The present invention provides a hybrid structure and an inspection apparatus including same, wherein peeling does not occur on an inner wall of a first through-hole even during repeated sliding operations of an electrically conductive contact pin, and problems caused by peeled particles falling and generating inspection errors can be prevented, thereby achieving high reliability of electrical connection, and wherein a structure in which the first through-hole is formed is formed with a sufficient thickness to provide an environment that reduces signal attenuation of high-frequency signals, thereby improving the reliability and accuracy of inspection of the inspection apparatus.
The present invention provides a high-capacitance capacitor component and an integrated circuit chip package including same, the component comprising: an anodic oxide film body including a plurality of pores; a first electrode layer including a first surface electrode part formed on the surface of the body and a first pore electrode part formed on the inner wall of the pore; a dielectric layer including a surface dielectric part formed on the first surface electrode part and a pore dielectric part formed on the first pore electrode part; and a second electrode layer including a second surface electrode part formed on the surface dielectric part and a second pore electrode part formed on the pore dielectric part.
The present invention provides: an electro-conductive contact pin array for responding to a narrow pitch of a semiconductor package; and an inspection device, and provides an electro-conductive contact pin that maintains a restoring force while ensuring a compressible space.
The present invention relates to an inductor having a coil unit through which current flows. In particular, the present invention is designed to solve the described problem and relates to an inductor capable of ensuring a high inductance by increasing the cross-sectional area of a body wound around by a coil unit by arranging a plurality of vertical connection parts parallel to the short sides of the body.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
5.
MULTILAYER CERAMIC WAFER FOR INDUCTOR AND INDUCTOR USING SAME
The present invention provides a multilayer ceramic dielectric for an inductor and an inductor using same, in which a high-permeability micro-body for concentrating a magnetic field along a magnetic flux flow of a coil part is provided inside a through-hole to minimize magnetic flux leakage and concentrate the magnetic field along the magnetic flux flow of the coil part, thereby efficiently forming a path of the magnetic field.
The present invention provides a multilayer ceramic dielectric for an inductor and an inductor using same, wherein a first anodic oxide film having a low porosity due to having relatively small pores or a relatively small number of pores is positioned on upper and lower surface layers, and a second anodic oxide film having a large porosity due to having relatively large pores or a relatively large number of pores is positioned on inner layers positioned between the upper and lower surface layers to make the dielectric constant high on the upper and lower surfaces and low in an inner region so that a current path operates efficiently on the surface sides, and the efficiency of magnetic field passage inside can be enhanced to improve high-frequency characteristics.
The present invention provides a multilayer ceramic dielectric for an inductor and an inductor using same, the dielectric having a heterogeneous composite filler comprising a high-k dielectric material and a high-permeability material to increase the permittivity of the upper and lower surfaces and the permeability of the inner region between the upper and lower surfaces.
Proposed is an electroconductive contact pin, and the objective is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized film material so that deformation of the electroconductive contact pin is prevented, and being capable of effectively improving current carrying capacity.
The present invention provides an electrically conductive contact pin comprising a first end region, a second end region, and a body region positioned between them, wherein the body region includes at least two beam portions spaced apart by a slit and comprises a functional layer inside the slit to prevent local destruction of the beam and improve the current carrying capacity.
Proposed are an electrically conductive contact pin formed by stacking a plurality of metal layers and a manufacturing method therefor, in which unintentional deformation of the electrically conductive contact pin is prevented by concentrating a pressing force pressing the electrically conductive contact pin on a tip portion having a relatively small cross-sectional area.
The present invention relates to an electrically conductive contact pin provided with an elastic portion, wherein the elastic portion includes: a plurality of straight portions; and a plurality of curved portions connecting the straight portions adjacent to each other above and below, and further includes a slit portion for dividing the curved portions into split beam portions, a stopper for limiting an elastic deformation position, or a groove portion for forming a cut portion on the inner surface of the curved portions. The purpose of the present invention is to improve the inspection reliability of an inspection object and to prevent damage to the inspection object by facilitating elastic deformation.
The present invention provides an inspection apparatus comprising an electrically conductive contact pin having one end contacting a connection pad of an inspection apparatus and another end contacting a connection pad of an inspection object to inspect the inspection object, and a guide plate having a guide hole into which the electrically conductive contact pin is inserted, wherein the electrically conductive contact pin comprises a body portion including a first metal layer and a second metal layer made of a metal having relatively higher electrical conductivity than the first metal layer, alternately stacked in a thickness direction, and an elastic portion including a plurality of unit elastic bodies spaced apart from each other in the thickness direction at one end, which can be easily elastically deformed by close contact and pressing by a connection object.
Proposed are an electrically conductive contact pin and a method for manufacturing the same. The electrically conductive contact pin includes a body portion composed of a plurality of metal layers stacked in a thickness direction, and a tip portion provided on at least one of a front end portion and a base end portion of the body portion, wherein the tip portion has dimensions smaller than the dimensions of the thickness direction of the body portion, and a metal layer constituting the tip portion is formed continuously of the same material as some of the metal layers constituting the body portion.
