A coupler and a chuck are described. The chuck is configured to secure an article while the wafer is undergoing an inspection process. The chuck has a plurality of vacuum areas, some of which hold the wafer in place while others suction couplant from the edge surface of the wafer. The coupler is used to inspect a surface and subsurface of the wafer for defects and includes a sensing device. One or more couplant inlet couplings are disposed on a second portion of the coupler and provide couplant to a portion of the wafer inspected by the sensing device. Vacuum inlet couplings is disposed on a third portion of the coupler. At least one vacuum inlet coupling provides suction through a recessed portion of a lower surface of the coupler to remove couplant that is outside the portion of the wafer being inspected by the sensing device.
G01N 29/28 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails pour établir le couplage acoustique
G01N 29/06 - Visualisation de l'intérieur, p. ex. microscopie acoustique
Systems, methods and apparatus related to pre-wetting an edge portion of a bonded wafer prior to wetting a flat, horizontal portion of the bonded wafer. The apparatus includes a frame having nozzles directed such that couplant discharged from these nozzles wet the edge of the wafer. The edge nozzles have couplant flow vectors that interface to dampen the trajectory of fluid to reduce splash and pre-wet the edges of the bonded wafer.
G01N 29/28 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails pour établir le couplage acoustique
B05B 1/26 - Buses, têtes de pulvérisation ou autres dispositifs de sortie, avec ou sans dispositifs auxiliaires tels que valves, moyens de chauffage avec des moyens pour briser ou dévier mécaniquement le jet à sa sortie, p. ex. des déflecteurs fixesDispersion du liquide ou d'autre matériau fluide sortant à l'aide de jets d'impact
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
3.
MULTI-HOLDER INSPECTION SYSTEM USING MOVEABLE SUPPORT STRUCTURE
An ultrasonic inspection system includes an ultrasonic scanning station, a support structure and two or more object holders coupled to the support structure. The support structure is moveable between first and second orientations. The object holders enable an object to be held for ultrasonic scanning. In the first orientation of the support structure, a first object holder is to be held in an ultrasonic scanning station and a second object holder is positioned to allow loading or unloading. In the second orientation, the second object holder is positioned in the ultrasonic scanning station and the first object holder is positioned to allow loading or unloading. The object holders may be raised above a water level for loading/unloading and lowered below the water level for ultrasonic inspection. The object holders may have wafer raisers to hold a semiconductor wafer above the object holder for automated handling.
G01N 29/06 - Visualisation de l'intérieur, p. ex. microscopie acoustique
G01N 29/22 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails
G01N 29/27 - Dispositions pour l'orientation ou le balayage en déplaçant le matériau par rapport à un capteur fixe
4.
MULTI-HOLDER INSPECTION SYSTEM USING MOVEABLE SUPPORT STRUCTURE
An ultrasonic inspection system includes an ultrasonic scanning station, a support structure and two or more object holders coupled to the support structure. The support structure is moveable between first and second orientations. The object holders enable an object to be held for ultrasonic scanning. In the first orientation of the support structure, a first object holder is to be held in an ultrasonic scanning station and a second object holder is positioned to allow loading or unloading. In the second orientation, the second object holder is positioned in the ultrasonic scanning station and the first object holder is positioned to allow loading or unloading. The object holders may be raised above a water level for loading/unloading and lowered below the water level for ultrasonic inspection. The object holders may have wafer raisers to hold a semiconductor wafer above the object holder for automated handling.
G01N 29/22 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails
G01N 29/27 - Dispositions pour l'orientation ou le balayage en déplaçant le matériau par rapport à un capteur fixe
G01N 29/28 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails pour établir le couplage acoustique
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
09 - Appareils et instruments scientifiques et électriques
Produits et services
Scanning acoustic microscopes; ultrasonic flaw detectors; ultrasonic inspection devices for non-medical, non-destructive testing; parts and fittings for all the aforesaid; software for use with ultrasonic flaw detectors; software for use with acoustic microscopes.
