COMPOSITION, RAW MATERIAL COMPOSITION OF COSMETIC, VIRUS PROLIFERATION SUPPRESSING AGENT, USE OF COMPOSITION FOR SUPPRESSING VIRUS PROLIFERATION, METHOD FOR SUPPRESSING VIRUS PROLIFERATION, AND SEALED BODY
Provided is a 2,3-BDO composition capable of appropriately exhibiting an effect of suppressing virus proliferation. A composition according to the present invention contains at least (2R,3R)-2,3-butanediol and/or (2S,3S)-2,3-butanediol, and does not contain (meso)-2,3-butanediol.
Provided is a composition capable of appropriately exhibiting an virus proliferation inhibition effect. This composition is characterized by containing at least (2R,3R)-2,3-butanediol and/or (2S,3S)-2,3-butanediol and (meso)-2,3-butanediol, wherein the weight-based proportion of the content of the (meso)-2,3-butanediol is not more than twice the total content of the (2R,3R)-2,3-butanediol and the (2S,3S)-2,3-butanediol.
A printed wiring board includes a first insulating layer, a connection conductor layer including wiring, a second insulating layer covering the connection conductor layer, a conductor layer including first and second electrodes such that the first electrode mounts a first electronic component and the second electrode mounts a second electronic component, and via conductors including first and second via conductors. The first via conductor connects the first electrode and wiring. The second via conductor connects the second electrode and wiring. The conductor layer includes a seed layer and an electrolytic plating layer. The seed layer includes a first layer formed on the first insulating layer and a second layer formed on the first layer, a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer of the seed layer.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A coil substrate includes a flexible substrate, terminals formed on one side of the flexible substrate such that the terminals are positioned in a longitudinal direction of the flexible substrate, coils each comprising a first wiring formed on a first surface and a second wiring formed on a second surface on the opposite side with respect to the first surface, and connection wirings formed on the flexible substrate such that the connection wirings include wirings connecting the terminals and the coils respectively and wirings connecting two of the coils respectively and that the connection wirings extend obliquely with respect to the longitudinal direction of the flexible substrate. The coil substrate is wound along the longitudinal direction of the flexible substrate around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the coil substrate is formed into a cylindrical shape.
H02K 3/04 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre
H02K 5/22 - Parties auxiliaires des enveloppes non couvertes par les groupes , p.ex. façonnées pour former des boîtes à connexions ou à bornes
H02K 7/00 - Dispositions pour la mise en œuvre d'énergie mécanique associées structurellement aux machines dynamo-électriques, p.ex. association structurelle avec des moteurs mécaniques d'entraînement ou des machines dynamo-électriques auxiliaires
[Problem] The objective of the present invention is to reduce the stray capacitance that is generated between a side surface of a land and a side surface of a solid pattern. [Solution] A wiring board according to the present disclosure comprises a first conductive layer, an insulating layer that covers the first conductive layer, a second conductive layer that is formed on the insulating layer, and a via conductor that penetrates the insulating layer and connects the first conductive layer and the second conductive layer to each other. The first conductive layer is provided with a pad that is connected to the via conductor, and a solid pattern that has an opening in which the pad is contained. A gap is provided between the side surface of the pad and the insulating layer, or between the inner surface of the opening of the solid pattern and the insulating layer.
A printed wiring board includes a conductor layer including wirings, a resin insulating layer having openings, a mounting conductor layer including first and second electrodes, first via conductors including a seed layer and an electrolytic plating layer such that the first via conductors connect the first electrodes and the wirings, and second via conductors including the seed layer and electrolytic plating layer such that the second via conductors connect the second electrodes and the wirings. The first electrodes are positioned to mount a first electronic component. The second electrodes are positioned to mount a second electronic component. The first and second via conductors are formed such that the seed layer is covering an inner wall surface of each opening in the insulating layer and has a first portion and a second portion connected to the first portion and having a part of the first portion formed on the second portion.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
7.
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Provided are a coil substrate capable of reducing the influence of wiring resistance and eddy current, a coil substrate for a motor, and a motor. A coil substrate according to an embodiment includes a resin substrate having a first surface and a second surface, and coil wiring formed on the first surface and the second surface of the resin substrate. The coil wiring comprises a first conductor layer and an additional plating layer. The first conductor layer comprises a metal foil layer, a chemical plating layer formed on the metal foil layer, and an electrolytic plating layer formed on the chemical plating layer. The cross-sectional shape of the first conductor layer is a substantially trapezoidal shape having a lower base facing the resin substrate and an upper base opposite the lower base. The additional plating layer covers an upper surface and a side surface of the first conductor layer.
H01F 5/04 - Dispositions des connexions électriques aux bobines, p.ex. fils de connexion
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
Provided are a coil substrate capable of reducing the influence of wiring resistance and eddy current, a coil substrate for a motor, and a motor. A coil substrate according to an embodiment includes a resin substrate having a first surface and a second surface, and coil wiring formed on the first surface and the second surface of the resin substrate. The coil wiring is composed of a first conductor layer and an additional plating layer. The first conductor layer is composed of a metal foil layer, a chemical plating layer formed on the metal foil layer, and an electrolytic plating layer formed on the chemical plating layer. The additional plating layer covers an upper surface and a side surface of the first conductor layer. The cross-sectional shape of a side-surface part of the additional plating layer that covers the side surface of the first conductor layer does not follow the cross-sectional shape of the side surface of the first conductor layer.
H01F 5/04 - Dispositions des connexions électriques aux bobines, p.ex. fils de connexion
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
The present invention keeps the intense heat from a battery cell that has undergone thermal runaway from being transmitted via a cooling plate. The present invention also provides a high-safety battery pack that keeps the intense heat from a battery cell that has undergone thermal runaway from being transmitted via a cooling plate. A battery cell pedestal (3) is to be interposed between a cooling plate (1) and a battery cell (20) and comprises a thermal expansion material. A battery pack (100) comprises a plurality of battery cells (20) that are installed on battery cell pedestals (3), the battery cells (20) being connected to each other in series or in parallel.
