The invention relates to an illuminating device (1) comprising a substrate (2), a non-transparent spacer (4) which is connected to the substrate (2) so as to be hermetically sealed, an opening in the spacer (4), opposite said substrate (2), and an illumination element (3) positioned beneath the spacer (4) and beneath the opening, which element is connected to the substrate (2) so as to be hermetically sealed, characterized in that the opening in the spacer (4) is closed, so as to be hermetically sealed, by an optical element (5) consisting of a glass material the volume of which comprises at least one luminophore and thus constitutes a luminescent composite glass material.
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
A61B 5/00 - Mesure servant à établir un diagnostic ; Identification des individus
A61B 90/30 - Dispositifs pour éclairer une zone chirurgicale, les dispositifs ayant une corrélation avec d’autres dispositifs chirurgicaux ou avec une intervention chirurgicale
C09K 11/77 - Substances luminescentes, p.ex. électroluminescentes, chimiluminescentes contenant des substances inorganiques luminescentes contenant des métaux des terres rares
F21V 33/00 - Combinaisons structurales de dispositifs d'éclairage avec d'autres objets, non prévues ailleurs
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
A61B 1/06 - Instruments pour procéder à l'examen médical de l'intérieur des cavités ou des conduits du corps par inspection visuelle ou photographique, p.ex. endoscopes; Dispositions pour l'éclairage dans ces instruments avec dispositifs d'éclairement
A61C 1/08 - Eléments de machines spécialement adaptés à la chirurgie dentaire
The invention proposes an improved illumination system (1). The illumination system (1) comprises: an LED module (2) having at least one LED or OLED; at least one light sensor (3); and a control circuit (4) designed to control the current flowing through the LED module (2), and to be supplied with an individual sensing signal of each of the at least one light sensor (3). The at least one light sensor (3) is designed such that: the light sensor (3) has its sensitivity peak set to be at a lower wavelength than the spectrum emitted by the LED module (2), preferably below 42onm, more preferably below 4ionm, and/or the light sensor (3) has its sensitivity peak set to be at a higher wavelength than the spectrum emitted by the LED module (2), preferably above 68onm. Furthermore, the invention proposes a method for calibrating the illumination system (1). The control circuit (4) is designed to calculate a crosstalk calibration value, by detecting the contribution of a switching on or increasing of the current through the LED module (2) in a non-ambient light state, on the basis of the supplied detection signals.
LED light source, comprising a series connection of at least two LED strings, wherein each of the at least two LED strings corresponds to a single LED or comprises at least two LEDs, wherein at least one ohmic resistive element is connected in series with a first LED string of the at least two LED strings, and at least one switching element is connected in parallel to the series connection of the at least one ohmic resistive element and the first LED string, wherein the at least one switching element is configured to bypass in its conductive state the series connection of the at least one ohmic resistive element and the first LED string. The LED light source comprises at least two capacitors wherein a first capacitor of the at least two capacitors is connected in parallel to the series connection of the at least one ohmic resistive element.
The invention relates to an illumination device (1) comprising a substrate (2), a non-transparent spacer (4) which is connected to the substrate (2) so as to be hermetically sealed, an opening in the spacer (4), opposite said substrate (2), and an illumination element (3) positioned beneath the spacer (4) and beneath the opening, which element is connected to the substrate (2) so as to be hermetically sealed, characterised in that the opening in the spacer (4) is closed, so as to be hermetically sealed, by an optical element (5) consisting of a glass material the volume of which comprises at least one luminophore and thus constitutes a luminescent composite glass material.
A61C 1/08 - Eléments de machines spécialement adaptés à la chirurgie dentaire
A61B 90/30 - Dispositifs pour éclairer une zone chirurgicale, les dispositifs ayant une corrélation avec d’autres dispositifs chirurgicaux ou avec une intervention chirurgicale
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/54 - Encapsulations ayant une forme particulière
A61B 1/06 - Instruments pour procéder à l'examen médical de l'intérieur des cavités ou des conduits du corps par inspection visuelle ou photographique, p.ex. endoscopes; Dispositions pour l'éclairage dans ces instruments avec dispositifs d'éclairement
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
F21K 9/64 - Agencements optiques intégrés dans la source lumineuse, p.ex. pour améliorer l’indice de rendu des couleurs ou l’extraction de lumière en utilisant des moyens de conversion de longueur d’onde distincts ou espacés de l’élément générateur de lumière, p.ex. une couche de phosphore éloignée
C09K 11/77 - Substances luminescentes, p.ex. électroluminescentes, chimiluminescentes contenant des substances inorganiques luminescentes contenant des métaux des terres rares
A61C 3/02 - Instruments à forer ou couper; Instruments agissant à la façon d'une décapeuse au jet de sable
The invention relates to an LED module (10) having a carrier (1) and at least two LED components (2) arranged on a surface (1a) of the carrier, wherein the LED components (2) are each LED chips (2a) individually surrounded by a casting compound (2b), wherein the LED components (2) are arranged with the formation of an intermediate space (4) between two opposing side surfaces (2d) of the LED components (2), and a transparent cover (3) arranged over the LED components (2), which covers the at least two LED components (2) and at least partially fills the intermediate space (4) between the LED components (2), and wherein the cover (3) consists of a material having a substantially equal refractive index or index of refraction to the individual casting compound (2b) of the LED chips (2a), and wherein the carrier is a circuit board and the LED components (2) are chip-scale package (CSP) LEDs.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
a) of the multilayer board, an encapsulation layer (3) arranged above the at least one LED chip (1), and current regulator means (4) arranged on the multilayer board, wherein the current regulator means (4) are designed to convert a DC input provided to the module (10) to a predefined DC output for being provided to the at least one LED chip (1).
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes
F21V 9/08 - CARACTÉRISTIQUES FONCTIONNELLES OU DÉTAILS FONCTIONNELS DES DISPOSITIFS OU SYSTÈMES D'ÉCLAIRAGE; COMBINAISONS STRUCTURALES DE DISPOSITIFS D'ÉCLAIRAGE AVEC D'AUTRES OBJETS, NON PRÉVUES AILLEURS Éléments modifiant les caractéristiques spectrales, la polarisation ou l’intensité de la lumière émise, p.ex. filtres pour réduire l’intensité de la lumière
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
A direct AC driving circuit an a luminaire for driving at least one LED (2), the driving circuit comprises a LED string (2') that comprises a series connection of at least two LEDs (2), wherein the LED string (2') is directly powered from a rectified AC mains voltage (4) and a LED string switching unit (1) that is configured to control at least one LED (2) shortening unit (1') that is arranged in parallel to at least one LED of the LED string (2'). The driving circuit comprises means configured to provide a low supply voltage which is also derived from the rectified AC mains voltage (4), wherein the low supply voltage is generated from unutilized voltage of the LED-string (2').
