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2020
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Invention
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Pcb fabrication with dielectric powder or suspension. A method of fabricating a printed circuit b... |
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Invention
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Stud bumped printed circuit assembly. A circuit board having a plurality of conductive layers inc... |
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2017
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Invention
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Electrodeposited contact terminal for use as an electrical connector or semiconductor packaging s... |
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2016
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Invention
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Mechanical contact retention within an electrical connector. An electrical connector and a method... |
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Invention
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Low profile electrical interconnect with fusion bonded contact retention and solder wick reductio... |
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Invention
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Method of making an electrical connector having electrodeposited terminals. An electrical connect... |
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2015
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Invention
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High performance surface mount electrical interconnect. An interconnect assembly including a subs... |
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2014
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Invention
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Performance enhanced semiconductor socket. A test socket for IC devices includes a multi-layered ... |
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Invention
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Matrix defined electrical circuit structure.
A system and method for “pixelating” a three-dimens... |
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Invention
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Fusion bonded liquid crystal polymer circuit structure. A method of making a multilayered, fusion... |
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Invention
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Copper pillar full metal via electrical circuit structure. An electrical interconnect including a... |
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Invention
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Method of making an electronic interconnect. An electrical interconnect including a substrate wit... |
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2013
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Invention
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Compliant printed circuit semiconductor package. A method of making a package for a semiconductor... |
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Invention
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Compliant core peripheral lead semiconductor socket. An electrical interconnect between terminals... |
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Invention
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Compliant conductive nano-particle electrical interconnect. An electrical interconnect providing ... |
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Invention
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Semiconductor socket with direct selective metalization. A semiconductor socket including a subst... |
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Invention
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High speed circuit assembly with integral terminal and mating bias loading electrical connector a... |
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Invention
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Hybrid printed circuit assembly with low density main core and embedded high density circuit regi... |
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2012
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Invention
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Direct metalization of electrical circuit structures. An electrical interconnect including a firs... |
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Invention
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Compliant core peripheral lead semiconductor test socket. An electrical interconnect for providin... |
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Invention
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Selective metalization of electrical connector or socket housing. A electrical interconnect adapt... |
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Invention
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Bumped semiconductor wafer or die level electrical interconnect. A probe assembly that acts as a ... |
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Invention
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Metalized pad to electrical contact interface. A surface mount electrical interconnect to provide... |
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Invention
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Area array semiconductor device package interconnect structure with optional package-to-package o... |
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2011
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Invention
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Electrical interconnect ic device socket. A surface mount electrical interconnect is disclosed th... |
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Invention
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High performance surface mount electrical interconnect. A surface mount electrical interconnect a... |
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Invention
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Electrical interconnect ic device socket. A surface mount electrical interconnect adapted to prov... |
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Invention
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High performance electrical circuit structure. A high performance electrical interconnect adapted... |
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Invention
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Electrical connector insulator housing. A socket housing and method of making the socket housing.... |
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Invention
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Semiconductor device package adapter. A semiconductor device packaged adapter for electrically co... |
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Invention
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High speed backplane connector.
A backplane connector including a substrate and a backplane conn... |
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2010
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Invention
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Compliant printed circuit semiconductor tester interface. A compliant printed circuit semiconduct... |
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Invention
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Singulated semiconductor device separable electrical interconnect. A socket assembly that forms a... |
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Invention
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Simulated wirebond semiconductor package. A semiconductor package with simulated wirebonds. A sub... |
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Invention
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Compliant printed circuit socket diagnostic tool. Diagnostic tools for testing integrated circuit... |
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Invention
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Compliant printed circuit wafer probe diagnostic tool. Diagnostic tools for testing wafer-level I... |
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Invention
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Compliant printed circuit area array semiconductor device package. An integrated circuit (IC) pac... |
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Invention
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Compliant printed circuit wafer level semiconductor package. A wafer-level package for semiconduc... |
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Invention
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Compliant printed flexible circuit. A compliant printed flexible circuit including a flexible pol... |
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Invention
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Compliant wafer level probe assembly. A probe assembly that acts as a temporary interconnect betw... |
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Invention
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High performance surface mount electrical interconnect. A method of forming an interconnect assem... |
