HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

China

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Total IP 145
Total IP Rank # 9,112
IP Activity Score 2.9/5.0    112
IP Activity Rank # 6,181

Patents

Trademarks

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Last Patent 2025 - Chip packaging method, chip pack...
First Patent 2013 - Chip package structure and metho...

Latest Inventions, Goods, Services

2024 Invention Method of packaging chip, chip packaging structure, and terminal device. A method of packaging a...
Invention Circuit board, method for manufacturing the same and terminal device having the same. A circuit ...
Invention Circuit board, manufacturing method, and display module. A circuit board includes an inner wirin...
Invention Transparent circuit board. A transparent circuit board includes a conductive wiring, a transpare...
2023 Invention Chip packaging structure and method for packaging the chip. A method for packaging a chip, the c...
Invention Bending-resistant circuit board and preparation method therefor. The present application provides...
Invention Chip packaging method, chip packaging structure, and terminal device. A chip packaging method, wh...
Invention Circuit board assembly and method of manufacturing the same, packaging structure having the same....
Invention Relay circuit board and manufacturing method thereof. A relay circuit board includes a first ext...
Invention Circuit board assembly and manufacturing method thereof. A circuit board assembly includes a fir...
Invention Circuit board, method for manufacturing circuit board, and terminal device. A circuit board, comp...
Invention Circuit board assembly. The disclosure provides a circuit board assembly, which includes a core ...
Invention Circuit board and method of manufacturing the same. A provided circuit board includes an embedde...
Invention Stretchable circuit board assembly and method for manufacturing the same. A stretchable circuit b...
Invention Circuit board with embedded resistors and method for fabricating the same. A circuit board with ...
Invention Circuit board and manufacturing method thereof. A circuit board includes a first circuit layer, ...
Invention Flexible circuit board and method for fabricating the same. A flexible circuit board and a metho...
Invention Transducer wiring board and method for manufacturing the same. A transducer wiring board and a m...
Invention Circuit board connection structure and preparation method therefor. A preparation method for a c...
Invention Flexible circuit board and method of fabricating the same. A flexible circuit board and a method...
Invention Circuit board. A circuit board includes an inner circuit substrate and an outer circuit substrat...
Invention Circuit board and manufacturing method therefor, and display module. Disclosed in the present app...
2022 Invention Circuit board and method for manufacturing the same. A circuit board with improved heat dissipati...
Invention Packaging method for chip, and chip packaging structure. A packaging method for a chip (30), comp...
Invention Circuit board assembly and manufacturing method therefor, and packaging structure. Provided is a ...
Invention Circuit board connection structure and manufacturing method therefor. A manufacturing method for ...
Invention Buried thermistor and method of fabricating the same. A buried thermistor includes a lower substr...
Invention Packaging structure with embedded electronic components and method for manufacturing the same. A ...
Invention Packaging structure. A packaging structure, includes: a dielectric layer; at least one inner wir...
Invention Circuit board and method for manufacturing the same. A circuit board, with inbuilt protection aga...
Invention Camera module of reduced size and method for manufacturing the same. A camera module of reduced s...
Invention Circuit board with embedded component and method of fabricating the same. A circuit board with e...
2021 Invention Manufacturing method of circuit board assembly. The disclosure provides a circuit board assembly,...
Invention Circuit board and method of manufacturing thereof. A circuit board includes a dielectric substrat...
Invention Circuit board assembly and manufacturing method thereof. The disclosure provides a circuit board ...
Invention Method of manufacturing display module with light emitting diode free of a split-screen boundary ...
Invention Wiring substrate and method of manufacturing the same. A wiring substrate includes a first insula...
Invention Circuit board and manufacturing method thereof. The present application provides a circuit board...
Invention Circuit board and manufacturing method therefor. The present application provides a circuit board...
Invention Method for manufacturing a circuit board. A circuit board with improved heat dissipation function...
Invention Circuit board and method for manufacturing the same. A method for manufacturing a circuit board e...
Invention Method for manufacturing a circuit board. A circuit board includes a circuit substrate, a solder,...
Invention Circuit board, method for manufacturing the same. A circuit board includes a circuit substrate, a...
Invention Circuit board and manufacturing method therefor. Provided in the present application is a circuit...
2020 Invention Multi-layer circuit board with embedded components and method for manufacturing same. A multi-la...
Invention Circuit board and preparation method thereof. A circuit board and a manufacturing method therefor...
Invention Board-to-board connection structure and method for manufacturing the same. The present disclosure...
Invention Circuit board with embedded electronic component and method for manufacturing the same. A method ...
2019 Invention Method for manufacturing transparent circuit board. A method for manufacturing a transparent circ...