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2023
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Invention
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Build-up film with low dielectric loss, preparation method therefor and circuit substrate structu... |
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Invention
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Modification method of polyphenylene ether resin, laminated film composite, laminated film, and s... |
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Invention
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Chip protective film and method for manufacturing same, and chip. Disclosed are a chip protective... |
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Invention
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Adhesive composition for chip, chip preparation method, and chip. The present invention relates t... |
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Invention
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High-glossiness epoxy molding compound (emc) film for protecting chip and preparation method ther... |
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Invention
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Die sealant for chip packaging and packaging structure.
The present application discloses a die ... |
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Invention
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Composition, adhesive film and chip packaging structure. The present application discloses a comp... |
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Invention
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Adhesive, die attach film and preparation method therefor. Embodiments of the present application... |
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Invention
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Underfill for chip packaging and chip packaging structure. The present application discloses an u... |
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Invention
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Modification method for polyphenyl ether resin, laminated film composite material, laminated film... |
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Invention
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Chip protective film and preparation method therefor, and chip. The present disclosure provides a... |
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Invention
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Build-up film with low dielectric loss and preparation method therefor, and circuit substrate str... |
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Invention
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Low-modulus die attach film adhesive for vertically stacked package, preparation method therefor ... |
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2022
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Invention
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Adhesive, and die attach film and preparation method therefor. The embodiments of the invention d... |
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Invention
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Molding sealant and packaging structure for chip packaging. Disclosed in the present application ... |
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Invention
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Composition, adhesive film and chip packaging structure. Disclosed in the present application are... |
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Invention
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Chip packaging underfill and chip packaging structure. Disclosed in the present application are c... |
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2021
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Invention
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Circuit build-up film for wafer-level packaging, and fabrication method and use thereof. A circui... |
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Invention
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Circuit laminate film for wafer-level packaging and sealing, preparation method therefor, and app... |
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2020
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Invention
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High-gloss epoxy molding compound chip protection film and preparation method therefor. A high-gl... |
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Invention
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Underfill resin having stable adhesiveness under high temperature and preparation method therefor... |
