xy22 2-theta peak at 30.05° +/- 0.3°.The target has a low resistivity, below 1000 ohm.cm, preferably below 100 ohm.cm, more preferably below 10 ohm.cm, even lower than 1 ohm.cm.
A magnetron structure is described for use in a sputtering apparatus. The magnetron structure comprises a magnetron (100, 200, 300, 401) and a controller (106, 206, 301, 402) rigidly connected to the magnetron (100, 200, 300, 401). The controller (106, 206, 301, 402) is adapted for at least partly controlling a condition and/or a functioning of the sputtering unit.
An end-block for use in a deposition apparatus, for connecting a cylindrical consumable target with magnetic bar, to an outside of the deposition apparatus, comprising at least drive means to provide a relative movement between consumable target and magnetic bar, the drive means comprising a driven shaft. The drive means comprising a consumable target motor and a consumable target drive shaft and/or a magnetic bar motor and a magnet bar drive shaft. The end-block housing including the end-block being substantially axially symmetric and coaxial with the driven shaft. Due to the axle symmetry, the end-block is universally mountable.
C04B 35/00 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques
A feedback system (210) for controlling properties of a single layer or multiple layer stack being applied on a substrate (10) by means of a vacuum coating process controlled by a plurality of process controlling means, comprises - at least one monitoring device (220) for implementing at least two distinct measurement techniques for determining measurement signals at each of a plurality of locations spatially distributed over the coated substrate (11), whereby a first measurement technique is adapted for being applied simultaneously to a plurality of locations, and a second measurement technique is adapted for being applied to at least one location, one of the first and second measurement techniques being a spectral transmission measurement, - at least one processing unit (230) adapted for receiving the measurement signals, and configured for determining therefrom actual values of a first layer property at the plurality of locations, and of a second layer property different from the first layer property at the at least one location, and/or for determining deviations between the actual first and second layer property values and desired layer property values, and - a controller (240) for providing actuation signals for actuating the plurality of process controlling means, and for generating further control signals to further drive at least one of the plurality of process controlling means in the coating process based on the determined values and/or deviations between the actual layer property values and the desired layer property values and on knowledge from a layer model expressing layer parameters as a function of settings and/or variations of at least two of the plurality of process controlling means, such that the properties of the layer stack lie within predetermined tolerance values.
An end-block (100) for use in a deposition apparatus, for connecting a cylindrical consumable target (150) with magnetic bar, to an outside of the deposition apparatus, comprising at least drive means to provide a relative movement between consumable target and magnetic bar, the drive means comprising a driven shaft. The drive means comprising a consumable target motor and a consumable target drive shaft and/or a magnetic bar motor and a magnet bar drive shaft. The end-block housing (160) including the end-block (100) being substantially axially symmetric and coaxial with the driven shaft. Due to the axle symmetry, the end-block is universally mountable.
A power transfer system (100) is described for transfer of electrical power to a sputter target in a sputter device. It comprises a first part (110) comprising a contact surface (115) positionable against a first part (210) of an endblock of the sputter device, a second part (120) inseparably connected to the first part (110) and a third part (130), and a third part (130) comprising a contact surface (135) positionable against a second part (220) of the endblock or directly against a sputter target when mounted on the endblock. At least two of the three parts (110, 120, 130) are formed as one monolithic piece. One of the parts of the power transfer system (100) is resilient such that, when mounted, the power transfer system is clamped between the first part (210) of the endblock and the second part (220) of the endblock or the sputter target. This part is also responsible for the transfer of electrical power.
H01J 37/34 - Tubes à décharge en atmosphère gazeuse fonctionnant par pulvérisation cathodique
8.
Device having two end blocks, an assembly and a sputter system comprising same, and a method of providing RF power to a target assembly using said device or assembly
A device for use in a sputter system, comprising at least a first end block and a second end block positioned at opposite sides of the sputter system. The device is adapted such that a target assembly comprising at least one target tube or sputter magnetron, when mounted on the first and second end blocks, may be powered actively with RF power at both sides of the assembly, and such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron. An assembly comprising said device and a control unit for controlling powering of opposite sides of the target assembly by RF power such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron.