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/249 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports spécialement adaptés aux aéronefs ou aux véhicules, p.ex. aux automobiles ou aux trains
10.
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A printed wiring board includes an insulating layer, and a conductor layer formed on the insulating layer and having degas holes formed such that the degas holes are penetrating through the conductor layer and exposing portions of the insulating layer. The conductor layer is formed such that each of the degas holes is a polygon shape having at least one inner angle of 100 degrees or more.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A coil substrate includes a flexible substrate having a first surface and a second surface on the opposite side with respect to the first surface, and coils including first wirings and second wirings such that the first wirings are formed on the first surface of the flexible substrate and that the second wirings are formed on the second surface of the flexible substrate. The flexible substrate has one or more recesses formed on one or more longitudinal sides of the flexible substrate and is formed to be wound in a circumferential direction around an axis extending in the width direction of the flexible substrate orthogonal to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
A coil substrate includes a flexible substrate and coils including first wirings and second wirings. The first wirings are formed on a first surface of the substrate. The second wirings are formed on a second surface of the substrate. The flexible substrate has a first end in a longitudinal direction of the substrate and is wound from the first end in a circumferential direction around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the substrate is formed into a cylindrical shape, the first surface of the substrate is positioned on an inner circumferential side of the cylindrical shape, and the second surface of the substrate is positioned on an outer circumferential side of the cylindrical shape, and the substrate has a first region adjacent to the first end such that the first region includes the second wirings and does not include the first wirings.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
A motor coil substrate includes a coil substrate including a flexible substrate and coils such that the coils include first wirings formed on a first surface of the flexible substrate and second wirings formed on a second surface of the flexible substrate on the opposite side. The coil substrate is wound N turns where N is an integer of 2 or more in a circumferential direction such that the first surface of the flexible substrate is positioned on an inner circumferential side of the coil substrate, the second surface of the flexible substrate is positioned on an outer circumferential side of the coil substrate, and a gap is formed between an M-th layer where M is an integer equal to or larger than 1 and less than N and an (M+1)-th layer from an inner side of N circumferential layers formed by winding the coil substrate N turns.
H02K 3/28 - Schémas d'enroulements ou de connexions entre enroulements
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
14.
PAPERMAKING MAT AND METHOD FOR MANUFACTURING PAPERMAKING MAT
Provided is a papermaking mat which has a high initial surface pressure and can maintain a surface pressure even when subjected to repeated compression. This papermaking mat is composed of inorganic fibers, and characterized in that the inorganic fibers include alumina fibers (AF) and refractory ceramic fibers (RCF), and in that when 100 of the inorganic fibers are randomly extracted and it is determined whether the inorganic fibers are alumina fibers or refractory ceramic fibers, the number of alumina fibers is 30% or more and the number of refractory ceramic fibers is less than 70%.
D01F 9/08 - Filaments, ou similaires, faits par l’homme, formés d’autres substances; Leur fabrication; Appareils spécialement adaptés à la fabrication de filaments de carbone de matière inorganique
D06M 11/45 - Oxydes ou hydroxydes d'éléments des groupes 3 ou 13 de la classification périodique; Aluminates
D06M 11/79 - Traitement des fibres, fils, filés, tissus ou des articles fibreux faits de ces matières, avec des substances inorganiques ou leurs complexes; Un tel traitement combiné avec un traitement mécanique, p.ex. mercerisage avec du silicium ou ses composés avec du dioxyde de silicium, des acides siliciques ou leurs sels
D06M 15/233 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'hydrocarbures, ou de leurs produits de réaction, p.ex. posthalogénés ou sulfochlorés aromatiques, p.ex. de styrène
D06M 15/263 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'acides carboxyliques non saturés; Leurs sels ou esters
D06M 15/333 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'alcools non saturés ou de leurs esters d'acétate de vinyle; Alcool polyvinylique
D06M 15/693 - Traitement des fibres, fils, filés, tissus ou articles fibreux faits de ces matières, avec des composés macromoléculaires; Un tel traitement combiné avec un traitement mécanique avec du caoutchouc naturel ou synthétique ou leurs dérivés
A printed wiring board includes a mounting conductor layer including first and second electrodes, a connection conductor layer including connection wirings such that the connection wirings connect the first and second electrodes, a resin insulating layer formed between the mounting conductor layer and the connection conductor layer and having openings, and connection via conductors formed in the openings of the resin insulating layer and including first and second connection via conductors such that the first connection via conductors electrically connect the first electrodes and the connection wirings and the second connection via conductors electrically connect the second electrodes and the connection wirings. The resin insulating layer includes inorganic particles and resin. The inorganic particles include first inorganic particles forming inner wall surfaces in the openings and second inorganic particles embedded in the resin insulating layer. Shapes of the first inorganic particles are different from shapes of the second inorganic particles.
A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part laminated on the first build-up part and including an insulating layer and a conductor layer. The minimum width and minimum inter-wiring distance of wirings in the first build-up part are smaller than the minimum width and minimum inter-wiring distance of wirings in the second build-up part. The insulating layer in the first build-up part includes resin and inorganic particles including first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin such that the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin, respectively. The insulating layer of the first build-up part has a surface covered by the conductor layer and including a surface of the resin and exposed surfaces of the first portions.
A wiring substrate includes a first build-up part including first insulating layers, first conductor layers, and first via conductors, and a second build-up part including second insulating layers and second conductor layers. The minimum wiring width and minimum inter-wiring distance in the first conductor layers are smaller than the minimum wiring width and minimum inter-wiring distance in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer formed on the first layer. The first layer includes a lower layer including a sputtering film including an alloy including copper, aluminum, and at least one element selected from nickel, zinc, gallium, silicon, and magnesium, and an upper layer including a sputtering film including copper. The lower layer is formed in contact with surfaces of the first insulating layers and inner wall surfaces and bottom surfaces in via openings for the first via conductors.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
18.