The present invention relates to a LED Module (10) comprising a first carrier (1) with at least one LED Chip (3) arranged thereon and a second carrier (2) on which electric components (4) for being connected to the at least one LED Chip (3) are arranged, wherein the first carrier (1) is an insulated metal substrate comprising a metal base material and a dielectric layer on which the at least one LED Chip (3) is arranged, wherein the second carrier (2) is a sheet-shaped circuit board arranged to at least partially cover a top surface of the first carrier (1) and which is electrically connected to the first carrier (1), and wherein the second carrier (2) comprises stress reducing means (8) which are arranged to at least partially surround or encompass electric connection means (7a) of the second carrier.
The invention relates to a method for producing an LED module (1) and comprises at least the following steps: - providing at least one LED chip (4) on a substrate material (2), and - dispensing a not-cured (flowable/liquid) potting compound (3) on top of the LED chip (4), said potting compound (3) containing at least one type of luminescent particles and preferably a matrix material. During the step of dispensing, a predetermined potential is applied directly or indirectly to at least one LED chip (4).
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
The present invention relates to an LED module (10) for emitting mixed light, preferably white light, comprising: a module plate (11) which has at least one dam (12), which delimits at least one light field, wherein a plurality of LED chips (13) are arranged inside the light field; wherein a plurality of bead-shaped walls (14) arranged separately to one another are provided inside the light field, which form regions (15) separated from each other in the light field; and wherein a casting compound which has a luminescent substance or a luminescent substance mixture is provided in the separated regions. The present invention further relates to a lighting device comprising such an LED module (10) and a method for producing such an LED module (10).
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
LED module (10) comprising a substrate (1) and at least one LED chip (2), which is arranged on a surface (1a) of the substrate, a potting compound (3), which is arranged over the LED chip (2), comprises sedimented colour conversion particles (3a) contained therein and extends to a defined height (h) from an upper side (2a) of the LED chip (2) that is facing away from the substrate, wherein the colour conversion particles (3a) form within the potting compound (3) a layer (4) which covers an upper side (2a) of the LED chip (2) that is facing away from the substrate and the surface (1b) of the substrate (1) that surrounds the LED chip, wherein the height (h) of the potting compound over the at least one LED chip is between 0.3 and 1.4 mm, and wherein the potting compound is formed such that it has a thermal conductivity of between 0.1 and 1.5 W/mK.
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
The invention relates to a method (100) for producing an LED module (10) comprising at least one LED chip (1). In the method (100), at least one LED chip (1) is first provided on a preferably reflective carrier (2). Color conversion particles (3) which are electrically charged with a first polarity are then preferably provided in a matrix material (4). The LED chip (1) is subsequently charged with a second polarity opposite the first polarity, and the color conversion particles (3) are applied onto the at least one LED chip (1). The upper face facing away from the carrier (2) and the lateral surfaces of the at least one LED chip (1) are thereby coated with a layer of color conversion particles (3) in the LED module (10), said layer having substantially the same thickness on the upper face and on the lateral surfaces. Furthermore, the LED chip (1) can have at least one bonding wire (5) which is then likewise coated with color conversion particles (3).
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
C25D 13/02 - Revêtement électrophorétique caractérisé par le procédé avec des matières inorganiques
18.
LED converter and method for controlling a converter circuit of an LED converter
An LED converter (3) comprises a converter circuit (11) with potential separation (12). The converter circuit (11) has at least one controllable switching means (15). A control device (16) for switching the at least one controllable switching means (15) in a clocked manner is configured to modulate a switching frequency of the at least one controllable switching means (15) in order to transmit information across a potential barrier (12).
The invention relates to an LED module (10, 10', 10") for emitting mixed light, preferably white light, comprising: a module plate (11) having at least one ridge (12) which delimits a light field (13), wherein a plurality of LED chips (14, 14', 14", 14'") embedded in a casting compound (15) are arranged within the at least one light field (13); and wherein a fluorescent substance or a mixture of fluorescent substances (16, 17) is arranged selectively in the region around a respective LED chip (14, 14', 14", 14'"),. The invention further relates to a method for producing such an LED module (10, 10', 10") and to a lighting device having such an LED module (10, 10', 10").
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/54 - Encapsulations ayant une forme particulière
A new color-tunable LED module is described by the present invention. The invented color-tunable LED module (1) comprises a LED arrangement (2) comprising at least two LED strings, each comprising at least one preferably white LED, the LED strings being connected in an anti-parallel manner and the LED strings emitting different spectra, preferably white spectra with different color temperature, and a LED driver (LD'') driving the LED arrangement and which is configured to output a DC voltage switched between two polarities, wherein the duty cycle of the polarities, i.e. the ratio of the time period of a first polarity compared to the time period of a second opposite polarity, is adjustable, and the unit is configured to output at least one control signal (PWM, PWM1, PWM2) to the LED driver (LD) and to vary the duty cycle of the at least one polarity based on the determined signal.
A modulated optical signal is generated for communication between an LED module (20) and an LED converter (10). Said modulated optical signal is transmitted between the LED module (20) and the LED converter (10).
A driver for driving at least one string of LEDs with a rectified AC voltage is provided, comprising input terminals for supplying a rectified AC voltage, a control circuitry being supplied with a signal indicating the amplitude or the phase of the AC voltage, and a switching network comprising switches, each switch being arranged for selectively shunting or activating a substring of one or more LEDs of the LED string, wherein the control circuitry is designed to control each of the switches independently such that the combined forward voltage of the activated substrings of LEDs follows the amplitude of the rectified AC voltage in incremental steps, characterized in that the control circuitry is designed to alternate at least 2 active substrings of LEDs having the same combined forward voltage during the time period of one step.
The invention relates to a retrofit LED lamp having an LED module, a driver circuit for supplying power to the LED module, a base for making mechanical and electrical contact with a bulb fitting and a heat sink arrangement for dissipating the heat produced during operation at the LED module and/or the driver circuit. The heat sink arrangement in this case has a metal mount insert consisting of a mount plate with an integrally attached collar, the mount plate bearing, in thermally conductive contact, the LED module, and a transparent upper shell being fitted to the collar of the mount insert in the light exit direction and a thermally conductive lower shell being fitted, in areal contact, in the direction of the base for heat dissipation, said upper shell and said lower shell together forming a housing of the LED lamp which surrounds the LED module and the mount insert.
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
F21V 29/70 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p.ex. puits thermiques
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
F21V 3/02 - Globes; Vasques; Verres de protection caractérisés par leur forme
F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage
The invention relates to a method for operating LEDs (13), comprising a driver module (10) and an LED module (11) having at least one LED (13), which LED module (11) is controlled by the driver module (10), wherein the driver module (10) has a first connection (1), which is designed to feed the LED module (11) with a current, and has a second connection (2) is present as earth connection (GND), wherein the LED module (11) is fed with a current by the driver module (10) via a first connection (1) and a second connection (2) is present as earth connection (GND), characterized in that the driver module (10) temporarily lowers the voltage at the first connection (1) and monitors the voltage at the first connection (1) and is designed to evaluate a change in the voltage at said connection as a transfer of information from the LED module (11).
