An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage a cage sized and shaped to receive the housing. The optoelectronic module may include a bail rotatably coupled to the housing. The bail may be configured to actuate the slider when the bail is rotated. The optoelectronic module may include a retainer including an occlusion member sized and shaped to be positioned inside a port of the optoelectronic module. The retainer may define a surface configured to engage with the bail.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01R 13/629 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz
An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver, a slider configured to move with respect to the housing, and a retainer configured to engage both the slider and the housing to retain the slider with respect to the housing. The slider may include a resilient tab and at least one protrusion configured to engage a cage sized and shaped to receive the housing. The retainer may include a first end portion configured to abut the resilient tab of the slider.
H01R 13/62 - Moyens pour faciliter l'engagement ou la séparation des pièces de couplage ou pour les maintenir engagées
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01R 43/26 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour engager ou séparer les deux pièces d'un dispositif de couplage
H01R 13/639 - Moyens additionnels pour maintenir ou verrouiller les pièces de couplage entre elles après l'engagement
An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver, and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage with a cage sized and shaped to receive the housing, and a retainer configured to engage both the slider and the housing to retain the slider with respect to the housing. The retainer may include a first protrusion sized and shaped to be positioned in a slot defined by the housing, and a second protrusion sized and shaped to abut the slider.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01R 13/633 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz pour la séparation uniquement
H01R 43/26 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour engager ou séparer les deux pièces d'un dispositif de couplage
H01R 13/639 - Moyens additionnels pour maintenir ou verrouiller les pièces de couplage entre elles après l'engagement
An optoelectronic assembly is disclosed. The disclosed assembly includes one or more lasers formed on a first substrate, and a programmable driver circuit formed on a second substrate configured as an integrated circuit. The first and second substrates are mounted on a third substrate in a stacked arrangement.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/024 - Dispositions pour la gestion thermique
H01S 5/06 - Dispositions pour commander les paramètres de sortie du laser, p. ex. en agissant sur le milieu actif
H01S 5/42 - Réseaux de lasers à émission de surface
H01S 5/062 - Dispositions pour commander les paramètres de sortie du laser, p. ex. en agissant sur le milieu actif en faisant varier le potentiel des électrodes
5.
LIGHT SOURCE REDUNDANCY IN OPTICAL COMMUNICATION DEVICES
An embodiment includes an optical transmitter. An optical transmitter may include a primary laser for transmitting a primary optical signal and a backup laser for transmitting a backup optical signal. The optical transmitter may further include a photonic integrated circuit (PIC). The PIC may include at least one input port configured to receive the primary optical signal from the primary laser and the backup optical signal from the backup laser. The PIC may also include at least one output port configured to receive each of the primary optical signal and the backup optical signal. The optical transmitter may be configured to activate the backup laser upon determining that the primary laser has failed or is failing.
In an example embodiment, a method includes receiving a first combined optical signal (209A) at an edge filter (250). The method further includes redirecting, at the edge filter (250), a second combined optical (209B) signal toward a first zigzag demultiplexer (210); and passing a third combined optical signal (209C) through the edge filter (250) toward a light redirector (230) based on wavelength. The method further includes redirecting the third combined optical signal (209C) toward a second zigzag demultiplexer (220). The method may further includes separating, at the first zigzag demultiplexer (210), the second combined optical signal (209A) into a first optical signal on a first optical path (201) and a second optical signal on a second optical path (202 based on wavelength. The method further includes separating, at the second zigzag demultiplexer, the third combined optical signal into a third optical signal on a third optical path (205) and a fourth optical signal on a fourth optical path (206) based on wavelengths.
G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde
In an example, a communication module (200A) such as an optoelectronic communication module may include an integrated circuit (IC) (218), an electrical interconnect (210A-D), and an interposer circuit (208). The electrical interconnect may include a radio frequency (RF) interconnect or a direct current (DC) interconnect. The interposer circuit may be electrically coupled between the IC and the electrical interconnect.
An optoelectronic assembly may include a PCB and an optical lens. The PCB includes a top surface where at least a portion of the top surface includes a first material with a first thermal property. The optical lens includes a lens frame and an optical portion positioned within the lens frame. The lens frame is coupled to the top surface of the PCB. The lens frame includes a second material with a second thermal property, the second material being different from the first material. The optical portion positioned includes a third material with a third thermal property, the third material being different from the first material and the second material. The third material is optically transparent.
A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.
An optical Mach-Zehnder superstructure modulator and method that can simultaneously linearize in-phase and quadrature components of optically modulated optical signals and reduce the modulated optical insertion loss (MOIL) by in-phase addition of the in-phase and quadrature components of an amplitude and/or phase modulated optical signal using two high-speed phase modulators embedded in the optical Mach-Zehnder superstructure modulator.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
G02B 27/10 - Systèmes divisant ou combinant des faisceaux
An electro-optical modulator includes first and second Mach-Zehnder modulators each comprising a positive signal electrode and a negative signal electrode. A first ground electrode is positioned between the first and second Mach-Zenhder modulators, a second ground electrode is positioned adjacent to the first Mach-Zehnder modulator, and a third ground electrode is positioned adjacent to the second Mach-Zehnder modulator. A plurality of first electrical connectors connect the first ground electrode to the second ground electrode and a plurality of second electrical connectors connect the first ground electrode to the third ground electrode. A spacing between at least two of the plurality of first electrical connecters is chosen to achieve a desired cross talk between an optical signal generated by the first Mach-Zehnder modulator and an optical signal generated by the second Mach-Zehnder modulator.
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
G02F 1/03 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des céramiques ou des cristaux électro-optiques, p. ex. produisant un effet Pockels ou un effet Kerr
G02F 1/225 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence dans une structure de guide d'ondes optique
G02F 1/21 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence
A ferrule-to-lens latch mechanism includes a cover (220) movable with respect to a housing (210) of an optical assembly (110) between an open position in which a cavity (235) defined by the housing (210) is visible and a closed position in which the cavity (235) is covered by the cover (220). A lens (215) is positioned in the cavity (235) and has one or more guide pins (325) which are visible when the cover (220) is in the open position prior to mating a ferrule (105) to the lens (215). A spring clip (230) coupled to the housing (210) and positioned in the cavity (235) is configured to allow insertion and removal of the ferrule (105) from the cavity (235) when the cover (220) is in the open position and may bias the ferrule (105) against the lens (215) when the ferrule (105) is mated to the lens (215). When the ferrule (105) is mated to the lens (215), the cover (235) may cooperate with the spring clip (230) to inhibit removal of the ferrule (105).