A sputter device for depositing a layer on a substrate in a vacuum chamber and having a layer property in each point of the substrate surface. The sputter device comprises at least one end block adapted for holding a cylindrical target having a longitudinal axis in a first direction, and a first drive means for providing a rotational movement of the at least one cylindrical target around its longitudinal axis. The sputter device includes a second drive means for applying a translational movement to an end block in a second direction. The first and the second drive means are adapted for, during sputtering, being simultaneously operational in the vacuum chamber. The movement of the first drive means does not impact the uniformity of the layer sputtered on the substrate in the direction on the surface of the substrate corresponding to a perpendicular projection of the second direction onto the substrate.
A cover (420, 430; 440; 520, 530; 620, 630) for a configurable measuring system of a configurable sputtering system (400; 500; 600) which is adapted for sputtering multilayer coatings with varying compositions and comprising a plurality of sputtering zones (401) and having a plurality of apertures on which the cover is detachably attachable, and wherein the cover comprises a sensor system (M1) for in situ detection of a property of the multilayer coating on a substrate, wherein said at least one sensor system is attached to the cover.
A cylindrical structure (1200) for use in an RF sputter process, comprising a backing tube (1203,1205) comprising or consisting of a layer of an electrically insulating material (1205) and at least one electrode (1204) arranged at least partly within or at least partly on top of said electrically insulating material, said electrode being adapted for receiving RF power from an RF power source, wherein the at least one electrode (1204) has such a distributed shape and size that a substantially uniform electrical field for sputtering is created, when used in a sputter system. A magnetron comprising said cylindrical structure (1200), and a sputter system comprising said magnetron are also provided.
H01J 37/34 - Tubes à décharge en atmosphère gazeuse fonctionnant par pulvérisation cathodique
C23C 14/35 - Pulvérisation cathodique par application d'un champ magnétique, p. ex. pulvérisation au moyen d'un magnétron
H01J 37/32 - Tubes à décharge en atmosphère gazeuse
12.
A DEVICE HAVING TWO END BLOCKS, AN ASSEMBLY AND A SPUTTER SYSTEM COMPRISING SAME, AND A METHOD OF PROVIDING RF POWER TO A TARGET ASSEMBLY USING SAID DEVICE OR ASSEMBLY
A device (602) for use in a sputter system(600), comprising at least a first end block (631) and a second end block (632)positioned at opposite sides of the sputter system. The device is adapted such that a target assembly comprising at least one target tube or sputter magnetron, when mounted on the first and second end blocks (631, 632), may be powered actively with RF power at both sides of the assembly, and such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron. An assembly (601) comprising said device and a control unit for controlling powering of opposite sides of the target assembly by RF power such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron is also provided, as well as a method for applying RF power to impedance target assembly.
An end-block for rotatably carrying a sputtering target tube and for rotatably restraining a magnet bar inside the sputtering target tube includes a receptacle for receiving a magnet bar fitting. The receptacle comprises a first part of a signal connector arranged to receive a second part of a signal connector from the magnet bar fitting, and allow a signal connector between the end-block and the magnet bar to be formed. The end-block is adapted for providing protection means to the signal connector for protecting it from degradation, destruction or interference of a power and/or data signal transmitted between the end-block and the magnet bar, due to surrounding cooling fluid and/or surrounding high energy fields. The disclosure provides a corresponding magnet bar, and a method for adjusting a magnetic configuration of a magnet bar in a cylindrical sputtering apparatus.
A sputter device (100) for depositing a layer on a substrate in a vacuum chamber, the layer having a layer property in each point of the substrate surface. The sputter device comprises at least one end block (120) adapted for each holding a cylindrical target (160) having a longitudinal axis in a first direction. The sputter device moreover comprises a first drive means (190) for providing a rotational movement of the at least one cylindrical target (160) around its longitudinal axis. The sputter device also comprises a second drive means (145) for applying a translational movement to the at least one end block (120) in a second direction, thereby keeping the target axis parallel during at least a significant portion of the movement trajectory along the second direction. The first and the second drive means are adapted for, during sputtering, being simultaneously operational in the vacuum chamber. The movement of the first drive means does not impact the uniformity of the layer sputtered on the substrate in the direction on the surface of the substrate corresponding to a perpendicular projection of the second direction onto the substrate (170).
A sputtering target having a one-piece top coat comprising a mixture of oxides of zinc, tin, and optionally gallium, characterized in that said one-piece top coat has a length of at least 80 cm; a method for forming such a sputtering target and the use of such a target for forming films.
