A method of performing contact tracing of persons on a network is provided. The method includes obtaining temperature data comprising one or more temperature readings for a first person associated with a first sensor assembly of a plurality of sensor assemblies on the network. The method includes determining whether the one or more temperature readings for the first person exceeds a threshold temperature. Responsive to determining the one or more temperature readings exceeds the threshold temperature, the method includes determining, by the one or processors, whether a second sensor assembly of the plurality of sensor assemblies is within a predetermined proximity of the first sensor assembly. Responsive to determining the second sensor assembly is within the predetermined proximity of the first sensor assembly, the method includes providing a notification indicative of a second person associated with the second sensor assembly being within the predetermined proximity of the first person.
H04W 4/029 - Services de gestion ou de suivi basés sur la localisation
G16H 50/80 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour la détection, le suivi ou la modélisation d’épidémies ou des pandémies, p. ex. de la grippe
H04W 4/80 - Services utilisant la communication de courte portée, p. ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie
2.
System and Method for Performing Contact Tracing Based on Temperature Measurements
A method of performing contact tracing of persons on a network is provided. The method includes obtaining temperature data comprising one or more temperature readings for a first person associated with a first sensor assembly of a plurality of sensor assemblies on the network. The method includes determining whether the one or more temperature readings for the first person exceeds a threshold temperature. Responsive to determining the one or more temperature readings exceeds the threshold temperature, the method includes determining, by the one or processors, whether a second sensor assembly of the plurality of sensor assemblies is within a predetermined proximity of the first sensor assembly. Responsive to determining the second sensor assembly is within the predetermined proximity of the first sensor assembly, the method includes providing a notification indicative of a second person associated with the second sensor assembly being within the predetermined proximity of the first person.
G01K 13/20 - Thermomètres médicaux par contact pour les humains ou les animaux
G01K 13/02 - Thermomètres spécialement adaptés à des fins spécifiques pour mesurer la température de fluides en mouvement ou de matériaux granulaires capables de s'écouler
G08B 5/38 - Systèmes de signalisation optique, p. ex. systèmes d'appel de personnes, indication à distance de l'occupation de sièges utilisant une transmission électriqueSystèmes de signalisation optique, p. ex. systèmes d'appel de personnes, indication à distance de l'occupation de sièges utilisant une transmission électromécanique utilisant des sources de lumière visible utilisant une lumière clignotante
G08B 3/10 - Systèmes de signalisation audibleSystèmes d'appel sonore de personnes utilisant une transmission électriqueSystèmes de signalisation audibleSystèmes d'appel sonore de personnes utilisant une transmission électromagnétique
3.
CIRCULARLY POLARIZED ARRAY ANTENNA FOR MILLIMETER WAVE COMMUNICATIONS
A circularly polarized array antenna is provided. The circularly polarized array antenna includes a ground plane and a plurality of circularly polarized antennas. Each of the circularly polarized antennas is configured to communicate over a frequency band ranging from 24 gigahertz (GHz) to 52 GHz. Each of the circularly polarized antennas includes a column substrate coupled to the ground plane. The column substrate includes a plurality of faces. Each of the circularly polarized antennas further includes a plurality of isolated magnetic dipole elements. Each of the isolated magnetic dipole elements is disposed on a different face of the column substrate.
H01Q 3/36 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier la phase par des moyens électriques avec des déphaseurs variables
H01Q 5/378 - Combinaison d’éléments alimentés et d’éléments passifs
H01Q 7/00 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre
H01Q 9/26 - Antennes résonnantes avec alimentation intermédiaire entre les extrémités de l'antenne, p. ex. dipôle alimenté par le centre avec élément replié ou éléments repliés, les parties repliées étant espacées l'une de l'autre d'une petite fraction de la longueur d'onde émise
H01Q 21/24 - Combinaisons d'unités d'antennes polarisées dans des directions différentes pour émettre ou recevoir des ondes polarisées circulairement ou elliptiquement ou des ondes polarisées linéairement dans n'importe quelle direction
H01Q 3/28 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier l'amplitude
An electrical contact includes a base having a first edge and a second edge opposite the first edge. The base is configured to electrically connect with a first electrical component. The electrical contact also includes a first section extending from the first edge and a second section extending from the second edge and including a contact portion to electrically connect with a second electrical component. The second section further includes a pre-load shelf configured to engage with the first section to electrically connect the first electrical component to the second electrical component.
A wideband phased array antenna is provided. The wideband phased array antenna includes a plurality of antenna cells. Each of the antenna cells is configured to communicate over a frequency band ranging from 24 GHz to 52 GHz. Furthermore, one or more of the antenna cells includes a driven element and a parasitic element. The driven element is disposed on a first substrate that includes a first dielectric material. The parasitic element is disposed on a second substrate positioned relative to the first substrate such that a gap is defined between the first substrate and the second substrate. The second substrate includes a second dielectric material that is different than the first dielectric material.
A phased array antenna is provided. The phased array antenna includes an array of antenna cells disposed on a substrate. Each of the antenna cells is configured to communicate on a frequency band ranging from 24 gigahertz (GHz) to 52 GHz. Furthermore, one or more of the antenna cells includes a multi-mode antenna configurable in a plurality of antenna modes. Each of the antenna modes has a distinct radiation pattern. When the multi-mode antenna is configured in a first antenna mode of the plurality of antenna modes, the phased array antenna has a first radiation pattern. Conversely, the phased array antenna has a second radiation pattern that is different than the first radiation pattern when the multi-mode antenna is configured in a second antenna mode of the plurality of antenna modes.
H01Q 3/36 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier la phase par des moyens électriques avec des déphaseurs variables
A phased array antenna is provided. The phased array antenna includes an array of antenna cells disposed on a substrate. Each of the antenna cells is configured to communicate on a frequency band ranging from 24 gigahertz (GHz) to 52 GHz. Furthermore, one or more of the antenna cells includes a multi-mode antenna configurable in a plurality of antenna modes. Each of the antenna modes has a distinct radiation pattern. When the multi-mode antenna is configured in a first antenna mode of the plurality of antenna modes, the phased array antenna has a first radiation pattern. Conversely, the phased array antenna has a second radiation pattern that is different than the first radiation pattern when the multi-mode antenna is configured in a second antenna mode of the plurality of antenna modes.
H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles
H01Q 3/24 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier l'orientation, par commutation de l'énergie fournie, d'un élément actif rayonnant à un autre, p. ex. pour commutation du lobe
H01Q 3/30 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier la phase
A capacitor that is capable of exhibiting good electrical properties under a wide variety of different conditions is provided. The capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric and includes a conductive polymer. The capacitor also contains multiple exposed anode lead portions that are electrically connected to respective anode terminations and a planar cathode termination that is electrically connected to the solid electrolyte.
This disclosure provides a method and apparatus for a single pair Ethernet (SPE) wire-to-board connector. The SPE connector may include a female connector portion and a male connector portion. The female connector portion may include a first electrical contact having a first press-fit pin and a first female portion, a second electrical contact having a second press-fit pin and a second female portion, and a first outer shield, the first outer shield mechanically secured to the first insulative housing. The first and second electrical contacts may be positioned partially within the first insulative housing. The male connector portion includes a third electrical contact comprising a first insulation displacement contact (IDC) portion and a first male portion, a fourth electrical contact comprising a second IDC portion and a second male portion, and a second outer shield, the second outer shield mechanically secured to a second insulative housing.