The invention provides an electrically conductive contact pin that improves test reliability for a test object and prevents separation in a side opening direction of a guide hole due to a lower catch portion.
The present invention provides a component using an anodic oxide film and including a three-dimensional electrode layer, and a manufacturing method therefor.
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
C23C 16/04 - Revêtement de parties déterminées de la surface, p. ex. au moyen de masques
C23C 16/44 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement
H10D 1/68 - Condensateurs n’ayant pas de barrières de potentiel
H01G 13/00 - Appareils spécialement adaptés à la fabrication de condensateursProcédés spécialement adaptés à la fabrication de condensateurs non prévus dans les groupes
The present invention relates to an electrical connector comprising a first metal layer and a second metal layer, wherein the electrical connector comprises: a plurality of beam portions consisting of the first metal layer, wherein the second metal layer is not provided between the first metal layers in the thickness direction such that the first metal layers are spaced apart from each other in the thickness direction and elastically deformed by an external force applied in the length direction; and a connecting portion in which the first metal layer and the second metal layer are stacked in the thickness direction and which connects the plurality of beam portions, thereby providing an electrical connector with an increased surface area and improved current carrying capacity (CCC).
H01R 13/03 - Contacts caractérisés par le matériau, p. ex. matériaux de plaquage ou de revêtement
H01R 13/646 - Détails de dispositifs de couplage des types couverts par les groupes ou spécialement adaptés à la haute fréquence, p. ex. structures procurant une adaptation d'impédance ou un accord de phase
The present invention comprises a first contact part; a second contact part; and an elastic deformation part connecting the first contact part and the second contact part, wherein the first contact part and the second contact part are relatively displaceable along a length direction, the elastic deformation part has a shape folded in a width direction, and the elastic deformation part includes a plurality of divided parts, thereby providing an electrical connector that can reduce pin force while maintaining the strength of the elastic part. Additionally, the present invention provides an electrical connector that improves the reliability of inspection by ensuring that numerous electrical connectors provided in an inspection device can form and maintain the same current path when they are pressed and deformed.
The present invention provides an electro-conductive contact pin which can implement a narrow-pitch and an inspection device including same. Furthermore, the present invention provides an electro-conductive contact pin which uses a guide housing formed to have consistent thickness overall, including a portion corresponding to a lower part of an interference member and prevents damage due to interference with the interference member, and an inspection device including same.
The electrical connector of the present invention comprises a plurality of unit needle pins arranged to be spaced apart from each other and having beam portions extending in a longitudinal direction to be elastically deformed; and a connecting portion fixing the plurality of unit needle pins to be spaced apart from each other. By including these components, the present invention provides an electrical connector with a significantly increased surface area, resulting in improved current carrying capacity (CCC), and an inspection apparatus comprising the same. Additionally, the present invention provides a highly reliable electrical connector and an inspection apparatus comprising the same.
The present invention provides an interposer that is provided between an object to be inspected and electrically conductive pins, allowing the contact terminal of the object to be inspected and the tip of the electrically conductive pins to be indirectly electrically connected to each other, thereby preventing damage to the contact terminal, and an inspection apparatus comprising the same.
The present invention provides a guide plate with an anodized film and a pin block having the same, by directly using the metal substrate, which was used to form the anodized films, as the structural material for the guide plate, thereby having anodized films on both the upper and lower portions of the metal substrate, which compensates for the vulnerability of the anodized film material.
The present invention provides a metal molded article, a manufacturing method therefor, and an inspection device having same. The metal molded article has an overall length dimension in a longitudinal direction, an overall thickness dimension in a thickness direction perpendicular to the longitudinal direction, and an overall width dimension in a width direction perpendicular to the longitudinal direction. The metal molded article is divided into a first body region and a second body region in the thickness direction. The lateral surfaces of the first body region are provided with multiple micro-trenches that are grooves formed to be elongated in the thickness direction and arranged side by side all over the entire lateral surfaces of the first body region. The lateral surfaces of the second body region are not provided with these micro-trenches.
Proposed are an anodized film structure which improves the mechanical and/or electrical characteristics by protecting perforated holes with a protective layer, and an inspection device. In the anodized film structure, parylene-type protective layer is formed with a uniform thickness on an inner wall of each of the perforated holes and a surface of the body made of an anodized film material. Micro-trenches are defined by peaks and valleys repeatedly arranged and formed on the inner wall of each of the perforated holes, and the protective layer covers the entire micro-trenches. In addition, a metal layer is provided on a surface of the body and between the protective layer and the inner wall of each of the perforated holes.
Proposed are an electro-conductive contact pin capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof, and a vertical probe card having the same.