C04B 35/453 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base d'oxydes de zinc, d'étain ou de bismuth ou de leurs solutions solides avec d'autres oxydes, p. ex. zincates, stannates ou bismuthates
C04B 35/457 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base d'oxydes de zinc, d'étain ou de bismuth ou de leurs solutions solides avec d'autres oxydes, p. ex. zincates, stannates ou bismuthates à base d'oxydes d'étain ou de stannates
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Coating machines; vacuum coating machines; sputtering
machines; endblocks for coating machines and for sputtering
machines; parts and fittings for all the aforesaid goods. Magnetrons and cathodes; rotary magnetrons and cathodes;
user and instruction manuals in electronic format. Research, design and consultancy services in connection with
coating machines and sputtering equipment.
A sputter system (100) for applying a coating on a substrate (111) is described. The sputter system comprises at least two cylindrical sputter units (125) for the joint sputtering of a single coating. Each sputter unit (125) comprising an elongated magnet configuration and at least one elongated magnet configuration comprising a plurality of magnet structures (140) and magnet structure control systems (150) along the length direction of the elongated magnet configuration. At least one magnet structure (140) is adjustable in position and/or shape by a magnet structure control system (150), while a sputter target (121) is mounted on the sputter unit.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Coating machines; vacuum coating machines; sputtering machines; endblocks for coating machines and for sputtering machines; parts and fittings for all the aforesaid goods. Measuring and detecting instruments, indicators and controllers; testing and quality control devices, in particular instruments for measuring coatings on glass. Technical consultancy and providing of expertise; technical measuring and testing; conducting development initiatives, testing and research; design and inspection services; computer programming; building and construction drafting; all aforementioned services relating to weighing, measuring and checking (supervision) apparatus and instruments, and relating to apparatus, instruments and equipment for testing, measuring and checking of coatings, coating machines, sputtering machines, and relating to parts and fittings for all the foregoing.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Coating machines; vacuum coating machines; sputtering machines; endblocks for coating machines and for sputtering machines; parts and fittings for all the aforesaid goods. Magnetrons and cathodes; rotary magnetrons and cathodes; user and instruction manuals in electronic format. Research, design and consultancy services in connection with coating machines and sputtering equipment.
20.
MAGNETIC CONFIGURATION FOR A MAGNETRON SPUTTER DEPOSITION SYSTEM
A sputter deposition magnetron system for sputtering material, the sputter deposition magnetron system comprising at least a first and a second sputter magnetron unit. Each of the magnetron units (102, 106) comprise a magnet configuration and a mounting element for mounting a target (101, 105) so that the first and second magnet configuration contribute to the formation and confinement of a plasma allowing sputtering of the first respectively second target (101, 105). The sputter deposition magnetron system furthermore comprises at least one extra magnet configuration (103) distanced from the mounting element for targets, whereby the first, the second and the at least one magnet configuration are arranged for each contributing to a confined plasma configuration wherein at least part of the plasma is shared across the first and the second sputter magnetron unit.
A magnetron deposition system for depositing material is disclosed. The magnetron deposition system comprises at least two magnetron units, each magnetron unit comprising a magnet configuration, the at least two magnetron units being arranged so that the magnetron units share a common plasma in a plasma region between the at least two magnetron units. The system furthermore comprises at least one gas inlet for supplying a gas. The at least one gas inlet for supplying a gas and the at least two magnetron units thereby are arranged for directly injecting the first gas in the plasma region between the two magnetron units.
A magnet support structure is described which comprises a set of compartments (110a, 110b, 110c, 110d, 110e) and wherein the structure comprises at least one folded plate profile (120a) for forming the compartment (110a) suitable for fitting an elongate magnetic field generator. The folded plate profile (120a) in this case has a flat part (122) adapted for serving as a reference surface for aligning the elongate magnetic field generator.
A sputtering target having a one-piece top coat comprising a mixture of oxides of zinc, tin, and optionally gallium, characterized in that said one-piece top coat has a length of at least 80 cm; a method for forming such a sputtering target and the use of such a target for forming films.
