A medical lead includes a first wire coil having an outer diameter and a marker coil having an inner diameter. The marker coil is assembled over the first wire coil. The outer diameter first wire coil is smaller than the inner diameter of the marker coil thereby defining a gap. A second wire coil substantially fills the gap between the first wire coil and the marker coil. A ball weld is formed at an end of the medical lead adjacent each of the first and second wire coils and adjacent the marker coil.
The invention relates to a method for producing fibers made of platinum, palladium, or alloys based on Pt or Pd from a melt by gas atomizing, wherein the viscosity of the melt is adjusted by alloying boron so that fibers, not powder, are created by atomizing. The fibers thus created can be sintered into non-woven mats or meshes. The boron can be thermally removed as an oxide. The method is particularly suitable for fibers made of PtRh alloys.
B22F 9/08 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau liquide par coulée, p. ex. à travers de petits orifices ou dans l'eau, par atomisation ou pulvérisation
Castings consisting of boron-containing alloys based on at least one metal from the platinum group are treated by thermal age-hardening in the presence of oxygen and at temperatures below the melting point of the alloy. The method allows for further processing at temperatures which are common in the field of jewelry. The castings treated can also be processed to form medical articles.
C22F 1/14 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid des métaux nobles ou de leurs alliages
A44C 27/00 - Confection de bijoux ou d'autres articles de parure personnelle
C22C 5/04 - Alliages à base d'un métal du groupe du platine
A cable includes a first layer of wire helically wound to define a lumen having a lumen diameter. A second layer of wire is helically wound over the first layer. A first end segment of the second layer is configured with a plurality of strands that are fused together. A second end segment of the second layer is configured with a plurality of strands that are fused together.
A cable includes a first layer of wire helically wound to define a lumen having a lumen diameter. A second layer of wire is helically wound over the first layer. A first end segment of the second layer is configured with a plurality of strands that are fused together. A second end segment of the second layer is configured with a plurality of strands that are fused together.
A microbial strain which converts anthracycline metabolites into non-natural anthracyline antibiotics. A process for converting anthracycline metabolites into anthracycline antibiotics using a microbial strain.
C12P 19/56 - Préparation d'O-glucosides, p. ex. glucosides avec un atome d'oxygène du radical saccharide lié directement à un système cyclique condensé d'au moins trois carbocycles, p. ex. daunomycine, adriamycine
7.
MATERIAL COMPRISED OF METAL AND LACTIC ACID CONDENSATE AND ELECTRONIC COMPONENT
The invention relates to a material which is comprised of metal and a lactic acid condensate, the metal being selected from the group comprising copper, silver and gold. The invention further relates to an electronic component having a metal, ceramic or oxide surface and to a method for producing metal surfaces on an electronic component.
A metal fibre based on one or more elements from the group consisting of platinum, palladium, rhodium, ruthenium and iridium together with from 0 to 30% by weight of one or more additional alloying elements from the group consisting of nickel, cobalt, gold, rhenium, molybdenum and tungsten has, according to the invention, from 1 to 500 ppm by weight of boron or phosphorus. A nonwoven or mesh according to the invention, in particular for producing nitrogen oxide or for producing hydrocyanic acid, comprises such fibres. To produce fibres based on noble metals together with up to 30% by weight of additional alloying metals, the melting point of the metal is reduced by at least 400°C by addition of boron or phosphorus as alloying constituent before drawing of the fibres from a melt and the boron or the phosphorus is removed again from the fibres.
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet
B22F 9/06 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau liquide
B01J 23/40 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe des métaux nobles des métaux du groupe du platine
The invention relates to solder materials, such as a solder paste (11), and contact surfaces for solder connections, wherein according to the invention a metal stearate is used as a flux, said metal stearate being applied either as a solid layer (14, 15) on the solder particles (12) or as contact surfaces (not shown) or being present as a dispersion or solution in the binder. Advantageously, this can allow one to avoid the use of classical fluxes, in particular non-resin solder materials can be provided. This provides a simplified storage and processability of the solder materials, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux can be achieved if the first oxide of the metals used is formed from pure metal at a lower oxygen activity (aO) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B23K 35/363 - Emploi de compositions spécifiées de flux pour le brasage ou le soudage
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
10.