A capacitor that comprises a capacitor element is provided. The capacitor element comprises a deoxidized and sintered anode body that is formed from a powder having a specific charge of about 35,000 μF*V/g or more. Further, a dielectric overlies the anode body and a solid electrolyte overlies the dielectric. The capacitor also exhibits a normalized aged leakage current of about 0.1% or less.
A method for distributing over the air (OTA) content is provided. The method includes detecting connection of an OTA antenna system capable of receiving an OTA signal including media content at a plurality of channels to a network access point via the removable connection. The method includes communicating a control signal from a network access point to the OTA antenna system via a removable connection to configure a modal antenna of the OTA antenna system in a selected mode of a plurality of antenna modes for a selected channel of the plurality of channels. The method includes receiving a signal associated with media content of the selected channel from the OTA antenna system via the removable connection. The method includes communicating the media content of the selected channel via a network communication link to a client device.
H04B 7/08 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station de réception
12.
SYSTEM AND METHOD FOR CONFIGURING A MULTI-MODE ANTENNA BASED ON NETWORK PERFORMANCE INDICATORS FOR A WIRELESS NETWORK
A system for configuring a multi-mode antenna onboard one or more of a plurality of network devices on a wireless network is provided. The system includes one or more processors configured to obtain data indicative of a channel quality indicator associated with one or more antenna modes of a plurality of antenna modes in which the multi-mode antenna onboard one or more of the network devices is configurable. Each of the plurality of antenna modes can have a distinct radiation pattern. The one or more processors can be configured to determine one or more network performance indicators for the wireless network based on the data. The one or more processors can be configured to provide one or more control signals over the wireless network based on the one or more network performance indicators. The control signal(s) can be associated with reconfiguring an antenna mode of the multi-mode antenna.
H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
H04B 7/08 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station de réception
13.
TEMPERATURE SENSOR ASSEMBLY FACILITATING BEAM STEERING IN A TEMPERATURE MONITORING NETWORK
A temperature sensor assembly can include a first temperature sensor that can be configured to obtain a first temperature measurement of a user. The temperature sensor assembly can further include a second temperature sensor that can be configured to obtain a second temperature measurement of the user. The temperature sensor assembly can further include one or more processors that can be configured to determine a third temperature measurement indicative of a temperature of the user based at least in part on the first temperature measurement and the second temperature measurement. The temperature sensor assembly can further include a base station communication antenna system that can include a modal antenna that can be configured to communicate the third temperature measurement with a base station based at least in part on a beam steering operation.
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/01 - Mesure de la température de parties du corps
G16H 50/80 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour la détection, le suivi ou la modélisation d’épidémies ou des pandémies, p. ex. de la grippe
A system for balancing ultracapacitors is provided. The system includes a balancing capacitor and a plurality of switching devices. The system further includes a control circuit. The control circuit is communicatively coupled to each of the plurality of switching devices. The control circuit is configured to control operation of a first pair of the switching devices to couple the balancing capacitor across a first ultracapacitor of a plurality of ultracapacitors to transfer electrical charge from the first ultracapacitor to the balancing capacitor. The control circuit is further configured to control operation of a second pair of the switching devices that is different than the first pair to couple the balancing capacitor across a second ultracapacitor of the plurality of ultracapacitors to transfer at least a portion of the electrical charge from the balancing capacitor to the second ultracapacitor.
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric, wherein the solid electrolyte includes a conductive polymer layer, and a moisture barrier that overlies the conductive polymer layer.
A method for monitoring one or more characteristics of an ultracapacitor is provided. The method includes obtaining a plurality of voltage measurements. Each of the voltage measurements can be obtained sequentially at one of a plurality of intervals. Furthermore, each of the voltage measurements can be indicative of a voltage across the ultracapacitor. The method can include determining an actual voltage step of the ultracapacitor based on two consecutive voltage measurements of the plurality of voltage measurements. The method can further include determining whether the actual voltage step exceeds a threshold voltage step of the ultracapacitor. Furthermore, in response to determining the actual voltage step exceeds the threshold voltage, the method can include providing a notification associated with performing a maintenance action on the ultracapacitor.
G01R 19/165 - Indication de ce qu'un courant ou une tension est, soit supérieur ou inférieur à une valeur prédéterminée, soit à l'intérieur ou à l'extérieur d'une plage de valeurs prédéterminée
G01R 27/02 - Mesure de résistances, de réactances, d'impédances réelles ou complexes, ou autres caractéristiques bipolaires qui en dérivent, p. ex. constante de temps
An ultracapacitor assembly is provided. The ultracapacitor assembly includes a plurality of ultracapacitors. The ultracapacitor assembly further includes a first bus bar and a second bus bar. The second bus bar is spaced apart from the first bus bar. The ultracapacitor assembly includes a discharge resistor coupled between the first bus bar and the second bus bar. The ultracapacitor assembly further includes a first plurality of switching devices and a second plurality of switching devices. Each switching device in the first plurality of switching devices is coupled between the first bus bar and a corresponding ultracapacitor of the plurality of ultracapacitors to selectively couple the corresponding ultracapacitor the discharge resistor via the first bus bar. Each switching device in the second plurality of switching devices is coupled between the second bus bar and a corresponding ultracapacitor to selectively couple the corresponding ultracapacitor the discharge resistor via the second bus bar.
H01G 11/26 - Électrodes caractérisées par leur structure, p. ex. multicouches, selon la porosité ou les caractéristiques de surface
H01G 11/08 - Combinaisons structurelles, p. ex. assemblage ou connexion de condensateurs hybrides ou EDL avec d’autres composants électriques, au moins un condensateur hybride ou EDL étant le composant principal
A filter can include a monolithic substrate and at least one conductive layer formed over a top surface of the monolithic substrate and along at least a portion of one or more of a first top edge of the monolithic substrate or a second top edge of the monolithic substrate. A cover layer can be arranged over the top surface of the monolithic substrate. A shield layer can connect with one or more of the conductive layer(s) at the first top edge or the second top edge of the monolithic substrate. The shield layer can include a first portion formed over the first side surface of the cover layer, a second portion formed over the top surface of the cover layer, and a third portion formed over the second side surface of the cover layer.
An antenna system can include an antenna array having a plurality of antenna elements. The antenna system can include an array controller configured to control operation of the antenna array for beam forming of the antenna array. The antenna system can include a radiofrequency circuit. The antenna system can include a transmission line coupling the radiofrequency circuit to the array controller. The transmission line can be configured to carry a radio-frequency signal to the antenna array. The radiofrequency circuit can be configured to modulate an antenna array control signal onto the radiofrequency signal to generate a transmit signal for communication over the transmission line to the array controller. The array controller can be configured to demodulate the antenna array control signal from the transmit signal such that the array controller is configured to control operation of the antenna array based at least in part on the antenna array control signal.