In an example, an optoelectronic device may include a hermetic cavity, an optical component, a multilayer ceramic, and an electrical circuit. The optical component may be positioned inside the hermetic cavity. The multilayer ceramic may define at least one side of the hermetic cavity. The electrical circuit may be routed through the multilayer ceramic to electrically couple the optical component positioned inside the hermetic cavity to an electrical component positioned outside of the hermetic cavity.
THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO (Canada)
Inventeur(s)
Mikkelsen, Jared Carl
Poon, Joyce Kai See
Mahgerefteh, Daniel
Abrégé
In an example, a system includes a grating coupled laser and a photonic integrated circuit. The grating coupled laser includes a first waveguide and a transmit grating coupler optically coupled to the first waveguide. The photonic integrated circuit includes a second waveguide and a receive grating coupler optically coupled to the second waveguide. The second grating coupler may include a negative angle grating coupler.
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/34 - Moyens de couplage optique utilisant des prismes ou des réseaux
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/27 - Moyens de couplage optique avec des moyens de sélection et de réglage de la polarisation
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
H01S 5/10 - Structure ou forme du résonateur optique
H01S 5/187 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités horizontales, p. ex. lasers à émission de surface à cavité horizontale [HCSEL] à réflexion de Bragg
In one example, an optical device may include a waveguide having a core index of refraction that decreases along a length of the waveguide and an edge index of refection of the waveguide that is constant along the length of the waveguide. The central rays of the optical signals travelling through the waveguide may be refracted towards higher radii while the outer rays propagate unaffected. The optical device may decrease dispersion of the optical signals travelling through an optical fiber.
A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.
An example optoelectronic module may include an optical subassembly (OSA), an optical port block, a housing, and a holder. The OSA may be configured to convert between optical and electrical signals. The optical port block may be attached to the OSA and may be configured to optically align a fiber optic cable with the OSA. The housing may be configured to substantially enclose the OSA and the optical port block. The holder may be configured to couple the OSA and the optical port block to the housing. The holder may be detachably coupled to the optical port block and fixedly coupled to the housing.
A photonic system may include a PIC and an interposer. The PIC may include a first SiN waveguide. The interposer may include second and third SiN waveguides substantially vertically aligned with the first SiN waveguide in an overlap region of a first waveguide stack that may include the first, second, and third waveguides in the first waveguide stack. Within the overlap region, the second SiN waveguide may include vertical tapering that increases a thickness of the second SiN waveguide from an initial thickness to an increased thickness toward the first SiN waveguide. The first waveguide stack may further include a non-overlap region in which the interposer does not overlap the PIC. The non-overlap region may include the second and third SiN waveguides. Within the non-overlap region, the second SiN waveguide may maintain the increased thickness and the second and third SiN waveguides may include a first lateral bend.
A directional coupler may include a first waveguide and a second waveguide. The first waveguide may include an optical input port to receive an optical signal and a first output port. The second waveguide may include a terminated port and a second output port. The first and second optical waveguides may be configured to split the optical signal such that a first portion of the optical signal is directed to the first output port and a second portion of the optical signal is directed to the second output port. The first portion of the optical signal may include first substantially equal portions of a transverse magnetic (TM) polarization mode and a transverse electric (TE) polarization mode of the optical signal. The second portion of the optical signal may include second substantially equal portions of the TM polarization mode and the TE polarization mode of the optical signal.
G02B 6/125 - Courbures, branchements ou intersections
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
An alignment connector for an optoelectronic module can include: a front end having a first gripper arm and a second gripper arm with an alignment connector aperture between the first gripper arm and the second gripper arm; a base having a bottom surface and a receptacle surface; the back end having a first back wall and a second back wall with a back gap therebetween; and a ferrule receptacle extending to a medial region where the alignment connector aperture extends from, and including a portion of the receptacle surface, the ferrule receptacle being defined by a first side wall having a first latch arm and a second side wall having a second latch arm. The alignment connector can be included in a module with a bail or pull-tab. Alternatively, the first gripper arm and second gripper arm can be mounted directly to a module housing.
In an example, a photonic system and method include a photonic integrated circuit (PIC) including a silicon (Si) waveguide and a first silicon nitride (SiN) waveguide. The system also includes an interposer including a second SiN waveguide including vertical tapers on the second SiN waveguide by increasing a thickness of the second SiN waveguide in a direction toward the first SiN waveguide to allow an adiabatic optical mode transfer and decreasing the thickness of the second SiN waveguide in a direction away from the first SiN waveguide to inhibit the optical mode transfer.
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
A VCSEL may include a bottom DBR mirror and a top DBR mirror above the bottom DBR mirror. The VCSEL may include a vertical optical cavity located within a portion of the bottom and top DBR mirrors. The vertical optical cavity may be configured to emit an optical signal. The VCSEL may include a lateral feedback optical cavity located within a different portion of the bottom and the top DBR mirrors configured to receive a feedback bias signal configured to bias the lateral feedback optical cavity to adjust the optical signal. The VCSEL may include an active region formed between the bottom and the top DBR mirrors that may include an oxide layer defining an oxide aperture. The VCSEL may include an isolation implant configured to electrically isolate the vertical optical cavity from the feedback optical cavity and to create a first and a second aperture within the oxide aperture.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/10 - Structure ou forme du résonateur optique
An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.
H01S 5/024 - Dispositions pour la gestion thermique
H01S 5/42 - Réseaux de lasers à émission de surface
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
25.
DC OFFSET CANCELLATION AND CROSSPOINT CONTROL CIRCUIT
A circuit and method in an amplifier circuit for filtering a DC offset in differential input signals and inserting a programmable adjustable crosspoint offset in differential output signals. An amplifier circuit includes a differential amplifier circuit configured to amplify differential input signals into differential output signal. The amplifier circuit further includes a feedback circuit coupled between the differential output signals and the differential input signals. The feedback circuit is configured to generate a programmably adjustable crosspoint offset in the differential output signal and a programmably adjustable cutoff frequency of the feedback circuit. An amplifier method includes amplifying differential input signals into differential output signals, generating a programmably adjustable crosspoint offset in the differential output signal, and generating a programmably adjustable cutoff frequency of a feedback circuit between the differential output signals and the differential input signals.
A communication module may include a communication ground layer (338). The communication module may also include a circuit board (340). The circuit board (340) may be located proximate the communication ground layer (338). The circuit board (340) may include a stitch layer (346). The stitch layer (346) may be electrically coupled to the communication ground layer (338) via a plurality of stitch layer vias (348). Additionally, the communication module may include multiple ground vias (342). The ground vias (342) may be electrically coupled to a portion of the circuit board (340) and to the communication ground layer (338).