Systems, methods and apparatus related to pre-wetting an edge portion of a bonded wafer prior to wetting a flat, horizontal portion of the bonded wafer. The apparatus includes a frame having nozzles directed such that couplant discharged from these nozzles wet the edge of the wafer. The edge nozzles have couplant flow vectors that interface to dampen the trajectory of fluid to reduce splash and pre-wet the edges of the bonded wafer.
B05B 1/26 - Buses, têtes de pulvérisation ou autres dispositifs de sortie, avec ou sans dispositifs auxiliaires tels que valves, moyens de chauffage avec des moyens pour briser ou dévier mécaniquement le jet à sa sortie, p. ex. des déflecteurs fixesDispersion du liquide ou d'autre matériau fluide sortant à l'aide de jets d'impact
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
G01N 29/28 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails pour établir le couplage acoustique
8.
Ultrasonic defect detection and classification system using machine learning
In an automated defect detection and classification system, one or more computing devices access scan data acquired in an ultrasonic scan of an object. A first input feature map, including a two-dimensional (2D) scan image, is built from the scan data and input to a first deep neural network to generate a first output feature map. A second input feature map, including an image of a defect-free object, is input to a second deep neural network, having the same structure and weight values as first deep neural network, to produce a second output feature map. The scanned object is determined to contain a defect when a distance between first and second output feature maps is large. In an alternative approach, the 2D scan image and one or more images of the defect-free object are input to different channels of neural network trained using color images.
G06V 10/74 - Appariement de motifs d’image ou de vidéoMesures de proximité dans les espaces de caractéristiques
G06V 10/764 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant la classification, p. ex. des objets vidéo
G06V 10/771 - Sélection de caractéristiques, p. ex. sélection des caractéristiques représentatives à partir d’un espace multidimensionnel de caractéristiques
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
9.
Method and apparatus for automated defect detection
In a method and apparatus for automated inspection, an image is acquired of an object under inspection and a difference image is generated showing the difference between the acquired image and a reference image of a defect-free object of the same type. Characteristics of the difference image, or detected isolated regions of the difference image, are passed to an automated defect classifier to classify defects in the object under inspection. The characteristics of the difference image may be pixels of the difference image or features determined therefrom. The features may be extracted using a neural network, for example. The automated defect classifier is trained using difference images and may be further trained, in operation, based on operator classifications and using simulated images of defects identified by an operator.
A coupler and a chuck are described. The chuck is configured to secure an article while the wafer is undergoing an inspection process. The chuck has a plurality of vacuum areas. Some vacuum areas hold the wafer in place while other vacuum areas suction couplant from the edge surface of the wafer. The coupler is used to inspect a surface and subsurface of the wafer for defects and includes a sensing device, which may be a transducer. One or more couplant inlet couplings are disposed on a second portion of the coupler, the couplant inlet couplings provide a couplant to a portion of the wafer inspected by the sensing device. A plurality of vacuum inlet couplings is disposed on a third portion of the coupler. At least one of the vacuum inlet couplings provide suction through a recessed portion of a lower surface of the coupler to remove couplant that is outside the portion of the wafer that is being inspected by the sensing device.
G01N 29/28 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails pour établir le couplage acoustique
G01N 29/26 - Dispositions pour l'orientation ou le balayage
G01N 29/06 - Visualisation de l'intérieur, p. ex. microscopie acoustique
A coupler and a chuck are described. The chuck is configured to secure an article while the wafer is undergoing an inspection process. The chuck has a plurality of vacuum areas. Some vacuum areas hold the wafer in place while other vacuum areas suction couplant from the edge surface of the wafer. The coupler is used to inspect a surface and subsurface of the wafer for defects and includes a sensing device, which may be a transducer. One or more couplant inlet couplings are disposed on a second portion of the coupler, the couplant inlet couplings provide a couplant to a portion of the wafer inspected by the sensing device. A plurality of vacuum inlet couplings is disposed on a third portion of the coupler. At least one of the vacuum inlet couplings provide suction through a recessed portion of a lower surface of the coupler to remove couplant that is outside the portion of the wafer that is being inspected by the sensing device.