H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles
H01Q 3/26 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante
A component array can include a first multilayer ceramic component having a first terminal at a first end and a second terminal at a second end opposite the first end in a first direction. A second component can have a first terminal at a first end and a second terminal at a second end opposite the first end in the first direction. A heat sink layer can be arranged between the first component and the second component in a second direction that is perpendicular to the first direction. The heat sink layer can include a first metallization layer electrically connecting the first terminal of the first multilayer ceramic component with the first terminal of the second multilayer ceramic component and a second metallization layer electrically connecting the second terminal of the first multilayer ceramic component with the second terminal of the second multilayer ceramic component.
A method of screening a lot of capacitors is provided. The method includes measuring a first leakage current of each individual capacitor in a first set of capacitors and calculating a first mean leakage current; removing each of the individual capacitors having a measured first leakage current equal to or above a first predetermined value, forming a second set of capacitors; subjecting the second set of capacitors to a burn in treatment; measuring a second leakage current for each of the individual capacitors in the second set and calculating a second mean leakage current; comparing the second leakage current for each of the individual capacitors to the first leakage current for each of the individual capacitors; and removing each of the individual capacitors having a second leakage current equal to or above a second predetermined value and/or having a second leakage current that does not change by a specified amount compared to the first leakage current for each of the individual capacitors.
G01R 31/52 - Test pour déceler la présence de courts-circuits, de fuites de courant ou de défauts à la terre
G01R 27/26 - Mesure de l'inductance ou de la capacitanceMesure du facteur de qualité, p. ex. en utilisant la méthode par résonanceMesure de facteur de pertesMesure des constantes diélectriques
22.
SYSTEM AND METHOD FOR SURFACING CHANNEL QUALITY INDICATOR (CQI) DATA ASSOCIATED WITH A MULTI-MODE ANTENNA
A method for surfacing data indicative of a channel quality indicator (CQI) associated with a multi-mode antenna of a first device is provided. The method includes obtaining data indicative of the CQI while the multi-mode antenna is configured in each of a plurality of antenna modes. Each of the plurality of antenna modes has a distinct radiation pattern. The method includes determining one of the plurality of antenna modes as a selected antenna mode for the multi-mode antenna based, at least in part, on the data indicative of the CQI. The method includes providing the data indicative of the CQI associated with one or more antenna modes of the plurality of antenna modes to a second device that is separate from the first device.
H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
H04B 7/0404 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées la station mobile comprenant plusieurs antennes, p. ex. pour mettre en œuvre une diversité en voie ascendante
A contact for a wire-to-wire electrical connector includes a first contact portion defining a first wire receiving opening to receive a first wire and a second wire receiving opening to receive a second wire. The contact further includes a splice contact portion abutting the first contact portion and defining a third wire receiving opening to receive a third wire. The first contact portion also includes a first plurality of contact tines to electrically connect the first wire and the second wire and the splice contact portion includes a second plurality of contact tines to electrically connect the third wire to the first wire and the second wire.
H01R 13/422 - Fixation de manière démontable sur un socle ou dans un boîtier flexible en une seule pièceSocle ou boîtier en une seule pièce comportant des moyens de verrouillage élastiques
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
An antenna assembly can be configured for RF communications. The antenna assembly can include a ground plane disposed on a substrate. The antenna assembly can include a patch antenna structure spaced apart from the ground plane. The antenna assembly can include one or more grounded posts coupled to and extending from the substrate. The one or more grounded posts can be arranged along at least a portion of a periphery of the patch antenna structure. The patch antenna structure can emit a radiation pattern based at least in part on a transmit signal. The radiation pattern can induce a resultant field in the one or more grounded posts to adjust a characteristic of the radiation pattern.
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a pre-coat that overlies the dielectric, and a solid electrolyte that overlies the pre-coat. The solid electrolyte includes a conductive polymer having repeating units derived from an aniline monomer having the general formula (I).
An antenna system is provided. The antenna system includes a modal antenna disposed on a circuit board. The modal antenna includes a driven element and a parasitic element. The modal antenna is operable in a plurality of different modes. Each of the plurality of modes has a distinct radiation pattern. The antenna system further includes a radio frequency amplifier circuit disposed on the circuit board. The radio frequency amplifier circuit is coupled between the drive element of the modal antenna and a transmission line.
A laser direct structure (LDS) antenna assembly is provided. The LDS antenna assembly includes a carrier having a first portion formed from a first resin and a second portion formed from a second resin that is different than the first resin. The LDS antenna assembly further includes an LDS antenna disposed on the carrier. The LDS antenna assembly includes a component coupled to the LDS antenna via a connection point positioned on a surface of the first portion of the carrier such that the component is in electrical communication with the LDS antenna via the connection point.
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains an anode body, a dielectric that overlies the anode body, a pre-coat that overlies the dielectric and that is formed from an organometallic compound, and a solid electrolyte that overlies the dielectric. The solid electrolyte includes an intrinsically conductive polymer containing repeating thiophene units of a certain formula.
H01G 9/028 - Électrolytes organiques semi-conducteurs, p. ex. TCNQ
H01B 1/12 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques substances organiques
C07F 7/08 - Composés comportant une ou plusieurs liaisons C—Si
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains an anode body that contains tantalum, a dielectric that overlies the anode body; and a solid electrolyte that overlies the dielectric. The solid electrolyte includes an intrinsically conductive polymer containing repeating thiophene units. Further, the capacitor exhibits a dielectric strength of about 0.6 volts per nanometer or more. The capacitor also exhibits a charge-discharge capacitance after being subjected to 3,000 cycles of a surge voltage and an initial capacitance prior to being subjected to the surge voltage, wherein the ratio of the charge-discharge capacitance to the initial capacitance is from about 0.75 to 1.
A wire termination device for coupling a wire to a feedthrough device is disclosed. The wire termination device can include a housing having a first end and a second end spaced apart from the first end in a longitudinal direction. The housing can define a cavity and an opening to the cavity at the first end for receiving a pin of the feedthrough device. The pin of the feedthrough device can extend in the longitudinal direction. The wire termination device can include a retention member coupled to the housing and located at least partially within the opening of the housing. The retention member can be configured to engage the pin of the feedthrough device to retain the pin of the feedthrough device in the opening of the housing.
A communication system for point to multipoint communications by grouping client devices based on associated modes is provided. In one example implementation, point to multipoint communication improvements are achieved by grouping a plurality of client devices by their optimal modes for communication. For example, the communication system can determine, based on channel quality indicators (CQIs) that two client devices of a plurality of client devices are associated with an optimal first mode of a modal antenna. The system can group the two client devices into a first group, the first group associated with communication using the first mode of the modal antenna. The modal antenna can communicate with the first group using the first mode of a modal antenna during a single frame of communication.
H04W 16/28 - Structures des cellules utilisant l'orientation du faisceau
H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
A biosensor having somatic cells immobilized on an electrode formed from a biologically inert material for sensing transepithelial/transendothelial electrical resistance is provided. The biosensor includes a working electrode formed from gold, graphene, carbon nanotube, or alloys or combinations thereof, having somatic cells formed directly thereon. With such a configuration, a very small sample size may be used while still eliciting an electrical response in the presence of a target composition.
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/525 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées avec des interconnexions modifiables
33.
