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2023
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Invention
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Semiconductor packaging structure and packaging method. Provided in the present invention are a s... |
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Invention
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Chip packaging method and device. The present invention provides a chip packaging method, compris... |
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2022
|
Invention
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Soldering material, and preparation method therefor and use thereof. A soldering material, and a ... |
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2021
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Invention
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Ultra-thin soldering gasket and preparation method therefor, soldering method, and semiconductor ... |
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2020
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G/S
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Wafers for integrated circuits; integrated circuits; semiconductor devices; sensors, namely, Elec... |
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G/S
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Wafers for integrated circuits; integrated circuits;
semiconductor devices; sensors; apparatus a... |
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Invention
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Thermal interface material layer and use thereof. 2 compound layer formed by welding the indium l... |
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Invention
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Thermal interface material layer and use thereof. 22 compound layer formed by welding the indium ... |
