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2023
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Invention
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Conductive composition and method for forming conductive film. The present invention provides: a ... |
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2022
|
Invention
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Copper ink, conductive film formation method, and rf tag. In the present invention, a low-resista... |
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2021
|
Invention
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Treatment method after plating with sn or sn alloy.
A treatment method is for preventing compou... |
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Invention
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Treatment method after sn or sn alloy plating. This treatment method is performed after Sn or Sn ... |
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Invention
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Joining method, copper sintered body and copper paste. The present invention inexpensively improv... |
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Invention
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Dust scattering inhibitor. The present invention provides a novel agent. A dust scattering inhibi... |
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Invention
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Method for producing ferrite film. A method for producing a ferrite film according to the present... |
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Invention
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Structure comprising under barrier metal and solder layer, and method for producing structure.
A... |
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|
Invention
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Structure comprising under barrier metal and solder layer, and method for producing structure. A ... |
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Invention
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Nickel colloid catalyst solution for electroless nickel or nickel alloy plating use, electroless ... |
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Invention
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Copper ink and method for forming electroconductive film. A copper ink for forming electroconduct... |
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2020
|
Invention
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Structure including copper plating layer or copper alloy plating layer. 2. A layer formed by chan... |
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|
Invention
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Structure provided with copper plating layer or copper alloy plating layer. This structure is pro... |
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|
Invention
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Structure containing sn layer or sn alloy layer.
A structure including an Sn layer or an Sn allo... |
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|
Invention
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Structure containing sn layer or sn alloy layer. A structure containing an Sn layer or Sn alloy l... |
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|
Invention
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Copper or copper alloy electroplating bath. A copper or copper alloy electroplating bath has two ... |
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Invention
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Electrolytic copper plate or copper alloy plating bath. An electrolytic copper plate or a copper ... |
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2019
|
Invention
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Method for producing conductive circuit, and conductive circuit. According to the present inventi... |
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G/S
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Chemicals for use in metal plating; metal plating chemical
compositions; chemical compositions f... |
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|
Invention
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Copper paste and method for forming conductive film. In the copper paste forming a conductive fil... |
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G/S
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Chemicals for use in metal plating; metal plating chemical compositions; chemical compositions fo... |
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2018
|
Invention
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Method for forming metal coating film on polyimide resin. A method for forming a metal coating fi... |
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Invention
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Structure containing sn layer or sn alloy layer. A structure containing a Sn layer or a Sn alloy ... |
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|
Invention
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Structure containing sn layer or sn alloy layer. This structure containing an Sn layer or an Sn a... |
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|
Invention
|
Method for manufacturing conductive polymer solid electrolytic capacitor, and conductive polymer.... |
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Invention
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Copper colloidal catalyst liquid for electroless copper plating, electroless copper plating metho... |
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Invention
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Ta-nb alloy powder and method for producing same, and anode element for solid electrolytic capaci... |
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2017
|
Invention
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Heat-treatment-type method for forming electroconductive coating on passive-state-forming light m... |
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|
Invention
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Solar battery cell manufacturing method. Provided is a solar battery cell manufacturing method ha... |
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|
Invention
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Nickel colloidal catalyst solution for electroless nickel or nickel alloy plating, and method for... |
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|
Invention
|
Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed there... |
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|
Invention
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Electrolytic tin or tin alloy plating bath and electronic component having electrodeposition arti... |
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|
Invention
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Fine copper particle dispersion liquid, electroconductive film formation method, and circuit boar... |
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2016
|
Invention
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Copper colloid catalyst solution for electroless copper plating and electroless copper plating me... |
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2015
|
Invention
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Method for manufacturing alloy bump. In order to manufacture an alloy bump, a resist pattern havi... |
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|
Invention
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Method for manufacturing alloy bump. In the present invention, in order to manufacture alloy bump... |
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|
Invention
|
Nickel colloid catalyst solution for electroless nickel or nickel alloy plating, and electroless ... |
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|
Invention
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Aqueous copper colloid catalyst solution for electroless copper plating and electroless copper pl... |
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2014
|
Invention
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Ta—nb alloy powder and anode element for solid electrolytic capacitor. 3 or more, and an anode el... |
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|
Invention
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Ta-nb alloy powder and anode element for solid electrolytic capacitor. A Ta-Nb alloy powder produ... |
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|
Invention
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Copper particulate dispersion, conductive film forming method, and circuit board.
To provide cop... |
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|
Invention
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Copper particulate dispersion, conductive film forming method, and circuit board.
Provided is a ... |
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Invention
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Copper-fine-particle dispersion liquid, conductive-film formation method, and circuit board. Prov... |
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2013
|
Invention
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Ta powder, production method therefor, and ta granulated powder.
Method of producing Ta powder f... |
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Invention
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Ta powder, production method therefor, and ta granulated powder. [Problem] To provide: a method f... |
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|
Invention
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Conductive film forming method and sintering promoter. In a conductive film forming method using ... |
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|
Invention
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Conductive film forming method and sintering promoter.
In a conductive film forming method using... |
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Invention
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Circuit board, conductive film forming method and adhesiveness improver.
In a conductive film fo... |
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2012
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G/S
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Nickel plating chemicals, zinc plating chemicals, metal plating chemicals, composite plating chem... |
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Invention
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Copper particulate dispersion, conductive film forming method and circuit board. The copper parti... |
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1997
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G/S
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Cleaning preparations, polishing preparations, polishing wax, auto wax, leather wax, preservative... |