TUBULAR SPUTTERING TARGET HAVING A GROOVED OUTER SURFACE OF THE SUPPORT TUBE
The invention relates to a sputtering target comprising a support tube and sputtering material located on the outer surface of the tube, wherein circular or spiral depressions which run circumferentially around the longitudinal axis of the support tube and into which the sputtering material engages are arranged on the outer surface of the support tube and the depressions are distributed over the length of the support tube in the region of the sputtering material.
C12N 1/21 - BactériesLeurs milieux de culture modifiés par l'introduction de matériel génétique étranger
C12P 19/56 - Préparation d'O-glucosides, p. ex. glucosides avec un atome d'oxygène du radical saccharide lié directement à un système cyclique condensé d'au moins trois carbocycles, p. ex. daunomycine, adriamycine
Palladium(0)-dibenzylidene acetone complexes Pdx(dba)y having y/x of 1.5 to 3 are prepared according to the invention at a purity of at least 99.5 wt%. The use of Pdx(dba)y complexes for determining the stoichiometry thereof by means of elementary analysis is made possible according to the invention. In a method for producing Pdx(dba)y complexes from a Pd-containing reactant and dibenzylidene acetone (dba) in alcohol, according to the invention, a solution of dba in alcohol pre-heated to over 40°C is first prepared, and then the Pd-containing reactant is added to the pre-heated solution, whereupon the complexes are precipitated using a base.
The invention relates to a method for the production of precious metal-carboxylate compounds, wherein a precious metal having at least one metal salt is disintegrated in a receptacle, the disintegration mass is dissolved in carboxylic acid, and the metal ions introduced by the metal salt are separated from the resulting solution using oxalate or an oxalate derivative.
B01J 31/04 - Catalyseurs contenant des hydrures, des complexes de coordination ou des composés organiques contenant des composés organiques ou des hydrures métalliques contenant des acides carboxyliques ou leurs sels
The invention relates to a sputtering target arrangement having a support tube and a target tube surrounding the support tube at a distance therefrom and provides for metal strips which each contact both the support tube and the target tube being arranged between target tube and support tube.
Disclosed is a lead-free soft solder based on an Sn-In-Ag solder alloy. Said soft solder contains 88 to 98.5 percent by weight of Sn, 1 to 10 percent by weight of In, 0.5 to 3.5 percent by weight of Ag, and 0 to 1 percent by weight of Cu, and is doped with a crystallization modifier, particularly a maximum of 100 ppm of neodymium. The soft solder further contains 0 to 3 percent of GA, Sb, Bi and has a fusion temperature exceeding 210°C, high resistance to fatigue at elevated temperatures, and little growth of intermetallic phases. The disclosed alloy can be used for soldering electronic components in wafer bumping technology.
The invention provides a bonding wire comprising at least two components (4, 5), whose surface comprises the first component (5), which is more suitable for ultrasound bonding, and whose core has the second component (4) having better electrical conductivity and mechanical strength and which, according to the invention, can be pinched more easily than if the core were homogeneous.
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
H01B 5/08 - Pluralité de fils ou analogues toronnés en forme de corde
H01B 7/20 - Tubes métalliques, p. ex. gaines de plomb
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
17.
SPUTTER TARGET WITH SPUTTER MATERIAL BASED ON TIO2, AND A PRODUCTION METHOD
The invention relates to a sputter target, with sputter material based on TiO2 which has 15-60 mol % of Nb20s. The invention further relates to a method for the production of a sputter target consisting of the following steps: - mixture of TiO2 and Nb2O5 powder in liquid slurry – spraying of this slurry to cause the TiO2-Nb2O5 mixed oxide mixture to granulate – plasma spraying of this granulated mixture onto the base body of a sputter target.
The invention relates to a sputter target comprising a sputter material that is made of an alloy or a material mixture composed of at least two components which are in a state of thermodynamic disequilibrium. According to the invention, the components are compacted by means of an isostatic or uniaxial cold-pressing process.