The present invention provides an electrically conductive contact pin comprising: a movable pin part provided with a first connection part, a second connection part, an elastic deformation part connected to the first connection part and the second connection part so as to relatively displace the first connection part and the second connection part in the length direction, and hollow parts; and a guide part provided with a pair of vertical parts positioned on respective side surfaces of the movable pin part, and connection parts connected to the pair of vertical parts and traversing the hollow parts.
The present invention relates to a diffuser used in a process chamber and, more specifically, to a diffuser used in a plasma-enhanced chemical vapor deposition apparatus, comprising: a diffuser body including a plurality of gas passages extending from an upper surface through to a lower surface; and a protective layer formed on a wall surface of the gas passage of the diffuser body, wherein the protective layer includes a first protective layer formed by anodizing the diffuser body, a second protective layer formed by repeating a cycle of generating a single-atom layer on the first protective layer, and a third protective layer formed by vapor deposition on the second protective layer.
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
C23C 16/44 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement
C23C 16/505 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement au moyen de décharges électriques utilisant des décharges à radiofréquence
H01J 37/32 - Tubes à décharge en atmosphère gazeuse
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H10K 50/10 - OLED ou diodes électroluminescentes polymères [PLED]
The present invention provides an inductor that can meet the needs for miniaturization and low resistance, and a manufacturing method therefor. An inductor manufacturing method of the present invention includes the steps of: providing a stack-type positive electrode oxide film body, which includes a step of stacking a first divided body part having a first through part formed therein and a second divided body part having a second through part formed therein, so that the first through part and the second through part are aligned with each other with a bonding part therebetween, and a step of removing the bonding part between the first through part and the second through part; forming vertical connection parts by filling the first through part and the second through part with a metal material; forming an upper connection part connecting the vertical connection parts with each other on the upper part of the stack-type positive electrode oxide film body; and forming a lower connection part connecting the vertical connection parts with each other on the lower part of the stack-type positive electrode oxide film body.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
The present invention relates to an inductor and a manufacturing method therefor, and, particularly, the objective of the present invention is to provide an inductor and a manufacturing method therefor, the inductor satisfying needs of small size and low resistance and, simultaneously, having a simplified manufacturing process such that mass production thereof is possible.
The present invention relates to a probe card for inspecting whether an object under inspection is defective, and particularly to a probe card which is provided with a plurality of space transformers and thus, if a defect occurs in some of the space transformers or probe pins, allows only the defective ones to be replaced and thereby facilitates repair and maintenance.
The present invention relates to an atomic layer deposition apparatus for forming a thin film on a metal component for a process chamber, in which a thin film is formed by depositing an atomic layer on a surface of a deposition target object and, particularly, to an atomic layer deposition apparatus for forming a thin film on a metal component for a process chamber, being capable of uniformly forming a thin film on a deposition target object by uniformly flowing a process gas inside a reaction chamber.
C23C 16/44 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement
C23C 16/458 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour supporter les substrats dans la chambre de réaction
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
31.
CONTACT PIN ASSEMBLY FOR KELVIN TEST AND KELVIN TEST DEVICE COMPRISING SAME
The present invention provides an electrically conductive contact pin for a Kelvin test and a test device comprising same, which can cope with the narrower pitch between electrodes of a semiconductor device.
KOREA PHOTONICS TECHNOLOGY INSTITUTE (République de Corée)
Inventeur(s)
Park, Seung Ho
Song, Tae Hwan
Min, Jung Hong
Lee, Sang Hern
Jeong, Tae Hun
Jung, Sung Hoon
Abrégé
The present invention relates to a method for manufacturing a laminated electronic device, the method including the steps of: sequentially laminating a first micro LED layer and a second micro LED layer on a substrate; and laminating a third micro LED layer on the second micro LED layer, wherein the first micro LED layer includes, in order from the bottom layer thereof, a first n-type current layer, a first current transport layer, a first p-type layer, a first active layer, and a first n-type layer, and the second micro LED layer includes, in order from the bottom layer thereof, a second n-type current layer, a second current transport layer, a second p-type layer, a second active layer, and a second n-type layer, wherein the first n-type layer and the second n-type current layer are the same layer and are electrically connected to a common electrode and a second electrode. Provided are the laminated electronic device capable of implementing a high-resolution display by laminating individual micro LEDs, and the method for manufacturing the laminated electronic device.
H01L 33/08 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une pluralité de régions électroluminescentes, p.ex. couche électroluminescente discontinue latéralement ou région photoluminescente intégrée au sein du corps semi-conducteur
H01L 33/38 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les électrodes ayant une forme particulière
H01L 33/14 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une structure contrôlant le transport des charges, p.ex. couche semi-conductrice fortement dopée ou structure bloquant le courant
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
33.
Inspection device using electrically conductive contact pin
An electrically conductive contact pin includes a first connection portion, a second connection portion, a pair of support portions, a first elastic portion, and a second elastic portion, and is characterized in that a first connection portion contacts the pair of support portions to form a current path when a first elastic portion is compressed, and the second connection portion contacts the pair of support portions to form a current path when the second elastic portion is compressed. An inspection device comprises an installation member having a through hole for receiving the electrically conductive contact pin.