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01P 3/00 - Guides d'ondesLignes de transmission du type guide d'ondes
H01P 3/02 - Guides d'ondesLignes de transmission du type guide d'ondes à deux conducteurs longitudinaux
H01P 5/02 - Dispositifs de couplage du type guide d'ondes à coefficient de couplage invariable
H01P 5/10 - Dispositifs de couplage du type guide d'ondes destinés au couplage de lignes ou de dispositifs de différentes sortes destinés au couplage de lignes ou de dispositifs équilibrés avec des lignes ou des dispositifs déséquilibrés
27.
METHOD AND APPARATUS FOR HARDWARE-CONFIGURED NETWORK
A method for configuring hardware-configured optical links includes generating a first optical signal comprising a slow scan of wavelength channels where the slow scan has a dwell time on a particular wavelength channel. A second optical signal is generated comprising a fast scan of wavelength channels, where the fast scan has a dwell time on a particular wavelength channel and a complete channel scan time where the slow scan dwell time is greater than or equal to complete channel scan time. The first optical signal is transmitted over a link and a portion is then detected. A pulse of light having a duration that is less than the dwell time on the particular wavelength channel of the fast scan is then detected. Client data traffic is then sent over the link in response to the detected pulse of light and the detected portion of the first optical signal.
A method for improving surface accuracy of an optical component comprises: positioning a first surface of the optical component against a reference surface of a reference member; urging together the reference member and the optical component; adhering a second surface of the optical component to a first surface of a support member; and separating the reference member from the optical component while leaving the optical component adhered to the support member. Urging together the reference member and the optical component substantially conforms the surface accuracy of the first surface of the optical component to the surface accuracy of the reference surface of the reference member. Adhering the optical component to the support member and then separating the reference member from the optical component leaves the surface accuracy of the first surface of the optical component substantially in conformance with the surface accuracy of the first surface of the reference member.
A VCSEL can include: an elliptical oxide aperture in an oxidized region that is located between an active region and an emission surface, the elliptical aperture having a short radius and a long radius with a radius ratio (short radius)/(long radius) being between 0.6 and 0.8, the VCSEL having a relative intensity noise (RIN) of less than -140 dB/Hz. The VCSEL can include an elliptical emission aperture having the same dimensions of the elliptical oxide aperture. The VCSEL can include an elliptical contact having an elliptical contact aperture therein, the elliptical contact being around the elliptical emission aperture. The elliptical contact can be C-shaped. The VCSEL can include one or more trenches lateral of the oxidized region, the one or more trenches forming an elliptical shape, wherein the oxidized region has an elliptical shape. The one or more trenches can be trapezoidal shaped trenches.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.
In one example embodiment, an integrated silicon photonic wavelength division demultiplexer includes an input waveguide, an input port, a plurality of output waveguides, a plurality of output ports, a first auxiliary waveguide, and a plurality of auxiliary waveguides. The input waveguide may be formed in a first layer and having a first effective index n1. The input port may be optically coupled to the input waveguide. The output waveguides may be formed in the first layer and may have the first effective index n1. Each of the output ports may be optically coupled to a corresponding output waveguide. The first auxiliary waveguide may be formed in a second layer below the input waveguide in the first layer. The first auxiliary waveguide may have a second effective index n2 and may have two tapered ends, and n2 may be higher than n1.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
32.
FABRICATION-TOLERANT AND BROADBAND POLARIZATION SPLITTER AND ROTATOR
A polarization splitter rotator can include: a substrate; a primary through waveguide (WG1) formed in the substrate having a custom tapered top region (108) over a bottom region (110); a secondary cross waveguide (WG2) formed in the substrate having a custom body shape; and a gap (102) between the primary through waveguide (WG1) and secondary cross waveguide (WG2). The custom tapered top region(108) forces the TM mode to convert to a TE mode and cross into the secondary cross waveguide (WG2).
G02B 6/126 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré utilisant des effets de polarisation
In an example, a photonic system includes a Si PIC -based polarization splitter rotator (PSR) that includes first and second SiN waveguides formed in a first layer of a Si PIC, each of the first and second SiN waveguides having a coupler portion. The PSR also includes a Si waveguide formed in a second layer of the Si PIC above or below the first layer. The Si waveguide includes a first tapered end near the coupler portion of the first SiN waveguide and adiabatically coupled to the coupler portion of the first SiN waveguide, a second tapered end near the coupler portion of the second SiN waveguide and adiabatically coupled to the coupler portion of the second SiN waveguide, and a first s-bend between the first and second tapered ends that cooperates with the first SiN waveguide to form a polarization rotator for light propagating in the first SiN waveguide.
G02B 6/27 - Moyens de couplage optique avec des moyens de sélection et de réglage de la polarisation
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/126 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré utilisant des effets de polarisation
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
In one embodiment, an optoelectronic assembly may include at least one transmitter or at least one receiver, a sleeve, a housing, a fiber stub, and a receptacle. The sleeve may define a sleeve opening sized and shaped to receive an optically transmissive portion of an optical fiber. The housing may define a housing cavity at least partially enclosing the transmitter or the receiver. The housing may include a lens port defining a lens port opening. The fiber stub may be positioned at least partially in the sleeve opening and the lens port opening. The receptacle may define a receptacle opening. The lens port, the sleeve and the fiber stub may be positioned at least partially in the receptacle opening.
Various embodiments relate to polarization splitters. A polarization splitter may include a silicon nitride (SiN) waveguide core configured to receive an input light signal having a first polarization mode and a second polarization mode. The polarization splitter may further include a silicon (Si) slot waveguide core disposed proximate the SiN waveguide core. The Si slot waveguide core may include a tapered portion at a first end configured to couple the first polarization mode to the Si slot waveguide.
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/126 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré utilisant des effets de polarisation
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
In an embodiment, an optoelectronic module includes a printed circuit board (PCB) and a lens block. The printed circuit board (PCB) includes at least one of an optical transmitting or receiving array. The lens block may be configured for directly coupling light between one of the optical transmitting or receiving array to optical fibers in an optical cable. A method may include directly coupling light between one of an optical transmitting or receiving array and a lens block, and further coupling the light through the lens block directly to an optical fiber of an optical cable externally coupled to the optoelectronic module.
An example system includes a grating coupled laser, a laser optical interposer (LOI), an optical isolator, and a light redirector. The grating coupled laser includes a laser cavity and a transmit grating optically coupled to the laser cavity. The transmit grating is configured to diffract light emitted by the laser cavity out of the grating coupled laser. The LOI includes an LOI waveguide with an input end and an output end. The optical isolator is positioned between the surface coupled edge emitting laser and the LOI. The light redirector is positioned to redirect the light, after the light passes through the optical isolator, into the LOI waveguide of the LOI.
