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Résultats pour
 brevets
1.
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METHOD TO CONTINUOUSLY FORM SURFACE MOUNT FLANGED PINS
| Numéro d'application |
US2009004453 |
| Numéro de publication |
2010/016882 |
| Statut |
Délivré - en vigueur |
| Date de dépôt |
2009-08-03 |
| Date de publication |
2010-02-11 |
| Propriétaire |
- BEAD INDUSTRIES, INC. (USA)
- TOTAL ELECTRONICS LLC (USA)
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| Inventeur(s) |
- Balazsi, James, W.
- Rayl, Kraig, R.
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Abrégé
A method to make a flanged pin (84) is described. The method includes feeding wire (80) through a forming die (52) whereby the wire (80) is deformed to create a straight pin (62). The straight pin (62) is then fed from the forming die (52) to a heading die (64) having a pre-formed cavity (60) where a first portion of the straight pin (62) is located in the forming die (52) and a second portion of the straight pin (62) is located in the heading die (64). A portion of the pin is secured in the forming (52) and heading (64) die, having a portion of the straight pin (62) disposed in a gap (70) defined by a space between the heading die (52) and the forming die (64).
Classes IPC ?
- B21D 22/00 - Mise en forme sans coupage, par estampage, repoussage ou emboutissage
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2.
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Method to continuously form surface mount flanged pins
| Numéro d'application |
12186561 |
| Numéro de brevet |
08087281 |
| Statut |
Délivré - en vigueur |
| Date de dépôt |
2008-08-06 |
| Date de la première publication |
2010-02-11 |
| Date d'octroi |
2012-01-03 |
| Propriétaire |
- Bead Industries, Inc. (USA)
- Total Electronics LLC (USA)
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| Inventeur(s) |
- Balazsi, James W.
- Rayl, Kraig R.
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Abrégé
A method to make a flanged pin is described. The method includes feeding wire through a forming die whereby the wire is deformed to create a straight pin. The straight pin is then fed from the forming die to a heading die having a pre-formed cavity where a first portion of the straight pin is located in the forming die and a second portion of the straight pin is located in the heading die. A portion of the pin is secured in the forming and heading die, having a portion of the straight pin disposed in a gap defined by a space between the heading die and the forming die. As the die gap is closed, the portion of the straight pin is displaced into a pre-formed cavity thereby creating a flange.
Classes IPC ?
- B21J 11/00 - Marteaux-pilons combinés avec des presses à forgerMachines à forger capables de marteler et de presser
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3.
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Method for manufacturing thin film heaters
| Numéro d'application |
11301151 |
| Numéro de brevet |
07617592 |
| Statut |
Délivré - en vigueur |
| Date de dépôt |
2005-12-12 |
| Date de la première publication |
2007-01-11 |
| Date d'octroi |
2009-11-17 |
| Propriétaire |
Total Electronics, LLC (USA)
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| Inventeur(s) |
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Abrégé
According to one embodiment of the present invention, a method for manufacturing thin film heaters includes an automated process for applying at least one layer of ink to a conductive substrate, and forming at least one electrically conductive electrode in electrical communication with the substrate by curing the ink. When an electrical current is applied to the thin film heater, current flowing through the substrate generates heat in the substrate. In alternate embodiments, a flexographic printing process is used to overlay two similar layers of ink on a carbon impregnated substrate and cure the ink to form at least one electrode conductor.
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