The present invention addresses the problems of: providing a mounting structure in which, when the mounting structure is linked and a linked structure is formed, the arrangement of an electronic component is insusceptible to being disarrayed across the entire surface of the linked structure; and providing a mounting structure that does not require a separate member for installation and that can be installed independently. As a solution to the aforementioned problems, there are provided: a mounting structure having a plurality of electronic components joined by soldering to one surface side of a flexible substrate, the flexible substrate being provided with a linking region in at least part of the periphery thereof, and there being formed, in the linking region, a plurality of linking holes that correspond to the positions at which the electronic components are arranged; and a mounting structure having an electronic device that is provided with a linked structure in which an adjacent mounting structure is linked once electronic components of one mounting structure are fitted into linking holes in the other mounting structure and that is also provided with a plurality of electronic components joined by soldering to one surface side of a flexible substrate, and a double-sided adhesive sheet having recesses or holes that correspond to at least some of the electronic components.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 31/02 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails
H01L 31/05 - Moyens d’interconnexion électrique entre les cellules PV à l’intérieur du module PV, p.ex. connexion en série de cellules PV
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H02S 40/00 - Composants ou accessoires en combinaison avec les modules PV, non prévus dans les groupes
Provided is technology capable of removing an electronic member from a circuit board even when the area of a metal terminal is small. A plurality of electronic components 20 are joined to a circuit board 10 by means of solder 30. This device comprises: a suction means 60 that includes a suction nozzle 50 having a hollow 51 and that suctions an electronic component 20 to the tip end of the suction nozzle; a heating means 70 that includes a heating element 71 provided to the lower part of the suction nozzle and that heats the heating element 71 by electromagnetic induction heating; and a conduction means 50 that conducts the heat generated by the heating element 71 to the tip end of the suction nozzle 50. The heat is conducted from the heating element 71, through the nozzle 50, and to the electronic component 20 and the solder 30. This melts the solder 30 and releases the bond between a circuit-side terminal 12 and an electronic component-side terminal 21. Meanwhile, the suction state between the electronic component 20 and the nozzle 50 is maintained, and the electronic component 20 can be removed from the circuit board 10 when the nozzle 50 is separated from the circuit board 10.
Provided is soldering technology with which it is possible to mount an electronic component having a small metal terminal area to a sheet-shaped circuit board. An electronic component mounting structure is formed by soldering an electronic component (e.g., an LED) 20 to a circuit board 10. The circuit board 10 is provided with: a non-heat-resistant sheet 11; a circuit provided on one side of the non-heat-resistant sheet 11; a circuit-side terminal 12 provided to the circuit; and an electroconductive pad 40 provided at a position, corresponding to the circuit-side terminal 12, on the other side of the non-heat-resistant sheet 11. The circuit-side terminal 12 generates heat by electromagnetic induction heating. The heat generated by the electroconductive pad 40 is transmitted through the non-heat-resistant sheet 11 and the circuit-side terminal 12. A shortage in the amount of heat generated by the circuit-side terminal 12 is compensated through indirect heating by the electroconductive pad 40, whereby heat generation solder 30 is caused to melt.
G09F 9/33 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels dans lesquels le ou les caractères désirés sont formés par une combinaison d'éléments individuels à semi-conducteurs, p. ex. à diodes
4.
ELECTRONIC COMPONENT CARRYING CONTAINER AND ELECTRONIC COMPONENT MOUNTING STRUCTURE
Provided is a mounting technique requiring no dedicated base board when mounting an electronic component onto an electric product. Fig. 1 is an overall constitutional view of this electronic component carrying container. This electronic component carrying container 1 is constituted from a container main body 2 and an electronic component 8, or the like. The container main body 2 comprises a resin, and has a bottom section 3, a trunk section 4, and a flange section 5. A pair of terminals 6 is provided on the top surface of the flange section 5. The electronic component 8 is mounted on the bottom section 3. Wiring 7 connects the electronic component 8 to the terminals 6. A circuit 11 and circuit-side terminals 12 are provided on the back surface of a casing body 10. The terminals 6 and the circuit-side terminals 12 are matched to one another, and solder-joined by electromagnetic induction-heating.
Provided is a soldering device comprising a heating means that solders an electronic part C to an electrode 13, the heating means comprising: a coil 20 having a space on the inside thereof; a plurality of ferrites 30 disposed in the space of the coil; an adjustment mechanism 40 that independently adjusts the interval between each ferrite and the electrode formed on a substrate; and a power source 50 that applies an alternating current voltage to the coil to inductively heat the electrode. The interval between each ferrite and the electrode is adjusted in advance so that the temperature of each electrode that is inductively heated is uniform among a plurality of electrodes disposed inside the coil.
Provided is a soldering device comprising: a conveyance means 12 that conveys a substrate 11 on which an electronic part C is mounted; and a heating means that melts solder interposed between an electrode 13 and the electronic part to solder the electronic part to the electrode. The heating means comprises: a coil 20 having a space on the inside thereof; a plurality of ferrites 30 that are arranged in the space of the coil along the conveyance direction of the substrate; an adjustment mechanism 40 that independently adjusts the interval between each ferrite and the electrode formed on the substrate; and a power source 50 that applies an alternating current voltage to the coil to inductively heat the electrode formed on the substrate.
Provided is a solder joining technique whereby joining time is reduced and joining precision can easily be ensured. In electromagnetic induction heating in the present invention, only a metal heats when an alternating electric current is passed through a coil conductor. Since the output of a power source can easily be controlled, step control and other complex control can easily be performed with good precision in the present invention. For example, for a solder paste including a thermosetting resin and solder particles, heating control is performed so that the thermosetting resin is softened before the solder particles melt, and for a solder paste including solder particles, a solvent, and a flux, heating control is performed so that the solvent is evaporated and the flux is liquefied before the solder particles melt.