The invention relates to a method for producing a wire or strip, in particular for use as an electrode or electrode tip in sparkplugs, in which the following steps are carried out: a) producing an intermetallic compound with a melting point above 1700°C, wherein the intermetallic compound corresponds to the formula AxBy, where A is selected from the group Ru, Ir, Pt, Rh and Pd, and B is selected from the group Zr, Al, Y, Hf, Th, Ti, Ta, Sc, V, Nb, Ce, W or the lanthanides, and the ratio of x : y lies between 0.8 and 5; b) grinding up the intermetallic compound; c) mixing the intermetallic compound with a noble metal powder; d) introducing the mixture obtained under c) into a tube of ductile material; e) shaping the tube filled according to d) into a wire or strip; and relates to a casing wire or casing strip, in particular a semifinished product for the production of electrodes or electrode tips of sparkplugs.
B22F 5/12 - Fabrication de pièces ou d'objets à partir de poudres métalliques caractérisée par la forme particulière du produit à réaliser de tubes ou de fils
C22C 1/04 - Fabrication des alliages non ferreux par métallurgie des poudres
H01T 13/39 - Emploi de matériaux particuliers pour les électrodes
The invention relates to a tubular target with a carrier tube and a sputter target material arranged on it, wherein the sputter target material is formed by cylinder shells multiply segmented in the longitudinal direction or in the longitudinal direction and the circumferential direction.
The invention relates to a gold alloy, containing 99% by weight, in particular 99.9% by weight, gold and 1 to 1000 ppm, in particular 10 to 100 ppm, calcium, and 1 to 1000 ppm, in particular 10 to 100 ppm ytterbium or europium or a mixture of ytterbium and europium, and to a method for producing a homogeneous gold alloy containing europium and/or ytterbium.
C22C 1/02 - Fabrication des alliages non ferreux par fusion
H01L 23/49 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées du type fils de connexion
The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down. The inventive gel is based on a mixture of carboxylic acid/s, amine/s, and solvent/s, said mixture being stable during storage. Major uses include applying soft solder pastes to power modules, die attach, chip on board, system in package (SiP), wafer bumping, particularly under-bump metallization (UBM) and surface-mounted technology (SMT), especially lacquered circuits. Using nonresinous soft solder pastes makes it possible to dispense with the need to perform a cleaning process before applying a protective lacquer after soldering an electrical connection while the formation of pores in solder bumps applied to UBMs is reduced to less than 20 percent by volume.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/362 - Emploi de compositions spécifiées de flux
23.
SPUTTERING TARGET MADE OF MULTI-COMPONENT ALLOYS AND PRODUCTION METHOD
The invention relates to a sputtering target made of a material containing at least two phases or components, at least one phase having a granular structure. The invention is characterized in that the granular structure of at least one phase has a diameter ratio of the largest diameter to the diameter perpendicular thereto of greater than 2, and the material has a density of at least 98 % of the theoretical density. The invention also relates to a method for producing a sputtering target.
The invention relates to a material mixture containing, as a main constituent, a cobalt-based alloy, characterized in that it also at least contains TiOx.
C22C 32/00 - Alliages non ferreux contenant entre 5 et 50% en poids d'oxydes, de carbures, de borures, de nitrures, de siliciures ou d'autres composés métalliques, p. ex. oxynitrures, sulfures, qu'ils soient soient ajoutés comme tels ou formés in situ
The invention relates to a slip ring consisting of a substrate material and a sliding contact surface made of gold or a gold alloy, the sliding contact surface being stabilised by a support base, and to the use of a slip ring in slip ring transmitters (in particular in wind power plants or industrial robots), for transmitting control signals and control currents and generator currents. An extended service life, in conjunction with improved quality, a reduced drop in voltage and considerable savings in the amount of gold used can be achieved with the invention.
The inventive recycling oven for treating explosive materials containing precious metals with organic portions, the combustion of which is associated with important energy release, comprises a switching device for alternating the a combustion chamber between the following operating modes consisting: A) in pyrolysing or carbonising, under a protective gas, in an atmosphere containing oxygen in a quantity equal to or less than 6 % by weight and B) in oxidatively combusting the carbon-containing organic portions, wherein the oven comprises an indirect heating and a control for determining, by means of a sensor, in particular a pressure sensor, the end of pyrolysis or carbonisation, and for controlling the switching system in such a way the oven chamber is supplied with air or oxygen upon the pyrolysis or carbonisation is over. The stages A) and B) are carried out one after the other in the indirectly heated oven chamber, wherein a charge is not changed and the oven is not opened, at the stage A), a low-oxygen atmosphere, whose oxygen content is equal to or less than 6 %, is adjusted in the oven chamber by rendering it inert with the aid of a protective gas and the stage B) is carried out by introducing air or oxygen immediately after the end of a recyclable material pyrolysis or carbonisation. The incorporation of liquid or liquefied substances is controlled along with pyrolysis by means of at least one post-combustion parameter, in particular with the aid of a temperature sensor. The thermal post-combustion is used for two oven chambers, one of which operates in a pyrolysis or carbonisation mode and the other operates in the form of a combustion chamber.
