Abrégé

A laser oscillator includes an outer electrode, an inner electrode forming a discharge chamber between the inner electrode and the outer electrode, a first resonator mirror provided on a first end side of the outer electrode and the inner electrode, a second resonator mirror provided on a second end side of the outer electrode and the inner electrode and configured to reflect the laser light between the second resonator mirror and the first resonator mirror, and a support member configured to support the inner electrode. The support member has an opening portion through which the laser light passes at a position corresponding to the discharge chamber, and at least a part of the opening portion has an opening width smaller than a beam diameter of the laser light emitted from the discharge chamber and serves as a space filter portion.

Classes IPC  ?

• H01S 3/038 - Électrodes, p. ex. forme, configuration ou composition particulières
• H01S 3/08 - Structure ou forme des résonateurs optiques ou de leurs composants

Abrégé

A purpose of the present invention is to provide a method of processing a substrate to improve a processing efficiency of the substrate. The method includes steps of: dividing a raw ceramic substrate into small substrates; annealing the divided small substrates; arraying the annealed small substrates; fixing the arrayed small substrates by using an organic member to form a large substrate; emitting laser beam to the arrayed small substrates in the large substrate to process a through hole; filling the through hole with a conductor; printing a wiring on the arrayed small substrates in the large substrate; stacking a new layer on front and back surfaces of the arrayed small substrates in the large substrate; and cutting the organic member of the large substrate to divide the large substrate into the small substrates.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser deflector configured to deflect the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser deflector, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser deflector is arranged in an input side of the laser deflector.

Classes IPC  ?

• B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p. ex. en utilisant la lumière rétrodiffusée
• B23K 26/046 - Focalisation automatique du faisceau laser
• B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
• B23K 26/064 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p. ex. lentilles, miroirs ou prismes
• B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser

Abrégé

A laser processing apparatus includes: a laser oscillator configured to oscillate a laser pulse; a first laser deflection unit configured to deflect the laser pulse emitted from the laser oscillator in a two-dimensional direction; a second laser deflection unit having a slower operation speed and configured to deflect the laser pulse emitted from the first laser deflection unit in a two-dimensional direction on a same plane; a laser oscillation control unit configured to control the laser oscillator; and first and second laser deflection control units respectively configured to control operations of the first and second laser deflection units. The first laser deflection control unit controls the first laser deflection unit to successively irradiate the laser pulse to multiple sites along a predetermined track in each of the processing positions in turn, and to change energy of the laser pulse emitted therefrom in a middle of repeated irradiation.

Classes IPC  ?

• B23K 26/388 - Trépanage, c.-à-d. perçage en déplaçant le spot du faisceau autour d’un axe
• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/064 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p. ex. lentilles, miroirs ou prismes
• B23K 26/073 - Détermination de la configuration du spot laser
• B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
• B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
• B23K 103/18 - Matériaux comportant des matières différentes
• G02B 19/00 - Condenseurs
• G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
• G02B 26/10 - Systèmes de balayage
• G02F 1/33 - Dispositifs de déflexion acousto-optique

Abrégé

A laser processing apparatus disclosed in the present application includes: an optical deflection unit capable of changing a deflection direction of and outgoing energy of an incoming laser pulse by changes of a frequency of and an amplitude of a driving signal to be supplied; and a control unit configured to supply driving signals with amplitudes corresponding to respective frequencies. In a laser processing apparatus configured to process a workpiece by leading outgoing laser pulse of the optical deflection unit to the workpiece and irradiating the workpiece with the laser pulse, as the amplitude corresponding to each of the frequencies, the control unit supplies an amplitude having the ratio that is close to the lowest ratio among ratios of the outgoing energy with respect to the incoming energy of the laser pulse at an amplitude having the largest outgoing energy of the optical deflection unit.

Classes IPC  ?

• G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p. ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
• H01S 3/00 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet
• B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

Provided is a laser processing method for drilling a hole in a glass substrate with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate from a side of the glass substrate on which a protective sheet is adhered so as to form a blind hole; removing the protective sheet from the glass substrate and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate not irradiated with the laser so as to convert the blind hole into a through hole.

Classes IPC  ?