The invention relates to a device for operating LEDs, comprising a driver module and an LED module (11), which is controlled by the driver module (10) and has at least one LED. The LED module (11) is fed a current by the driver module (10) via a first connection (1), and a second connection (2) is present, preferably as a ground connection (GND). The device is characterized in that the LED module (11) is connected to the driver module (10) by means of a third connection (3), which is designed as a data channel, a voltage fed by the driver module (10) being applied to the data channel.
The invention relates to an LED-module (1) for emitting mixed light, preferably white light, comprising a light field (2''';2'''') which is divided into several flat sectors for dispensing different light spectra. The flat sectors of the light field (2''';2'''') are embodied as sectors of a circle (3c''',3d''';3c'''',3d'''') and sectors of a circular ring (3a''',3b''';3a'''',3b'''').
The invention relates to a lighting device (1) for generating white light which has at least one strip of three light diodes (LEDs) (2) in a linear arrangement, wherein: a) each LED strip (2) has two outer LEDs (3) and one center LED (4); b) each of the two outer LEDs (3) and the center LED (4) are phosphor-converted white LEDs; and c) the distance of each of the color coordinates of the two outer LEDs to the color coordinates of the mixed light of the two outer LEDs and the center LED is smaller than the distance of the color coordinate of the center LED to the color coordinates of the mixed light of the two outer LEDs.
The present application relates to a LED module (10) for being connected to a DC power supply (11), the LED module comprising a multilayer board (2) comprising a metal surface (2a) and a dielectric layer (2b) arranged thereon, at least one LED chip (1) arranged on the metal surface (2a) of the multilayer board, an encapsulation layer (3) arranged above the at least one LED chip (1), and current regulator means (4) arranged on the multilayer board, wherein the current regulator means (4) are designed to convert a DC input provided to the module (10) to a predefined DC output for being provided to the at least one LED chip (1).
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
36.
LED MODULE HAVING AN INTEGRATED SECONDARY OPTICAL UNIT
The invention relates to an LED module (1), comprising a carrier substrate (3), at least one LED chip (2), which is arranged on the carrier substrate (3), a color conversion layer (4), which at least partially contacts the LED chip and which converts at least some of the primary light emitted by the LED chip into a light of different wavelength, and a secondary optical unit (5), which is arranged after the color conversion layer (4) in an emission direction, wherein the secondary optical unit (5) is formed integrally with the color conversion layer (4).
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
The invention relates to an LED module having at least one first group of serially connected dye-converted white LEDs and a second group of serially connected dye-converted white LEDs. The first group and the second group of LEDs are connected together in parallel such that the groups can be controlled independently of each other by one or more drive circuits, and the nominal color temperature of the LEDs of the first group differs from the nominal color temperature of the LEDs of the second group. Each group of LEDs has at least two sub-groups comprising LEDs, said sub-groups differing with respect to the color location, and the groups and the sub-groups of LEDs are arranged on a substrate in a periodically repeating pattern at least in one direction of extension.
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes
F21Y 103/00 - Sources lumineuses de forme allongée, p.ex. tubes fluorescents
The present invention relates to an LED module (1) for operating based on ambient light sensing. The LED module (1) comprises a control unit (2) for driving at least one LED. At least one LED is an emitting LED (3) for emitting light, and least one LED is a sensing LED (4) for sensing light and outputting a sensing signal (5) according to the sensed light. Based on the sensing signal (5), the control unit (2) is configured to control a light output of the at least one emitting LED (3) obtained from the at least one sensing LED (4). The present invention relates similarly to a method for operating the LED module (1). In particular, the method may control the light output of the at least one emitting LED (3) with a pulse width modulation, PWM, signal, and obtain or evaluate the sensing signal (5) from the at least one sensing LED (4) only in off-periods of the PWM signal.
A Circuit arrangement (1) for an LED module (53) comprising a plurality of serially connected LEDs (11-25), comprises a first current source (35) and a second current source (36). The first current source (35) is serially connected to all the LEDs (11 - 25) of the LED module (53). The second current source (36) is serially connected to a first sub-set (33) of LEDs (11 - 24) of the LED module (53). The LEDs (11 - 24) of the first sub-set (33) are serially connected. The first sub-set (33) comprises at least one LED (25) less than the LED module (53).
An LED converter (3) comprises an isolated (12) converter circuit (11). The converter circuit (11) includes at least one controllable switching means (15). A control device (16) for clocked switching of the at least one controllable switching means (15) is designed to modulate a switching frequency of the at least one controllable switching means (15) in order for data to be transmitted via a potential barrier (12).
AnLED module (1) comprises at least one LED (21) and a wireless interface (27) for wireless energy transmission to supply the at least one LED (21) with energy.
The invention relates to a central unit (10) which supplies a lighting-means operating device (20, 30) for a lighting means, preferably an LED module (4), by means of a DC bus. The lighting-means operating device (20, 30) has a sensor (23, 33). The central unit (10) produces a DC supply voltage for supplying the lighting-means operating device (20, 30). Data are transferred between the central unit (10) and the sensor (23, 33) of the lighting-means operating device (20, 30) by means of a line (3), by means of which the central unit (10) supplies the sensor (23, 33) of the lighting-means operating device (20, 30) with energy.
An LED module, including a carrier having high reflectivity, wherein a metal layer, preferably a silver layer or a layer of high-purity aluminum, is applied to the carrier. Also disclosed is an LED module, including a carrier having high reflectivity, wherein a metal layer is applied to the carrier, at least one LED chip, and a dam, wherein the metal layer partially covers the surface of the carrier lying under the dam.
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
H01L 25/13 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
The invention relates to a white light LED module having at least one LED chip, wherein the LED chip emits light in the blue spectrum, preferably in the range from 440-455 nm, in particular in the range form 445-450 nm, wherein the LED module furthermore has: a first color conversion material, preferably LuAG, which has a dominant emissions wavelength in the green spectrum, preferably in the range from 475 - 625 nm and in particular in the range from 500 - 575 nm, a second color conversion material, preferably a nitride, which has a dominant emissions wavelength in the red spectrum, preferably in the range from 645 - 655 nm and in particular at 650 nm.
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
46.
CONTROL GEAR FOR A LIGHTING MEANS, PROGRAMMING DEVICE AND METHOD FOR CONFIGURING CONTROL GEAR
The invention relates to control gear for a lighting means (2), said gear comprising a supply voltage input for receiving a supply voltage and a control device (14) for controlling the control gear (1; 100), said control device (14) being designed to evaluate a voltage signal (51; 61; 71 ) at the supply voltage input in order to set at least one operating mode for a subsequent operation.
