Abrégé

Provided is a method of making colloidal metal nanoparticles. The method includes the steps of: mixing a metal aqueous solution and a reducing agent to form a mixture solution in a reaction tank; heating the mixture solution and undergoing a reduction reaction to produce a composition containing metal nanoparticles, residues and gas, wherein the amount of the residues is less than 20% by volume of the mixture solution, and guiding the gas out of the reaction tank; dispersing the metal nanoparticles with a medium to obtain colloidal metal nanoparticles. By separating the reduction reaction step and the dispersion step, the method of making colloidal metal nanoparticles is simple, safe, time-effective, cost-effective, and has the advantage of high yield.

Classes IPC  ?

• B82Y 30/00 - Nanotechnologie pour matériaux ou science des surfaces, p. ex. nanocomposites
• B01J 13/00 - Chimie des colloïdes, p. ex. production de substances colloïdales ou de leurs solutions, non prévue ailleursFabrication de microcapsules ou de microbilles

Abrégé

A method of making the inorganic gold compound, such as tetrachloroauric acid, sodium tetrachloroaurate, potassium tetrachloroaurate, sodium tetracyanoaurate, and potassium tetracyanoaurate, includes the step of: treating gold with a halogen-containing oxidizing agent in a hydrochloric acid to obtain the inorganic gold compound, wherein the halogen-containing oxidizing agent excludes chlorine gas. The method of making the inorganic gold compound is simple, safe, time-effective, cost-effective, and environment-friendly, and has the advantage of high yield.

Classes IPC  ?

• C01G 7/00 - Composés de l'or
• C01C 3/10 - Cyanures simples de métaux alcalins

Abrégé

A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H01F 27/28 - BobinesEnroulementsConnexions conductrices
• H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/42 - Trous de passage métallisés
• H01F 17/00 - Inductances fixes du type pour signaux
• H01F 17/06 - Inductances fixes du type pour signaux avec noyau magnétique avec noyau refermé sur lui-même, p. ex. tore
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

Classes IPC  ?

• H01F 5/00 - Bobines d'induction
• H01F 27/28 - BobinesEnroulementsConnexions conductrices
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés
• H01F 17/00 - Inductances fixes du type pour signaux
• H01F 17/06 - Inductances fixes du type pour signaux avec noyau magnétique avec noyau refermé sur lui-même, p. ex. tore

Abrégé

A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.

Classes IPC  ?

• B23P 11/00 - Assemblage ou désassemblage de pièces ou d'objets métalliques par des processus du travail du métal non prévus ailleurs
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
• H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
• H01F 41/14 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour appliquer des pellicules magnétiques sur des substrats

Abrégé

A method of forming an electrode having an electrochemical catalyst layer is disclosed. The method includes etching a surface of a substrate, followed by immersing the substrate in a solution containing surfactants to form a conditioner layer on the surface of the substrate, and immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioner layer.

Classes IPC  ?

• C03C 15/00 - Traitement de surface du verre, autre que sous forme de fibres ou de filaments, par attaque chimique

Abrégé

A method of forming an electrode having an electrochemical catalyst layer is disclosed, which comprises providing a substrate with a conductive layer formed on the surface of a substrate, conditioning the surface of the substrate, immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioned surface of the substrate, and thermally treating the polymer-protected electrochemical catalyst layer at a temperature approximately below 300° C.

Classes IPC  ?

• B05D 5/12 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers pour obtenir un revêtement ayant des propriétés électriques spécifiques

Produits et services

Semiconductor chips; printed circuit boards; circuit boards provided with integrated circuits; computer interface boards; integrated circuit modules; RAM (random access memory) card; flash memory card; electronic integrated circuits; printed circuit boards for computers. Import and export agencies; business consulting and information services; product demonstrations. Manufacture of general product lines in the field of wafers to the order and specification of others; manufacture of general product lines in the field of Printed Circuit Boards to the order and specification of others.

Produits et services

Semiconductor chips; Printed circuit boards; Circuit boards provided with integrated circuits; Computer interface boards; Integrated circuit modules; RAM (Random Access Memory) cards; Flash memory cards; Printed circuit boards without components; electronic integrated circuits