BUS BAR AND METHOD FOR PRODUCING SAME, AND POWER STORAGE DEVICE
Provided are a bus bar in which an insulating film is formed in a desired region and peeling or the like of the insulating film can be suppressed, even if a bus bar body has a complicated shape, and a method for producing the same. A bus bar (20) has a bus bar body (25) and an insulating film (10) formed on the surface of the bus bar body (25). The bus bar body (25) has a pair of main surface portions (25a) that face each other, a plurality of end surface portions (25b) that join the facing main surface portions (25a) to each other, and corner portions (25c) that are formed between the main surface portions (25a) and the end surface portions (25b). The outer surfaces of the insulating film (10) formed on the corner portions (25c) of the bus bar body (25) have R shapes. In addition, the film thickness of the insulating film (10) formed on the corner portions (25c) of the bus bar body (25) is greater than the film thickness of the insulating film (10) formed on the main surface portions (25a) of the bus bar body (25).
A wiring substrate includes insulating layers including a first insulating layer and a second insulating layer, conductive layers including a first conductive layer including a pad and a second conductive layer, a coating film covering the first conductive layer including the pad and improving adhesion between the first conductive layer and the second insulating layer, and a via conductor formed in a through hole penetrating through the second insulating layer and the coating film on the pad and connecting the pad and the second conductive layer. The pad has a surface formed such that a root mean square roughness of the surface is in a range of 0.10 μm to 0.23 μm, and a peeling part is formed between the pad and the second insulating layer such that the peeling part is formed within 15 μm around an outer edge of the through hole on the surface of the pad.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
20.
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Provided are a coil substrate, a coil substrate for a motor, and a motor with which it is possible to maintain a circular shape of a cross-section of the coil substrate even when the density of the coil wiring is increased, or the size of the coil substrate is reduced. The coil substrate according to an embodiment comprises a flexible substrate, a coil that is a first wiring on a first surface of the flexible substrate, and a coil that is a second wiring on a second surface of the flexible substrate. The coil that is the first wiring and the coil that is the second wiring are arranged with a plurality of coils arranged from a first side to a second side of the flexible substrate. The flexible substrate includes a first region near one end, a second region adjacent to the other end side of the first region, and a third region that is positioned near the other end and adjacent to the other end side of the second region. A first insulating layer is formed on the first surface and a second insulating layer is formed on the second surface. In the first region, the first insulating layer is not formed, while the second insulating layer is formed. In the second region, the first insulating layer and the second insulating layer are formed.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
A thermal insulation sheet containing a thermal insulation material containing inorganic particles and a resin film covering at least a part of a surface of the thermal insulation material. A method for producing the thermal insulation sheet, including: molding a material for a thermal insulation material containing the inorganic particles into a sheet shape; and coating the surface of the thermal insulation material molded into the sheet shape with the resin film forming composition by a screen printing method or a spray coat printing method to form the resin film.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/293 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
A wiring substrate includes a core substrate having a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer. The via conductor electrically connects the through-hole conductor and conductor layer. The via conductor includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate and has a through hole penetrating through the glass substrate. The through-hole conductor is formed in the through hole. The seed layer is covering inner wall surface of the insulating layer in opening in which the via conductor is formed. The seed layer has a first portion and a second portion electrically connected to the first portion. That part of the first portion is formed on the second portion.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The minimum wiring width in the first conductor layers is smaller than the minimum wiring width in the second conductor layers. The minimum inter-wiring distance in the first conductor layers is smaller than the minimum inter-wiring distance in the second conductor layers. Each first conductor layer and each via conductor include first and second layers. The first layer includes a first portion covering respective surface of the first insulating layers, a second portion covering inner wall surface in respective via opening in the first insulating layers, and a third portion covering bottom surface in the respective via opening. The thickness of the first portion is larger than the thickness of the second portion and larger than the thickness of the third portion.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part including an insulating layer and a conductor layer. The minimum wiring width of wirings in the conductor layer of the first build-up part is smaller than the minimum wiring width of wirings in the conductor layer of the second build-up part. The minimum inter-wiring distance of the wirings in the first part is smaller than the minimum inter-wiring distance of the wirings in the second part. The first build-up part is formed such that the conductor layer includes a conductor pattern including a first metal layer, a second metal layer, and a third metal layer. The width of the first metal layer is larger than the width of the second metal layer. The width of the third metal layer is larger than the width of the first metal layer.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
25.
METHOD OF PRODUCING INORGANIC FIBER MAT AND INORGANIC FIBER MAT
Provided is a method of producing an inorganic fiber mat, the method including: a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat; a defibrating step of defibrating the first inorganic fiber molding to obtain defibrated inorganic fibers; and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes caractérisés par la méthode de formation des voiles ou couches, p.ex. par la réorientation des fibres les fibres étant disposées au hasard
D21B 1/12 - Matières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p.ex. fibres par l'emploi de vapeur
26.
SHEET FORMATION MAT AND METHOD FOR MANUFACTURING SHEET FORMATION MAT
Provided is a sheet formation mat having sufficiently high surface pressure. This sheet formation mat is composed of inorganic fibers. The sheet formation mat is characterized: by comprising fiber bundles formed by interlacing 10 or more of the inorganic fibers so as to be twisted, as well as the inorganic fibers which do not constitute the fiber bundles. The papermaking mat is also characterized in that: the average length of the fiber bundles is 5-15 mm; the average width of the fiber bundles is 0.2-1.0 mm; the fiber bundles include fiber bundles in a wavy state; and a traced length of the fiber bundles in a wavy state measured by the following traced length measuring method is longer than the length of the fiber bundles in a wavy state by 0.1 mm or more. Traced length measuring method: A fiber bundle in a wavy state is statically placed on a flat surface. When the statically-placed fiber bundle in a wavy state is viewed from above, one end part to another end part of the fiber bundle in a wavy state is traced along the fiber bundle in a wavy state, and the traced distance is set as "the traced length of the fiber bundle in a wavy state".