The invention relates to a method for altering the colour location of the visible light emitted by an LED module, said LED module having at least two parallel LED sections, each section having at least one LED and the emission spectra of the LED sections being different. The LED sections are operated alternately with a constant current and in order to alter the colour location, the relationship between the activation periods of the LED sections is altered, preferably whilst maintaining the sum of the activation periods of all the LED sections.
A circuit arrangement (1) is designed to operate a lighting means (2) comprising at least one light emitting diode, LED. The circuit arrangement (1) has a driver circuit (11 -13) which can be configured to provide at least two different LED currents. The circuit arrangement (1) is designed to identify a forward voltage of the lighting means (2). The circuit arrangement (1) is designed to configure the driver circuit (11-13) in accordance with the identified forward voltage in order to provide an LED current associated with the identified forward voltage.
The present invention relates to an LED module (1) that is suitable for emitting mixed light, preferably white light. The LED module (1) has a light-emitting light field (2) that is divided into a plurality of regions for emitting different light spectra. The regions of the light field (2) are planar sectors (3a, 3b, 3c) according to the invention. The LED module (1) is produced by a method in which, for creating the light field (2), first barriers (5) are formed which separate sectors (3a, 3b, 3c) of the light field (2) from each other, and then a transparent casting compound or a casting compound containing a luminescent substance is filled between the barriers (5) of each sector (3a, 3b, 3c). The present invention thereby provides a lighting device that has at least one LED module (1) and preferably one reflector placed on the LED module (1).
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
F21V 9/16 - Emploi de matériaux luminescents spécifiés comme écrans de lumière
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
The invention relates to a device for operating LEDs (13), comprising a driver module (10) and an LED module (11) having at least one LED (13), which LED module (11) is controlled by the driver module (10), wherein the driver module (10) has a first connection (1) which is designed to feed the LED module (11) with a current, and a second connection (2) is provided as earth connection (GND), wherein the LED module (11) is fed with a current by the driver module (10) via a first connection (1), and a second connection (2) is provided as earth connection (GND), characterised in that the driver module (10) temporarily lowers the voltage at the first connection (1) and monitors the voltage at the first connection (1) and is designed to evaluate a change in the voltage at said connection as a transfer of information from the LED module (11).
The invention relates to a device for operating LEDs, comprising a driver module and an LED module (11), which is controlled by the driver module (10) and has at least one LED. The LED module (11) is fed a current by the driver module (10) via a first connection (1), and a second connection (2) is present, preferably as a ground connection (GND). The device is characterised in that the LED module (11) is connected to the driver module (10) by means of a third connection (3), which is designed as a data channel, a voltage fed by the driver module (10) being applied to the data channel.
In one embodiment, the invention provides an LED module, having a carrier, a first group and a second group of LED chips arranged on the carrier, optionally one or more further groups of LED chips, and a layer covering all LED chips and containing at least one colour conversion material, which converts the spectrum of the LEDs of one or all groups into a spectrum with a different dominant wavelength. Every group comprises at least one LED chip, preferably a plurality of LED chips. The LED chips of one group are preferably connected in series and can be supplied starting from the same electrical supply. The LED chips of different groups can be supplied independently of one another, starting from different electrical supplies.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
F21S 9/02 - Dispositifs d'éclairage avec une source d'énergie incorporée; Systèmes utilisant des dispositifs d'éclairage avec une source d'énergie incorporée la source de courant étant une pile ou un accumulateur
53.
METHOD AND ARRANGEMENT FOR THE TEMPERATURE-CORRECTED CONTROL OF LEDS USING LOOK-UP TABLES
The invention proposes a circuit (2) for controlling a plurality of LED channels (K1, K2) each having at least one LED (L1, L2) and for generating mixed light from the light generated by the respective LED channels (K1, K2), wherein a look-up table is provided in each case for each target colour locus which can be reached by the LED module, said table storing the operating current (Ir, Iw) for each LED channel (K1, K2).
The invention relates to a lighting unit comprising a light source (16), which emits lights of a first wavelength (L1), and comprising a shield (20). The shield (20) is spaced from the light source (16) such that the light of the first wavelength (L1) from the light source (16) is incident on an inner face of the shield (20), and the shield (20) is constructed in at least three layers, specifically, starting from the inside, i.e. near the light source (16), and proceeding towards the outside, a first layer (S1) which is made of plastic or glass and which is permeable for the light of the first wavelength (L1), a color conversion layer (S2) made of at least one color conversion phosphor and at least one supporting material, and a third layer (S3) which is made of plastic or glass and which is permeable for a light of the first wavelength (L1) and a second wavelength (L2), said second wavelength (L2) being greater than the first wavelength (L1).
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT (Autriche)
Inventeur(s)
Pachler, Peter
Szücs, Anna
Langer, Gregor
Sommer, Christian
Abrégé
The present invention relates to an LED module 10, a circuit board 1, and a method for coating the circuit board 1 that is used in an LED module 10. The circuit board 1 is used particularly for reflecting light emitted by at least one LED chip of the LED module 10. The at least one LED chip 6 is located on a carrier plate 5 in a cut-out 2 of the circuit board 1. To increase the light yield of the LED module 10, the circuit board 1 is sprayed with a highly reflective layer 4. The layer 4 can be an ink provided with reflective particles, for example, which is sprayed on using an ink jet printing method. The LED module can additionally have at least one colour conversion element 7, 8, 9, which is preferably positioned in or above the at least one cut-out 2 of the circuit board 1. Finally; positioning elements 12, 13 can improve the assembly of the LED module 10, particularly the alignment of the circuit board 1 and the carrier plate 5.
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT (Autriche)
Inventeur(s)
Hartmann, Paul
Janisch-Lang, Franz
Krenn, Günther
Stahr, Johannes
Abrégé
The invention relates to an LED arrangement (1) which has a frame support (20), in particular a printed circuit board, a heat sink (10) which is provided in a recess (21) in the frame support (20), and at least one LED module (30) which is electrically contacted via the frame support (20) and which is thermally contacted with the heat sink (10) at least laterally in order to ensure a good heat flow from the LED module (30) to the heat sink (10). The invention further relates to the aforementioned frame support (20) together with the heat sink (10) without the LED module (30). In one embodiment, the LED chip radiates through an opening, which is introduced into the heat sink, rather than away from the frame.