The invention relates to a laminated substrate producing method for mounting semiconductor chips, wherein at least respective metal and plastic structure films having respective different recurrent contour are laminated together in such a way that a material strip is obtained and said lamination is followed by perforations or cuttings, the inventive method is characterised by at least one of the following steps: A) the films are structured in such a way that the superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total thickness thereof; B) the films are not laminated through the total thickness of the laminate in partly recurrent areas; and C) the reccurent cross-sections of the reccurent contours are curved from the surface of the laminated strip starting from said laminate.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
28.
WIRE AND FRAME IN PARTICULAR NIOBIUM-BASED FOR SINGLE-SIDE SOCKET LAMPS AND A METHOD FOR THE PRODUCTION AND USE THEREOF
The invention relates to a high heat resistance wire which is based on niobium, tantalum or the alloy thereof and used for single-side socket lamps and which, according to said invention, is phosphorus-enriched and is converted into an annealed state. The inventive wire exhibits an yield strength Rp 0.2 equal to or greater than 200 MPa or a tension strength Rm equal to or greater than 300 MPa. In order to produce a frame for single-side socket lamps, a metal based on niobium, tantalum or the alloy thereof is phosphorus-doped and said doped material is cold-shaped into a wire which is annealed and shaped in the form of a frame. Said frame is simultaneously used for supplying current and holding a burner in the single-side socket lamp.
The invention relates to a wire or strip made of an alloy hardened by an oxide dispersion which is based on platinum or palladium or the mixture thereof and is characterised in that the wire or strip cross-section comprises an edge area in which a relatively easily volatile oxide generator is reduced at least by 25 %. A method for producing the wire or strip made of the alloy hardened by the oxide dispersion which is based on platinum or palladium or the mixture thereof is also disclosed. The inventive method consists in thermally producing a porous skin on the wire or strip made of the alloy hardened by the oxide dispersion and in compressing said porous skin in the form of a elastic or impermeable skin.
The invention relates to an iridium alloy comprised of at least 85 % by weight of iridium, at least 0.005 % by weight of molybdenum, 0.0005 to 0.6 % by weight of hafnium and, optionally, rhenium, the sum of molybdenum and hafnium ranging from 0.02 to 1.2 % by weight, and to a method for producing an iridium alloy during which each IrMo and IrHf intermediate alloy is created in an electric arc and is optionally immersed with Re into an iridium melt.
The invention relates to an adhesive, particularly for gluing conductive materials, comprising at least one adhesive component and fillers. Said fillers contain fibers or fiber-powder mixtures, the fibers and/or the powders being made of an electrically conductive material. The invention further relates to a compound comprising a sputter target material and a carrier material with an adhesive.
The invention relates to a method for producing tubular sputter targets. Said method consists of the following steps; initially, a hollow cylinder is produced by hot isostatic pressing a powder, a powder mixture or a prepressed powder body into a hermetically closed capsule. Said hollow cylinder has an internal diameter which is not more than 10 %, preferably not more than 3 % in relation to the diameter of the final product, and has a density of at least 98 %, preferably 99 % of the theoretical density of the initial product. The hollow cylinder is machined until the final dimension is obtained.
The invention relates to a bonding or superfine wire made from copper, with a gold enrichment on the surface thereof, in particular to an amount corresponding to a coating of at most 50 nm, or which may be bonded by the ball/wedge method, has a copper-coloured appearance and the ball thereof after flame-off has a hardness of 95 by HVO.002. In order to produce said bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. Said wires are bonded to a semiconductor silicon chip.
H01L 23/49 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées du type fils de connexion
brevets