D04H 1/58 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles par application, incorporation ou activation de liages chimiques ou thermoplastiques, p.ex. adhésifs
D06M 11/45 - Oxydes ou hydroxydes d'éléments des groupes 3 ou 13 de la classification périodique; Aluminates
D06M 11/79 - Traitement des fibres, fils, filés, tissus ou des articles fibreux faits de ces matières, avec des substances inorganiques ou leurs complexes; Un tel traitement combiné avec un traitement mécanique, p.ex. mercerisage avec du silicium ou ses composés avec du dioxyde de silicium, des acides siliciques ou leurs sels
D06M 15/233 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'hydrocarbures, ou de leurs produits de réaction, p.ex. posthalogénés ou sulfochlorés aromatiques, p.ex. de styrène
D06M 15/244 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'hydrocarbures halogénés
D06M 15/263 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'acides carboxyliques non saturés; Leurs sels ou esters
D06M 15/327 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'alcools non saturés ou de leurs esters
D06M 15/693 - Traitement des fibres, fils, filés, tissus ou articles fibreux faits de ces matières, avec des composés macromoléculaires; Un tel traitement combiné avec un traitement mécanique avec du caoutchouc naturel ou synthétique ou leurs dérivés
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The first build-up part is laminated on the second build-up part. The minimum wiring width of wirings in the first conductor layers is smaller than the minimum wiring width of wirings in the second conductor layers. The minimum inter-wiring distance of the wirings in the first conductor layers is smaller than the minimum inter-wiring distance of the wirings in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer. The first layer of each via conductor is covering inner wall surface in a via opening and has a first portion and a second portion. The first portion has a portion formed closer to the center of the via opening than the second portion.
A thermal insulation material having carbon fibers, the thermal insulation material containing; a covering layer containing pyrolytic carbon at a surface of the thermal insulation material; and a base layer containing carbon-based particles between the carbon fibers below the covering layer. A method for producing a thermal insulation material including: forming a base layer by impregnating a surface of a molded body containing carbon fibers with a slurry containing carbon-based particles; and forming a covering layer containing pyrolytic carbon on the base layer by applying a chemical vapor deposition method to the molded body in a CVD furnace.
Provided is a mat made by a papermaking process that is less likely to be cracked even when wound around a base material. A mat made by a papermaking process according to the present invention is composed of inorganic fibers, and has a first principal surface and a second principal surface facing the first principal surface. A plurality of linear protrusions are formed on the first principal surface. The protrusions are oriented in one direction in the plane direction of the first principal surface in a plan view of the mat made by a papermaking process. The protrusions have an average length of 5 to 200 mm, an average width of 1 to 50 mm, and an average height of 0.05 to 0.50 mm. At least five protrusions are formed in an arbitrary area of 10 cm by 10 cm in length and breadth on the first principal surface. The protrusions each include a fiber bundle formed by a plurality of fibers interlaced in a twisted manner.
D21H 13/40 - Fibres ou flocons inorganiques siliceux vitreux, p.ex. laine minérale ou fibres de verre
D21H 15/02 - Pâte ou papier comprenant des fibres ou des matériaux formant des nappes caractérisés autrement que par leur constitution chimique caractérisés par leur configuration
Provided is a mat made by a papermaking process, the mat being less likely to have cracks even when wound around a base material, and having a sufficiently high surface pressure. The mat made by a papermaking process is configured from inorganic fibers, and is characterized by comprising a fiber bundle formed by interlacing 10 or more of the inorganic fibers in a twisted manner, and the inorganic fibers that do not constitute the fiber bundle, wherein: the average length of the fiber bundle exceeds 5 mm; and, when the mat made by a papermaking process is opened by a method indicated below for opening the mat made by a papermaking process, and a slurry including the inorganic fibers is obtained, an underwater bulk specific gravity of the inorganic fibers included in the slurry is 0.012 to 0.035 g/cm3. A method for opening the mat made by a papermaking process: Heat-treat the mat made by a papermaking process at 600°C for 1 hour. Weigh out 5.0 grams of fibers from the mat made by a papermaking process while disentangling the fibers, and put the fibers into a container containing 400 cc of water. After stirring at a speed of 1000 rpm for 10 minutes, transfer the mixture to a measuring cylinder and add water until the total capacity is 500 cc. Let the mixture stand for 30 minutes, read the height of the settled fibers, and calculate the underwater bulk specific gravity by using the following formula (1). (1): Underwater bulk specific gravity (g/cm3) = 5.0 (g)/sedimentation volume of fibers (cm3)
C04B 38/00 - Mortiers, béton, pierre artificielle ou articles de céramiques poreux; Leur préparation
D06M 11/45 - Oxydes ou hydroxydes d'éléments des groupes 3 ou 13 de la classification périodique; Aluminates
D06M 11/79 - Traitement des fibres, fils, filés, tissus ou des articles fibreux faits de ces matières, avec des substances inorganiques ou leurs complexes; Un tel traitement combiné avec un traitement mécanique, p.ex. mercerisage avec du silicium ou ses composés avec du dioxyde de silicium, des acides siliciques ou leurs sels
D06M 15/233 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'hydrocarbures, ou de leurs produits de réaction, p.ex. posthalogénés ou sulfochlorés aromatiques, p.ex. de styrène
D06M 15/263 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'acides carboxyliques non saturés; Leurs sels ou esters
D06M 15/333 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'alcools non saturés ou de leurs esters d'acétate de vinyle; Alcool polyvinylique
D06M 15/693 - Traitement des fibres, fils, filés, tissus ou articles fibreux faits de ces matières, avec des composés macromoléculaires; Un tel traitement combiné avec un traitement mécanique avec du caoutchouc naturel ou synthétique ou leurs dérivés
31.