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT (Autriche)
Inventeur(s)
Hoschopf, Hans
Lutschounig, Ferdinand
Volkheimer, Eva Maria
Wenzl, Franz-Peter
Abrégé
The invention relates to an LED module (1) which has a support (2), in particular a printed circuit board, at least one LED chip (3) which is applied onto the support (2) or is inserted into the support (2), and an optical element (4), preferably an optical plate which borders, preferably surrounds, a translucent area (5) provided above the LED chip (3). The optical element can have scattering particles. If this is the case, the concentration of the scattering particles can be higher in a region (43) which is aligned with the surface (30) of the LED chip (3), when seen in a main emission direction (H) that is preferably perpendicular to said surface, than in a region (44) which is not aligned with the surface (30) of the LED chip (3), when seen in the main emission direction (H). Alternatively or in addition to the scattering particle distribution which is concentrated in a controlled manner, at least one reflective element (6) can be provided on an optical element (4) face facing away from the LED chip (3) and at least in a surface region (41) which is aligned with the surface (30) of the LED chip (3), when seen in a main emission direction (H) that is preferably perpendicular to said surface, such that the emission of the LED chip (3) in the main emission direction (H) is evenly distributed preferably over the entire optical element (4). A homogenous light emission is achieved by means of the aforementioned embodiments. The invention further relates to a support (2) which has the aforementioned optical element (4), i.e. without the LED chip (3).
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
F21V 9/16 - Emploi de matériaux luminescents spécifiés comme écrans de lumière
The invention relates to a LED spotlight, preferably for white light, comprising—an LED module having several LED chips on a carrier,—a cooling body that is in thermal contact with the LED module,—a reflector that laterally surrounds the LED chips, and—a light mixing chamber arranged within the reflector and laterally surrounding the LED chips, the light mixing chamber base surface and the reflector bottom being located on the same plane.
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
F21V 29/505 - Dispositions de refroidissement caractérisées par l’adaptation au refroidissement de composants spécifiques de réflecteurs
F21V 29/77 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p.ex. puits thermiques avec ailettes ou lames avec ailettes ou lames en plans divergents essentiellement identiques, p.ex. avec une section en forme d’éventail ou d’étoile
F21V 29/83 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p.ex. puits thermiques les éléments comportant des ouvertures, des conduits ou des canaux, p.ex. des trous de rayonnement thermique
The invention relates to an LED module, comprising a carrier (3) having high reflectivity, wherein a metal layer (4), preferably a silver layer or a layer of high-purity aluminum, is applied to the carrier (3). The invention further relates to an LED module (1), comprising a carrier (3) having high reflectivity, wherein a metal layer (4) is applied to the carrier (3), at least one LED chip (2), and a dam (8), wherein the metal layer (4) partially covers the surface (17) of the carrier (3, 31) lying under the dam.
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
The present invention presents an end seal 10 for sealing a lighting tube 3 of a tubular lamp 10, and for connecting to a plastic carrier 1 for LED modules 2 inside the lighting tube 3. The end seal 10 comprises a cylindrical base body 11 with a first end 12a and a second end 12b, and a connector 13 provided at the first end 12a for engaging with a connector provided at an end of the plastic carrier 1. The end seal 10 is further designed so that a matrix material and/or a sealing material can be injected through the end seal 10 into the lighting tube 3.
The present invention presents a plastic carrier (1) for holding one or more LED modules (2) inside a lighting tube (3). The plastic carrier (1) comprises at least one bendable part (4) adapted to hold the plastic carrier (1) inside the lighting tube (3) by being biased and thus pressing against the inner wall of the lighting tube (3). The bendable part (4) can be composed of one or more bendable arms (4a, 4b). The plastic carrier is further equipped with a snap connector at each of its ends (12, 12b) to assist longitudinal connection of several plastic carriers (1).
F21V 17/16 - Fixation des parties constitutives des dispositifs d'éclairage, p.ex. des abat-jour, des globes, des réfracteurs, des réflecteurs, des filtres, des écrans, des grilles ou des cages de protection caractérisée par des moyens de fixation spécifiques par déformation de parties du dispositif d'éclairage; Montage du type à action rapide
F21S 4/00 - Dispositifs ou systèmes d'éclairage utilisant une guirlande ou une bande de sources lumineuses
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
The present invention presents a production method of a tubular lamp (20), the method comprising the steps of mounting at least one or more LED modules (2) on a plastic carrier (1), inserting the plastic carrier (1) into a lighting tube (3), connecting an end seal (10) to each end of the plastic carrier (1) to seal the lighting tube (3), and injecting a matrix material through a conduit through at least one of the end seals (10) to fill voids between the one or more LED modules (2) and the inner wall of the lighting tube (3).
The invention is directed to an LED lamp comprising a tubular translucent housing (2), and a linear light engine (3) having a linear heat sink (4, 40) and at least one LED module (5) being arranged on the heat sink (4, 40). The linear light engine (3) is arranged inside and enclosed by the housing (2) such that the linear light engine (3) is distanced from the inner wall of the housing (2) about its circumference in sectional side view, wherein the linear light engine (3) is distanced from the inner wall of the housing (2) by a predefined minimum distance (d) of at least 3mm in a horizontal direction (H) and angles (α, β, γ, δ) of at least +/- 45°, preferably +/- 60°, more preferably +/- 75°, most preferably +/- 90° from the horizontal direction (H) to allow the generation of an air circulation around the linear light engine (3) for enhanced heat transfer from the heat sink (4, 40) to the housing (2) by convection.
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
F21Y 103/00 - Sources lumineuses de forme allongée, p.ex. tubes fluorescents
The present invention proposes an LED dimming module (10) comprising two LED strings (1,2), the first LED string (1) comprising at least one color converted blue or UV LED (1a) and the second LED string (2) comprising at least one amber light emitting LED (2a), the LED module further comprising control means (3) connected to the first and second LED string (1,2), said control means (3) being designed to selectively vary a current provided to the first LED string (1) such that a non-linear dimming curve (13b) of the resulting emitted light is obtained, said dimming curve (13b) approaching the planckian curve (9) on the CIE chromaticity diagram.
The invention relates to a retrofit LED lamp having an LED module, a driver circuit for supplying power to the LED module, a base for making mechanical and electrical contact with a bulb fitting and a heat sink arrangement for dissipating the heat produced during operation at the LED module and/or the driver circuit. The heat sink arrangement in this case has a metal mount insert consisting of a mount plate with an integrally attached collar, the mount plate bearing, in thermally conductive contact, the LED module, and a transparent upper shell being fitted to the collar of the mount insert in the light exit direction and a thermally conductive lower shell being fitted, in areal contact, in the direction of the base for heat dissipation, said upper shell and said lower shell together forming a housing of the LED lamp which surrounds the LED module and the mount insert.
H01J 13/32 - Dispositifs de réfrigération; Dispositifs de chauffage
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
The invention relates to an LED lamp for warm white light having an LED module consisting of at least one color-converted blue or UV LED, and at least one monochromatic LED, preferably a red LED, in the case of which the mixed spectrum produces white light with a color temperature CCT of between 1500K and 2400K, preferably 1700K and 2100K at room temperature, and between 1800K and 2400K, preferably 2100K and 2300K at a stationary operating temperature of, for example, between 70° C. and 80° C. of the LED lamp.
