Microbonds Inc.

Canada

Create a watch for Microbonds Inc.
Total IP 4
Total IP Rank # 390,530
IP Activity Score 0.9/5.0    2
IP Activity Rank # 477,853
Dominant Nice Class Pharmaceutical, veterinary and s...

Patents

Trademarks

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0 1
2 0
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Last Patent 2015 - Bonding wire and process for man...
First Patent 1997 - High density integrated circuits...
Last Trademark 2020 - Daily Shield
First Trademark 2020 - DAILY SHIELD

Industry (Nice Classification)

Latest Inventions, Goods, Services

2020 G/S Sanitizing and disinfectant preparation with anti-microbial properties that can be applied to ski...
2012 Invention Bonding wire and process for manufacturing a bonding wire. A bonding wire comprises a core wire ...
Invention Bonding wire and process for manufacturing a bonding wire. A bonding wire comprises a core wire g...
2011 Invention Metal graphic and method to produce a metal graphic. The present invention comprises a metal grap...
2007 Invention Wire bonding process for insulated wires. A process for bonding insulated wires is provided wher...
2006 Invention System and method for assembling packaged integrated circuits using insulated wire bond. Devices ...
Invention High performance ic package and method. A novel wire-based interconnect IC package is described a...
2005 Invention Wire bonder for ball bonding insulated wire and method of using same. A microchip wire bonder for...
Invention High performance ic package and method. A novel wire-based interconnect IC package is described ...
2004 Invention High density integrated circuit package s and method of making same. An integrated circuit packag...
Invention Wire bonder for ball bonding insulated wire and method of using same. An electrical contact devic...
2003 Invention High density integrated circuits and the method of packaging the same. An integrated circuit pack...
2002 Invention Wire bonder for ball bonding insulated wire and method of using same. A wire bonder for bonding a...
Invention A wire bonder for ball bonding insulated wire and method of using same. A wire bonder for bonding...
1997 Invention High density integrated circuits and the method of packaging the same. A method of increasing the...