In this invention, a coil 16, having a shape surrounding a predetermined region R on a base board 7 on which mounting components CP have been mounted, is disposed above or below the base board 7. A ferrite material 41 is disposed so as to face a region of interest T containing an electrode 21 and one of the mounting components CP which are to be heated. A magnetic flux F generated around the coil 16 is efficiently transmitted to the ferrite material 41 to become focused, and the focused magnetic flux F is irradiated in a vertical direction onto the region of interest T on the base board 7. Consequently, due to the performance of induction-heating being limited to the electrode 21 located within the range of the region of interest T on the base board 7, only the targeted electrode 21 and mounting component CP can be joined selectively with solder.
Provided is a touch panel having a curved surface. A touch panel 10 is formed of a sheet of a flat sheet 1 by thermoforming. A plurality of island-like electrodes 2,3 is arrayed in each of an X direction and a Y direction on the input region. The island-like electrodes 2, 3, inter-electrode wires 4, and a lead wiring are formed of a ductile wire material. A center portion of the flat sheet 1 is formed into a convex dome shape by thermoforming. The touch panel 10 includes a first input region 11 and a second input region 12. The first input region 11 is provided on the convex dome shape. The second input region 12 is provided on the flat surface (zero curvature). The first input region 11 is provided at around a center on the inside of the second input region 12.
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
B60K 35/00 - Instruments spécialement adaptés aux véhiculesAgencement d’instruments dans ou sur des véhicules
H01L 27/32 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
10.
SOLDER BONDING METHOD FOR MOUNTING COMPONENT AND SOLDER BONDING APPARATUS FOR MOUNTING COMPONENT
In the present invention, a circuit pattern including electrodes 21 for mounting a mounting component CP is formed on a flexible substrate 7, a solder paste P is applied to the electrodes 21, and the mounting component CP is mounted on the electrodes 21. A predetermined region 19 where the mounting component CP is mounted is held by a holding table 15 formed of an insulating material, a coil 16 having a shape surrounding the predetermined region 19 is disposed on the rear surface of the predetermined region 19, and the mounting component CP is bonded to the electrodes 21, while inductively heating the electrodes 21 by supplying the coil 16 with a current.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
11.
TOUCH PANEL, TOUCH-PANEL MANUFACTURING METHOD, AND TOUCH-PANEL-INTEGRATED DISPLAY DEVICE
Provided is a touch panel with a curved shape. A touch panel 10 is formed by subjecting a single flat sheet 1 to thermoforming. An electrode array of a plurality of island-like electrodes 2 is provided on the front surface of the flat sheet 1 in an x direction, and an electrode array of a plurality of island-like electrodes 3 is provided on the rear surface thereof in a y direction. The island-like electrodes 2 and 3, inter-electrode wires 4, and lead wires are formed of ductile wire rods. The center portion of the flat sheet 1 is formed into a convex dome shape through thermoforming. The touch panel 10 has a first input region 11 and a second input region 12. The first input region 11 is provided on the convex dome shape. The second input region 12 is provided on a flat surface (zero curvature). The first input region 11 is provided almost at the center within the second input region 12.
A method for preventing a molded body made of low melting point resin from being thermally damaged when external connection terminals provided on the molded body and external connection terminals provided on a flexible sheet are joined together via soldering. The method includes arranging the connection terminal of the molded body and the connection terminal of the flexible sheet such that the connection terminals face each other, and an electromagnetic induction heating performing electromagnetic induction heating after the arranging.
B29C 65/14 - Assemblage d'éléments préformésAppareils à cet effet par chauffage, avec ou sans pressage par énergie ondulatoire ou rayonnement corpusculaire
H05K 3/22 - Traitement secondaire des circuits imprimés
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
This electrical product manufacturing method is provided with: a disposing step for disposing a connecting terminal of a molded body of a low-melting point resin-molded product and a connecting terminal of a flexible sheet such that the connecting terminals face each other; and an electromagnetic induction heating step for performing electromagnetic induction heating after the disposing step. A solder that is provided between the connecting terminal of the molded body and the connecting terminal of the flexible sheet is molten due to the electromagnetic induction heating, and at that time, the molded body formed of a low-melting point resin is not thermally damaged, then the molten solder is hardened, and the connecting terminal of the molded body and the connecting terminal of the flexible sheet are bonded to each other.
The present invention provides a high-quality molded article simply and at low cost. Provided is a laminated film for obtaining a molded article, the laminated film being provided with a resin layer, a protective-film-constituent material layer provided on the surface of the resin layer, and a mold-release layer provided on the surface of the protective-film-constituent material layer. The resin layer, the protective-film-constituent material layer, and the mold-release layer are laminated together; the protective-film-constituent material layer being in an uncured state, i.e., the layer is not completely cured; the protective-film-constituent material layer containing a fluorine-based substance; and the mold-release layer being configured using a fluorine-based resin.
Provided is an electrostatic capacitive touch panel having excellent operability. The electrostatic capacitive touch panel is equipped with a case body made of electric insulation transparent resin film. The case body has a principal surface portion, side surface portions, and a hollow portion. The principal surface portion has a principal surface input region, and at least one side surface portion of the side surface portions has a side surface input region. The principal surface portion has a first electrode row and a second electrode row. The side surface portion having the side surface input region has a third electrode row and a fourth electrode row. One end of a first lead wiring is electrically connected to the end of the first electrode row or the end of the third electrode row. One end of a second lead wiring is electrically connected to the end of the second electrode row or the end of the fourth electrode row. The other ends of the first and second lead wiring are formed on the side surface portion which does not have the side surface input region. At least either the first lead wiring or the second lead wiring passes through the boundary of the side surface portions.
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