H05B 41/16 - Circuits dans lesquels la lampe est alimentée par courant continu ou par courant alternatif à basse fréquence, p.ex. courant alternatif à 50 Hertz
H05B 41/24 - Circuits dans lesquels la lampe est alimentée par courant alternatif à haute fréquence
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
Tridonic connection technology GmbH & Co KG (Autriche)
Inventeur(s)
Moser, Peter
Kreuzbichler, Jürgen
Riedler, Thomas
Margreiter, Reinhard
Meyer, Dieter
Platzer, Christoph
Fink, Bernhard
Abrégé
The invention relates to a device (1) for mechanically connecting and making electrical contact with at least one LED unit (2), comprising at least one first connection socket (3) arranged on the LED unit (2), wherein the first connection socket (3) has contact elements (7), which are electrically conductively connected indirectly or directly to an LED module (13) of the LED unit (2), wherein a contact‑connection for electrically connecting the LED module (13) of the LED unit (2) to a supply conductor via the first connection socket (3) is provided. It is essential that the device has at least one further connection socket (20) fitted on the LED unit (2), wherein the connection sockets (3, 20) are preferably arranged in each case in the region of the ends of the LED unit (2). Moreover, the invention relates to an LED unit (2) and a luminous system (28) comprising at least one device according to the invention.
F21V 21/005 - Soutien, suspension ou fixation des dispositifs d'éclairage; Poignées pour plusieurs dispositifs d'éclairage disposés bout à bout, c. à d. rails de lumière
F21V 23/06 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage les éléments étant des dispositifs de couplage
F21S 4/00 - Dispositifs ou systèmes d'éclairage utilisant une guirlande ou une bande de sources lumineuses
The present invention relates to a heat sink (1), which is in thermal connection with at least one electronic component (4). The heat sink (1) has at least one chamber (2), which has at least one wall with at least one porous element (3a). Pressure producing means (7) are connected to the chamber (2), in order to cyclically modulate the air pressure P1 in the chamber (2). Thus, a "breathing" of air through the at least one porous element (3a) can be achieved and a cooling effect is obtained. Additionally, holes (8) can be provided to the chamber (2), which produce cyclic air jets (9) due to the fluctuating chamber air pressure P1. By providing an interaction of the air jets (9) with the air volume surrounding the at least one porous element (3a), the cooling of the at least one electronic component (4) can be optimized.
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
F21V 29/02 - Refroidissement en forçant l'air sur ou autour de la source lumineuse (dispositions de réfrigération structurellement associées avec des lampes électriques H01J 61/52, H01K 1/58)
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p.ex. d'air
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
70.
COOLING SYSTEM AND METHOD FOR ELECTRONIC COMPONENTS
The present invention is directed to a cooling system (1) for electronic components (4). The cooling system (1) comprises means (7) for producing cyclic air pressure fluctuations, wherein the electronic components (4) are distanced from the pressure producing means (7). In the vicinity of the electronic components (4) are situated means (5), preferably restrictions like holes, which are affected by the cyclic air pressure fluctuations, and which produce cyclic air jets (6). The air jets (6) affect the surface of the electronic component (4), and since the air jets (6) originate directly in the vicinity of the electronic components (4), an efficient heat transfer is affected. Preferably, the pressure producing means (7) actuate a pressure Pc inside a chamber (2), and turbulent air jets (6) are produced through holes (5) of a substrate (3), onto which electronic components (4) are mounted.
F21V 29/02 - Refroidissement en forçant l'air sur ou autour de la source lumineuse (dispositions de réfrigération structurellement associées avec des lampes électriques H01J 61/52, H01K 1/58)
F04F 7/00 - Pompes déplaçant des fluides en utilisant leur inertie, p.ex. en produisant des vibrations dans le fluide
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p.ex. d'air
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
The present invention proposes a LED lamp comprising a housing (20), at least one LED (11), a heat sink (9) thermally connected to the at least one LED (11), and a cooling element (1) inside the housing, the cooling element (1) comprising at least one piezo-electrically driven blade member (2), and an oscillator circuit (4) for oscillating the blade member (2) at resonance, wherein the oscillator circuit (4) is designed to adapt a driving current applied to the blade member (2) in response to an input signal of a feedback element (5) connected to the blade member (2).
F21V 29/02 - Refroidissement en forçant l'air sur ou autour de la source lumineuse (dispositions de réfrigération structurellement associées avec des lampes électriques H01J 61/52, H01K 1/58)
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
The invention relates to an LED emitter, preferably for white light, comprising: - an LED module (5) having a plurality of LED Chips (7, 7') on a carrier (6), - a light-transmissive medium (8), below which the LED chips are accommodated, - a reflector (2) laterally surrounding the LED chips (7, 7'), characterized in that a diffusing cap (900) is arranged within the reflector (2), wherein the diffusing cap (900) encloses the LED chips (7, 7').
It is proposed a LED module (1) comprising a substrate (5) for LED chips, at least two LED chips (2, 3, 4) mounted directly or indirectly on the substrate (5), and an encapsulation layer (9) arranged on the LED chips (2, 3, 4) and comprising color conversion material for modifying the emission spectrum of the LED chips (2, 3, 4) r wherein the quantity of color conversion material arranged on a first group of at least one LED chip (4) is lower than the quantity of color conversion material arranged on a second group of at least one LED chip (2, 3).
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
74.
LED MODULE WITH PREFABRICATED WAVELENGTH CONVERSION ELEMENT
LUMITECH PRODUKTION UND ENTWICKLUNG GMBH (Autriche)
Inventeur(s)
Pachler, Peter
Schrank, Franz
Abrégé
The invention relates to an LED module, comprising: - at least one LED chip (1) on a carrier (5), and - a prefabricated element (3) applied on the light emission surface of the LED chip (1), wherein scattering particles and colour conversion particles different therefrom in a matrix are accommodated in the element (3), wherein the concentration of the scattering particles decreases with a substantially constant first gradient from that side of the element (3) which faces the LED chip, and wherein the concentration of the colour conversion particles - in a first region, facing the LED chip, is substantially constant, in such a way that the colour conversion particles are packed in the densest possible fashion in this region, and - in a second region, adjoining the first region, falls abruptly with a second gradient, which is significantly greater than the first gradient of the scattering particles.
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
The invention relates to a LED spotlight, preferably for white light, comprising - an LED module (5) having several LED chips (7, 7') on a carrier (6), - a cooling body (3) that is in thermal contact with the LED module (5), - a reflector (2) that laterally surrounds the LED chips (7, 7'), and - a light mixing chamber (40) arranged within the reflector (3) and laterally surrounding the LED chips (7, 7'), the light mixing chamber base surface (50) and the reflector bottom (60) being located on the same plane.