• B23K 26/386 - Enlèvement de matière par perçage ou découpage par perçage de trous borgnes
• B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
• C03C 15/00 - Traitement de surface du verre, autre que sous forme de fibres ou de filaments, par attaque chimique
• C03C 23/00 - Autres traitements de surface du verre, autre que sous forme de fibres ou de filaments
• B23K 26/18 - Travail par rayon laser, p. ex. soudage, découpage ou perçage utilisant des couches absorbantes sur la pièce à travailler, p. ex. afin de marquer ou de protéger
• B23K 26/384 - Enlèvement de matière par perçage ou découpage par perçage de trous de forme spéciale
• B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
• B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
• B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
• B23K 103/00 - Matières à braser, souder ou découper

Abrégé

In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

Classes IPC  ?

• G01B 11/26 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des angles ou des cônesDispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes
• C03B 33/10 - Outils à couper le verre, p. ex. outils de rayage
• B25H 7/04 - Dispositifs de marquage, p. ex. pointes à tracer
• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• B23K 26/035 - Alignement du faisceau laser
• B23K 26/352 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface
• B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
• B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
• C03C 17/32 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement par des matières organiques avec des résines synthétiques ou naturelles
• C03C 19/00 - Traitement de surface du verre, autre que sous forme de fibres ou de filaments, par des procédés mécaniques
• B23K 103/00 - Matières à braser, souder ou découper
• C03B 33/037 - Commande ou régulation
• C03B 33/07 - Découpe de produits en verre armé ou stratifié
• B23K 103/16 - Matériaux composites

Abrégé

In a laser oscillator, a pair of electrodes is disposed in a housing into which a gas is sealed, a waveguide is formed by the pair of electrodes, and a laser beam is configured to be extracted from an end of the housing. The laser oscillator includes a mirror holder attached to an end of the electrode, the end serving as an end of the waveguide, and a reflection mirror attached to the mirror holder and reflecting a laser beam generated in the waveguide. In the laser oscillator, a passage through which a cooling medium is passed is formed inside each of the pair of electrodes.

Classes IPC  ?

• H01S 3/041 - Dispositions pour la gestion thermique pour des lasers à gaz
• H01S 3/00 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet
• H01S 3/22 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet caractérisés par le matériau utilisé comme milieu actif à gaz
• H01S 3/038 - Électrodes, p. ex. forme, configuration ou composition particulières
• H01S 3/063 - Lasers à guide d'ondes, p. ex. amplificateurs laser
• H01S 3/03 - Détails de structure des tubes laser à décharge dans le gaz
• H01S 3/034 - Dispositifs optiques placés à l'intérieur du tube ou en faisant partie, p. ex. fenêtres, miroirs
• H01S 3/04 - Dispositions pour la gestion thermique
• H03B 17/00 - Production d'oscillations au moyen d'une source de rayonnement et d'un détecteur

Abrégé

The object of the present invention is to achieve the combination processing that accelerates the processing speed while keeping the accuracy of finishing. In the combination processing consisting combination of stationary processing and synchronization processing, the processing of the section in the rows in an processing area is performed from a first end to a second end of a row, and then from the second end to the first end of the next row so that the processing is performed from side to side. The stationary processing is performed in sections having relatively low processing densities and the synchronization processing is performed in the other sections than the sections for the stationary processing.

Classes IPC  ?

• B23K 26/035 - Alignement du faisceau laser
• B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
• B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
• B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
• B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
• B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
• B23K 101/36 - Dispositifs électriques ou électroniques
• B23K 101/42 - Circuits imprimés

Produits et services

Machines and apparatus for machining printed circuit boards, and parts therefor; semiconductor wafer processing machines and apparatus, and parts therefor; ceramics processing machines and apparatus, and parts therefor; plastic processing machines and apparatus, and parts therefor; glass processing machines and apparatus, and parts therefor; exposure machines for printed circuits boards, and parts therefor; printing presses; motor spindles for rotating tool bits. Inspection machines for printed circuit boards, and parts therefor; optical inspection apparatus for industrial use; lasers not for medical purposes; optical lenses; optical mirrors; optical scanners; optical modulators; optical beam shaping devices. Repair or maintenance of machines and apparatus for machining printed circuit boards; repair or maintenance of metalworking machines and apparatus; repair or maintenance of exposure machines for printed circuits boards; repair or maintenance of lasers not for medical purposes.