METHOD OF PRODUCING INORGANIC FIBER MAT AND INORGANIC FIBER MAT
Provided is a method of producing an inorganic fiber mat the method including: a preparing step of preparing a first inorganic fiber molding derived from a needle-punched mat and a second inorganic fiber molding derived from a papermaking mat; a defibrating step of defibrating the first inorganic fiber molding and the second inorganic fiber molding to obtain defibrated inorganic fibers; and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/70 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes caractérisés par la méthode de formation des voiles ou couches, p.ex. par la réorientation des fibres
D04H 1/46 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles les voiles ou couches étant renforcées par des moyens mécaniques, p.ex. par roulage par aiguilletage ou opérations similaires pour provoquer l'enchevêtrement des fibres
D21B 1/12 - Matières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p.ex. fibres par l'emploi de vapeur
32.
COVER PROTECTOR, METHOD FOR MANUFACTURING COVER PROTECTOR, AND BATTERY MODULE
Provided are a cover protector that can protect a heat insulating material from scattered objects and can further improve heat insulation performance, a method for manufacturing the cover protector, and a battery module. A cover protector (1) comprises: a heat insulating material (2) containing inorganic particles; an inorganic fiber sheet (3); and an adhesive layer (4) that joins the heat insulating material (2) and the inorganic fiber sheet (3), and contains an organic material. When viewed in the lamination direction of the heat insulating material (2) and the inorganic fiber sheet (3), the adhesive layer (4) has a plurality of island-shaped parts (5) and a mesh-shaped part (6) that connects the island-shaped parts (5) to each other.
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
Provided are: a cover protector and a method for manufacturing same, capable of enhancing adhesiveness between a heat insulating material and a prescribed surface such as an inner wall surface of a battery case; and a battery module. A cover protector (10) includes: a heat insulating material (1) containing first organic fibers (3); and an organic film (2) bonded to at least a portion of a surface of the heat insulating material (1). At least a portion of the first organic fibers (3) protrudes from the surface of the heat insulating material (1). A battery module (100) includes: the cover protector (10); a storage battery (110); and a battery case (120) that accommodates the cover protector (10) and the storage battery (110).
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
This heat insulation material for a combustion chamber is a plate-like molding including inorganic fibers, the heat insulation material being characterized in that when the bulk densities of a first main surface part, a second main surface part, and a central part between the first main surface part and the second main surface part in the thickness direction are compared, at least the bulk density of the first main surface part is smaller than the bulk density of the central part, and the first main surface part is arranged toward the inner wall surface of the combustion chamber.
F24H 1/12 - Chauffe-eau instantanés, c. à d. dans lesquels il n'y a production de chaleur que lorsque l'eau s'écoule, p.ex. avec contact direct de l'eau avec l'agent chauffant dans lesquels l'eau est maintenue séparée de l'agent chauffant
35.
HEAT TRANSFER SUPPRESSING SHEET, METHOD FOR MANUFACTURING SAME, AND BATTERY MODULE
Provided are: a heat transfer suppressing sheet which has a multilayer structure and has a more outstanding heat insulating effect and flame retarding effect, in addition to which the multilayer structure can be maintained even when exposed to a high heat or a flame from a battery cell that has undergone thermal runaway; and a battery module that is provided with the heat transfer suppressing sheet and that is extremely safe. In a heat transfer suppressing sheet (A1), a laminated body including a heat insulating material (A10) and an inorganic sheet (A20) is sewn together using a sewing thread (A30) that has a melting point lower than that of inorganic fibers of the inorganic sheet (A20), and that is preferably thinner than openings of the inorganic sheet (A20), and a battery module (A100) accommodates storage batteries (A110) in a battery case (A120), the heat transfer suppressing sheet (A1) being disposed between the storage batteries (A110), and/or the top of the battery case (A120), and/or a side wall of the battery case (A120), and/or the bottom wall of the battery case (A120).
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 10/659 - Moyens de commande de la température associés de façon structurelle avec les éléments par stockage de la chaleur ou chaleur tampon, p.ex. capacité calorifique, changements ou transitions de phase liquide-solide
36.
HEAT TRANSFER SUPPRESSION SHEET, METHOD FOR PRODUCING SAME, AND BATTERY PACK
The present invention provides: a heat transfer suppression sheet which has excellent thermal insulation performance; a method for producing this heat transfer suppression sheet; and a battery pack which comprises this heat transfer suppression sheet. This heat transfer suppression sheet (10) contains dry silica particles (1), while having pores (2) inside. The dry silica particles (1) have an average primary particle diameter of 25 nm or less, and the total volume of pores having a mode diameter of 68 nm or less is 10% or more with respect to the total volume of the pores. This method for producing a heat transfer suppression sheet (10) has a processing step in which a material mixture containing dry silica particles (1) is processed into a sheet shape by a dry method. The dry silica particles (1) have an average primary particle diameter of 25 nm or less.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p.ex. rapports, tailles ou concentrations
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
Provided is a heat transfer suppression sheet with which heat insulation properties can be further improved, damage caused by scattered matter during thermal runaway can be suppressed, and the heat insulation properties can be maintained. Also provided is a battery pack having this heat transfer suppression sheet. A heat transfer suppression sheet (50) includes: a heat insulation material (10) having inorganic particles (4), and organic fibers (1) or inorganic fibers (15); and a mica sheet (51) laminated on at least one of a first surface (10a) and a second surface (10b), which are orthogonal to the thickness direction of the heat insulation material (10). Meanwhile, a battery pack (100) has a plurality of battery cells (20a, 20b, 20c) and the heat transfer suppression sheet (50), and the plurality of battery cells (20a, 20b, 20c) are connected in series or in parallel.