Proposed is an electro-conductive contact pin which can implement a narrow pitch between electro-conductive contact pins and prevent the electro-conductive contact pins from being short-circuited even upon contact between center portions of the electro-conductive contact pins, through a manufacturing method for an electro-conductive contact pin, the manufacturing method including a step of forming a module area including pin bodies and a support frame supporting the pin bodies through connecting portions, and a coating layer forming step of forming a coating layer on the pin bodies.
A guide member, an inspection device, and an electro-conductive contact pin for improving inspection reliability with respect to an inspection object are proposed.
The present invention provides an anodic oxidation film structure and a manufacturing method therefor, the anodic oxidation film structure comprising: a body made of an anodic oxidization film obtained by anodic oxidation on a parent metal and then removing the parent metal; a through-hole which is formed through the body and has a larger inner width than that of a pore formed during the anodic oxidation; and a metal layer provided on the inner wall of the through-hole, and thus improving the mechanical and/or electrical characteristics of the inner wall of the through-hole.
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
C23C 14/16 - Matériau métallique, bore ou silicium sur des substrats métalliques, en bore ou en silicium
Proposed is a vertical probe card capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof.
Proposed are a metal product, a method of manufacturing the same, and a test device having the same. More particularly, proposed are a metal product that has a high degree of freedom of shape and reliability and improves test reliability for a test object, a method of manufacturing the same, and a test device having the same.
The present invention relates to a susceptor which seats a substrate on the upper surface thereof during a deposition process for the substrate, the susceptor comprising: a first plate; a second plate provided under the first plate; and a planar heater provided between the first and second plates, wherein the planar heater is in the form of a plane, and a heating pattern formed to have a large area corresponding to the area of the plane is provided inside the planar heater. Accordingly, the present invention provides a susceptor in which a uniform temperature is formed over the entire area thereof without the risk of disconnection.
C23C 16/458 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour supporter les substrats dans la chambre de réaction
The present invention provides an electro-conductive contact pin that prevents localized damage to a beam due to functional layers provided in slits. In addition, the present invention provides an electro-conductive contact pin that improves current-carrying capacity due to the functional layers provided in the slits.
Proposed are a method of manufacturing a metal product that uses an anodic aluminum oxide film and a patternable material together, in which a space where the metal product is manufactured is formed by the patternable material and the anodic aluminum oxide film provides structural support to the patternable material; and a mold using an anodic aluminum oxide film used therefor.
Provided is a coupling-type electrically conductive contact pin that is easy to handle and does not have the separation problem of a cross-coupled structure. The electrically conductive contact pin comprises a first pin part and a second pin part that is cross-coupled to the first pin part. The first pin part includes: a first connecting portion in which a first fastening portion is formed concavely in the longitudinal direction above a first connecting body portion; a second connecting portion in which a second fastening portion passes through a second connecting body portion from one side to the other side in the thickness direction; and an elastic portion connecting the first connecting portion and the second connecting portion in the longitudinal direction. The second pin part includes: a first contact fastening portion that is provided in a central region of a contact body part and seated on the first fastening portion; a stopper portion that extends downward in the longitudinal direction from both ends of the contact body portion in the thickness direction; and a second contact fastening portion that protrudes toward the inner surface of the stopper portion in the thickness direction, extends downward in the longitudinal direction, and is fastened to the second fastening portion.
The present invention provides: a component using an anodic oxide film in which the pores of the anodic oxide film are prevented from opening during a photoresist process so that foreign substances of the photoresist do not enter the pores during a subsequent process for forming a specific material inside the pores; and a method for manufacturing same.
G03F 7/26 - Traitement des matériaux photosensiblesAppareillages à cet effet
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
The present invention provides an electro-conductive contact pin with improved connection reliability. The electro-conductive contact pin includes: a body portion in which a plurality of first metal layers including a metal having a relatively high elastic modulus and a plurality of second metal layers including a metal having a relatively high electrical conductivity are alternately stacked in the thickness direction; and a tip portion provided at the front end portion of the body portion in the longitudinal direction. The body portion may include a first thickness area continuously connected to the tip portion in the longitudinal direction and a second thickness area provided on the upper portion of the first thickness area in the thickness direction, and the thickness of the first metal layer in the first thickness area is in the range of 1.1 to 50.0 times the thickness of the second metal layer.
The present invention provides a metal structure fabricated by using a positive-electrode oxide film such that the strength of bonding between the body and an insulating film is increased by a micro-trench provided on the inner wall of a through-hole, a method for manufacturing same, and an inspection device comprising same.
The present invention provides a metal molded product and a method for producing same, and an electro-conductive contact pin and a method producing same, the metal molded product comprising: a body part; a tip part provided at either the front end part or the base end part of the body part; and a transition part, provided between the body part and tip part to continuously connect same, widening gradually in going from the tip part to the body part, thus easing the concentration of stress at the tip part to minimize damage thereto and to improve contact reliability.