Produits et services

machines and apparatus for machining printed circuit boards; [ semiconductor wafer processing machines and apparatus; ] ceramics processing machines and apparatus; plastic processing machines and apparatus; glass processing machines and apparatus [; exposure machines for printed circuits boards; printing presses; ] [ motor spindles for rotating tool bits ] [ inspection machines for printed circuit boards, namely, hole analyzer and automatic optical inspection machine; optical inspection apparatus for industrial use; lasers not for medical purposes; optical lenses; optical mirrors; optical scanners; optical modulators; optical beam shaping and focusing unit for lasers ] Repair or maintenance of machines and apparatus for machining printed circuit boards; repair or maintenance of metalworking machines and apparatus; repair or maintenance of exposure machines for printed circuits boards; repair or maintenance of lasers not for medical purposes

Abrégé

The present invention aims to prevent, in a gas laser resonator, the deterioration in quality of discharge by reduction of the change of the pressure in a discharge chamber and the inflow of impurity gases, such as air, into the discharge chamber. A bracket 6 is attached to one end of a tube 1 interposing a gasket 13 only for sealing an opening of the discharge chamber 2 only and a gasket 14 for sealing both openings of the discharge chamber 2 and a buffer chamber 12. Also, a glass plate 8 and further a bracket 9 are attached to the other end of the tube 1 interposing a gasket 15 only for sealing the opening of the discharge chamber 2 and a gasket 16 for sealing both openings of the discharge chamber 2 and the buffer chamber 12. The pressure in the buffer chamber 12 is set lower than that of the discharge chamber 2 or set higher than the atmospheric pressure to decrease the inflow of the impurity gases to the discharge chamber 2.

Classes IPC  ?

• H01S 3/22 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet caractérisés par le matériau utilisé comme milieu actif à gaz
• H01S 3/032 - Détails de structure des tubes laser à décharge dans le gaz pour le confinement de la décharge, p. ex. par des caractéristiques particulières du tube pour la contraction de la décharge
• H01S 3/07 - Structure ou forme du milieu actif consistant en une pluralité de parties, p. ex. segments
• H01S 3/036 - Moyens pour obtenir ou maintenir la pression désirée du gaz à l'intérieur du tube, p. ex. au moyen d'un getter ou d'une réactivationMoyens pour faire circuler le gaz, p. ex. pour uniformiser la pression à l'intérieur du tube
• H01S 3/097 - Procédés ou appareils pour l'excitation, p. ex. pompage par décharge dans le gaz d'un laser à gaz
• H01S 3/134 - Stabilisation de paramètres de sortie de laser, p. ex. fréquence ou amplitude par commande du milieu actif, p. ex. par commande des procédés ou des appareils pour l'excitation dans des lasers à gaz

Abrégé

Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1≦N≦“the maximum number of holes to be drilled in the area”−1″) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3). The scanning area is machined and then machining each scanning area, specifically in machining the (N+1)th hole, after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value. Subsequently, machining is performed (S4).

Classes IPC  ?

• B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p. ex. en utilisant la lumière rétrodiffusée
• B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• G06Q 10/04 - Prévision ou optimisation spécialement adaptées à des fins administratives ou de gestion, p. ex. programmation linéaire ou "problème d’optimisation des stocks"
• B23K 26/38 - Enlèvement de matière par perçage ou découpage
• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
• B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
• B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser

Abrégé

A laser machining method for cutting or cutting grooves on a workpiece using an apparatus having an X-Y table for mounting the workpiece, a laser source emitting a continuous wave or a quasi-continuous wave laser beam, modulator forming a pulsed laser beam by a high-speed modulation of the continuous wave or quasi-continuous wave laser beam, and an optical system capable of converging the pulsed laser beam on the workpiece, wherein the method comprising cutting with the pulsed laser beams along a locus including a portion where the moving speed of the X-Y table is decreased, and the pitch of holes machined with said laser pulses is kept constant by adjusting the intervals between successive said laser pulses in accordance with the moving speed of said workpiece, the method further comprising increasing the pulse widths of the laser pulses in accordance with the decrease in moving speed of the X-Y table in the portion where the moving speed of the X-Y table is decreased.

Classes IPC  ?

• B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
• B23K 26/38 - Enlèvement de matière par perçage ou découpage
• B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
• B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• B23K 103/00 - Matières à braser, souder ou découper

Abrégé

A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.

Classes IPC  ?