G01N 29/28 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails pour établir le couplage acoustique
G01N 29/265 - Dispositions pour l'orientation ou le balayage en déplaçant le capteur par rapport à un matériau fixe
G01N 29/22 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails
09 - Appareils et instruments scientifiques et électriques
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Automated microscope and operating software sold as a unit for use in laboratory operations, microscopes, microscopes and parts thereof, industrial ultrasonic testing equipment for determining industrial flaws in microelectronic and semiconductor structures, surface roughness testing machines and instruments, all in the fields of microelectronics and semiconductors; testing apparatus for testing printed circuit boards, transducers that utilize ultrasonic oscillations to test for stress and fatigue including cracks, delaminations and inclusions in microelectronic and semiconductor structures, all in the fields of microelectronics and semiconductors; ultrasonic detectors for inspection of semiconductor wafers, bonded wafers and packaging including pre-packaged and discrete semiconductor components, ultrasonic equipment used to test or inspect damage to circuit boards and microelectronic packages, ultrasonic equipment for process monitoring and improvement and failure analysis, ultrasonic sensors used for inspection of microelectronic and semiconductor structures, all in the fields of microelectronics and semiconductors; computer software; computer programs; downloadable computer software; scientific, optical and measuring apparatus and instruments; apparatus for recording, transmission or reproduction of images; digital recording media; electronic microscopes; microscopes; optical lenses; electric measuring devices; electronic testing apparatus and instruments; ultrasonic testing apparatus and instruments; transducers; but not including meters for measuring gases or the flow of fluids; none of the aforesaid relating to water treatment, wastewater treatment, agricultural waste and sewage treatment. Training in the use and operation of ultrasonic inspection equipment in the fields of microelectronics and semiconductors; education; providing of training; arranging and conducting of seminars, conferences and congresses; none of the aforesaid relating to water treatment, wastewater treatment, agricultural waste and sewage treatment. Technical scientific consulting services, namely, laboratory, testing and diagnostic services, in the fields of microelectronics and semiconductors; testing of new products for others; materials testing, analyzing and evaluation; product testing; contract laboratory scientific and research services; testing of computer components, all in the fields of microelectronics and semiconductors; scientific and technological services and research and design relating thereto; industrial analysis and research services; material testing for others; product testing services for others; product quality certification services for others; none of the aforesaid relating to water treatment, wastewater treatment, agricultural waste and sewage treatment.
A wafer chuck includes a support structure having a first side structurally configured to support a wafer, and a vacuum zone formed on the first side of the support structure. The vacuum zone may be at least partially bounded by a ring extending from a recessed surface of the first side of the support structure. The wafer chuck further includes a plurality of suction cups disposed in the vacuum zone, where one or more of the plurality of suction cups is coupled with a channel extending through the support structure. One or more vacuums are in fluid communication with the channel, where a vacuum is structurally configured to provide suction through the channel.
B25B 11/00 - Porte-pièces ou dispositifs de mise en position non couverts par l'un des groupes , p. ex. porte-pièces magnétiques, porte-pièces utilisant le vide
G01N 29/22 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails
G01N 29/06 - Visualisation de l'intérieur, p. ex. microscopie acoustique
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
14.
Adjustable fixture for scanning acoustic microscopy
An adjustable fixture for holding a sample for inspection with a scanning acoustic microscope includes a first horizontal bar disposed on a first end of a frame, and a second horizontal bar disposed on a second end of the frame. The second horizontal bar may be engaged with the frame to be movable between the first end and the second end of the frame. The adjustable fixture may further include a side bar disposed on one or more of the first side and the second side of the frame, with an end of the second horizontal bar slidable and lockable along the side bar, and an engagement mechanism releasably coupling the end of the second horizontal bar to the side bar.