The present invention provides an electrically conductive contact pin formed by laminating a plurality of metal layers, wherein the electrically conductive contact pin has improved physical or electrical properties.
The present invention relates to a micro bump, which is capable of coping with a narrow pitch between terminals and preventing an increase in current density and thermal energy density at a bump connection portion, and to an interposer for electrical connection having same, a semiconductor package, a multi-layer stacked semiconductor device, and a display. The micro bump may be manufactured using: an electrically conductive material part forming step of forming an electrically conductive material part inside a through hole provided in a body made of an anodized film; and a bonding material part forming step of forming a bonding material part on at least a portion of an upper portion and a lower portion of the electrically conductive material part.
Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.
B22C 9/20 - Moulage en grappe, c.-à-d. en moules multiples ou en châssis multiples superposés en gradins
B22D 19/16 - Coulée dans, sur, ou autour d'objets formant partie intégrante du produit final pour fabriquer des moulages composites à partir de métaux différents, p. ex. pour fabriquer des cylindres de laminoirs
An anodized film structure according to the present invention comprises: a body, formed from an anodized film material, which is formed by anodizing a base metal and then removing the base metal; through holes having a greater inner width than pores formed during anodizing, and formed through the body; and an inner metal layer provided inside the body. Provided is the anodized film structure having enhanced physical and/or electrical properties to solve the problem of brittle fractures and impart partial conductivity.
Proposed is a vertically stacked electronic device that enables the implementation of high-resolution displays by stacking individual LEDs vertically, and a method for manufacturing the vertically stacked electronic device.
H01L 27/15 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants semi-conducteurs avec au moins une barrière de potentiel ou une barrière de surface, spécialement adaptés pour l'émission de lumière
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
54.
VERTICALLY STACKED ELECTRONIC ELEMENT AND METHOD FOR MANUFACTURING VERTICALLY STACKED ELECTRONIC ELEMENT
The present invention provides a vertically stacked electronic element comprising: a substrate; a first micro-LED disposed on the substrate; a second micro-LED disposed on the first micro-LED; a third micro-LED disposed on the second micro-LED; a common electrode formed to pass through the third micro-LED, the second micro-LED, and the first micro-LED; a first electrode passing through the electronic element and electrically connected to the first micro-LED; a second electrode passing through the electronic element and electrically connected to the second micro-LED; and a third electrode passing through the electronic element and electrically connected to the third micro-LED.
H01L 33/08 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une pluralité de régions électroluminescentes, p.ex. couche électroluminescente discontinue latéralement ou région photoluminescente intégrée au sein du corps semi-conducteur
H01L 33/38 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les électrodes ayant une forme particulière
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
55.
CAPACITOR COMPONENT, METHOD FOR MANUFACTURING SAME, AND INTEGRATED CIRCUIT CHIP PACKAGE HAVING CAPACITOR COMPONENT
The present invention provides a capacitor component which is suitable for a high frequency environment and capable of being miniaturized, a method for manufacturing same, and an integrated circuit chip package having the capacitor component. The capacitor component comprises: a positive electrode oxide film body having a plurality of pores; a first wire metal layer provided on the inner walls of the pores; a dielectric layer provided on the first wire metal layer; a second wire metal layer provided on the dielectric layer; and a lower common electrode layer connected to the first wire metal layer, under the body.
H10N 97/00 - Dispositifs électriques à l’état solide à film mince ou à film épais, non prévus ailleurs
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
Proposed are an electrically conductive contact pin formed by stacking a plurality of metal layers and a manufacturing method therefor, in which the electrically conductive contact pin has improved physical or electrical characteristics.
G01R 3/00 - Appareils ou procédés spécialement adaptés à la fabrication des appareils de mesure
G01R 31/02 - Essai des appareils, des lignes ou des composants électriques pour y déceler la présence de courts-circuits, de discontinuités, de fuites ou de connexions incorrectes de lignes
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
57.
CAPACITOR COMPONENT AND INTEGRATED CIRCUIT CHIP PACKAGE INCLUDING SAME
The present invention provides a high-capacitance capacitor component and an integrated circuit chip package including same, the component comprising: an anodic oxide film body including a plurality of pores; a first electrode layer including a first surface electrode part formed on the surface of the body and a first pore electrode part formed on the inner wall of the pore; a dielectric layer including a surface dielectric part formed on the first surface electrode part and a pore dielectric part formed on the first pore electrode part; and a second electrode layer including a second surface electrode part formed on the surface dielectric part and a second pore electrode part formed on the pore dielectric part.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
Proposed are a metal part used in a display or semiconductor manufacturing process and a process chamber having the part. More particularly, proposed are a metal part that enables a film of uniform thickness to be formed on a surface of a substrate to be processed due to high emissivity thereof, and a process chamber having the same.
H01J 37/32 - Tubes à décharge en atmosphère gazeuse
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
C25D 11/18 - Post-traitement, p. ex. bouchage des pores
60.