H01S 5/187 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités horizontales, p. ex. lasers à émission de surface à cavité horizontale [HCSEL] à réflexion de Bragg
G02B 6/34 - Moyens de couplage optique utilisant des prismes ou des réseaux
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
Various polarization rotator splitter (PRS) configurations are disclosed. In an example embodiment, a system includes a PRS that includes a silicon nitride (SiN) rib waveguide core that includes a rib and a ridge that extends vertically above the rib, the SiN rib waveguide core having a total height hsiN from a bottom of the rib to a top of the ridge, a rib height hrib from the bottom of the rib to a top of the rib, a rib width Wrib, and a top width wsiN of the ridge. The rib width Wrib varies along at least a portion of a length of the SiN rib waveguide core.
G02B 6/126 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré utilisant des effets de polarisation
Various embodiments relate to bi-directional optical communication. An optical system may include a first transceiver module including at least one transmitter and at least one receiver, wherein each transmitter of the at least one transmitter is configured to transmit a first signal via an optical fiber and at a first wavelength. The optical system may further include a second transceiver module configured to communicate with the first transceiver module via the optical fiber and including at least one transmitter and at least one receiver, wherein each transmitter of the at least one transmitter of the second transceiver module is configured to transmit a second signal via the optical fiber and at a second different wavelength. A third transceiver module may be provided and configured to transmit a third signal to the second transceiver module at the first wavelength. The first and second wavelengths may be different portions of a WDM channel.
A circuit may include amplifier circuitry configured to receive a current signal at an amplifier input node, convert the current signal to a voltage signal, and output the voltage signal at an amplifier output node. The circuit may also include overload circuitry configured to receive a replica DC input voltage and a replica DC output voltage. The overload circuitry may be further configured to detect that the current signal exceeds a threshold level based on the replica DC input voltage and the replica DC output voltage. In addition, the overload circuitry may be configured to, in response to and based on detecting that the current signal exceeds the threshold level, direct DC current of the current signal through a DC shunt path and direct AC current of the current signal through an AC shunt path. The AC shunt path may be different from the DC shunt path.
H04B 10/69 - Dispositions électriques dans le récepteur
H03F 1/00 - Détails des amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge, uniquement des dispositifs à semi-conducteurs ou uniquement des composants non spécifiés
H03F 3/00 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs
41.
IMPLANT REGROWTH VCSEL AND VCSEL ARRAY WITH HETEROGENEOUS COMBINATION OF DIFFERENT VCSEL TYPES
A non-planarized VCSEL can include: a blocking region over or under an active region, the blocking region having a first thickness; one or more conductive channel cores in the blocking region, the one or more conductive channel cores having a second thickness that is larger than the first thickness, wherein the blocking region is defined by having an implant and the one or more conductive channel cores are devoid of the implant, wherein the blocking region is lateral the one or more conductive channel cores, the blocking region and one or more conductive channel cores being an isolation region; and a non-planarized semiconductor region of one or more non-planarized semiconductor layers over the isolation region. The VCSEL can include a planarized bottom mirror region below the active region and a non-planarized top mirror region above the isolation region, or a non- planarized bottom mirror region below the active region.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
42.
BI-DIRECTIONAL TRANSCEIVER WITH TIME SYNCHRONIZATION
A system or a network may include an optoelectronic module that includes an optical transmitter optically coupled with an optical fiber, and a controller communicatively coupled to the optical transmitter. The controller may be configured to operate the optical transmitter to transmit data signals through the optical fiber. The optoelectronic module may be configured to transmit time synchronization signals through the optical fiber along with the data signals.
An etched planarized VCSEL includes: an active region (122) comprising MQW (138,140); a blocking region (127,160) over the active region which may be made form InGaP, and defining apertures therein; and conductive channel cores (129,162) in the apertures which may be made from AIGaAs, wherein the conductive channel cores and blocking region form an isolation region (128). The VCSEL may comprise spacer layers (148,150). A method of making the VCSEL includes: forming the active region; forming the blocking region over the active region; etching the apertures in the blocking region; and forming the conductive channel cores in the apertures of the blocking region. Another etched planarized VCSEL includes: an active region; a conductive region over the active region, and defining apertures therein; and blocking cores in the apertures, wherein the blocking cores and conductive region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the conductive region over the active region; etching the apertures in the conductive region; and forming the blocking cores in the apertures of the conductive region. This kind of providing a current aperture for a VCSEL avoids the reliability problems of current apertures provided by lateral oxidisation of a layer in the mesa of the VCSEL.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique
H01S 5/42 - Réseaux de lasers à émission de surface
A fiber optic connector (110) may include a body, a first fiber ferrule (302), and a second fiber ferrule (302). The first fiber ferrule may extend in a length direction of the body from a module-side end of the body. The second fiber ferrule may extend in the length direction of the body from the module-side end of the body and may be spaced apart from the first fiber ferrule in a width direction of the body. A maximum width in the width direction of a portion of the body configured to be received in a port of an optoelectronic communication module may be less than half a width of a fiber-side end of the optoelectronic communication module.
An optical system includes a silicon (Si) substrate (102), a buried oxide (BOX) layer (104) formed on the substrate (102), a silicon nitride (SiN) layer (112) formed above the BOX layer, and a SiN waveguide (114) formed in the SiN layer (112). In some embodiments, the optical system may additionally include an interposer waveguide (116) adiabatically coupled to the SiN waveguide (114) to form a SiN-interposer adiabatic coupler that includes at least the tapered section of the SiN waveguide, the optical system further including at least one of: a cavity (402) formed in the Si substrate at least beneath the SiN-interposer adiabatic coupler or an oxide overlay (822) formed between a top of a SiN core of the SiN waveguide and a bottom of the interposer waveguide. Alternatively or additionally, the optical system may additionally include a multimode Si-SiN adiabatic coupler that includes a SiN taper (1008) of a SiN waveguide and a Si taper (1006) of a Si waveguide.
In one example embodiment, an optoelectronic assembly (200) includes an electronic substrate (208), a transparent component (202) coupled on a first side of the electronic substrate, and a first component (210) which may be formed of or may include nickel plated copper coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure (244). A laser array (232) or a receiver array (236) may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component (214) may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.
In an example, a method may include dispensing a portion of epoxy on a first surface. The method may also include curing the portion of epoxy to form precured epoxy. The method may also include positioning the first surface and a second surface separated from each other by a gap. The precured epoxy is located within the gap between the first surface and the second surface. The method may also include dispensing bulk epoxy into the gap and in contact with the precured epoxy, the first surface, and the second surface. The method may also include curing the bulk epoxy to bond the first surface to the second surface.
