There is provided a method for accessing a memory cell of a plurality of memory cells that are part of a memory unit, the memory cells being grouped into a plurality of memory cell groups, wherein each memory cell group is associated with one or more local bit lines with each of the one or more local bit lines being operatively connected to a corresponding global bit line via a passgate comprising a PMOS transistor. The method comprises connecting each of the one or more local bit lines to the corresponding global bit line by decreasing a gate voltage that is applied to a gate of the corresponding PMOS transistor to a value that is sufficient to allow the PMOS transistor to conduct, wherein the value of the gate voltage that is sufficient to allow the PMOS transistor to conduct is either a positive or negative voltage.
G11C 11/4074 - Circuits d'alimentation ou de génération de tension, p. ex. générateurs de tension de polarisation, générateurs de tension de substrat, alimentation de secours, circuits de commande d'alimentation
G11C 11/4094 - Circuits de commande ou de gestion de lignes de bits
There is provided a method for accessing a memory cell of a plurality of memory cells that are part of a memory unit, the memory cells being grouped into a plurality of memory cell groups, wherein each memory cell group is associated with one or more local bit lines with each of the one or more local bit lines being operatively connected to a corresponding global bit line via a passgate comprising a PMOS transistor. The method comprises connecting each of the one or more local bit lines to the corresponding global bit line by decreasing a gate voltage that is applied to a gate of the corresponding PMOS transistor to a value that is sufficient to allow the PMOS transistor to conduct, wherein the value of the gate voltage that is sufficient to allow the PMOS transistor to conduct is either a positive or negative voltage.
G11C 11/4074 - Circuits d'alimentation ou de génération de tension, p. ex. générateurs de tension de polarisation, générateurs de tension de substrat, alimentation de secours, circuits de commande d'alimentation
There is provided a memory unit comprising an array of memory cells and a driver circuit configured to output an output address signal that addresses a portion/subset of the array of memory cells. The driver circuit comprises a logic gate that is configured to receive one or more input address signals and to provide an output address signal in dependence upon the one or more input address signals, and wherein the logic gate is configured to output a drive voltage provided by a first of the one or more input address signals as the output address signal when the output of the logic gate is true/high.
There is provided a multiple data rate memory configured to implement first and second memory accesses within a single cycle of an external clock signal. The memory comprises a plurality of memory cell groups, each memory cell group comprising a plurality of memory cells that are each operatively connected to at least one local bit line, the at least one local bit line of each memory cell group being connected to a local-to-global interface circuit. The local-to-global interface circuit is configured to control the state of at least one first global bit line in dependence upon the state of the at least one local bit line during the first memory access and to control the state of at least one second global bitline in dependence upon the state of the at least one local bit line during the second memory access.
G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
G11C 7/18 - Organisation de lignes de bitsDisposition de lignes de bits
G11C 7/22 - Circuits de synchronisation ou d'horloge pour la lecture-écriture [R-W]Générateurs ou gestion de signaux de commande pour la lecture-écriture [R-W]
G11C 8/16 - Réseau de mémoire à accès multiple, p. ex. adressage à un élément d'emmagasinage par au moins deux groupes de lignes d'adressage indépendantes
There is provided a memory unit comprising an array of memory cells and a driver circuit configured to output an output address signal that addresses a portion/subset of the array of memory cells. The driver circuit comprises a logic gate that is configured to receive one or more input address signals and to provide an output address signal in dependence upon the one or more input address signals, and wherein the logic gate is configured to output a drive voltage provided by a first of the one or more input address signals as the output address signal when the output of the logic gate is true/high.
G11C 8/08 - Circuits de commande de lignes de mots, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, pour lignes de mots
G11C 8/12 - Circuits de sélection de groupe, p. ex. pour la sélection d'un bloc de mémoire, la sélection d'une puce, la sélection d'un réseau de cellules
There is provided a method for accessing a memory cell of a plurality of memory cells that are part of a memory unit, the memory cells being grouped into a plurality of memory cell groups, wherein each memory cell group is associated with one or more local bit lines with each of the one or more local bit lines being operatively connected to a corresponding global bit line via a passgate comprising a PMOS transistor. The method comprises connecting each of the one or more local bit lines to the corresponding global bit line by decreasing a gate voltage that is applied to a gate of the corresponding PMOS transistor to a value that is sufficient to allow the PMOS transistor to conduct, wherein the value of the gate voltage that is sufficient to allow the PMOS transistor to conduct is either a positive or negative voltage.
G11C 7/18 - Organisation de lignes de bitsDisposition de lignes de bits
G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
G11C 8/12 - Circuits de sélection de groupe, p. ex. pour la sélection d'un bloc de mémoire, la sélection d'une puce, la sélection d'un réseau de cellules
There is provided a multiple data rate memory comprising a clock splitting circuit and a multiplexing address latch. The clock splitting circuit is configured to generate first and second internal clock pulses from a rising edge of an external clock signal and to provide the first and second internal clock signals to the multiplexing address latch. The multiplexing address latch is configured to output a first address signal in response to the first internal clock pulse and a second address signal in response to the second internal clock pulse.
