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2021
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Invention
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Hyperspectral camera. A camera includes a first lens configured to focus incoming light onto a re... |
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2019
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Invention
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Monolithic multi-focus light source device. A light source device that includes a light device as... |
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2018
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Invention
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Method of making a sensor package with cooling feature. A sensor device includes a first substrat... |
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2017
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Invention
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Method of forming a wire bond sensor package. A packaged chip assembly with a semiconductor subst... |
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2016
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Invention
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Method of forming a stress released image sensor package structure. A sensor package that include... |
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Invention
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Under screen sensor assembly. A sensor assembly that includes a silicon substrate and a sensor in... |
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Invention
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Sensor package with cooling feature. A sensor device includes a first substrate of semiconductor ... |
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Invention
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Method of making low profile sensor package with cooling feature. A sensor device and method of m... |
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Invention
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Stress released image sensor package structure and method. A sensor package that includes a subst... |
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2015
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Invention
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Method of forming a low profile image sensor package with an image sensor substrate, a support su... |
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Invention
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Sensor package with exposed sensor array and method of making same. A packaged sensor assembly an... |
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Invention
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Wire bond sensor package. A packaged chip assembly with a semiconductor substrate, a semiconducto... |
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Invention
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Stepped package for image sensor. An image sensor package includes a crystalline handler having o... |
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Invention
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Chip level heat dissipation using silicon. A semiconductor device that includes a semiconductor c... |
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Invention
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Back side illumination image sensor with non-planar optical interface. An image sensor that inclu... |
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Invention
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Imaging device with photo detectors and color filters arranged by color transmission characterist... |
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2014
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Invention
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Semiconductor device on cover substrate and method of making same.
A sensor device comprising a ... |
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Invention
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Three dimensional system-on-chip image sensor package. An image sensor that comprises a first sub... |
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Invention
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Sensor package with cooling feature and method of making same. A sensor device includes a first s... |
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Invention
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Low profile sensor package with cooling feature and method of making same. A sensor device and me... |
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Invention
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Integrated camera module and method of making same. A camera module and method of making same, in... |
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Invention
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Method of making interposer package for cmos image sensor. An image sensor package and method of ... |
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Invention
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Method of forming a low profile image sensor package. An image sensor package, and method of maki... |
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Invention
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Cover-free sensor module and method of making same.
A sensor package includes host substrate ass... |
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Invention
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Low profile image sensor. A sensor package comprising a host substrate with opposing first and se... |
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Invention
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Low profile sensor module and method of making same. A host substrate assembly includes a first s... |
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2013
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Invention
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Method of making a low stress cavity package for back side illuminated image sensor. An image sen... |
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Invention
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Method of making 3d integration microelectronic assembly for integrated circuit devices. A microe... |
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Invention
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Method of forming 3d integrated microelectronic assembly with stress reducing interconnects. A mi... |
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Invention
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Method of making 3d integration microelectronic assembly for integrated circuit devices. A 3D int... |
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2012
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Invention
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Low profile image sensor package. An image sensor package, and method of making same, that includ... |
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Invention
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Integrated image sensor package with liquid crystal lens. A package structure with a sensor chip ... |
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Invention
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Method of making stamped multi-layer polymer lens. A method of forming lenses includes providing ... |
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Invention
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Quantum efficiency back side illuminated cmos image sensor and package, and method of making same... |
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Invention
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Back side illuminated image sensor architecture, and method of making same. An image sensor devic... |
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Invention
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Multi-layer polymer lens and method of making same. A multi-layered lens having a substrate with ... |
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2011
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Invention
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Wire bond interposer package for cmos image sensor and method of making same. An image sensor pac... |
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Invention
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Interposer package for cmos image sensor and method of making same. An image sensor package and m... |
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Invention
|
Stepped package for image sensor and method of making same. An image sensor package includes a cr... |
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Invention
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3d integration microelectronic assembly for integrated circuit devices. A microelectronic assembl... |
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Invention
|
3d integration microelectronic assembly for integrated circuit devices. A 3D interposer (and meth... |
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Invention
|
3d integrated microelectronic assembly with stress reducing interconnects. A microelectronic asse... |