In an example, a communication module includes an optical transmitter, an optical receiver, and a periodical filter. The optical transmitter is configured to emit an outbound optical signal. The optical receiver is configured to receive an inbound optical signal. A first frequency of the outbound optical signal is offset from a second frequency of the inbound optical signal by an amount less than a channel spacing of a multiplexer/demultiplexer implemented in an optical communication system that includes the communication module. The periodical filter is positioned in optical paths of both the outbound optical signal and the inbound optical signal and has a transmission spectrum with periodic transmission peaks and troughs. The first frequency of the outbound optical signal may be aligned to one of the transmission peaks and the second frequency of the inbound optical signal may be aligned to one of the transmission troughs, or vice versa.
In an example, a communication module includes an optical transmitter, an optical receiver, and a periodical filter. The optical transmitter is configured to emit an outbound optical signal. The optical receiver is configured to receive an inbound optical signal. A first frequency of the outbound optical signal is offset from a second frequency of the inbound optical signal by an amount less than a channel spacing of a multiplexer/demultiplexer implemented in an optical communication system that includes the communication module. The periodical filter is positioned in optical paths of both the outbound optical signal and the inbound optical signal and has a transmission spectrum with periodic transmission peaks and troughs. The first frequency of the outbound optical signal may be aligned to one of the transmission peaks and the second frequency of the inbound optical signal may be aligned to one of the transmission troughs, or vice versa.
H04J 14/02 - Systèmes multiplex à division de longueur d'onde
50.
A CARRIER LAYOUT FOR AN ELECTRO-OPTICAL MODULE, AN ELECTRO OPTICAL MODULE USING THE SAME, AND INTERCONNECT STRUCTURE FOR COUPLING AN ELECTRONIC UNIT TO AN OPTICAL DEVICE
The present invention provides a carrier layout for an electro-optical module and respective electro-optical module, the carrier layout comprising a substrate (210) comprising a ground plane layer (212) and a coplanar waveguide interconnect (270; 280) disposed onto the substrate (210). The coplanar waveguide interconnect (270; 280) comprises a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The coplanar conductors of the pair are electrically connected to each other by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212). The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate (210) having a ground plane layer (212), the interconnect structure comprising a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The conductors of the pair are electrically connected by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212).
A distributed reflector (DR) laser may include a distributed feedback (DFB) region (102) and a distributed Bragg reflector (DBR) (104). The DFB region may have a length in a range from 30 micrometers (µm) to 100 μm and may include a DFB grating with a first kappa in a range from 100 cm-1 to 150 cm-1. The DBR region may be coupled end to end with the DFB region and may have a length in a range from 30-300 µm. The DBR region may include a DBR grating with a second kappa in a range from 150 cm-1 to 200 cm-1. The DR laser may additionally include a lasing mode and a p-p resonance frequency. The lasing mode may be at a long wavelength side of a peak of a DBR reflection profile of the DBR region. The p-p resonance frequency may be less than or equal to 70 GHz.
H01S 5/0625 - Dispositions pour commander les paramètres de sortie du laser, p. ex. en agissant sur le milieu actif en faisant varier le potentiel des électrodes dans des lasers à plusieurs sections
A thermal interface (118) may include a thermally conductive cap (120). The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket (122) defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings. An optoelectronic module (100) with an optical subassembly (108) having a plurality of leads located within the cap and gasket openings is described.
A transceiver connector may include a bottomside connector. The bottomside connector may include a first ground pin adjacent to an edge of the bottomside connector, a first high-speed differential input pin adjacent to the first ground pin, a second high-speed differential input pin adjacent to the first high-speed differential input pin, a second ground pin adjacent to the second high-speed differential input pin, a serial interface data line pin adjacent to the second ground pin, a serial interface clock pin adjacent to the serial interface data line pin, a third ground pin adjacent to the serial interface clock pin, a first high-speed differential output pin adjacent to the third ground pin, a second high-speed differential output pin adjacent to the first high-speed differential output pin, and a fourth ground pin adjacent to the second high-speed differential output pin.
A system includes a surface coupled edge emitting laser (212) that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating (206) formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating. Due to the tapered shape of the fan out grating (206) alignment requirements between the laser chip and the PIC are reduced.
H01S 5/10 - Structure ou forme du résonateur optique
H01S 5/187 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités horizontales, p. ex. lasers à émission de surface à cavité horizontale [HCSEL] à réflexion de Bragg
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
H01S 5/125 - Lasers à réflecteurs de Bragg répartis [lasers DBR]
H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique
G02B 6/27 - Moyens de couplage optique avec des moyens de sélection et de réglage de la polarisation
55.
CHARACTERIZATION AND COMPENSATION OF OPTICAL IMPAIRMENTS IN INP-BASED OPTICAL TRANSMITTER
A method and apparatus for characterizing and compensating optical impairments in an optical transmitter includes operating an optical transmitter comprising a first and second parent MZ, each comprising a plurality of child MZ modulators. An electro-optic RF transfer function is generated for each of the plurality of child MZ modulators. Curve fitting parameters are determined for each of the plurality of electro-optic RF transfer functions and operating points of each child MZ modulator are determined using the curve fitting parameters. An IQ power imbalance is determined using the curve fitting parameters. Initial RF drive power levels are determined that compensate for determined IQ power imbalance. The XY power imbalance is determined for initial RF drive power levels using the curve fitting parameters. The operating RF drive powers are determined that compensate for first and second IQ power imbalances and for XY power imbalance for the optical transmitter.
H04B 10/073 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal hors service
An integrated optical component includes at least one input waveguide, at least one output waveguide; a first slab waveguide having a first refractive index, n1. The first slab waveguide may be disposed between at least one of the input waveguides and at least one of the output waveguides. The integrated optical component may further include a second slab waveguide having a second refractive index, n2. The integrated optical component may also include a third cladding slab having a third refractive index, n3. The third cladding slab may be disposed between the first slab and the second slab. The thickness of the second slab waveguide and the thickness of the third slab waveguide are adjustable to reduce a birefringence of the integrated optical component.
G02B 6/10 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/126 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré utilisant des effets de polarisation
G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde
57.
STRATEGIC PLACEMENT OF PLASTIC STRUCTURES FOR EMI MANAGEMENT OF TRANSCEIVER MODULE
An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board ("PCB") that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference ("EMI") attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
A holographic display image projector system including an input light source for generating an at least partially coherent optical input beam and an imaging system for transforming an image representation in the Fourier domain into a corresponding holographic image in the spatial domain. The image projector includes a spatial light modulator having a reflective phase manipulating surface and being responsive to an electric control signal to generate a two-dimensional phase profile on the reflective phase manipulation surface to diffract the optical input beam into a diffracted beam having a plurality of diffraction components angularly separated in a first dimension. A coupling prism having a first surface positioned such that a first subset of the diffraction components is refracted through the first surface to the imaging system, wherein upon refraction, an angular separation of the first subset of diffraction components is increased by at least a factor of 2.