G11C 7/22 - Circuits de synchronisation ou d'horloge pour la lecture-écriture [R-W]Générateurs ou gestion de signaux de commande pour la lecture-écriture [R-W]
G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. circuits de commande E/S de données, mémoires tampon de données E/S
G11C 8/18 - Circuits de synchronisation ou d'horlogeGénération ou gestion de signaux de commande d'adresse, p. ex. pour des signaux d'échantillonnage d'adresse de ligne [RAS] ou d'échantillonnage d'adresse de colonne [CAS]
There is provided a multiple data rate memory configured to implement first and second memory accesses within a single cycle of an external clock signal. The memory comprises a plurality of memory cell groups, each memory cell group comprising a plurality of memory cells that are each operatively connected to at least one local bit line, the at least one local bit line of each memory cell group being connected to a local-to-global interface circuit. The local-to- global interface circuit is configured to control the state of at least one first global bit line in dependence upon the state of the at least one local bit line during the first memory access and to control the state of at least one second global bitline in dependence upon the state of the at least one local bit line during the second memory access.
G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. circuits de commande E/S de données, mémoires tampon de données E/S
G11C 8/16 - Réseau de mémoire à accès multiple, p. ex. adressage à un élément d'emmagasinage par au moins deux groupes de lignes d'adressage indépendantes
G11C 7/22 - Circuits de synchronisation ou d'horloge pour la lecture-écriture [R-W]Générateurs ou gestion de signaux de commande pour la lecture-écriture [R-W]
G11C 7/18 - Organisation de lignes de bitsDisposition de lignes de bits
There is provided a SRAM memory unit comprising a SRAM memory cell, the memory cell being operatively connected to one or more bit lines, and wherein access for the one or more bit lines to the memory cell during a write operation is controlled by a word line. The memory cell further comprises a positive supply rail for supplying a positive voltage to the memory cell, wherein the positive supply rail is connected to a positive voltage source via a supply switch. The supply switch is provided by a PMOS transistor with a gate of the PMOS transistor being connected to the word line such that the positive supply rail is disconnected from the positive voltage source during a write operation.
G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
There is provided a method of detecting offset in a sense amplifier of an SRAM memory unit. The method comprises using a sense amplifier of the SRAM memory unit to implement a read of a first data value stored in a memory cell of the SRAM memory unit, and measuring a first time for the sense amplifier to read the first data value. The method further comprises using the sense amplifier to implement a read of a second data value stored in a memory cell of the SRAM memory unit, and measuring a second time for the sense amplifier to read the second data value. The method then comprises calculating a difference between the first time and the second time, and determining whether an offset adjustment should be applied to the sense amplifier in dependence upon the difference between the first time and the second time.
There is provided a memory unit comprising one or more global bit lines connected to a sense amplifier, and a plurality of memory cells that are grouped into a plurality of memory cell groups, each memory cell group having one or more local bit lines operatively connected to each of the memory cells in the memory cell group. Each memory cell group is configured such that, when a memory cell of the memory cell group is being read, the one or more local bit lines of the memory cell group are provided as inputs to a logic circuit and are not connected to the global bit lines, the logic circuit being configured to cause a capacitance element to be connected to one of the one or more global bit lines in dependence upon the states of the one or more local bit lines of the memory cell group.
G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
G11C 7/06 - Amplificateurs de lectureCircuits associés
G11C 7/18 - Organisation de lignes de bitsDisposition de lignes de bits
There is provided a memory unit that comprises a plurality of memory cell groups, each memory cell group comprising a plurality of memory cells that are each operatively connected to a first local bit line and a second local bit line by respective first and second access transistors, and each memory cell being associated with a word line configured to control the first and second access transistors of the memory cell. The first and second local bit lines of each memory cell group being operatively connected to respective first and second column bit lines by respective first and second group access switches, the first group access switch being configured to be controlled by the second column bit line, and the second group access switch being configured to be controlled by the first column bit line.