G01N 29/06 - Visualisation de l'intérieur, p. ex. microscopie acoustique
G01N 29/22 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonoresVisualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet Détails
09 - Appareils et instruments scientifiques et électriques
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Automated microscope and operating software sold as a unit for use in laboratory operations, microscopes; microscopes and structural parts thereof; Industrial ultrasonic testing equipment for determining industrial flaws in microelectronic and semiconductor structures; Surface roughness testing machines and instruments; Testing apparatus for testing printed circuit boards; Transducers that utilize ultrasonic oscillations to test for stress and fatigue including cracks, delaminations and inclusions in microelectronic and semiconductor structures; Ultrasonic detectors for inspection of semiconductor wafers, bonded wafers and packaging including pre-packaged and discrete semiconductor components; Ultrasonic equipment used to test or inspect damage to circuit boards and microelectronic packages; ultrasonic equipment for process monitoring and improvement and failure analysis; Ultrasonic sensors used for inspection of microelectronic and semiconductor structures, all in the fields of microelectronics and semiconductors Training in the use and operation of ultrasonic inspection equipment in the fields of microelectronics and semiconductors [ Technical scientific consulting services, namely, laboratory, testing and diagnostic services, in the fields of microelectronics and semiconductors; Testing of new products for others; Materials testing, analyzing and evaluation; Product testing; Contract laboratory scientific and research services; Testing of Computer Components, all in the fields of microelectronics and semiconductors ]
16.
Method and apparatus for signal path equalization in a scanning acoustic microscope
A scanning acoustic microscope includes a signal processor and one or more signal paths. In operation, each signal path couples an ultrasonic transducer to the signal processor that processes signals received from the signal paths to produce an ultrasonic scan image. Each signal path has a response characteristic that includes a response characteristic of the ultrasonic transducer. In order to compensate for variations between the signal paths or variations between different transducers in the same signal path, at least one of the signal paths includes a signal path equalizer. The equalizer may be responsive to a set of equalization coefficients. The coefficients are selected such that the response characteristic of the signal path including the equalizer more closely matches a reference characteristic response. The equalizer may operate on a transmitted or received signal or be used to generate an ultrasonic pulse.
A scanning acoustic microscope includes a signal processor and one or more signal paths. In operation, each signal path couples an ultrasonic transducer to the signal processor that processes signals received from the signal paths to produce an ultrasonic scan image. Each signal path has a response characteristic that includes a response characteristic of the ultrasonic transducer. In order to compensate for variations between the signal paths or variations between different transducers in the same signal path, at least one of the signal paths includes a signal path equalizer. The equalizer may be responsive to a set of equalization coefficients. The coefficients are selected such that the response characteristic of the signal path including the equalizer more closely matches a reference characteristic response. The equalizer may operate on a transmitted signal, be used to generate an ultrasonic pulse, or operate on a received signal produced in response to an ultrasonic pulse.
G01Q 30/00 - Moyens auxiliaires destinés à assister ou améliorer les techniques ou les appareils à sonde à balayage, p. ex. dispositifs d’affichage ou de traitement de données
18.
Method and apparatus for automated ultrasonic inspection
A method and apparatus for ultrasonic inspection of one or more parts, in which one or more parts to be inspected are transferred from a parts carrier to a scan nest that is located in the scanning station. The parts are restrained in the scan nest and then scanned. A pick and place mechanism is used to transfer the parts to be inspected between the parts carrier the scan nest. The inspection path may be altered if a missing part is detected. In one embodiment, a first gas flow port located on the pick and place mechanism or on the transducer holder is used to blow ultrasonic coupling fluid from the front surface of the parts in the scan nest after they have been scanned. In a further embodiment, two or more scan nests are used for parallel operation.
A method and apparatus for ultrasonic inspection of one or more parts, in which one or more parts to be inspected are transferred from a parts carrier to a scan nest that is located in the scanning station. The parts are restrained in the scan nest and then scanned. A pick and place mechanism is used to transfer the parts to be inspected between the parts carrier the scan nest. The inspection path may be altered if a missing part is detected. In one embodiment, a first gas flow port located on the pick and place mechanism or on the transducer holder is used to blow ultrasonic coupling fluid from the front surface of the parts in the scan nest after they have been scanned. In a further embodiment, two or more scan nests are used for parallel operation.