H01M 10/653 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des matériaux électriquement isolants ou thermiquement conducteurs
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
An assembled battery in which a plurality of battery cells is connected serially or in parallel, the battery cells each having an electrode surface having an electrode and a peripheral surface orthogonal to the electrode surface and being disposed such that the peripheral surfaces face each other. The assembled battery contains the battery cells, an insulating material covering the peripheral surface of the battery cells, and a heat dissipation member covering the peripheral surface of the battery cells which is covered with the insulating material. The insulating material has a plurality of holes piercing the insulating material from a surface thereof facing the battery cells to a surface thereof facing the heat dissipation member.
H01M 10/6551 - Surfaces spécialement adaptées à la dissipation de la chaleur ou à la radiation, p.ex. nervures ou revêtements
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/653 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des matériaux électriquement isolants ou thermiquement conducteurs
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
39.
HEAT TRANSFER SUPPRESSION SHEET, METHOD FOR PRODUCING SAME, AND BATTERY PACK
Provided is a heat transfer suppression sheet which is capable of suppressing the reduction of the service life of a battery by reducing unevenness of pressing force to a battery cell by an elastic sheet. This heat transfer suppression sheet (10) has a heat insulation material (11) that contains inorganic particles, an elastic sheet (12) that is superposed on the heat insulation material (11), and a resin film (13) that covers the heat insulation material (11) and the elastic sheet (12). The heat insulating material (11) has a pair of heat insulating material main surfaces (11a) that are orthogonal to the thickness direction, and the elastic sheet (12) has a pair of elastic sheet main surfaces (12a) that are orthogonal to the thickness direction, and a plurality of elastic sheet end surfaces (12b) that connect the pair of elastic sheet main surfaces (12a). In addition, the heat insulating material (11) and the elastic sheet (12) are superposed upon each other in such a manner that a heat insulating material main surface (11a) and an elastic sheet main surface (12a) face each other. Furthermore, at least one end surface among the plurality of elastic sheet end surfaces (12b) is inclined further inward with the distance from the heat insulating material (11) by being pressed by the resin film (13).
H01M 50/293 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/291 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
A wiring substrate includes a core substrate including a through-hole conductor, a first resin insulating layer, a first conductor layer including a seed layer and an electrolytic plating layer, a via conductor formed such that the via conductor electrically connects the through-hole conductor and first conductor layer, and a second resin insulating layer covering the first conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is penetrating through the glass substrate, the seed layer includes a first layer formed on the first resin insulating layer and a second layer formed on the first layer, and the first conductor layer includes a conductor circuit such that a width of the first layer is larger than a width of the second layer in the conductor circuit and a width of the electrolytic plating layer is larger than the width of the first layer in the conductor circuit.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
The present invention suppresses a connection loss between an electronic component and a photoelectric component, and a reduction in data speed caused by the connection loss between the electronic component and the photoelectric component. A wiring board (1) according to an embodiment of the present invention comprises: a first component mounting region (A1) on a component mounting surface (1a); a photoelectric component mounting region (A0); and optical wiring (31) that can be optically connected to a photoelectric component (E0). A recess (20) is formed in the component mounting surface (1a) of the wiring board (1). The first component mounting region (A1) is provided in the recess (20). The first component mounting region (A1) at least partially overlaps the photoelectric component mounting region (A0) in a plan view.
A flameproof sheet for use in an assembled battery in which a plurality of battery cells is connected serially or in parallel, the battery cells each having an electrode surface having an electrode and a peripheral surface orthogonal to the electrode surface and being disposed such that the peripheral surfaces face each other. The flameproof sheet contains a pair of flameproof materials and an elastic member disposed between the pair of flameproof materials.
H01M 50/383 - Moyens pare-flammes ou moyens de prévention de l’allumage
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p.ex. ronde ou elliptique
H01M 50/291 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
H01M 50/293 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first and second conductor layers and has a land portion extending on a boundary part of the resin insulating layer. The via conductor is formed in a via hole formed in the resin insulating layer. The resin insulating layer is formed such that the boundary part has a surface roughness that is larger than a surface roughness of the surface on which the second conductor layer formed and that an inner wall surface in the via hole in the resin insulating layer is equal to or larger than the surface roughness of the boundary part of the resin insulating layer.
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor formed in the glass substrate, a resin insulating layer formed on the core substrate and including resin and inorganic particles, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer such that the via conductor is electrically connected to the through-hole conductor formed in the glass substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The conductor layer and the via conductor are formed such that the seed layer is formed by sputtering, and the resin insulating layer has an opening in which the via conductor is formed such that the inorganic particles include first particles forming an inner wall surface in the opening and second particles embedded in the insulating layer.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A wiring substrate includes a core substrate including a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor formed in the resin insulating layer such that the via conductor is connected to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is formed in a through hole penetrating through the glass substrate, and the conductor layer and via conductor are formed such that the seed layer is formed by sputtering and includes an alloy including copper, aluminum, and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
46.
INSULATION FILM AND METHOD FOR FORMING SAME, AND COMPOSITE MEMBER
Provided is an insulation film which exhibits excellent heat resistance in addition to insulating properties, which does not require a winding operation such as using ceramic tape, which does not exhibit problems such as uneven winding and gaps being generated and peeling off of the film, and which can also easily be adapted to conductive base materials having complex shapes. In an insulation film (1), at least an inorganic material (20) is dispersed in a first matrix (10) comprising silicone. Further, a material of the first matrix (10) or a material of a second matrix of a different component than the first matrix (10) may be impregnated. The insulation film (1) is formed by, for example, dip coating.