SOLID ELECTROLTYIC CAPACITOR FOR USE AT HIGH VOLTAGES
A capacitor that is capable of exhibiting good electrical properties even under a variety of conditions is provided. More particularly, the capacitor contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. The solid electrolyte contains an inner layer and an outer layer, wherein the inner layer is formed from an in situ-polymerized conductive polymer and the outer layer is formed from pre-polymerized conductive polymer particles. Further, the in-situ polymerized conductive polymer is formed from an alkylated thiophene monomer.
A solid electrolytic capacitor comprising a capacitor element, anode lead extending from a surface of the capacitor element, an anode termination that is in electrical connection with the anode lead, a cathode termination that is in electrical connection with the solid electrolyte, and a casing material that encapsulates the capacitor element and anode lead is provided. A barrier coating is disposed on at least a portion of the anode termination and/or cathode termination and is in contact with the casing material. The coating contains a hydrophobic resinous material that includes an olefin polymer having a glass transition temperature of from about 20°C to about 160°C.
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
35.
METHOD FOR ESTIMATING A TRANSMIT SIGNAL CHANNEL QUALITY INDICATOR BASED ON A RECEIVE SIGNAL CHANNEL QUALITY INDICATOR
A method for controlling operation of a multi-mode antenna is provided. The multi-mode antenna is configurable in a plurality of modes, and each mode associated with a different radiation pattern or polarization. The method includes receiving, at the multi-mode antenna a first RF signal. The method further obtaining, by one or more control devices, data indicative of a receive signal channel quality indicator for the first RF signal. The method includes configuring, by the one or more control device, the multi-mode antenna for transmitting a second RF signal in a selected mode of the plurality of modes based, at least in part, on the data indicative of the receive signal CQI. The method further includes transmitting, by the multi-mode antenna the second RF signal while the multi-mode antenna is configured in the selected mode.
H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
H04B 1/401 - Circuits pour le choix ou l’indication du mode de fonctionnement
An antenna system is provided. In one example, the system includes a modal antenna having a driven element and a parasitic element. The system includes a radio frequency circuit. The system includes a transmission line coupling the radio frequency circuit to the modal antenna. The radio frequency circuit is configured to modulate a control signal onto an RF signal to generate a transmit signal for communication over the transmission line to the tuning circuit. The control signal can include a frame having a plurality of bits associated with the selected mode of the antenna. The radio frequency circuit is configured to encode the plurality of bits associated with the selected mode in accordance with a coding scheme. The coding scheme specifies a unique code for each mode of the plurality of modes. The unique code for each mode of the plurality of modes differs by at least two bits relative to the unique code for each other mode of the plurality of modes.
Antenna systems are provided. In one example, an antenna system includes a first antenna array having a plurality of first antenna elements. The first antenna elements are operable to communicate one or more signals via a communication protocol tin a multiple input multiple output (MIMO) mode. The antenna system includes a second antenna array having a plurality of second antenna elements. The antenna system includes a control circuit configured to control operation of one or more of the second antenna elements of the second antenna array in a first mode or a second mode. In the first mode, one or more of the second antenna elements are configured to provide a secondary function to support communication of the first antenna elements via the communication protocol. In a second mode. One or more of the second antenna elements are configured to support beam forming or beam steering of the first antenna elements.
H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
H04B 7/0408 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées utilisant plusieurs faisceaux, c.-à-d. diversité de faisceaux
38.
ACTIVE ANTENNA SYSTEM FOR DISTRIBUTING OVER THE AIR CONTENT
Systems and methods for distributing over the air (OTA) content are provided. In one example, an antenna system can include a network access point. The antenna system can include an OTA antenna system configured to receive an OTA signal associated with media content. The OTA signal can be a VHF signal or a UHF signal. The OTA antenna system can be coupled to the network access point via a universal serial bus (USB) connection. The access point can be configured to perform operations, including receiving a signal associated with the media content from the OTA antenna system via the universal serial bus connection; and communicating media content via a network communication link to one or more client devices. The OTA antenna system can include a modal antenna configurable in a plurality of antenna modes. Each antenna mode can be associated with a distinct radiation pattern or polarization.
H04N 5/46 - Circuits de réception pour la réception à volonté de plus d'un type de norme d'émission
H01Q 3/00 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne
An antenna assembly comprises a tube structure disposed on a circuit board, a helical antenna comprising a plurality of conductive traces disposed on a flexible substrate wrapped around the tube structure, and a phase shifter circuit coupled to a second side of the circuit board, the phase shifter circuit configured to provide a RF signal to the helical antenna such that an axial ratio of a radiation pattern associated with the helical antenna is less than 4 decibels when an elevation angle of the helical antenna is from about -25 degrees to about -40 degrees or from about 25 degrees to 40 degrees.
A solid electrolytic capacitor that comprises a capacitor element that contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric is provided. An anode lead wire extends from the capacitor element in a longitudinal direction, wherein the lead wire defines an external surface having a plurality of distinct recessed regions that are spaced apart along the longitudinal direction. A hydrophobic coating is disposed on at least a portion of the external surface of the anode lead wire. Further, an anode termination is in electrical connection with the anode lead wire and a cathode termination is in electrical connection with the solid electrolyte.
A solid electrolytic capacitor comprising a capacitor element is provided. The capacitor element comprises a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric and that includes conductive polymer particles. The anode body has an exterior surface that spans in a longitudinal direction to define a length of the anode body, wherein at least one channel is recessed into the exterior surface of the anode body. The channel is defined by opposing sidewalls that intersect at a base, wherein the channel has a width of from about 0.4 millimeters to about 3 millimeters and a depth of from about 50 micrometers to about 350 micrometers.
A solid electrolytic capacitor comprising a capacitor element is provided. The capacitor element comprises a sintered porous anode body; a dielectric that overlies the anode body; and a solid electrolyte that overlies the dielectric and that includes a conductive polymer and a depolarizer.
A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
A multilayer ceramic capacitor may include a monolithic body and interleaved first and second pluralities of electrodes extending from the first and second ends, respectively, of the monolithic body towards opposite ends of the monolithic body. A first margin distance and a second margin distance may be formed, respectively, between the electrodes and the opposite ends of the monolithic body. First and second external terminations may be respectively disposed along the first end and second end of the monolithic body and respectively connected with the first and second plurality of electrodes. A margin ratio between a length of the monolithic body and the first margin distance and/or second margin distance may be less than about 10. At least one of the first external termination or the second external termination may include a conductive polymeric composition.
An integrated component may include a multilayer capacitor include a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The integrated component may include a discrete varistor comprising a first external varistor termination connected with the first active termination and a second external varistor termination connected with the second active termination of the multilayer capacitor.
H01G 4/40 - Combinaisons structurales de condensateurs fixes avec d'autres éléments électriques non couverts par la présente sous-classe, la structure étant principalement constituée par un condensateur, p. ex. combinaisons RC
H01G 4/232 - Bornes pour la connexion électrique d'au moins deux couches d'un condensateur à empilement ou à enroulement
H01C 7/10 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants sensibles à la tension, p. ex. varistances
H01C 7/18 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants comprenant une pluralité de couches empilées entre les bornes
A low inductance component may include a multilayer, monolithic device including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The lead(s) may be coupled with the first active termination, second active termination, and/or the at least one ground termination. The lead(s) may have respective length(s) and maximum width(s). A ratio of the length(s) to the respective maximum width(s) of the lead(s) may be less than about 20.