G03H 1/04 - Procédés ou appareils pour produire des hologrammes
G03H 1/22 - Procédés ou appareils pour obtenir une image optique à partir d'un hologramme
G03B 37/02 - Photographie panoramique ou à grand écranPhotographie de surfaces étendues, p. ex. pour la géodésiePhotographie de surfaces internes, p. ex. de tuyaux avec mouvements de balayage de l'objectif ou de l'appareil
G03H 1/02 - Procédés ou appareils holographiques utilisant la lumière, les infrarouges ou les ultraviolets pour obtenir des hologrammes ou pour en obtenir une imageLeurs détails spécifiques Détails
An out-of-band (OOB) signal detector is disclosed. The OOB signal detector may include a first node configured to receive an alternating current (AC) portion and a direct current (DC) portion of an electrical signal. The AC portion may include modulated OOB data carried by the electrical signal. The OOB signal detector may also include a current to voltage processing circuit configured to extract the AC portion of the electrical signal. The OOB signal detector may additionally include a limiting amplifier circuit configured to receive the extracted AC portion and to generate an amplified signal based on the extracted AC portion. The OOB signal detector may further include an analog-to-digital converter circuit configured to sample the amplified signal and to generate a digital sample that represents the modulated OOB data.
In an example embodiment, an N-channel WDM OSA includes active optical devices coupled to a carrier, an optical block, and a MUX or a DEMUX. The optical block may be positioned above the active optical devices and coupled to the carrier. The optical block may include a bottom with lenses formed in the bottom that are aligned with the active optical devices; a first side that extends up from the bottom; a second side that extends up from the bottom and is opposite the first side; a port that extends forward from the bottom and the first and second sides; and an optical block cavity defined by the bottom and the first and second sides that extends rearward from the port. The MUX or DEMUX may be positioned in the optical block cavity in an optical path between the port of the optical block and the active optical devices.
Described herein is a system and method of controlling an optical heterodyne measurement system (1). The measurement system (1) has a tunable laser (9) for generating a local oscillator signal, an optical input (5) for receiving an input optical signal (7) and a mixing module (13) for mixing the local oscillator signal with the input optical signal to generate an output optical measurement signal. One embodiment provides a method including the steps of: a) receiving an input electrical drive signal for driving the tunable laser (9) to produce a laser output having a spectral linewidth and peak central frequency; b) coupling the input electrical drive signal with an electrical linewidth control signal (54) to selectively broaden the spectral linewidth; and c) during a measurement period, selectively tuning the central frequency of the laser in a stepwise manner across a predetermined frequency spectrum at predefined tuning increments.
G01J 3/433 - Spectrométrie par modulationSpectrométrie par dérivation
G01R 23/14 - Dispositions pour procéder à la mesure de fréquences, p. ex. taux de répétition d'impulsionsDispositions pour procéder à la mesure de la période d'un courant ou d'une tension en hétérodynantDispositions pour procéder à la mesure de fréquences, p. ex. taux de répétition d'impulsionsDispositions pour procéder à la mesure de la période d'un courant ou d'une tension par mesure des battements résultant d'une comparaison de fréquences
A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves. An optoelectronic transceiver comprises the system and a fiber optic cable including a cable lens component, a plurality of optical fibers at least partially positioned in the cable lens component, and a lens clip configured to be removably located on the transceiver lens component.
An optical network element for a hardware configured optical network includes a first optical port that receives an input optical signal comprising receive control information from the hardware configured optical network. A demodulator optically coupled to the first optical port decodes the receive control information for configuring the optical network element. A modulator having an electrical modulation input that receives transmit control information imparts a modulation onto an optical carrier thereby generating a transmit optical control signal representing the transmit control information. A second optical port transmits the transmit optical control signal representing the transmit control information to the hardware configured optical network.
An optical network element for a hardware configured optical network includes a first optical port that receives an input optical signal comprising receive control information from the hardware configured optical network. A demodulator optically coupled to the first optical port decodes the receive control information for configuring the optical network element. A modulator having an electrical modulation input that receives transmit control information imparts a modulation onto an optical carrier thereby generating a transmit optical control signal representing the transmit control information. A second optical port transmits the transmit optical control signal representing the transmit control information to the hardware configured optical network.
A optical element (transmissive or reflective) includes a transmissive layer comprising two different optical media arranged among discrete volumes arranged along the layer. The discrete volumes are arranged to approximate a desired phase function (typically modulo 2π) and are smaller than an operational wavelength in order to provide a range of phase delays needed to adequately approximate the desired phase function.
G02B 26/06 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la phase de la lumière
66.
AUTOMATIC BIAS STABILIZATION OF DUAL-POLARIZATION IN-PHASE AND QUADRATURE OPTICAL MODULATOR
Embodiments include a method and apparatus used for automatic bias stabilization of a DP IQM based on MZM for transmitting DP-QPSK optical data and/or DP-16QAM optical data. The apparatus simultaneously dithers DC-bias voltages of in-phase child, quadrature-phase child, and parent MZMs with three different dither patterns in time-domain which are mutually orthogonal to each other in the frequency-domain for X and Y polarization IQ modulators. Tap monitor photodiodes detect an interference term between these three dither patterns for each polarization. The interference term is sampled using an ADC in the time domain. The time-synchronous detection method may solve a set of three simultaneous linear partial differential equations with three unknowns to compute controlled DC-bias voltages to set on the respective MZM with a solution set which may iteratively converge to a unique solution, thereby biasing the child MZM in dual-polarization IQM to transmission minimum and parent MZM in quadrature transmission.
A method of performing clock recovery and equalizer coefficient estimation in a multi-channel receiver may include recovering, at a first clock recovery unit, a first clock signal associated with a first channel. The method may include estimating a first set of coefficients for a first equalizer associated with the first channel using the first clock signal. The method may include passing the first clock signal to a second clock recovery unit associated with a second channel. The method may also include recovering, at the second clock recovery unit, a second clock signal associated with the second channel using the first clock signal as a reference clock signal. The method may also include passing the first set of coefficients as initialization coefficients to a second equalizer associated with the second channel. The method may also include estimating a second set of coefficients for the second equalizer using the initialization coefficients.
An example embodiment includes a pluggable active optical cable connector configured to permanently maintain engagement of an optical interface included in an optoelectronic module. The pluggable active optic cable connector includes a lens connection section which connects a plurality of optical fibers to the optical interface, a latching portion which engages with a latch receiving portion of the optoelectronic module, the latching portion including a first engagement portion which engages with an optoelectronic engagement portion of the optical interface and a second engagement portion, and a locking portion which engages with the second engagement portion of the latching portion and locks the lens connection section in place with respect to the optoelectronic module as a plug insertion force is applied to the pluggable active optical cable connector so as to prevent the lens connection section from disengaging from the optical interface of the optoelectronic module.
