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2025
|
Invention
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Core ball and semiconductor package including the same.
A core ball includes a core that is meta... |
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2022
|
Invention
|
Lead-free solder alloy and method of manufacturing electronic device using the same. A lead-free ... |
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2021
|
Invention
|
Lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the... |
|
|
Invention
|
Pin-grid-array-type semiconductor package.
A semiconductor package of a pin-grid-array type incl... |
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|
Invention
|
Semiconductor package using core material for reverse reflow. Provided is a semiconductor package... |
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2018
|
Invention
|
Anode active material for secondary battery, and preparation method therefor. Provided is an anod... |
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2017
|
Invention
|
Bonding wire. A bonding wire according to the technical spirit of the present invention comprises... |
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|
Invention
|
Secondary battery anode active material and manufacturing method therefor. Provided is a secondar... |
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|
Invention
|
Negative electrode active material for lithium secondary battery, and lithium secondary battery i... |
|
|
Invention
|
Negative electrode active material and method of preparing the same. 2. |
|
|
Invention
|
Negative electrode active material for secondary battery and manufacturing method therefor. Provi... |
|
|
Invention
|
Anode active material, secondary battery comprising same, and anode active material manufacturing... |
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2016
|
Invention
|
Core for reverse reflow, semiconductor package, and method of fabricating semiconductor package. ... |
|
|
Invention
|
Solder ball for fluxless bonding, method of manufacturing the same, and method of forming solder ... |
|
|
Invention
|
Lead-free solder having low melting point.
A solder ball includes about 1.0 wt % to about 2.0 wt... |
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2015
|
Invention
|
Negative active material for secondary battery, negative electrode and lithium battery each inclu... |
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2014
|
Invention
|
Lead free solder bumps. Provided are a lead-free solder, a solder paste, and a semiconductor devi... |
|
|
Invention
|
Silver alloy boding wire and semiconductor device using same. The present invention relates to a ... |
|
|
Invention
|
Silver alloy bonding wire and method for manufacturing same. The present invention relates to a s... |
|
|
Invention
|
Metal ball fabricating apparatus.
Provided is a metal ball fabricating apparatus for fabricating... |
|
|
Invention
|
Solder balls and semiconductor device employing the same. 3Sn intermetallic compound (IMC) nanopa... |
|
|
Invention
|
Anode active material for secondary battery, and secondary battery including same.
An anode acti... |
|
|
Invention
|
Anode active material for secondary battery and method for manufacturing same.
An anode active m... |
|
|
Invention
|
Substrate having excellent thermal conductivity in thickness direction, led device having same, a... |
|
|
Invention
|
Silver alloy bonding wire. The present invention relates to a silver alloy bonding wire having si... |
|
|
Invention
|
Silver alloy bonding wire. The present invention relates to a silver(Ag)alloy bonding wire, and m... |
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2013
|
Invention
|
Anode active material, secondary battery comprising same and method for manufacturing anode activ... |
|
|
Invention
|
Powder manufacturing apparatus and anode active material for secondary battery manufactu... |
|
|
Invention
|
Negative active material for secondary battery and method of manufacturing the same.
A ... |
|
|
Invention
|
Secondary battery including silicon-metal alloy based negative active material. Provided is a sec... |
|
|
Invention
|
Bonding wire for semiconductor device and manufacturing method therefor. The present invention re... |
|
|
Invention
|
Method for improving color rendering of artificial light source. The present invention relates to... |
|
|
Invention
|
Method for manufacturing heat-dissipating plate having excellent heat conductivity in thickness d... |
|
|
Invention
|
Anode active material for secondary battery and method of manufacturing the same.
An anode activ... |
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2012
|
Invention
|
Tin-based solder ball and semiconductor package including the same. A tin (Sn)-based solder ball ... |
|
|
Invention
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Anode active material for secondary battery, and secondary battery including same. The present in... |
|
|
Invention
|
Anode active material for secondary battery and method for manufacturing same. The present invent... |
|
|
Invention
|
Tin-based solder ball and semiconductor package including the same.
A tin (Sn)-based solder ball... |
|
|
Invention
|
Tin-based solder ball and semiconductor package including same. The technical idea of the present... |
|
|
Invention
|
Anode active material for secondary battery and secondary battery including the same.
An anode a... |
|
2008
|
G/S
|
Electric contacts for semi-conductor devices [; diodes; semi-conductors; wafers silicon slices; s... |
|
|
G/S
|
Electric contacts for semi-conductor devices; diodes;
semi-conductors; wafers[silicon slices]; s... |
|
|
Invention
|
Ag-based alloy wire for semiconductor package.
An Ag-based alloy wire for a semiconductor packag... |
|
|
Invention
|
Semiconductor package using wires consisting of ag or ag alloy.
A semiconductor package using Ag... |
|
|
Invention
|
Lead free solder containing sn, ag and bi. A lead free solder is provided. The lead free solder i... |
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2007
|
Invention
|
Au-ag based alloy wire for semiconductor package. A gold-silver based wire for a semiconductor pa... |
|
2006
|
Invention
|
Au alloy bonding wire.
Provided is a gold alloy bonding wire for semiconductor packaging. The go... |
|
|
Invention
|
Method of fabricating bonding wire and apparatus for strengthening bonding wire. Provided a metho... |
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2005
|
Invention
|
Copper bonding wire for semiconductor packaging.
Provided is a copper bonding wire formed of a h... |
|
|
Invention
|
Pb-free solder alloy. Provided is a Pb-free solder alloy used for mounting electronic parts on a ... |
|
2003
|
Invention
|
Gold alloy bonding wire for semiconductor device. A gold (Au) alloy bonding wire for a semiconduc... |