H01G 4/40 - Combinaisons structurales de condensateurs fixes avec d'autres éléments électriques non couverts par la présente sous-classe, la structure étant principalement constituée par un condensateur, p. ex. combinaisons RC
H01C 7/10 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants sensibles à la tension, p. ex. varistances
H01C 7/18 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants comprenant une pluralité de couches empilées entre les bornes
A system including an electrical header connector assembly is provided. The electrical header connector assembly includes an insulated body with a mating body portion and a strain relief portion, a first self-shorting contact and a second self-shorting contact. Each self-shorting contact includes a contact tail with a wire receiving recess and a contact blade extending opposite and substantially parallel to the contact tail. Each self-shorting contact further includes a shorting beam extending opposite the contact tail. The shorting beam includes a curved portion extending away from the contact blade and a bent tip portion extending toward the contact blade. The shorting beam of the first self-shorting contact is configured to touch the shorting beam of the second self-shorting contact when the electrical header is in a neutral position.
H01R 13/703 - Association structurelle avec des composants électriques incorporés avec interrupteur incorporé actionné par l'engagement ou le retrait des pièces de couplage
H01R 13/516 - Moyens pour maintenir ou envelopper un corps isolant, p. ex. boîtier
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
This disclosure provides a method and apparatus for connecting wires and interlocking wires to an electrical component. More specifically, an electrical connector that includes an insulative housing, two electrical contacts, and two interlocking contacts is disclosed. In an embodiment, each electrical contact includes a female end, a press-fit end, and a transition portion. The transition portion is designed such that the first female end and the first press-fit end may be properly aligned depending on the application. The transition portion also provides support and stability to the electrical contacts when they are disposed within the insulative housing. The insulative housing includes four contact recesses. In an embodiment, the electrical connector allows for the safe, efficient, re-usable, and reliable connection for connecting high-voltage wires to a corresponding sensitive electrical component (e.g., a printed circuit board).
H01R 13/707 - Association structurelle avec des composants électriques incorporés avec interrupteur incorporé verrouillé avec les pièces de contact ou la pièce complémentaire
A multi-mode antenna system include at least a first modal antenna and a second modal antenna. The first modal antenna is disposed on a ground plane of a circuit board and configurable in a plurality of different modes. The first modal antenna can include a driven element, at least one parasitic element and an active element configured to adjust a reactance of the at least one parasitic element. The multi-mode antenna system, further includes a second modal antenna disposed on the ground plane and configurable in a plurality of different modes. The second modal antenna can include a driven element, at least one parasitic element, and an active element configured to adjust a reactance of the at least one parasitic element. The parasitic element of the second modal antenna is positioned such that adjusting the reactance of the parasitic element affects the radiation pattern associated with the first modal antenna.
A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.
H01P 5/18 - Dispositifs à accès conjugués, c.-à-d. dispositifs présentant au moins un accès découplé d'un autre accès consistant en deux guides couplés, p. ex. coupleurs directionnels
This disclosure provides a method and apparatus for connecting insulated wires to electrical components. More specifically, an apparatus that includes a wire guide designed to assist with the alignment of wires prior to termination of the wires to electrical components is disclosed. In an embodiment, the wire guide includes a body portion and a latching portion. The body portion includes at least one wire opening and is configured to mechanically secure one or more insulated wires in a desirable position. The latching portion is configured to secure the wire guide to a corresponding device such as an insulation displacement contact connector. A wire guide allows for insulated wires to be quickly and reliably positioned and secured relative to one another in order to safely and efficiently electrically and mechanically connect each insulated wire to a corresponding electrical component.
H01R 4/2433 - Plaques planes, p. ex. plaques planes multi-couches montées sur un support isolant une partie du support pouvant être déplacée pour enfoncer le câble dans l’entaille
53.
HIGH FREQUENCY, SURFACE MOUNTABLE MICROSTRIP BAND PASS FILTER
A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than ‑3.5 dB at a frequency that is greater than about 15 GHz.
The present invention is directed to a multilayer ceramic capacitor. The capacitor comprises a top surface, a bottom surface, and at least one side surface connecting the top surface and the bottom surface. The capacitor comprises a main body containing a plurality of alternating dielectric layers and internal electrode layers comprising a first plurality of internal electrode layers and a second plurality of internal electrode layers. A first through-hole conductive via electrically connects the first plurality of internal electrode layers to a first external terminal on the top surface and a first external terminal on the bottom surface of the capacitor. A second through-hole conductive via electrically connects the second plurality of internal electrode layers to a second external terminal on the top surface and a second external terminal on the bottom surface of the capacitor. The at least one side surface does not include an external terminal.
A multilayer ceramic capacitor may include a monolithic body including a plurality of dielectric layers and a plurality of electrode regions. The plurality of electrode regions can include a dielectric region, an active electrode region, and a shield electrode region. The active electrode region may be located between the dielectric region and the shield electrode region in a Z-direction. The dielectric region may extend from the active electrode region to the top surface of the broadband multilayer ceramic capacitor. The capacitor may include a plurality of active electrodes arranged within the active electrode region and at least one shield electrode arranged within the shield electrode region. The dielectric region may be free of electrode layers that extend greater than 25% of a length of the capacitor. A ratio of a capacitor thickness to a thickness of the dielectric region may be less than about 20.
The present invention is directed to a multilayer ceramic capacitor that includes a plurality of active electrodes and at least one shield electrode that are each arranged within a monolithic body and parallel with a longitudinal direction. The capacitor may exhibit a first insertion loss value at a test frequency, which may be greater than about 2 GHz, in a first orientation relative to the mounting surface. The capacitor may exhibit a second insertion loss value at about the test frequency in a second orientation relative to the mounting surface and the capacitor is rotated 90 degrees or more about the longitudinal direction with respect to the first orientation. The longitudinal direction of the capacitor may be parallel with the mounting surface in each of the first and second orientations. The second insertion loss value may differ from the first insertion loss value by at least about 0.3 dB.
The present invention is directed to a multilayer ceramic capacitor. A plurality of active electrodes may be arranged within a monolithic body of the capacitor and parallel with a longitudinal direction. A first shield electrode may be arranged within the monolithic body and parallel with the longitudinal direction. The first shield electrode may be connected with a first external terminal. The first shield electrode may have a first longitudinal edge and a second longitudinal edge that are each aligned with the lateral direction and face away from the first external terminal. The second longitudinal edge may be offset in the longitudinal direction from the first longitudinal edge by a shield electrode offset distance. A second shield electrode may be connected with a second external terminal. The second shield electrode may be approximately aligned with the first shield electrode in the Z-direction.
A multilayer capacitor may include a monolithic body including a plurality of dielectric layers. A first external terminal may be disposed along a first end, and a second external terminal may be disposed along a second end of the capacitor. The external terminals may include respective bottom portions that extend along a bottom surface of the capacitor. The bottom portions of the external terminals may be spaced apart by a bottom external terminal spacing distance. A bottom shield electrode may be arranged within the monolithic body between a plurality of active electrodes and the bottom surface of the capacitor. The bottom shield electrode may be spaced apart from the bottom surface of the capacitor by a bottom-shield-to-bottom distance that may range from about 3 microns to about 100 microns. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be less than about 4.