An example embodiment includes a pluggable active optical cable product configured to maintain engagement of an optical interface included in an optoelectronic module. The pluggable active optical cable product includes a lens connection section which connects a plurality of optical fibers to the optical interface, a clip configured to surround the lens connection section and the optical interface so as to apply a compressive force which urges the lens connection section to connect to the optical interface, an bottom shell which houses the lens connection section, optical interface, and clip, and an upper shell which is configured to be disposed on a surface of the bottom shell when assembled with the bottom shell so as to form an enclosure for the lens connection section, the optical interface, and the clip.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/38 - Moyens de couplage mécaniques ayant des moyens d'assemblage fibre à fibre
H01R 13/633 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz pour la séparation uniquement
In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the S1O2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the S1O2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.
G02B 6/126 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré utilisant des effets de polarisation
In an example, a coupled system includes a first waveguide, at least one second waveguide, and an interposer. The first waveguide has a first refractive index n1 and a tapered end. The at least one second waveguide each has a second refractive index n2. The interposer includes a third waveguide having a third refractive index n3 and a coupler portion, where n1 > n2 > n3. The tapered end of the first waveguide is adiabatically coupled to a coupler portion of one of the at least one second waveguide. A tapered end of one of the at least one second waveguide is adiabatically coupled to the coupler portion of the third waveguide of the interposer. The coupled system is configured to adiabatically couple light between the first waveguide and the at least one second waveguide and between the at least one second waveguide and the third waveguide.
This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.
This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.
This disclosure generally relates to devices and methods involving optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a multi-channel optoelectronic subassembly including a multi-channel header subassembly with a plurality of optoelectronic transducers on a substrate, a housing defining a housing cavity and including an optically transmissive portion, a ferrule assembly retaining optical fibers and an alignment sleeve with a sleeve cavity sized and shaped to receive the ferrule assembly. At least one of the optoelectronic transducers may be configured to transmit and/or receive optical signals corresponding to one channel.
A wavelength locker for use with tunable optical devices may include an etalon (20), a polarization beam splitter(30), and a first and second detector ((41), (42)). The etalon may be positioned to receive a first beam (11) and may include a first birefringent crystal (21) having a first optical axis and a second birefringent crystal (22) having a second optical axis. The first birefringent crystal may be coupled to the second birefringent crystal such that the first optical axis and the second optical axis are orthogonal to one another.
This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.
in in the plane of incidence, is less than that variation exhibited by a reference diffraction grating that has parallel first and second substrate surfaces but is otherwise identical to the optical diffraction grating.
A capacitor in a multilayer printed circuit board 100 is described. The capacitor may include a via 114, 116 of a via-in-pad type and a dielectric mixture filled in the via of the via-in-pad type. The via may be disposed under an integrated circuit contact pad 112 of the multilayer printed circuit board. The dielectric mixture may include a nanoparticle-sized dielectric powder mixed with an adhesive material.
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
A differential TWE MZM includes a differential driver, first and second capacitors, and first and second terminations. The differential driver includes a first differential output and a second differential output that collectively form a differential pair. The first differential output is DC coupled to a cathode of a first arm optical phase shifter of a TWE MZM. The second differential output is DC coupled to a cathode of a second arm optical phase shifter of the TWE MZM. The first capacitor AC couples the second differential output to an anode of the first arm optical phase shifter. The second capacitor AC couples the first differential output to an anode of the second arm optical phase shifter. The first and second terminations are coupled to the cathode and the anode of, respectively, the first or second arm optical phase shifter.
G02F 1/225 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence dans une structure de guide d'ondes optique
H04B 10/556 - Modulation numérique, p. ex. modulation par déplacement de phase différentielle [DPSK] ou modulation par déplacement de fréquence [FSK]
80.
Partially metallized total internal reflection immersion grating
A system (100) may include a driver circuit (102) configured to receive a clock signal (106). The system may also include a first tuned circuit (104a) and a second tuned circuit (104b). The first tuned circuit (104a) and the driver circuit (102) may be collectively tuned according to a first frequency range. The first tuned circuit may be configured to be active (110out high) when a rate of the clock signal is within the first frequency range and to be inactive (110out low) when the rate is outside the first frequency range. Further, the second tuned circuit (104b) and the driver circuit (102) may be collectively tuned according to a second frequency range that is different from the first frequency range. The second tuned circuit (104b) may be configured to be active (110out low) when the rate is within the second frequency range and to be inactive when the rate is outside the second frequency range (110out high).
A circuit (200) may include an input terminal (202, 203) configured to receive an input signal with a first voltage swing and an output terminal (204, 205). The circuit may also include a first transistor (220), a second transistor (221), a third transistor (222), and a control circuit (210). The control circuit may be coupled to the input terminal (202, 203), a gate terminal of the first transistor (220), and a gate terminal of the second transistor (221). The control circuit may be configured to adjust voltages provided to the gate terminals based on the input signal (202, 203) such that the first transistor (220) conducts in response to the input signal being at a first logical level and the second transistor (221) conducts in response to the input signal being at a second logical level to generate an output signal (204, 205) output on the output terminal (204, 205). The second voltage swing of the output signal (204-205) may be different from the first voltage swing of the input signal (202-203).
A circuit may include first and second input nodes, first and second output nodes, first and second intermediate nodes, first and second resistances, a first amplification transistor coupled to the first input node, the first resistance, and the first intermediate node and a second amplification transistor coupled to the second input node, the second resistance, and the second intermediate node. The circuit may also include a first active device coupled to the first output node and the first intermediate node, a second active device coupled to the second output node and the second intermediate node, a first output transistor coupled to the first output node and configured to conduct based on a second intermediate signal on the second intermediate node, and a second output transistor coupled to the second output node and configured to conduct based on a first intermediate signal on the first intermediate node.
In an embodiment, a pluggable connector configured to removably couple an end of an optical cable to an optoelectronic module includes a first portion and a second portion. The first portion is configured to engage a latch slot of the optoelectronic module to retain within the optoelectronic module a ferrule optically coupled to optical fibers of the optical cable. The second portion is configured to engage the ferrule to prevent removal of the ferrule from within the optoelectronic module when the first portion engages the latch slot.