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
C09D 7/61 - Adjuvants non macromoléculaires inorganiques
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p.ex. les contacts incorrects des bornes ou des barres omnibus
Provided is a bus bar which does not require wrapping work such as ceramic tape, which does not cause problems such as the occurrence of wrapping inconsistencies, gaps, and peeling, which can be easily applied to complex shapes, and which can be simply manufactured. A bus bar (20) is used in an electric power storage device that includes a battery cell, and includes: a bus bar body (25) including a plurality of flat portions (5a, 5c, 5e), and corner portions (5d, 5b) formed between adjacent flat portions and extending linearly; and an insulating film (10) formed on the surface of the bus bar body (25). The thickness of the insulating film formed on the corner portions (5d, 5e) of the bus bar body (25) is less than the thickness of the insulating film formed on the flat portions (5a, 5c, 5e) of the bus bar body (25).
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
The present invention provides: a bus bar which is capable of stably ensuring insulation properties; a method for producing a bus bar; and an electric power storage device. A bus bar (1) which is used for an electric power storage device that comprises a battery cell is formed by covering a bus bar main body (5) containing a conductive material with an insulating coating film (10). A corner part (7) of the bus bar main body (5) is rounded. A method for producing the bus bar (1) comprises: a step for rounding a corner part of a bus bar main body (5) that contains a conductive material; and a step for forming an insulating coating film (10) by applying an insulating coating material to the bus bar main body (5) and subsequently curing the insulating coating material. An electric power storage device according to the present invention is obtained by connecting a plurality of battery cells or battery modules by means of the bus bar.
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p.ex. les contacts incorrects des bornes ou des barres omnibus
Provided are: a bus bar which can stably ensure insulation properties and can be protected from high temperature or flame caused by the occurrence of abnormalities in a battery cell; and a manufacturing method for a bus bar. This bus bar (1) has: a bus bar body (5) containing a conductive material; and a heat-resistant insulating film (10) containing a filler and covering the bus bar body, wherein the surface roughness (Ry) of the heat-resistant insulating film (10) satisfies 0
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p.ex. les contacts incorrects des bornes ou des barres omnibus
The present invention provides a bus bar which can be produced at a low cost and is capable of stably ensuring insulation properties. A bus bar (1a), which is used for an electric power storage device that comprises a battery cell, comprises: a bus bar main body (25) that contains a conductive material and has a plurality of main surfaces (a first main surface (25a) and a second main surface (25b)) that are perpendicular to a plate thickness direction (27); and an insulating film (26) that covers the bus bar main body (25). Among the plurality of main surfaces of the bus bar main body (25), the first main surface (25a) has a first region (21) in which the insulating film (26) formed on the first main surface (25a) has the maximum film thickness T1max, and a second region (22) in which the insulating film (26) formed on the first main surface (25a) has the minimum film thickness T1min. The ratio (T1max/T1min) of the maximum film thickness T1max to the minimum film thickness T1min is more than 1.0 but not more than 7.0.
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.
A printed wiring board includes a first conductor layer, a resin insulating layer including resin and inorganic particles, a second conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and via conductor are formed such that the seed layer includes an alloy including copper, aluminum and a metal including one or more metals selected from nickel, zinc, gallium, silicon and magnesium, and the resin insulating layer is formed such that the inorganic particles include first inorganic particles forming an inner wall surface in the opening and second inorganic particles embedded in the resin insulating layer and that shapes of the first inorganic particles are different from shapes of the second inorganic particles.
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and the second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and via conductor are formed such that the seed layer includes a first layer including copper, aluminum and one or more metals selected from nickel, zinc, gallium, silicon and magnesium, and a second layer formed on the first layer and including copper. The seed layer in the via conductor has a first portion and a second portion such that the first portion is electrically connected to the second portion and has a portion formed on the second portion.
Provided are a coil substrate with which a high-performance motor can be obtained, a motor coil substrate that is formed using the coil substrate, and a motor that is formed using the motor coil substrate. A coil substrate according to the present invention comprises a flexible substrate having a first surface and a second surface on the side opposite the first surface, a coil formed by wiring provided to at least one of the first surface and the second surface, and a resin insulation layer that covers the wiring. The wiring has a first layer and a second layer covering the outer surface of the first layer. The wiring width is 60-400 µm, and the wiring thickness is 20-200 µm.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
A wiring substrate includes a core substrate including a glass substrate, a resin insulating layer including inorganic particles and resin, a conductor layer including a seed layer and an electrolytic plating layer such that the conductor layer includes signal wirings, and a via conductor formed in an opening formed in the resin insulating layer and including the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a through-hole conductor formed such that the core substrate has a through hole penetrating through the glass substrate and the through-hole conductor is formed in the through hole, the via conductor is electrically connected to the through-hole conductor formed in the core substrate, and the resin insulating layer is formed such that the surface upon which the conductor layer is formed includes the resin and an inner wall surface in the opening includes the resin and inorganic particles.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
Provided are: a coil substrate yielding a high-performance motor; a motor coil substrate that is formed by using the coil substrate; and a motor that is formed by using the motor coil substrate. This coil substrate has: a flexible substrate comprising a first surface and a second surface on the side opposite the first surface; a coil formed of a wiring provided to the first surface and/or the second surface; and a resin insulating layer covering the wiring. The wiring has a first layer, and a second layer coating the outer surface of the first layer. The second layer has a first portion coating the upper surface of the first layer, and a second portion coating the side surface of the first layer. The width of the wiring is 60 to 400 μm. The ratio T1/T2 of the thickness T1 of the first portion and the thickness T2 of the second portion satisfies relational expression 1. Expression 1: 1.0 < T1/T2 ≤ 1.4
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part formed on a surface of the electrical wiring part and including a support plate and an optical waveguide formed on the support plate. The optical wiring part is formed such that the optical waveguide includes at least one core part that transmits light and a cladding part surrounding the at least one core part and that the support plate has a thermal expansion coefficient that is lower than a thermal expansion coefficient of the optical waveguide.