An antenna system is provided. The antenna system includes a circuit board. The antenna system further includes a first antenna structure and a second antenna structure. The first antenna structure is positioned between the circuit board and the second antenna structure such that the first antenna structure forms a ground plane for the second antenna structure. In addition, the first antenna structure is electrically coupled to the circuit board via a first conductive path. The second antenna structure is electrically coupled to the circuit board via a second conductive path extending through an opening defined by the first antenna structure.
A broadband multilayer ceramic capacitor may include a monolithic body including a plurality of dielectric layers stacked in the Z-direction, a first external terminal, and a second external terminal. A plurality of active electrodes, a bottom shield electrode, and a top shield electrode may be arranged within the monolithic body. The top shield electrode may be positioned between the active electrodes and a top surface of the capacitor and spaced apart from the top surface of the capacitor by a top-shield-to-top distance. A bottom shield electrode may be positioned between the active electrodes and the bottom surface of the capacitor and spaced apart from the bottom surface of the capacitor by a bottom-shield-to-bottom distance. A ratio of the top-shield-to-top distance to the bottom-shield-to-bottom distance may be between about 0.8 and about 1.2. The bottom-shield-to-bottom distance may range from about 8 microns to about 100 microns.
A mobile computing device including a modal antenna is disclosed. The mobile computing device may include a radio frequency circuit and a modal antenna mechanically coupled to a portion of the mobile computing at a location that is remote from the radio frequency circuit. The modal antenna may include a driven element and a parasitic element positioned proximate to the driven element. The modal antenna may be operable in a plurality of different modes. Each mode may be associated with a different radiation pattern. The mobile computing device may include a transmission line coupling the radio frequency circuit to the modal antenna. The radio frequency circuit may be configured to transmit an RF signal over the transmission line to the modal antenna and configured to communicate a control signal to adjust the mode of the modal antenna over the transmission line.
A millimeter wave RF phase shifter includes an input and an output. The RF phase shifter further includes a transmission line coupled to the input. The transmission line can include a plurality of taps. The RF phase shifter can further include a plurality of switching devices. Each switching device can be coupled between the output and a corresponding tap of the plurality of taps. The RF phase shifter can include a control device operatively coupled to the plurality of switching devices. The control device can be configured to control operation of the plurality of switching devices to selectively couple one of the plurality of taps to the output to control a phase shift of a RF signal propagating on the transmission line.
H01P 5/18 - Dispositifs à accès conjugués, c.-à-d. dispositifs présentant au moins un accès découplé d'un autre accès consistant en deux guides couplés, p. ex. coupleurs directionnels
63.
SYSTEM AND METHOD FOR CONTROLLING A VOLTAGE TUNABLE MULTILAYER CAPACITOR
A controller and system for tuning a voltage tunable capacitor is provided. The controller may include at least one analog-to-digital converter configured to receive at least one input signal and convert the at least one input signal into at least one digital signal. The controller may include a processor configured to process the at least one digital signal using logic to generate an output signal. The controller may include a charge pump configured to boost the output signal to generate a boosted output signal. The controller may be configured to provide the boosted output signal to the voltage tunable capacitor to adjust a bias voltage of the voltage tunable capacitor.
H01G 7/06 - Condensateurs dont la capacité varie par des moyens non mécaniquesProcédés pour leur fabrication à diélectrique choisi pour sa variation de permittivité en fonction de la tension appliquée, c.-à-d. condensateurs ferro-électriques
A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.
H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
H03H 1/00 - Détails de réalisation des réseaux d'impédances dont le mode de fonctionnement électrique n'est pas spécifié ou est applicable à plus d'un type de réseau
65.
MULTILAYER FILTER INCLUDING A RETURN SIGNAL REDUCING PROTRUSION
A multilayer filter may include a signal path having an input, an output, and a conductive layer overlying at least one of a plurality of dielectric layers. The conductive layer may be elongated in the first direction and may have a first edge aligned with the first direction and a second edge parallel with the first edge. The conductive layer may include a protrusion extending in the second direction and having an end edge that is parallel with the first edge and offset from the first edge in the second direction by a protrusion length that is greater than about 50 microns. The multilayer filter may include an inductor that is electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground.
H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
66.
MULTILAYER FILTER INCLUDING A CAPACITOR CONNECTED WITH AT LEAST TWO VIAS
A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.
H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz.
H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
H03H 1/00 - Détails de réalisation des réseaux d'impédances dont le mode de fonctionnement électrique n'est pas spécifié ou est applicable à plus d'un type de réseau
68.
MULTILAYER ELECTRONIC DEVICE INCLUDING A CAPACITOR HAVING A PRECISELY CONTROLLED CAPACITIVE AREA
A multilayer electronic device may include a plurality of dielectric layers stacked in a Z-direction that is perpendicular to an X-Y plane. The device may include a first conductive layer overlying one of the plurality of dielectric layers. The multilayer electronic device may include a second conductive layer overlying another of the plurality of dielectric layers and spaced apart from the first conductive layer in the Z-direction. The second conductive layer may overlap the first conductive layer in the X-Y plane at an overlapping area to form a capacitor. The first conductive layer may have a pair of parallel edges at a boundary of the overlapping area and an offset edge within the overlapping area that is parallel with the pair of parallel edges. An offset distance between the offset edge and at least one of the pair of parallel edges may be less than about 500 microns.
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
H01P 1/201 - Filtres à ondes électromagnétiques transversales
69.
MULTILAYER ELECTRONIC DEVICE INCLUDING A HIGH PRECISION INDUCTOR
A multilayer electronic device may include a plurality of dielectric layers and a signal path having an input and an output. An inductor may include a conductive layer formed on one of the plurality of dielectric layers and may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The inductor may include an outer perimeter that includes a first straight edge facing outward in a first direction and a second straight edge parallel to the first straight edge and facing outward in the first direction. The second straight edge may be offset from the first straight edge by an offset distance that is less than about 500 microns and less than about 90% of a first width of the inductor in the first direction at the first straight edge.
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric, and an external coating that overlies the solid electrolyte and includes conductive polymer particles. The solid electrolyte includes a conductive polymer containing repeating thiophene units of a certain formula.
A capacitor comprising a solid electrolytic capacitor element that contains a sintered porous anode body, a dielectric film that is formed by sequential vapor deposition and overlies the anode body, and a solid electrolyte that overlies the dielectric film is provided.
H01G 9/042 - Électrodes caractérisées par le matériau
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
Systems and methods for point to multipoint communications are provided. In one example, a system includes one or more modal antennas. Each modal antenna is configured to operate in a plurality of modes. The system can include a transceiver configured to communicate with a plurality of client devices over a wireless communication medium via the one or more modal antennas over a plurality of frames. The system can include one or more control devices configured to control the operation of the one or more modal antennas. For each of the plurality of frames communicated to one of the plurality of client devices, the one or more control devices are configured to determine a selected mode of the plurality of modes to communicate during the frame and to operate at least one of the one or more modal antennas in the selected mode during the frame.
H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
H04B 1/401 - Circuits pour le choix ou l’indication du mode de fonctionnement
73.