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
The invention relates to a packaged LED module (1) comprising a module (2) having at least one LED (3) arranged thereon, and a one-piece package (10, 100) having a receptacle for the module (2), a substantially optically transmissive region (11, 11a, 11b, 11c), which makes it possible to emit light from the LED (3) towards the outside, an opening (16) and potting blocking means (17). The package (10, 100) is embodied in such a way that a potting component is introduced via the opening (16) into the package (10, 100) equipped with the module (2). The introduced potting component forms a potting body (30), which completely fills the package (10, 100), excluding a region between the LED (3) and the substantially optically transmissive region (11, 11a, 11b, 11c) on account of the potting blocking means (17), and which connects the package (10, 100), the module (2) and connecting cables (20) that can be connected to the module (2) in an externally sealing manner.
The invention relates to a circuit arrangement for operating LEDs (LED1, LED2, LED3) with a pulsating DC voltage. Said circuit arrangement has a constant power source which prevents the brightness of the LEDs following the pulse form of the DC voltage. Said circuit arrangement is also provided with an auxiliary power source which takes over the supply of power to the LEDs when the pulsating DC voltage falls below a predefined minimum value in the interpulse periods and the constant power source is inactive. The pulsating DC voltage is generated from an AC voltage, preferably from an AC power supply system voltage, by means of a bridge rectifier. If the circuit arrangement is intended to be operated with an upstream phase-gating dimmer, the circuit arrangement can additionally be provided with an extinction circuit which, in the event of a drop in the input voltage caused by the interpulse periods, briefly reduces the input resistance of the circuit arrangement to such an extent that a sufficiently high extinction current can flow across the input resistor.
The invention relates to a LED module (7) which comprises: at least one LED chip (20, 21) mounted on a substrate, a first diffuser element (10) which scatters the light from the at least one LED chip (20, 21) diffusely, and a second diffuser element (8) which when viewed in the light beam direction is outside the first diffuser element (10) and is separated therefrom, preferably forming an air gap.
The invention relates to an LED lamp (1) having two connector pins (7) for electrically contacting the LED lamp (1), comprising at least one platform (3) comprising a silicon substrate (9) having at least one LED (4), and at least one cooling element (6). The at least one LED (4) is applied directly or indirectly to the silicon substrate (9) of the platform (3). At least one electronic component (5), being part of the electrical circuit supplying the at least one LED (4), is thereby integrated in the at least one platform (3), preferably in the silicon substrate (9). The at least one cooling element (6) is also disposed below the at least one platform (3) in the area of the connector pins (7).
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
81.
RETROFIT LED LAMP WITH WARM-WHITE, MORE PARTICULARLY FLAME-LIKE WHITE LIGHT
The invention relates to an LED lamp for warm-white light, comprising an LED module consisting of at least one dye-converted blue or UV-LED, and at least one monochromatic LED, preferably a red LED, wherein the mixed spectrum is white light having a colour temperature CCT of between 1500K and 2400K, preferably 1700K and 2100K, at room temperature and between 1800K and 2400K, preferably 2100K and 2300K, at a steady-state operating temperature of e.g. between 70°C and 80°C of the LED lamp.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
The invention relates to an electronic system (1) comprising at least one electronic functional unit (2), at least one receiver unit (5) for wirelessly transmitting signals, and at least one remote control unit (7) transmitting control signals to the electronic functional unit (2) by means of the receiving unit (5). The remote control unit (7) is thereby part of a conventional object (8, 9, 10) associated with a person.
H04L 12/28 - Réseaux de données à commutation caractérisés par la configuration des liaisons, p.ex. réseaux locaux [LAN Local Area Networks] ou réseaux étendus [WAN Wide Area Networks]
The invention relates to a retrofit LED-lamp (1), comprising an LED module (7), a driver circuit (5) for supplying power to the LED module, wherein the driver circuit is designed to operate with mains alternating voltage or low-voltage direct voltage, a base (2) for the mechanical and electrical contact with a light bulb socket, and a cooling body assembly for dissipating heat produced during operation on the LED module (7) and/or the driver circuit (5). The cooling body assembly comprises a metal carrier insert (6) consisting of a carrier plate having an integrally attached collar (10), wherein the carrier plate carries the LED module being in a thermally conductive contact, and wherein on the collar of the carrier insert a transparent upper shell (8) is arranged in the light emission direction and a thermally conductive lower shell (4) is arranged in the direction of the base for dissipating heat in flat contact, which together form a housing of the LED lamp surrounding the LED module and the carrier insert.
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
84.
LIGHT-EMITTING DIODE MODULE AND CORRESPONDING MANUFACTURING METHOD
A manufacturing method is described by the present invention for a LED module (1). The method comprises mounting of at least one LED (3) onto a surface of a substrate (2), and depositing a base layer (5) to cover said substrate (2) surface and the LED (3), wherein the base layer (5) is transparent for visible light and preferably does not comprise phosphor particles. Optionally, a first heat treatment to modify the surface properties of the base layer (5) is comprised. The method further comprises dispensing a matrix material, so that it forms an essentially half-spherical cover (6) covering the LED (3) and optionally nearby portions of the base layer (5), and optionally, a second heat treatment to harden the half -spherical cover layer (6). Additionally the present invention discloses an LED module (1), which is manufactured by the claimed method.
The invention relates to a method for operating a range of LEDs preferably fed with constant current, which range of LEDs generates preferably white mixed light with at least two LED types of different spectrum, wherein the movement of the color locus of the mixed light, which is caused by the different negative gradients of the temperature dependencies of the intensity of at least two different LED types, is reduced by circuitry without using measurements and feedback variables.
The invention relates to an LED lamp (L) comprising a luminous element having at least one LED and a cooling body (K1-K6), characterized in that: the cooling body (K1-K6) is designed such that a plurality of channels (1, 1', 1'', 1''') for evacuation of air heated by an operation of the luminous element are formed and pass through the cooling body, wherein the channels (1, 1', 1'', 1''') are arranged about an axis (A) in a ring shape and wherein the length of at least one channel (1, 1', 1'', 1''') is at least half of the shortest diagonal or transversal in the transverse extension of the corresponding one channel. The assembly and in particular the configuration of the channels (1, 1', 1'', 1''') according to the invention allows for a particularly effective heat evacuation to be achieved.
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
87.
OPERATION OF AN LED LUMINAIRE HAVING A VARIABLE SPECTRUM
The invention relates to a method for controlling the operation of an LED luminaire (1), which comprises a plurality of LEDs (5, 6) as luminous elements. The method comprises the following steps: - evaluating, by means of a control unit (3) of the LED luminaire (1), an electrical signal generated by a switch, push-button or dimmer switch (10) that can be operated by a user (11) and is connected to the control unit (3) by means of an interface (23) of the LED luminaire (1) and supplied with power, and - changing the color spectrum of the LED luminaire (1) depending on the evaluated signal.