Latch mechanisms for modules are disclosed. A module includes a housing (208) and a release slide (202). The housing includes a first rib (236) located on a first side of the housing and a second rib located on a second side of the housing. The release slide is slidingly positioned on the housing. The release slide includes a release slide base (238), a first release slide arm (240) extending from the release slide base (238), and a second release slide arm extending from the release slide base. A first flange (242) extending from the first release slide arm is positioned at least partially over the first rib. A second flange extending from the second release slide arm is positioned at least partially over the second rib.
An example embodiment includes a system for communicating an optical signal. The system includes an optical transmitter and an optical receiver. The optical transmitter includes one or more lasers configured to produce a light signal and a transmitter optical sub assembly (TOSA) receptacle. The TOSA receptacle optically couples the lasers to an optical fiber and launches a quasi-multimode optical signal (quasi-MM signal) that includes at least one lower order mode optical signal and at least one higher order mode optical signal onto the optical fiber. The optical receiver is connected to the optical fiber via a receiver optical sub assembly (ROSA) receptacle. The optical receiver is configured to receive the quasi-MM signal and to substantially block the at least one higher order mode optical signal.
An example embodiment includes a system for communicating an optical signal. The system includes an optical transmitter and an optical receiver. The optical transmitter includes one or more lasers configured to produce a light signal and a transmitter optical sub assembly (TOSA) receptacle. The TOSA receptacle optically couples the lasers to an optical fiber and launches a quasi-multimode optical signal (quasi-MM signal) that includes at least one lower order mode optical signal and at least one higher order mode optical signal onto the optical fiber. The optical receiver is connected to the optical fiber via a receiver optical sub assembly (ROSA) receptacle. The optical receiver is configured to receive the quasi-MM signal and to substantially block the at least one higher order mode optical signal.
Described herein is a calibration system (25) for a wavelength selective switch (1). The switch (1) is adapted for dynamically switching optical beams (5, 7) along respective trajectories between input and output ports disposed in an array (3) using a reconfigurable Liquid crystal on silicon (LCOS) spatial light modulator device (17). The calibration system (25) includes a monitor (27) for projecting an optical monitor beam (29) through at least a portion of the switch (1) onto the LCOS (17) and detecting the monitor beam (29) reflected from the LCOS (17). In response, system (25) provides a calibration signal (33) to an active correction unit (35) for applying a correction to one or more of the trajectories while maintaining a constant switching state in the LCOS (17).
H04B 10/077 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant un signal de surveillance ou un signal supplémentaire
H04B 10/071 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal réfléchi, p. ex. utilisant des réflectomètres optiques temporels [OTDR]
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
H04J 14/02 - Systèmes multiplex à division de longueur d'onde
A latch may include a follower and a driver. The follower may include a follower opening configured to receive a post of a housing. The driver may include a driver opening configured to receive the post of the housing such that the driver is selectively rotatable relative to the post. The driver may further include an interfacing finger positioned to be received by the follower opening. The interfacing finger may be configured to urge the follower to slidingly move relative to the housing as the driver is rotated relative to the post.
Described herein is a spatial light modulator (15) for modulating the phase, retardation or polarization state of an incident optical signal propagating in a first dimension. The optical phase modulator (15) includes a liquid crystal material (17) and a pair of electrodes (19 and 21) for supplying an electric potential across the liquid crystal material (17) to drive liquid crystals in a predetermined configuration. Modulator (15) also includes a diffractive optical element (29) disposed adjacent a first electrode (19). Element (29) includes a first array of diffractive elements (31) formed of a first material having a first refractive index and extending in a second dimension substantially perpendicular to the first dimension. Elements (31) are at least partially surrounded by a second material (33) formed of a lower refractive index.
A serializer circuit may include a recovery circuit, an adjusting circuit, and a multiplexer circuit. The recovery circuit may be configured to receive a first data signal at a first frequency, to generate a first clock signal at the first frequency using the first data signal, and to retime the first data signal based on the first clock signal to generate a retimed first data signal. The adjusting circuit may be configured to receive a second data signal and retime the second data signal based on the first clock signal to generate a retimed second data signal. The multiplexer circuit may be configured to multiplex the retimed first data signal and the retimed second data signal.
In an example embodiment, a WDM array includes an optical filter, N common ports, N reflection ports, and N pass ports. The N common ports may be positioned to a first side of the optical filter. N may be greater than or equal to two. The N reflection ports may be positioned to the first side of the optical filter. The N pass ports may be positioned to a second side of the optical filter opposite the first side.
A circuit may include an input node configured to receive a signal and an output node configured to be coupled to a load. The circuit may also include a first circuit coupled between the input node and the output node, the first circuit being configured to receive the signal and drive the signal on the output node at a first voltage. The circuit may also include a signal adjust circuit configured to adjust a current of the signal driven by the first circuit. The signal adjust circuit may be configured to apply a first current adjustment to adjust the current of the signal at one but not both of a falling edge of the signal or a rising edge of the signal.
In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB) (100), a second PCB (114), a spacer (108), and an electrically conductive solder joint (120). The first PCB includes a first electrically conductive pad (104). The second PCB includes a second electrically conductive pad (116). The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad.
Described herein is a diffraction grating (1) for use in an optical system. The diffraction grating includes a substrate (2) and an array of elongate diffracting elements (3) arranged in a grating profile across the substrate. The grating profile imparts a predefined phase change to optical beams to at least partially correct the beams for optical aberrations present in the optical system.
An example embodiment includes a cable clip. The cable clip is configured to maintain engagement of an optical interface with a lens assembly included in an optoelectronic module. The cable clip includes a forward section, a clip body, a connector retention mechanism, a lens latch, and a release lever. The clip body is connected to the forward section at a clip shoulder. The connector retention mechanism is configured to retain the optical interface and extends from the clip body. The lens latch is positioned at a first end. The lens latch is configured to latch the lens assembly when a portion of the optical interface is received within the lens assembly. The release lever is connected to the forward section. The release lever is configured to unlatch the lens latch from the lens assembly in response to application of an actuation force above a particular threshold magnitude.
An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.
An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly (402), a module board, heat-generating components (150), and a thermally conductive plate (200). The lens assembly is secured to the module board. The module board includes a printed circuit board (PCB). The heat-generating components is mounted to the PCB. The thermally conductive plate is secured to a surface (134) of the module board. The thermally conductive plate defines an opening (208) that receives at least a portion of the lens assembly. The thermally conductive plate is configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.
An example embodiment includes an optical transmission device. The optical transmission device includes an optical source, a collimator lens, and an optical monitor. The optical source is configured to transmit a channel of light. The collimator lens is configured to reflect a portion of the channel of light. The optical monitor is arranged to receive at least a first portion of the reflected channel of light directly from the collimator lens, and is configured to communicate a gross electrical signal representative of received light including the first portion of the reflected channel of light.
H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données