SOLID ELECTROLYTIC CAPACITOR FOR A TANTALUM EMBEDDED MICROCHIP
A solid electrolytic capacitor and method for making the capacitor are provided. The capacitor includes a sintered porous anode body formed from a valve metal, a metallic physical vapor deposition (PVD) layer disposed directly on a planar surface of the anode body, a dielectric, a cathode, and anode and cathode terminations. The dielectric overlies at least a portion of the anode body and is also formed within the anode body. The cathode overlies at least a portion of the dielectric that overlies the anode body and includes a solid electrolyte, and a portion of a lower surface of the metallic PVD layer is free of both the dielectric and solid electrolyte. The anode termination is electrically connected to the portion of the lower surface of the metallic PVD layer that is free of both the dielectric and solid electrolyte, and the cathode termination is electrically connected to the solid electrolyte.
A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.
A patch antenna array system is provided. The patch antenna array system can include a plurality of patch antennas oriented with respect to each other to provide a nearly symmetric radiation pattern over a range of frequencies, such as from 1500 Megahertz (MHz) to 1700 MHz. The patch antenna array system can include a sequential phase feed network that is in communication with the plurality of patch antennas. The sequential phase feed network can be configured to provide a radio frequency (RF) signal to each patch antenna of the plurality of patch antennas such that the patch antenna array system has an axial ratio of less than 1 decibel (dB) over the range of frequencies.
A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.
H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
H01P 1/30 - Dispositifs de compensation des effets de la température ou de l'humidité ou de protection contre ces effets
An electrical spring contact is provided. The electrical spring contact includes a connection portion configured to couple the electrical spring contact to a printed circuit board, a bulge portion, a bend portion having a substantially U-shaped configuration, and an inclined portion extending from the bend portion at an angle relative to a plane that is substantially parallel to the connection portion. The connection portion, the bulge portion, the bend portion, and the inclined portion are formed from a single conductive contact material.
High performance antennas for smart appliances are described herein. An antenna for use with a smart controller for an appliance can include a length of memory metal. The antenna can be configured to maintain the length while undisturbed, deform while under external stress, and return to or near to the length after deformation. Additionally, one end of the length of memory metal is in operative communication with a communication circuit associated with the smart controller.
A system for communicating data over a transmission line is disclosed. In one example implementation, the system may include a transmitter configured to modulate a control signal onto an RF signal using amplitude-shift keying modulation to generate a transmit signal. The system may include a receiver and a transmission line coupling the transmitter to the receiver. The transmitter may be configured to transmit the transmit signal over the transmission line to the receiver, and the receiver may be configured to de-modulate the control signal and extract clock information associated with the transmitter. In some embodiments, the system may include a tuning circuit and a modal antenna, and the tuning circuit may be or include the receiver. The receiver may be configured to adjust a mode of the modal antenna based on the control signal transmitted by the transmitter.
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric, and an external polymer coating that overlies the solid electrolyte and includes conductive polymer particles. The solid electrolyte includes a conductive polymer having repeating units derived from an aniline monomer having the following general formula (I).
H01B 1/12 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques substances organiques
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric, and an external coating that overlies the solid electrolyte and includes conductive polymer particles. The solid electrolyte includes an intrinsically conductive polymer containing repeating thiophene units of a certain formula.
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
82.
SOLID ELECTROLYTIC CAPACITOR FORMED FROM CONDUCTIVE POLYMER PARTICLES
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric that includes conductive polymer particles that contain a complex formed from a thiophene polymer and a copolymer counterion, and an external polymer coating that overlies the solid electrolyte and includes conductive polymer particles.
H01G 11/56 - Électrolytes solides, p. ex. gelsAdditifs pour ceux-ci
H01B 1/20 - Matériau conducteur dispersé dans un matériau organique non conducteur
H01B 1/12 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques substances organiques
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
C08L 33/12 - Homopolymères ou copolymères du méthacrylate de méthyle
A phased array antenna is provided. The phased array antenna includes a dome shaped substrate. The phased array antenna further includes a plurality of antenna elements disposed on the substrate.
An antenna system for use with one or more media devices is provided. The antenna system includes a plurality of antenna elements. Each antenna element is associated with an independent feed element. In addition each antenna element is configured to receive a plurality of radio frequency (RF) signals. Each RF signal can he associated with a UHF band or a VHF band. The antenna system can include at least one tuner and at least one switching device. The at least one switching device can be configured to selectively couple the at least one tuner to one antenna element of the plurality of antenna elements based, at least in part, on channel selection data associated with the at least one tuner.
H01Q 5/28 - Dispositions pour régler la polarisation ou la largeur de faisceau sur plusieurs gammes d’ondes différentes
H01Q 21/30 - Combinaisons d'unités d'antennes séparées, fonctionnant sur des bandes d'ondes différentes et connectées à un système d'alimentation commun
85.
METHODS FOR CONFIGURING A MULTI-MODE ANTENNA SYSTEM FOR MULTI-CHANNEL COMMUNICATION SYSTEMS
A method for configuring a multi-mode antenna system is provided. The method includes obtaining channel selection data indicating the antenna system is tuned to a first channel of a plurality of channels. The method includes configuring the antenna system in at least one operating mode of a plurality of operating modes, with each operating mode of the plurality of operating modes having a distinct radiation pattern. The method includes obtaining data indicative of a channel quality indicator for the at least one operating mode. The method includes determining a selected operating mode for the multi-mode antenna system for the first channel of the plurality of channels based, at least in part, on the data indicative of the channel quality indicator. The method includes configuring the antenna system in the selected operating mode when the multi-mode antenna system is tuned to the first channel.
In general, a varistor including a passivation layer and a method of forming such a varistor are disclosed. The varistor comprises a ceramic body comprising a plurality of alternating dielectric layers and electrode layers. The varistor also comprises a first external terminal on a first end surface and a second external terminal on a second end surface opposite the first end surface wherein at least two side surfaces extend between the first end surface and the second end surface. The varistor also comprises a passivation layer on at least one side surface of the ceramic body between the first external terminal and the second external terminal. The passivation layer includes a phosphate and a metal additive including an alkali metal, an alkaline earth metal, or a mixture thereof. The passivation layer has an average thickness of from 0.1 micron to 30 microns.
H01C 7/10 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants sensibles à la tension, p. ex. varistances
H01C 7/18 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants comprenant une pluralité de couches empilées entre les bornes
H01C 7/112 - Noyaux de varistance en oxyde métallique du type ZnO
H01C 17/28 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour appliquer les bornes
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
A feedthrough device for protecting a system from an electrical transient may include a housing having a first end and a second end spaced apart from the first end in a longitudinal direction. A conductive line may extend through the housing from the first end to the second end of the housing. The conductive line may define an input end proximate the first end of the housing and an output end proximate the second end of the housing for connecting the feedthrough device with the system to be protected. A filter may be disposed within the housing and coupled with the conductive line at a first location. A gas discharge tube may be disposed within the housing and coupled with the conductive line at a second location on the conductive line that is proximate the filter and between the input end of the conductive line and the first location.