C04B 35/453 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base d'oxydes de zinc, d'étain ou de bismuth ou de leurs solutions solides avec d'autres oxydes, p. ex. zincates, stannates ou bismuthates
C04B 35/457 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base d'oxydes de zinc, d'étain ou de bismuth ou de leurs solutions solides avec d'autres oxydes, p. ex. zincates, stannates ou bismuthates à base d'oxydes d'étain ou de stannates
C23C 14/00 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement
A sputtering method and apparatus having at least one set of dual rotatable cylindrical sputtering targets mounted in a vacuum chamber. Magnet assemblies in hollow target cylinders provide erosion zones running long the parallel sides of a racetrack that act as target flux sources towards a substrate. These parallel erosion zones have a highly concentrated plasma density for rapid sputtering of the target and any reactive material. Features include the angular distance between normals to adjacent parallel erosion zones, the angle greater than 45° subtended at the center of the cylindrical target, placement of the substrate with respect to the targets, and pointing angles (orientation or tilt) of the racetracks toward the substrate and/or each other. These parameters form a relatively wide and efficient constant flux deposition region at the substrate, and allows for high deposition rates at constant reactive gas partial pressures with substantially uniform film stoichiometry and thickness.
The present invention provides an end-block (100) for rotatably carrying a sputtering target tube (200) and for rotatably restraining a magnet bar inside said sputtering target tube. The end-block (100) comprises a receptacle for receiving a magnet bar fitting (150), wherein said receptacle comprises a first part (162) of a signal connector arranged to receive a second part (164) of a signal connector from said magnet bar fitting (150),and allowing a signal connector between the end-block (100) and the magnet bar (220) to be formed. The end-block is adapted for providing protection means to the signal connector for protecting it from degradation, destruction or interference of a power and/or data signal transmitted between the end-block and the magnet bar, due to surrounding cooling fluid and/or surrounding high energy fields. The present invention also provides a corresponding magnet bar, and a method for adjusting a magnetic configuration of a magnet bar in a cylindrical sputtering apparatus.
A sputtering installation and method are described for coating substrates, the substrate being transportable in said installation in a transport direction, the substrate having a substrate width perpendicular to said transport direction, the installation comprising at least one pair of sputtering targets, each rotatable about a longitudinal axis of the target, the targets having magnet bars arranged lengthwise in pole lines for generating elongated race tracks on the surface of the targets during use. The pole lines are substantially parallel to the substrate transport direction. All targets are arranged side by side with their longitudinal axes parallel. The targets are closer to the substrate than the substrate width, i.e. the distance between the target surfaces and the substrate is lower than the width of the substrate. According to an advantageous embodiment of the invention and especially for coating uniformity the race track angle should be larger than 45°, i.e. the angle between adjacent pole lines is larger than 45° as measured from the target axis.
A sputtering method and apparatus are described having at least one set of dual rotatable cylindrical sputtering targets mounted in a vacuum chamber. Magnet assemblies are provided in the hollow target cylinders to provide erosion zones running long the parallel sides of a racetrack. The parallel sides of each racetrack act as target flux sources towards a substrate. These parallel erosion zones have a highly concentrated plasma density for rapid sputtering of the target and any reactive material. Aspects of the present invention are one or more of: the angular distance between normals to adjacent parallel erosion zones, this angle being greater than 45° subtended at the centre of the cylindrical target, the placement of the substrate with respect to the targets, and the pointing angles (orientation or tilt) of the racetracks toward the substrate and/or each other. These parameters are optimized to form a relatively wide and efficient constant flux deposition region at the substrate. This allows high deposition rates at constant reactive gas partial pressures with substantially uniform film stoichiometry and thickness.
A sputtering magnetron (300) insertable in a rotatable target is described. The magnetron is designed around a single piece, multiwalled tube (102, 202) with compartments (316, 316′, 318, 318′) extending over the length of the tube. The multiwalled tube gives a much stiffer magnetron carrier structure compared to prior art magnetrons. As a result, the magnetic field generator can be mounted inside a compartment and the distance between magnets and target surface is easily adjustable as the tube is much stiffer than the generator. Additionally, the coolant channels can be incorporated inside the tube and close to the outer wall of the tube so that coolant can be supplied in the vicinity of the magnetic field generator. The increased stiffness of the magnetron allows the target tube to be carried by the magnetron—not the other way around—at least during part of the useful life of the target. As a result thin target carrier tubes can be used as they don't have to carry the magnetron anymore resulting in a longer use of the target.
An end-block for use in a tubular magnetron sputtering apparatus is disclosed. Such an end-block rotatably transfers movement, coolant 5 and electrical current to the target while maintaining vacuum integrity and a closed coolant circuit. It hence comprises a drive means, a rotary electrical contact means, a bearing means, a number of rotary coolant seal means and a number of vacuum seal means. The inventive end-block occupies a minimal axial length along the target thus allowing 10 space savings in existing equipment such as e.g. display coaters. The axial length is reduced by mounting at least two of the means radial to one another.