A method and apparatus for dynamically adjusting the level of a response signal from an ultrasound transducer is disclosed. During a calibration phase, a description of a gain profile of a level adjuster is set dependent upon an expected response signal for a type of object to be tested and the description is stored in memory. During a measurement phase for an object under test, a description of a gain profile is selected for the type of the object under test and a gain profile is determined from the selected description. The response signal from the object under test is passed through a level adjuster and the level of the response signal is adjusted dynamically in accordance with the gain profile. The description of the gain profile is selected with reference to an expected response either by operator interaction with a user interface or automatically.
G10K 11/00 - Procédés ou dispositifs pour transmettre, conduire ou diriger le son en généralProcédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général
G01H 17/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores non prévue dans les autres groupes de la présente sous-classe
A61B 8/00 - Diagnostic utilisant des ondes ultrasonores, sonores ou infrasonores
A61B 8/12 - Diagnostic utilisant des ondes ultrasonores, sonores ou infrasonores dans des cavités ou des conduits du corps, p. ex. en utilisant des cathéters
21.
METHOD AND APPARATUS FOR ADJUSTING THE LEVEL OF A RESPONSE SIGNAL FROM AN ULTRASOUND TRANSDUCER
A method and apparatus for dynamically adjusting the level of a response signal from an ultrasound transducer is disclosed. During a calibration phase, a description of a gain profile of a level adjuster is set dependent upon an expected response signal for a type of object to be tested and the description is stored in memory. During a measurement phase for an object under test, a description of a gain profile is selected for the type of the object under test and a gain profile is determined from the selected description. The response signal from the object under test is passed through a level adjuster and the level of the response signal is adjusted dynamically in accordance with the gain profile. The description of the gain profile is selected with reference to an expected response either by operator interaction with a user interface or automatically.
Configuration of an ultrasonic inspection system is facilitated using an ultrasound response predicted by a simulation tool. In one embodiment, estimated material properties of an object to be inspected are input to the simulation tool. Also input to the simulation tool is at least one estimated property of an ultrasonic transducer of the ultrasonic inspection. The simulation tool predicts the response of the object to ultrasound from the ultrasonic transducer. This response is dependent upon the estimated material properties of the object to be inspected and the at least one estimated property of the ultrasonic transducer. The ultrasonic inspection system is then configured dependent upon a feature of the predicted response. The system may be configured, for example, by setting the position of a time gate, selecting an appropriate ultrasonic transducer, selecting the position of the transducer to achieve good focus, or selecting parameters for signal processing.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Automated microscope and operating software sold as a unit for use in laboratory operations, microscopes, Microscopes and parts thereof, Industrial ultrasonic testing equipment for determining industrial flaws in microelectronic and semiconductor structures, Surface roughness testing machines and instruments, Testing apparatus for testing printed circuit boards, Transducers that utilize ultrasonic oscillations to test for stress and fatigue including cracks, delaminations and inclusions in microelectronic and semiconductor structures, Ultrasonic detectors for inspection of semiconductor wafers, bonded wafers and packaging including pre-packaged and discrete semiconductor components, Ultrasonic equipment used to test or inspect damage to circuit boards and microelectronic packages, ultrasonic equipment for process monitoring and improvement and failure analysis, Ultrasonic sensors used for inspection of microelectronic and semiconductor structures, all in the fields of microelectronics and semiconductors Technical scientific consulting services, namely, laboratory, testing and diagnostic services, in the fields of microelectronics and semiconductors, Testing of new products for others, Materials testing, analyzing and evaluation, Product testing, Contract laboratory services, Testing of Computer Components, all in the fields of microelectronics and semiconductors
Configuration of an ultrasonic inspection system is facilitated using an ultrasound response predicted by a simulation tool. In one embodiment, estimated material properties of an object to be inspected are input to the simulation tool. Also input to the simulation tool is at least one estimated property of an ultrasonic transducer of the ultrasonic inspection. The simulation tool predicts the response of the object to ultrasound from the ultrasonic transducer. This response is dependent upon the estimated material properties of the object to be inspected and the at least one estimated property of the ultrasonic transducer. The ultrasonic inspection system is then configured dependent upon a feature of the predicted response. The system may be configured, for example, by setting the position of a time gate, selecting an appropriate ultrasonic transducer, selecting the position of the transducer to achieve good focus, or selecting parameters for signal processing.