H01T 1/22 - Moyens pour amorcer l'arc ou pour faciliter l'allumage de l'éclateur par la forme ou la composition des électrodes
H01T 4/12 - Limiteurs de surtension utilisant des éclateurs ayant un intervalle simple ou plusieurs intervalles disposés en parallèle scellés hermétiquement
H02H 9/06 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension utilisant des éclateurs à étincelles
An antenna system is provided. In one example implementation, the antenna system may include a modal antenna that is operable in a plurality of different modes, and each mode may be associated with a different radiation pattern. The antenna system may include a tuning circuit configured to operate the modal antenna in the plurality of different modes. A transmission line may couple a radio frequency circuit to the modal antenna. The radio frequency circuit may be configured to modulate a control signal onto an RF signal using amplitude-shift keying modulation to generate a transmit signal for communication over the transmission line to the tuning circuit. The tuning circuit may be configured to demodulate the control signal such that the radio frequency circuit can adjust a mode of the modal antenna via the control signal. In some embodiments, the amplitude-shift keying modulation may include on-off keying modulation.
H04L 27/04 - Circuits de modulationCircuits émetteurs
H01Q 1/24 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
H01Q 3/28 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier l'amplitude
A solid electrolytic capacitor comprising a capacitor element, anode lead extending from a surface of the capacitor element, an anode termination that is in electrical connection with the anode lead, a cathode termination that is in electrical connection with the solid electrolyte, and a casing material that encapsulates the capacitor element and anode lead is provided. An interfacial coating is disposed on at least a portion of the anode termination and/or cathode termination and is in contact with the casing material. The coating contains a hydrophobic resinous material and the adhesion strength of the casing material is about 5 newtons per square millimeter or more as determined at a temperature of about 23C and relative humidity of about 30%.
A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. An anode lead extends from the front surface of the capacitor element in the longitudinal direction. An anode termination is in contact with the anode lead at a connection region, wherein the ratio of the distance between the connection region and the front surface of the capacitor element to the length of the capacitor is 0.13 or more. A cathode termination is in electrical connection with the solid electrolyte and a casing material encapsulates the capacitor element and anode lead. Further, an interfacial coating that is disposed on at least a portion of the anode termination and/or cathode termination and is in contact with the casing material.
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
This disclosure provides a method and apparatus for connecting and disconnecting various electrical components. More specifically, an apparatus that includes an electrical contact and an insulated housing. In an embodiment, the electrical contact includes a first insulation displacement contact, a second insulation displacement contact, and a motion-force portion. The motion-force portion is configured to allow the electrical contact to be actuated around a central axis and relative to the insulated housing. The first and second insulation displacement contacts allow for the electrical contact to create an electrical and mechanical connection between respective wires when the electrical contact is rotated. A rotary insulation displacement contact (IDC) junction connector allows for two wires to be reliably and safely connected in environments where space is limited.
A solid electrolytic capacitor is provided that contains a casing material that encapsulates the capacitor element. The casing material is formed from a curable resinous matrix that has a coefficient of thermal expansion of about 42 ppm/°C or less at a temperature above the glass transition temperature of the resinous matrix. Further, the capacitor exhibits an initial equivalence series resistance of about 200 mohms or less as determined at an operating frequency of 100 kHz and temperature of 23°C, and the ratio of the equivalence series resistance of the capacitor after being exposed to a temperature of 125°C for 560 hours to the initial equivalence series resistance of the capacitor is about 2.0 or less.
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
A surface mount component is disclosed including an electrically insulating beam that is thermally conductive. The electrically insulating beam has a first end and a second end that is opposite the first end. The surface mount component includes a thin-film component formed on the electrically insulating beam adjacent the first end of the electrically insulating beam. A heat sink terminal is formed on the electrically insulating beam adjacent a second end of the electrically insulating beam. In some embodiments, the thin-film component has an area power capacity of greater than about 0.17 W/mm2 at about 28 GHz.
H01C 1/084 - Dispositions de réfrigération, de chauffage ou de ventilation par refroidissement naturel, p. ex. ailettes, dissipateurs thermiques
H01C 1/014 - MontageSupport la résistance étant maintenue et supportée entre deux éléments de support
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
H01C 17/28 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour appliquer les bornes
94.
SURFACE MOUNTED CARD EDGE CONTACT PAIR WITH PICK-UP CARRIER
A card edge contact pair for electrically coupling printed circuit board assemblies is provided. The card edge contact pair includes a first contact body and a second contact body. The first contact body includes a first solder joint end and a first deflection end. The second contact body includes a second solder joint end and a second deflection end. The card edge contact pair further includes an integral carrier component. The integral carrier component is detachably coupled to the first contact body and the second contact body.
H01R 13/629 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz
The present invention is directed to a varistor comprising a dielectric material comprising a sintered ceramic composed of zinc oxide grains and a grain boundary layer between the zinc oxide grains. The grain boundary layer contains a positive temperature coefficient thermistor material in an amount of less than 10 mol% based on the grain boundary layer.
H01C 7/102 - Couche-barrière de varistance, p. ex. couches de surface
H01C 7/112 - Noyaux de varistance en oxyde métallique du type ZnO
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
96.
SOLID ELECTROLYTIC CAPACITOR CONTAINING A SEQUENTIAL VAPOR-DEPOSITED INTERIOR CONDUCTIVE POLYMER FILM
A capacitor comprising a solid electrolytic capacitor element that a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte is provided. The solid electrolyte contains an interior conductive polymer film that overlies the dielectric, which may be formed by sequential vapor deposition. An exterior conductive polymer layer also overlies the interior conductive polymer film.
A capacitor comprising a solid electrolytic capacitor element that contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. The capacitor further contains a barrier film that is formed by vapor deposition and that is positioned between the dielectric and the solid electrolyte or overlies the dielectric.
A capacitor comprising a solid electrolytic capacitor element that contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte is provided. The solid electrolyte contains an interior conductive polymer layer overlying the dielectric, an adhesive film that overlies the interior conductive polymer layer, which may be formed by sequential vapor deposition. An exterior conductive polymer layer also overlies the adhesive film.
A supercapacitor assembly is disclosed that includes a supercapacitor enclosed within a housing. The housing may have an outer surface and may be sealed at a seal location. A barrier layer may be formed on a portion of the outer surface that is adjacent at least one of the seal location or a surface to which the supercapacitor is mounted. The barrier layer may be a high performance polymer, such as a thermoplastic polymer or a thermoset polymer.
H01G 11/12 - Condensateurs hybrides ou EDL à empilement
H01G 11/28 - Électrodes caractérisées par leur structure, p. ex. multicouches, selon la porosité ou les caractéristiques de surface agencées ou disposées sur un collecteur de courantCouches ou phases entre les électrodes et les collecteurs de courant, p. ex. adhésifs
H01G 11/70 - Collecteurs de courant caractérisés par leur structure
The invention is directed to a multilayer ceramic capacitor comprising a top surface and an opposing bottom surface and four side surfaces that extend between the top and bottom surfaces, a main body formed from a plurality of dielectric layers and a plurality of internal electrode layers alternately arranged, and external terminals electrically connected to the internal electrode layers wherein a first external terminal is disposed along the top surface and a second external terminal is disposed along the bottom surface. The internal electrode layer includes a first electrode electrically connected to the first external terminal and a second counter electrode electrically connected to the second external terminal, wherein the first electrode includes a central portion extending from the first external terminal toward the second external terminal and wherein the central portion extends 40% to less than 100% a distance from the first external terminal to the second external terminal.
