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2024
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Invention
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Thermally decomposable build plate structure for stabilization of metal build surface during 3d p... |
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2023
|
Invention
|
Thermally decomposing build plate for facile release of 3d printed objects.
A method includes: o... |
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|
Invention
|
Solder preform with internal flux core including thermochromic indicator.
A solder preform in th... |
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2022
|
Invention
|
Liquid metal paste containing metal particle additive. Some implementations of the disclosure are... |
|
|
Invention
|
Liquid metal paste containing metal particle additive.
Some implementations of the disclosure ar... |
|
|
Invention
|
Liquid metal composites containing organic additive as thermal interface materials, and methods o... |
|
|
Invention
|
Snin solder alloys.
Some implementations of the disclosure are directed to low melting temperatu... |
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|
Invention
|
High reliability lead-free solder alloys for harsh environment electronics applications. A SnAgCu... |
|
|
Invention
|
High reliability lead-free solder pastes with mixed solder alloy powders. Some implementations of... |
|
|
Invention
|
High reliability lead-free solder pastes with mixed solder alloy powders.
Some implementations o... |
|
|
Invention
|
Solid metal foam thermal interface material.
Solid metal foam thermal interface materials and th... |
|
|
Invention
|
Liquid metal thermal interface.
Liquid metal thermal interface materials and their uses in elect... |
|
|
Invention
|
Solid metal foam thermal interface material. Solid metal foam thermal interface materials and the... |
|
|
Invention
|
Low temperature melting and mid temperature melting lead-free solder paste with mixed solder allo... |
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|
Invention
|
Thermally decomposing build plate with casting mold for facile release of 3d printed objects. Add... |
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|
Invention
|
Build plate with thermally decomposing top surface for facile release of 3d printed objects. Ther... |
|
|
Invention
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Build plate with thermally decomposing top surface for facile release of 3d printed objects.
The... |
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2021
|
Invention
|
Lead-free solder paste with mixed solder powders for high temperature applications. Some implemen... |
|
2020
|
Invention
|
Thermally decomposing build plate for facile release of 3d printed objects. Implementations of th... |
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|
Invention
|
Solder preform with internal flux core including thermochromic indicator. Some implementations of... |
|
|
Invention
|
Method for preparing graphite sheets with piercing treatment to enhance thermal conduction. Some ... |
|
|
Invention
|
High reliability leadfree solder alloys for harsh service conditions. High reliability leadfree s... |
|
|
Invention
|
Lead-free solder paste as thermal interface material. Some implementations of the disclosure are ... |
|
2019
|
Invention
|
Semiconductor device assembly having a thermal interface bond between a semiconductor die and a p... |
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|
Invention
|
Snbi and snin solder alloys. Some implementations of the disclosure are directed to low melting t... |
|
|
Invention
|
Ge-doped ausn solder alloys.
Implementations of the disclosure are directed to improving the duc... |
|
|
Invention
|
Preventing post reflow interconnect failures in vippo solder joints via utilization of adhesive m... |
|
|
Invention
|
Lead-free solder paste for thermal via filling.
Implementations of the disclosure are directed t... |
|
2018
|
Invention
|
Apparatus and methods for creating a thermal interface bond between a semiconductor die and a pas... |
|
|
Invention
|
Burn-in preform and method of making the same. Some implementations are directed to a burn-in sol... |
|
|
Invention
|
Fluxes effective in suppressing non-wet-open at bga assembly. The disclosure describes techniques... |
|
|
Invention
|
Hybrid high temperature lead-free solder preform. A lead-free solder preform includes a core laye... |
|
2017
|
Invention
|
Semiconductor device assembly including a thermal interface bond between a semiconductor die and ... |