The invention relates to an elongated luminous element (1) having a plurality of approximately point-shaped light sources (2) disposed along a line and having light diffusion means (3) deflecting at least one part of the light rays (12) sent out by the light sources (2) in a desired direction. The light diffusion means (3) are disposed lateral to the main emitting direction of the light sources. The elongated luminous element (1) is particularly suitable for installation in a light box (13) for advertising or demonstration purposes. The light box has a transparent or partially transparent front side (7) and a reflective back side (8). The elongated luminous element (1) or a plurality thereof is or are applied to at least one of the side areas (11, 14), such that the light rays (12) emitted by the light sources (2) and deflected by the light diffusing means (3) are aimed between or on the back side (8) and/or the front side (7) of the light box (13).
The invention relates to a housed LED module consisting of a module (6) with at least one LED (1) located thereon. The module (6) is situated inside a sealable housing (3,4) and a front face of the housing (3,4) has at least two rigid conductors (27) that protrude outwards from the wall of the housing, said conductors being designed to electrically contact two conductors (10) running substantially at right angles to the first conductors by cutting into the insulation of the two conductors.
The invention relates to a method and a lighting system designed therefor for controlling a multichannel LED module (3), wherein the light radiated by the multichannel LED module (3) is set to a predetermined color by independently activating the individual channels (5) and the actually radiated light color (11) is fed back for control purposes. A rough control, in which only the channels of a subgroup, in particular two channels, are adjusted independently of each other, occurs in a first step until the overall radiated light color lies within a specified tolerance range. A fine control, in which all channels are adjusted, occurs in a second step.
The invention relates to an LED light for refrigerated vending furniture (1), in particular refrigerated shelves, comprising a plurality of LEDs (4, 9) for illuminating the vending furniture. The invention is characterized in that a least some of the LEDs of the LED light are designed as at least one linear LED unit (3), e.g. a wall floodlight, which is mounted in the top region of the refrigerated piece of vending furniture, especially below the top closing cover (7) of the refrigerated shelf unit. Furthermore, the emission characteristics of the linear LED unit (3) are limited to a specific angle, and the linear LED unit (3) has an asymmetrical light intensity distribution, the asymmetrical emission characteristics of the linear LED unit (3) being obtained using a specially designed asymmetrical lens (20).
F21S 4/00 - Dispositifs ou systèmes d'éclairage utilisant une guirlande ou une bande de sources lumineuses
F21V 5/08 - Réfracteurs pour sources lumineuses produisant une distribution de lumière asymétrique
F21W 131/405 - Utilisation ou application des dispositifs ou des systèmes d'éclairage, non prévues dans les groupes Éclairage pour un usage industriel, commercial, récréatif ou militaire pour les vitrines ou les étalages
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
The invention relates to a retrofit LED module (1) comprising a support (2) having at least one LED (3), also comprising a retrofit base (4) for mechanically and electrically contacting to conventional lamp sockets and an electronic system (5, 6, 7, 27, 30) for controlling the at least one LED, characterised in that at least one part of the electronic system (6, 7) is integrated into the support, and said electronic system comprises a light sensor (7, 27, 30) and/or a day light sensor and/or a colour sensor (7, 27, 30) and/or the associated electronics system for processing the signal.
TRIDONIC CONNECTION TECHNOLOGY GMBH & CO. KG (Autriche)
Inventeur(s)
Platzer, Christoph
Kreuzbichler, Jürgen
Riedler, Thomas
Abrégé
The invention relates to an LED luminaire with an LED module (2), which has at least one LED as light-emitting means. Furthermore, the LED luminaire has a light head (4) with a heat sink (3), wherein the LED module (2) is connected thermally to the heat sink (3) in order to dissipate heat which can be produced by the LED. In addition, means (40, 42) for producing a releasable electrical, at least three-pole connection between the LED module (2) and the light head (4) are provided. This enables particularly good drive possibilities for the LED; for example differently coloured LEDs can be driven thereby. So-called back-channels, for example for temperature sensor systems etc., are thus also possible.
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
F21V 17/10 - Fixation des parties constitutives des dispositifs d'éclairage, p.ex. des abat-jour, des globes, des réfracteurs, des réflecteurs, des filtres, des écrans, des grilles ou des cages de protection caractérisée par des moyens de fixation spécifiques
F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
F21V 17/16 - Fixation des parties constitutives des dispositifs d'éclairage, p.ex. des abat-jour, des globes, des réfracteurs, des réflecteurs, des filtres, des écrans, des grilles ou des cages de protection caractérisée par des moyens de fixation spécifiques par déformation de parties du dispositif d'éclairage; Montage du type à action rapide
F21V 23/02 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage les éléments étant des transformateurs ou des impédances
A LED module comprises a printed circuit board or a SMD carrier. At least one LED chip is mounted on the board or carrier. An element is arranged, i.e. dispensed or mounted, on top of the LED chip. The surface of the board or carrier, on which the globe top is dispensed, is covered with white reflective material contacting the LED chip, preferably at its side walls. Alternatively, said element is partially covered with said reflective material.
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 33/46 - Revêtement réfléchissant, p.ex. réflecteur de Bragg en diélectriques
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
95.
LED MODULE FOR MODIFIED LAMPS AND MODIFIED LED LAMP
The invention relates to a LED lamp modified as a light bulb having an LED module that has a printed circuit board or an SMD carrier and a plurality of LED chips that are mounted on the board or the carrier, wherein a ball covering is arranged - that is, distributed or mounted on the LED chips and the surface of the board or the carrier that surround the LED chip - and wherein at least one LED chip emits blue light that is partially converted from a phosphor and wherein at least one LED chip emits a spectrum, preferably in the red spectrum, that is substantially not influenced by the phosphor.
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
H01L 33/54 - Encapsulations ayant une forme particulière
H01L 33/46 - Revêtement réfléchissant, p.ex. réflecteur de Bragg en diélectriques
TRIDONIC CONNECTION TECHNOLOGY GMBH & CO KG (Autriche)
Inventeur(s)
Dobos, Janos
Hoschopf, Hans
Hlina, Werner
Kreuzbichler, Jürgen
Abrégé
The invention relates to a housed LED module comprising a module (6) having at least one LED (1) arranged thereupon, wherein said module (6) is arranged within a sealable housing (3,4), and wherein said housing (3,4) has lateral connection lead-throughs (20) as tension relief elements for at least two connection cables (10) used for electrical contacting of said module (6). Said housing has a partially transparent upper shell (3) having a substantially optically permeable region (12) having a function of changing the light emission characteristics of said LED (1), wherein said optically permeable region (12) comprises a dispersion effect, a reflection effect and/or a color conversion effect.
brevets