G11C 14/00 - Mémoires numériques caractérisées par des dispositions de cellules ayant des propriétés de mémoire volatile et non volatile pour sauvegarder l'information en cas de défaillance de l'alimentation
G11C 8/14 - Organisation de lignes de motsDisposition de lignes de mots
G11C 11/412 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors formant des cellules avec réaction positive, c.-à-d. des cellules ne nécessitant pas de rafraîchissement ou de régénération de la charge, p. ex. multivibrateur bistable, déclencheur de Schmitt utilisant uniquement des transistors à effet de champ
G11C 11/413 - Circuits auxiliaires, p. ex. pour l'adressage, le décodage, la commande, l'écriture, la lecture, la synchronisation ou la réduction de la consommation
G11C 11/417 - Circuits auxiliaires, p. ex. pour l'adressage, le décodage, la commande, l'écriture, la lecture, la synchronisation ou la réduction de la consommation pour des cellules de mémoire du type à effet de champ
G11C 11/404 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors formant des cellules nécessitant un rafraîchissement ou une régénération de la charge, c.-à-d. cellules dynamiques avec régénération de la charge commune à plusieurs cellules de mémoire, c.-à-d. rafraîchissement externe avec une porte à transfert de charges, p. ex. un transistor MOS, par cellule
There is provided a memory unit (100). The memory unit comprises a plurality of memory cells (110), each memory cell of the plurality of memory cells being operatively connected to data input and output circuitry by a pair of bit lines (130a, 130b), a pre-charge circuit (150) configured to provide a voltage for charging the bit lines, and a multiplexer circuit. The multiplexer circuit (140) comprises, for each bit line, an associated NMOS (142a, 142b) device that is configured to selectively connect the bit line (130a, 130b) to the data input and output circuitry and to the pre-charge circuit (150) when activated by a corresponding bit line selection signal, and a multiplexer controller (144) that is configured to be able to select each pair of bit lines by activating the associated NMOS devices (142a, 142b) using the corresponding bit line selection signals.
G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
b); a first bit line (28) operably connected for controlling 10 said node (24); a second bit line (30) operably connected for controlling said node (26); in which there is provided a data dependent conductive path (46) between the first and second bit lines (28, 30).
G11C 11/412 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors formant des cellules avec réaction positive, c.-à-d. des cellules ne nécessitant pas de rafraîchissement ou de régénération de la charge, p. ex. multivibrateur bistable, déclencheur de Schmitt utilisant uniquement des transistors à effet de champ
There is provided a method of detecting offset in a sense amplifier of an SRAM memory unit. The method comprises using a sense amplifier of the SRAM memory unit to implement a read of a first data value stored in a memory cell of the SRAM memory unit, and measuring a first time for the sense amplifier to read the first data value. The method further comprises using the sense amplifier to implement a read of a second data value stored in a memory cell of the SRAM memory unit, and measuring a second time for the sense amplifier to read the second data value. The method then comprises calculating a difference between the first time and the second time, and determining whether an offset adjustment should be applied to the sense amplifier in dependence upon the difference between the first time and the second time.
There is provided a memory unit comprising one or more global bit lines connected to a sense amplifier, and a plurality of memory cells that are grouped into a plurality of memory cell groups, each memory cell group having one or more local bit lines operatively connected to each of the memory cells in the memory cell group. Each memory cell group is configured such that, when a memory cell of the memory cell group is being read, the one or more local bit lines of the memory cell group are provided as inputs to a logic circuit and are not connected to the global bit lines, the logic circuit being configured to cause a capacitance element to be connected to one of the one or more global bit lines in dependence upon the states of the one or more local bit lines of the memory cell group.
G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
G11C 7/18 - Organisation de lignes de bitsDisposition de lignes de bits
There is provided a memory unit that comprises a plurality of memory cell groups, each memory cell group comprising a plurality of memory cells that are each operatively connected to a first local bit line and a second local bit line by respective first and second access transistors, and each memory cell being associated with a word line configured to control the first and second access transistors of the memory cell. The first and second local bit lines of each memory cell group being operatively connected to respective first and second column bit lines by respective first and second group access switches, the first group access switch being configured to be controlled by the second column bit line,and the second group access switch being configured to be controlled by the first column bit line.
G11C 11/412 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors formant des cellules avec réaction positive, c.-à-d. des cellules ne nécessitant pas de rafraîchissement ou de régénération de la charge, p. ex. multivibrateur bistable, déclencheur de Schmitt utilisant uniquement des transistors à effet de champ
G11C 11/413 - Circuits auxiliaires, p. ex. pour l'adressage, le décodage, la commande, l'écriture, la lecture, la synchronisation ou la réduction de la consommation
G11C 11/417 - Circuits auxiliaires, p. ex. pour l'adressage, le décodage, la commande, l'écriture, la lecture, la synchronisation ou la réduction de la consommation pour des cellules de mémoire du type à effet de champ
The present invention provides a memory unit (4) comprising: a storage element (6) comprising a pair of back to back inverters (12a, 12b and 14a, 14b) having respective first and second storage access nodes (24, 26);first and second voltage lines (VSS, VDD 16a, 6b) across which said pair of back to back inverters (12a, 12b and 14a, 14b) are connected;a first access transistor (18a), connected to said first storage node (24);a second access transistor (18b), connected to said second storage node (26);a write word line (22) connected to a gate (18g1) on said first access transistor (18a) and a gate (18g2) on said second access transistor (18b);a first bit line (28) operably connected for controlling 10 said node (24);a second bit line (30) operably connected for controlling said node (26); in which there is provided a data dependent conductive path (46) between the first and second bit lines (28, 30).
G11C 11/412 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors formant des cellules avec réaction positive, c.-à-d. des cellules ne nécessitant pas de rafraîchissement ou de régénération de la charge, p. ex. multivibrateur bistable, déclencheur de Schmitt utilisant uniquement des transistors à effet de champ
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