The present invention relates to a method of cutting a substrate (6) by the introduction of thermo -mechanical tensions. The present invention also relates to the precise manufacturing of a substrate shape by the cutting methods specified. The present invention also relates to a device (1,3,3') for performing the method according to the present invention.
The present invention relates to a method for cutting a substrate by introducing thermomechanical tensile stress, and a device. The method according to the present invention: (a) supplies a substrate to be cut; (b) supplies electricity and thermal energy to the substrate by one or more electrode means connected to an AC voltage source, and supplies AC voltage and an electric current to a predetermined region of the substrate at a frequency in the range of 1 kHz to 10 GHz to heat the region; (c) cools the region; and (d) during step (b), moves the electrode and/or the substrate relative to the other, thereby moving the region along a path on the substrate surface and cutting the substrate along the path.
A METHOD OF GENERATING A HOLE OR RECESS OR WELL IN A SUBSTRATE, A DEVICE FOR CARRYING OUT THE METHOD, AND A HIGH FREQUENCY HIGH VOLTAGE SOURCE FOR USE IN SUCH A DEVICE
The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.
B26D 7/10 - Moyens de traitement de la pièce ou de l'outil de coupe pour faciliter la coupe par échauffement
B26F 1/28 - Perforation par des moyens non mécaniques, p. ex. par un jet de fluide par décharges électriques
B23K 26/38 - Enlèvement de matière par perçage ou découpage
B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
B23K 26/14 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet
B23K 26/16 - Enlèvement de résidus, p. ex. des particules ou des vapeurs produites pendant le traitement de la pièce à travailler
H03B 5/12 - Éléments déterminant la fréquence comportant des inductances ou des capacités localisées l'élément actif de l'amplificateur étant un dispositif à semi-conducteurs
The present invention relates to a method of cutting a substrate by the introduction of thermo-mechanical tensions. The present invention also relates to the precise manufacturing of a substrate shape by the cutting method specified. The present invention also relates to a device for performing the method according to the present invention.
The present invention relates to a method of producing an electrically- conducting via in a substrate and to a substrate produced thereby. The method comprises the steps : a) providing a substrate made of at least one electrically insulating material (1), b) placing said substrate between two electrodes (3, 3' ), said two electrodes being connected to a user-controlled voltage source (4), c) appling a voltage to said substrate, d) causing a dielectric breakdown and energy dissipation between said two electrodes through said substrate by locally or globally increasing the electrical conductivity of said substrate, wherein, in step d), a modification of said at least one electrically insulating material into an electrically conducting material occurs, thereby generating an electrically conducting via (6). In particular, in one embodiment, the present invention relates to a substrate, such as a printed circuit board having one or several metal-free electrically conducting vias.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
6.
A METHOD OF SMOOTHING AND/OR BEVELLING AN EDGE OF A SUBSTRATE
The present invention relates to a method of smoothing and/or bevelling an edge of a substrate. The present invention also relates to a substrate produced by the method according to the present invention, in particular a substrate having an edge smoothed and/or bevelled by the method according to the present invention.
This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.
This invention relates to methods and devices for the production of optical microstructures or domains in dielectric substrates based on electrothermal focussing. More specifically, the invention relates to a method of introducing a change of dielectric and/or optical properties in a region of an electrically insulating or electrically semiconducting substrate, and to substrates produced by such method.
The invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in microfluidic and analysis devices and provides a method of introducing a structure, preferably a hole or cavity or channel or well or recess, in a region of an electrically insulating substrate (s), said method comprising the steps: a) providing an electrically insulating substrate (s), b) storing electrical energy across said substrate using an energy storage element (c) which is charged with said electrical energy, said energy storage element being electrically connected to said substrate, said electrical energy being sufficient to significantly heat, and/or melt and/or evaporate parts or all of a region of said substrate, c) applying additional energy, preferably heat, to said substrate or a region thereof to increase the electrical conductivity of said substrate or said region thereof, and thereby initiate a current flow and, subsequently, a dissipation of said stored electrical energy within the substrate and d) dissipating said stored electrical energy, wherein the rate of dissipating said stored electrical energy is controlled by a current and power modulating element, said current and power modulating element being part of the electrical connection between said energy storage element and said substrate. A device for performing the method is also provided.
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