Electrically conductive contact pin and manufacturing method therefor
Proposed are an electrically conductive contact pin formed by stacking a plurality of metal layers and a manufacturing method therefor, in which unintentional deformation of the electrically conductive contact pin is prevented by concentrating a pressing force pressing the electrically conductive contact pin on a tip portion having a relatively small cross-sectional area.
The present invention provides a membrane-electrode assembly for a fuel cell, and a fuel cell comprising same, wherein the cross-sectional area for reaction activation can be increased compared to the prior art, and the reaction area can be made uniform for each product compared to the prior art by making reaction gases (H2 and O2) undergo an ionization process while reacting with catalyst material, provided on the inner walls of regularly arranged pores, while moving through channels following the pores.
The present invention provides an electro-conductive pin and a test device including same, which have improved test reliability with respect to a test object, the electro-conductive pin having an overall length dimension (L) in the longitudinal direction (±y direction), an overall thickness dimension (H) in the thickness direction perpendicular to the longitudinal direction (±z direction), and an overall width dimension (W) in the width direction perpendicular to the longitudinal direction (±x direction) and comprising: a first connection portion including a first contact portion and flange portions extending downwardly from both sides of the first contact portion; a second connection portion including a second contact portion and support portions which extend upwardly from both sides of the second contact portion and are located outside the flange portions; and an elastic portion connected to the first contact portion and the second contact portion to relatively displace the first contact portion and the second contact portion with respect to each other.
Proposed is an electrically conductive contact pin, including a pin portion including a first contact portion, a second contact portion, and an elastic portion between the first contact portion and the second contact portion, a fixing portion provided outside the pin portion, and a connecting portion provided between the pin portion and the fixing portion to connect the pin portion and the fixing portion to each other.
The present invention provides an electroconductive contact pin that has a size that is clearly distinguishable from a surrounding structure and forms a diffused-reflection surface during vision inspection, allowing the location of a tip portion to be accurately recognized by a vision inspection device.
The present invention provides a micro metal molded article in which the magnetic areas and conductive areas are separated such that when the magnetic parts of adjacent micro metal molded articles are oriented by magnetic lines of force, the conductive parts of the adjacent micro metal molded articles are also oriented towards each other.
G01R 1/04 - BoîtiersOrganes de supportAgencements des bornes
H01F 1/04 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
G01R 3/00 - Appareils ou procédés spécialement adaptés à la fabrication des appareils de mesure
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
66.
Test device capable of testing micro LED and manufacturing method thereof
Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and/or a pitch distance ranging from 1 to 100 micrometers (μm).
Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.
Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
An electrically conductive contact pin which prevents a fatigue fracture in a void part by distributing stress concentration in the void part is provided. The electrically conductive contact pin includes: a first surface; a second surface facing the first surface; a lateral surface for connecting the first surface and the second surface; and a void part formed inside the electrically conductive contact pin by passing through the first surface and the second surface along the length direction of the electrically conductive contact pin. The void part includes: a center void part; and an end void part communicating with the center void part and extending toward an end side of the electrically conductive contact pin, wherein the width of the end void part is narrower than the width of the center void part.
An inductor and a body part for an inductor are proposed. The inductor and the body part satisfy needs for miniaturization and low resistance and increase a value of inductance thereof.
Proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber. More particularly, proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber, wherein the metal part is installed in a process chamber used in a display or semiconductor manufacturing process or constitutes a part of the process chamber, and a large thickness of the thin film layer of the metal part for the process chamber is easily secured, thereby achieving an extended lifespan by preventing cracks of the metal part for the process chamber, while preventing outgassing due to pores.
C25D 11/12 - Anodisation en plusieurs étapes, p. ex. dans différents bains
C25D 11/04 - Anodisation de l'aluminium ou de ses alliages
C23C 16/44 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement
72.
ELECTRO-CONDUCTIVE CONTACT PIN AND TESTING DEVICE HAVING SAME
The present invention provides an electro-conductive contact pin and a testing device having same, the contact pin improving testing reliability for a test object, and generating a supportive force for eccentric pressure, thereby preventing excessive tilt deformation.
The present invention provides an electrically conductive contact pin and a method for manufacturing same, the electrically conductive contact pin comprising: a body portion composed of a plurality of metal layers stacked in a thickness direction; and a tip portion provided on at least one of a front end portion and a base end portion of the body portion, wherein the tip portion has dimensions smaller than the dimensions of the thickness direction of the body portion, and a metal layer constituting the tip portion is formed continuously of the same material as some of the metal layers constituting the body portion.
The present invention relates to an inductor and a method for manufacturing same and, specifically, to an inductor capable of minimizing eddy current losses and a method for manufacturing same.
H01F 27/245 - Noyaux magnétiques fabriqués à partir de tôles, p. ex. à grains orientés
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01F 17/00 - Inductances fixes du type pour signaux
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
75.
MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHOD USING SAME
A micro device, a micro device alignment apparatus, and an alignment method using the same are proposed. In a micro device that has to be aligned with at least any one surface of front and rear surfaces of the micro device when mounted on a substrate and simultaneously be aligned with any one direction of the micro device when mounted on the substrate, there is provided the micro device, the micro device alignment apparatus, and the alignment method using the same so that surface alignment and direction alignment are simultaneously performed for a plurality of micro devices that is not aligned with at least any one surface of the front and rear surfaces and simultaneously is not aligned with any one direction.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
The present invention relates to an electrically conductive contact pin provided with an elastic portion, wherein the elastic portion includes: a plurality of straight portions; and a plurality of curved portions connecting the straight portions adjacent to each other above and below, and further includes a slit portion for dividing the curved portions into split beam portions, a stopper for limiting an elastic deformation position, or a groove portion for forming a cut portion on the inner surface of the curved portions. The purpose of the present invention is to improve the inspection reliability of an inspection object and to prevent damage to the inspection object by facilitating elastic deformation.
The present invention relates to an electroconductive contact pin, and the objective of the present invention is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized film material so that deformation of the electroconductive contact pin is prevented, and being capable of effectively improving current carrying capacity.
Proposed are an electrically conductive contact pin, a method for manufacturing the same, an inspection apparatus, a method for manufacturing a molded product, and a molded product manufactured thereby. More specifically, proposed are: a method for manufacturing an electrically conductive contact pin, the method including the steps of providing an anodic aluminum oxide mold made of an anodic aluminum oxide film and having openings formed by etching at least partial regions of the anodic aluminum oxide mold to correspond to a shape of electrically conductive contact pins, forming a metal filler in each of the openings, and removing the anodic aluminum oxide mold; an electrically conductive contact pin including at least one micro-convex portion and a plurality of fine trenches; an inspection apparatus; a method for manufacturing a molded product; and a molded product manufactured thereby.
G01R 1/04 - BoîtiersOrganes de supportAgencements des bornes
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
H01R 43/16 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour la fabrication des pièces de contact, p. ex. par découpage et pliage
79.
ELECTRO-CONDUCTIVE CONTACT PIN AND INSPECTION DEVICE INCLUDING SAME
The present invention provides an electro-conductive contact pin which can implement a narrow-pitch and an inspection device including same. Furthermore, the present invention provides an electro-conductive contact pin which uses a guide housing formed to have consistent thickness overall, including a portion corresponding to a lower part of an interference member and prevents damage due to interference with the interference member, and an inspection device including same.
Proposed are an inductor and a manufacturing method thereof. More particularly, proposed are an inductor capable of mass production by simplifying the manufacturing process while satisfying the needs for miniaturization and low resistance, and a manufacturing method thereof.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
81.
ELECTRO-CONDUCTIVE CONTACT PIN AND INSPECTION DEVICE INCLUDING SAME
The present invention provides an electro-conductive contact pin and an inspection device with improved inspection reliability with respect to an object to be inspected. The electro-conductive contact pin, comprising: a metal body part including a first connection part, a second connection part and a metal elastic part for connecting the first connection part and the second connection part; and an elastic insulation material, comprises: a first connection area including the first connection part; a second connection area including the second connection part; and an elastic area including the metal elastic part, wherein at least one from among the first connection area, the second connection area and the elastic area includes the elastic insulation material.
The present invention provides an anodized film structure and an inspection device comprising same, the structure protecting perforated holes through protective layers, thereby improving the mechanical and/or electrical characteristics of the inner wall of the perforated holes. In the anodized film structure, parylene-type protective layers are formed to have uniform thickness on the inner walls of the perforated holes and on the surface of bodies made of an anodized film material. Micro-trenches, in which peaks and valleys are repeatedly provided, are formed on the inner walls of the perforated holes, and the protective layers cover all of the micro-trenches. In addition, metal layers are provided between the surface of the bodies and the protective layers of the inner walls of the perforated holes.
The present invention provides a metal molded article, a manufacturing method therefor, and an inspection device having same, enabling having high reliability and degree of freedom in shape, improving inspection reliability for an inspected object, and enabling the metal molded article, produced using a MEMS process, to have a sufficient thickness, thereby enabling the prevention of buckling in an undesired direction from easily occurring.
G01R 3/00 - Appareils ou procédés spécialement adaptés à la fabrication des appareils de mesure
84.
Anodized film substrate base, anodized film substrate part having same, anodized film-based interposer having same, and semiconductor package having same
The present invention relates to an anodized film substrate base made of an anodized oxide film, an anodized film substrate part including a vertical conductive part provided inside the anodized film substrate base, an anodized film-based interposer having same, and a semiconductor package having same.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/32 - Supports pour maintenir le dispositif complet pendant son fonctionnement, c.-à-d. éléments porteurs amovibles
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/525 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées avec des interconnexions modifiables
H01L 23/528 - Configuration de la structure d'interconnexion
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
85.
