconductor module, dimm module, and manufacturing method for same. The present in... |
|
2019
|
Invention
|
Layered semiconductor device, and production method therefor. The purposes of the present inventi... |
|
|
Invention
|
Semiconductor module, dimm module and manufacturing method therefor. Provided are a semiconductor... |
|
|
Invention
|
Semiconductor module, dimm module, manufacturing method of semiconductor module, and manufacturin... |
|
|
Invention
|
Stacked semiconductor, wafer stack, method of manufacturing stacked semiconductor, assistance dev... |
|
|
Invention
|
Laminated semiconductor, wafer laminate, method for manufacturing laminated semiconductor, assist... |
|
|
Invention
|
Communication device, memory module, and program. The purpose of the present invention is to prov... |
|
|
Invention
|
Semiconductor module, method for manufacturing same, and semiconductor module mounting body. A se... |
|
|
Invention
|
Semiconductor module, method for manufacturing same, and semiconductor module mounting body. Prov... |
|
|
Invention
|
Semiconductor module and manufacturing method therefor.
A semiconductor module that can absorb t... |
|
|
Invention
|
Semiconductor module and manufacturing method therefor. Provided are a semiconductor module that ... |
|
|
Invention
|
Trimming method. Provided is a trimming method for facilitating deposition of a seed layer that i... |
|
|
Invention
|
Three-dimensional semiconductor module including system in a package (sip) with improved heat dis... |
|
|
Invention
|
Semiconductor module, semiconductor member, and method for manufacturing same. The present invent... |
|
2018
|
Invention
|
Semiconductor module and manufacturing method thereof. The purpose of the present invention is to... |
|
|
Invention
|
Method for manufacturing semiconductor module. Provided is a method for manufacturing a semicondu... |
|
|
Invention
|
Semiconductor device and method of manufacturing same. Provided are: a semiconductor device 1 wit... |
|
2017
|
Invention
|
Semiconductor module.
The objective of the invention is to provide a semiconductor module allowi... |
|
|
Invention
|
Semiconductor device with sub-amplifier. Provided are a sub-amplifier, a switching device and a s... |
|
|
Invention
|
Signal output device. Provided is a signal output device capable of appropriately outputting a si... |
|
|
Invention
|
Semiconductor module.
Provided is a semiconductor module which enables a memory bandwidth to be ... |