• H02K 33/00 - Moteurs avec un aimant, un induit ou un système de bobines à mouvement alternatif, oscillant ou vibrant
• G02B 26/10 - Systèmes de balayage
• H02K 1/27 - Noyaux rotoriques à aimants permanents
• H02K 26/00 - Machines adaptées pour le fonctionnement en moteur-couple, c.-à-d. pour exercer un couple quand elles sont arrêtées
• H02K 21/14 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants avec des aimants tournant à l'intérieur des induits
• H02K 21/12 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants

Abrégé

A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.

Classes IPC  ?

• H02K 33/00 - Moteurs avec un aimant, un induit ou un système de bobines à mouvement alternatif, oscillant ou vibrant
• G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
• G02B 26/10 - Systèmes de balayage
• H02K 1/27 - Noyaux rotoriques à aimants permanents
• H02K 26/00 - Machines adaptées pour le fonctionnement en moteur-couple, c.-à-d. pour exercer un couple quand elles sont arrêtées
• H02K 21/14 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants avec des aimants tournant à l'intérieur des induits
• H02K 21/12 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants

Abrégé

The present invention is designed to improve machining quality by eliminating variations in laser pulse pitch and diameter in the acceleration and deceleration regions of laser machining. This laser machining device is characterized in comprising: a laser pulse generation means for generating a laser pulse sequence of a constant period; a light-directing means capable of receiving the laser pulse sequence output from the laser pulse generation means and selectively directing the laser pulses in the laser pulse sequence in the direction to be used for the machining; an optical system for receiving the laser pulses from the light-directing means and irradiating same on the workpiece; a means for driving the table on which the workpiece is loaded; a specified movement amount-detecting means for periodically detecting a specified amount of table movement; and a control means for performing control so that when the specified movement amount-detecting means detects the specified movement amount, laser pulses in the laser pulse sequence output from the laser pulse generation means are directed in the machining direction.

Classes IPC  ?

• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Produits et services

Drilling machine for printed circuit boards; laser drilling machine for printed circuit boards; power tools, namely, routers for printed circuit boards; [ metal working machine, namely, electric discharge machine for precision die production and parts machining; power operated high speed grinding wheel; milling machines; metal working machines, namely, machining centers; transfer machines for motor frames; printing presses and printing machines, namely, rotary gravure and letter rotary presses; electric welding machines; electric die cutting machines; electric soldering machines; ] laser drilling machine not for medical use [ Inspection apparatus for printed circuit boards, namely, hole analyzer and automatic optical inspection machine; stand alone laser direct imaging machines for use in imaging of innerlayers and flex panels of printed circuit boards; digitizers, namely, electronic digital writing and drawing pads ] Installation, maintenance and repair of drilling machines, power tools, metal working machines, power operated high speed grinding wheels, milling machines, metal working machines, transfer machines for motor frames, printing presses and printing machines, electric welding machines, electric die cutting machines, electric soldering machines, laser drilling machines, laser direct imaging machines for use in imaging the innerlayers and flex panels of printed circuit boards and digitizers in the nature of electronic digital writing and drawing pads

Abrégé

A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.

Classes IPC  ?

• G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
• H02K 21/14 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants avec des aimants tournant à l'intérieur des induits
• G02B 26/10 - Systèmes de balayage
• H02K 21/12 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants

Abrégé

Fiber lasers and methods for constructing and using fiber lasers for micro-/nano-machining with output beams including stacked pulses and combinations of continuous wave, pseudo-continuous wave and pulse sequence components.

Classes IPC  ?

• H01S 3/30 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet utilisant des effets de diffusion, p. ex. l'effet Brillouin ou Raman stimulé

Abrégé

A method of manufacturing a printed circuit board is provided. The method includes preliminarily forming a plurality of test pattern layers for detecting the depth of an inner layer in a multilayer printed circuit board such that at least a part of a lower test pattern layer is not overlaid with any upper test pattern layer when viewed from a drill entrance side, and preliminarily forming a surface conductor layer; applying a voltage between the surface conductor layer and the test pattern layers; performing drilling toward one test pattern layer, and detecting a current produced when the drill comes into contact with the test pattern to measure the depth of the layer (D1); performing drilling toward the other test pattern layer, and measuring the depth of the layer (D2); and performing drilling up to just before the conductor-wiring layer based on a depth calculated from D1 and D2.

Classes IPC  ?

• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

Inspection of partially drilled microvias by fluorescence based optical imaging techniques, selective coaxial illumination and multivariable off-axis illumination and the use of comparative image analysis and the transformation of back reflected radiation by means of an integrated fluorescing plate mounted to the surface of a CCD or EMCCD array.

Classes IPC  ?

• G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales

Abrégé

A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 μm high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.

Classes IPC  ?

• B23K 26/38 - Enlèvement de matière par perçage ou découpage

Abrégé

A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

Classes IPC  ?

• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/073 - Détermination de la configuration du spot laser

Abrégé

A positioning control system for positioning a moving element on a basis of position command data is provided with a feedback loop. The system is also provided with a loop gain modifier for determining a loop gain, which is to be used in a following positioning operation, on a basis of a difference between an amount of overshoot measured in a current positioning operation and a predetermined tolerance or on a basis of a difference between an amount of overshoot measured in a current positioning operation and a first predetermined tolerance and a difference between an amount of undershoot measured in the current positioning operation and a second predetermined tolerance. The first and second tolerances may preferably be the same in absolute value. The moving element may specifically be a steerable mirror for drilling holes in a work by reflecting a laser beam. Also disclosed is a laser drilling machine including the system.

Classes IPC  ?

• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• G05B 13/02 - Systèmes de commande adaptatifs, c.-à-d. systèmes se réglant eux-mêmes automatiquement pour obtenir un rendement optimal suivant un critère prédéterminé électriques
• G05B 11/18 - Commandes à phases successives multiples
• G05B 19/23 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par systèmes de commande de positionnement ou de commande de contournage, p. ex. pour commander la position à partir d'un point programmé vers un autre point ou pour commander un mouvement le long d'un parcours continu programmé utilisant un dispositif de mesure numérique différentielle pour commande point par point

Abrégé

There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.

Classes IPC  ?

• B23K 26/38 - Enlèvement de matière par perçage ou découpage

Abrégé

There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per a certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.

Classes IPC  ?

• B23B 35/00 - Méthodes d'alésage ou de perçage ou autres méthodes de travail impliquant l'utilisation de machines à aléser ou à percerUtilisation d'équipements auxiliaires en relation avec ces méthodes

Abrégé

A scanner has a rotor, and a stator disposed in the outside of the rotor. The rotor includes a shaft, and a permanent magnet mounted on the outer circumferential side of the shaft. The stator includes a casing, a yoke held in the inner circumferential side of the casing, and coils disposed in the inner circumferential side of the yoke. The permanent magnet of the rotor has radially depressed grooves formed in its outer circumferential portion. The torque constant of the scanner is circumferentially equalized by the grooves.

Classes IPC  ?

• H02K 21/12 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants

Abrégé

There is provided a laser machining apparatus for sheet-like workpieces that allows an installation area to be reduced and that may be readily controlled. The laser machining apparatus includes a Y-table movable in X- and Y-plane directions orthogonal to a laser beam irradiated from an fθ lens, a supply reel for holding a supply-side roll which contains a sheet-like workpiece, and a take-up reel for holding a take-up side roll containing a finished sheet-like workpiece. Machining is carried out by fixing the sheet-like workpiece in the machining area on the movable table and by irradiating the laser beam while moving the movable table relative to the laser beam. At least one of the supply reel and the take-up reel is disposed on the movable table.

Classes IPC  ?

• B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser

Abrégé

A difference between each position command data outputted in a form of a step signal from a high-level controller and its corresponding detected position data of a movable body is integrated by an integral compensator to position the movable body. Assuming, for example, that the movable body is a steerable mirror, digital filters are arranged to compensate the value of an initial state of an angular displacement and the value of an initial state of an angular velocity, respectively, and respective impulse responses of the digital filters as additional input elements are added to an output terminal of the integral compensator. For higher effectiveness, internal state variables of the digital filters can desirably be cleared to zero whenever an angle (position) command data is received.

Classes IPC  ?

• G06F 19/00 - Équipement ou méthodes de traitement de données ou de calcul numérique, spécialement adaptés à des applications spécifiques (spécialement adaptés à des fonctions spécifiques G06F 17/00;systèmes ou méthodes de traitement de données spécialement adaptés à des fins administratives, commerciales, financières, de gestion, de surveillance ou de prévision G06Q;informatique médicale G16H)
• B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p. ex. en utilisant la lumière rétrodiffusée