ELECTRICALLY CONDUCTIVE CONTACT PIN, ALIGNMENT PLATE, AND INSPECTION APPARATUS COMPRISING SAME
The present invention provides: an electrically conductive contact pin having improved inspection reliability with respect to an inspection target; an alignment plate; and an inspection apparatus. In addition, in the alignment plate, on which the electrically conductive contact pin is installed, the electrically conductive contact pin and/or the alignment plate are/is prevented from being damaged by a pressing force applied to the electrically conductive contact pin.
The present invention relates to an inductor and a manufacturing method therefor, and, particularly, the objective of the present invention is to provide an inductor and a manufacturing method therefor, the inductor satisfying needs of small size and low resistance and, simultaneously, having a simplified manufacturing process such that mass production thereof is possible.
The present invention provides: an electrically conductive contact pin that enhances inspection reliability for an inspection object; and an inspection device including same. In addition, the present invention provides: an electrically conductive contact pin for preventing a connection object from being damaged when in contact with the connection object and compressed; and an inspection device including same.
The present invention provides an electrically conductive contact pin which improves the reliability of a test for an object, and of which the amount of compression is limited by a stopper unit.
The invention provides an electrically conductive contact pin that improves test reliability for a test object and prevents separation in a side opening direction of a guide hole due to a lower catch portion.
MICRO ELEMENT CARRIER AND MICRO ELEMENT TRANSFER SYSTEM INCLUDING SAME, AND MANUFACTURING METHOD FOR ELECTRONIC PRODUCT IN WHICH MICRO ELEMENT IS MOUNTED
A microelement transfer system includes a microelement carrier. The microelement carrier includes a first plate, a second plate, and a microelement support. The first plate has a plurality of first through-holes corresponding to respective microelements. The second plate is provided on the first plate and has a second through-hole having a smaller inner diameter than that of the first through-hole. At least one of the first plate and the second plate is made of an anodic oxide film material. The microelement support includes a carrier substrate on which the microelements are temporarily fixed. The microelement transfer system relatively moves at least one of the microelement carrier and the microelement support in at least one direction so that each of the microelements comes into contact with a side wall of a corresponding one of the first through-holes and detaches to be released from the temporarily fixed state.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
The present invention relates to an electrically conductive contact pin comprising: a first connection part; a second connection part; a support part extending in the longitudinal direction; an elastic part, which is connected to at least one of the first connection part and the second connection part and can be elastically deformed in the longitudinal direction; and a deformation prevention part extending in the longitudinal direction between the support part and the elastic part, wherein, when pressing force for compressing the elastic part behaves eccentrically, the deformation prevention part comes in contact with the support part so as to be supported by the support part, and thus buckling deformation of the elastic part in the left and right directions is prevented.
The present invention relates to micro bumps for bonding a semiconductor device and a substrate and a manufacturing method thereof, wherein the micro bumps can easily bond a micro unit semiconductor device to a substrate, and can be easily mass-produced in a micro size.
The present invention provides an electro-conductive contact pin and an inspection device having improved inspection reliability with respect to an object to be inspected. In addition, the present invention provides an electro-conductive contact pin and an inspection device for preventing damage of an elastic part in an inspection device which adopts a terminal guide film and preventing separation thereof from an installation member.
The present invention provides an electrically conductive contact pin which improves the reliability of a test for a subject, and is prevented from departure from a guide plate.
The present invention provides an electrically conductive contact pin for a Kelvin test and a test device comprising same, which can cope with the narrower pitch between electrodes of a semiconductor device.
G01R 27/02 - Mesure de résistances, de réactances, d'impédances réelles ou complexes, ou autres caractéristiques bipolaires qui en dérivent, p. ex. constante de temps
The present invention provides an anodic oxidation film structure and a manufacturing method therefor, the anodic oxidation film structure comprising: a body made of an anodic oxidization film obtained by anodic oxidation on a parent metal and then removing the parent metal; a through-hole which is formed through the body and has a larger inner width than that of a pore formed during the anodic oxidation; and a metal layer provided on the inner wall of the through-hole, and thus improving the mechanical and/or electrical characteristics of the inner wall of the through-hole.
Proposed is a micro bump array capable of more effectively transporting a micro bump, the micro bump being capable of coping with a narrow pitch between terminals and being capable of preventing increases in current density and thermal energy density at a bump connection portion.
Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.
The present invention provides an electrically conductive contact pin and an inspection device having improved inspection reliability for an inspection object. The electrically conductive contact pin is characterized in that a first connection portion contacts a support portion to form a current path when a first elastic portion is compressed, and a second connection portion contacts the support portion to form a current path when a second elastic portion is compressed. The inspection device comprises an installation member having a through hole for receiving the electrically conductive contact pin.
Proposed are a probe head for testing, through a probe, a pattern formed on a wafer, and a probe card having the same. More particularly, proposed are a probe head in which formation of a guide hole into which a probe is inserted and insertion of the probe therein are facilitated, and a probe card having the same.