G02B 6/122 - Elements optiques de base, p.ex. voies de guidage de la lumière
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
A printed wiring board includes a first conductor layer, a resin insulating layer including glass particles and resin, a second conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and the via conductor are formed such that the second conductor layer includes signal wirings and that the seed layer is formed by sputtering an alloy including copper, aluminum, and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium, and the resin insulating layer is formed such that the surface of the resin insulating layer includes the resin and that an inner wall surface in the opening includes the resin and the glass particles.
The purpose of the present invention is to provide a penetration enhancer and an agricultural composition that can promote the penetration of organic substances into plant tissues. A penetration enhancer for organic substances in plants, comprising at least one compound selected from oxo fatty acids, derivatives thereof, or salts thereof, and hydroxylated fatty acids, derivatives thereof, or salts thereof. An agricultural composition comprising: (a) at least one compound selected from oxo fatty acids, derivatives thereof, or salts thereof; and hydroxylated fatty acids, derivatives thereof, or salts thereof; and (b) an organic substance for at least one type of plant.
A01N 25/00 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, caractérisés par leurs formes, ingrédients inactifs ou modes d'application; Substances réduisant les effets nocifs des ingrédients actifs vis-à-vis d'organismes autres que les animaux nuisibles
A01N 27/00 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des hydrocarbures
A01N 37/44 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un contenant au moins un groupe carboxylique ou un thio-analogue, ou un de leurs dérivés, et un atome d'azote lié au même squelette carboné par une liaison simple ou double, cet atome d'azote ne faisant pas partie d'un dérivé ou d'un thio-analogue d'un
A01N 57/12 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques du phosphore comportant des liaisons phosphore-oxygène ou des liaisons phosphore-soufre contenant des radicaux acycliques ou cycloaliphatiques
A01N 57/16 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques du phosphore comportant des liaisons phosphore-oxygène ou des liaisons phosphore-soufre contenant des radicaux hétérocycliques
A01P 21/00 - Régulateurs de croissance des végétaux
A01N 37/36 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un contenant au moins un groupe carboxylique ou un thio-analogue, ou d'un de leurs dérivés, et un atome d'oxygène ou de soufre lié par une liaison simple, liés au même squelette carboné, cet atome d'oxygène ou de soufre ne faisant pas partie d'un groupe
A01N 37/42 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un contenant dans le même squelette carboné un groupe carboxylique ou un thio-analogue, ou un de leurs dérivés, et un atome de carbone ne comportant que deux liaisons à des hétéro-atomes, avec au plus une liaison à un halogène, p.ex. acides cétocarboxyl
60.
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, bumps including a first bump and a second bump such that the first bump is formed on the first conductor pad of the conductor layer and that the second bump is formed on the second conductor pad of the conductor layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.
A printed wiring board includes a first conductor layer, a resin insulating layer including inorganic particles and resin, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The inorganic particles include first particles, second particles, third particles and fourth particles formed such that the first and second particles are solid particles, the third and fourth particles are hollow particles, the first and third particles form an inner wall surface of the opening in the resin insulating layer, the second and fourth particles are embedded in the resin insulating layer, the first particles have shapes that are different from shapes of the second particles, and the third particles have shapes that are different from shapes of the fourth particles.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A printed wiring board includes a conductor layer, an outermost insulating layer formed on the conductor layer and having an opening exposing a portion of the conductor layer, and a metal post formed in the opening of the outermost insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer such that the metal post has a height exceeding a surface of the outermost insulating layer and has a portion exceeding a height of the outermost insulating layer, the seed layer of the metal post has a first layer and a second layer formed on the first layer. The portion exceeding the height of the outermost insulating layer is formed such that a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer.
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
63.
ANTIVIRAL SUBSTRATE, ANTIVIRAL COMPOSITION, METHOD FOR MANUFACTURING ANTIVIRAL SUBSTRATE, ANTIMICROBIAL SUBSTRATE, ANTIMICROBIAL COMPOSITION AND METHOD FOR MANUFACTURING ANTIMICROBIAL SUBSTRATE
In an antimicrobial substrate, a cured material of a binder containing a copper compound and a polymerization initiator is fixed onto a surface of a base material. At least a part of the copper compound is exposed on a surface of the cured material of the binder. A surface composition ratio of the cured material of the binder obtained by an energy dispersive X-ray analyzer is calculated on a basis of a peak intensity of a characteristic X-ray of a carbon element and a copper element that are a main constituent element of a resin component, and a weight ratio is C/Cu=28.0/1.0 to 200.0/1.0.
C08F 2/20 - Polymérisation en suspension utilisant des agents de dispersion macromoléculaires
C08F 2/48 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible
C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
A wiring substrate includes an insulating layer, a conductor pad that is formed on a surface of the insulating layer and is connected to a component such that the insulating layer has a component region that is covered by the component connected to the conductor pad, and an optical waveguide including a core part that transmits light and is positioned on an outer side of the component region of the insulating layer such that the core part has an end surface exposed and facing a component region side. The optical waveguide is positioned such that the end surface of the core part is adjacent to the component region.
G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
A wiring substrate includes a first insulating layer, a first conductive layer laminated on a surface of the first insulating layer and including pads, a second insulating layer laminated on the first insulating layer such that the second insulating layer is covering the first conductive layer and has a cavity exposing the pads of the first conductive layer, an electronic component accommodated in the cavity of the second insulating layer such that the electronic component has electrodes formed on a surface of the electronic component, and a conductive connecting part formed between the electrodes of the electronic components and the pads of the first conductive layer in the cavity of the second insulating layer such that the conductive connecting part electrically connects the electrodes of the electronic components and the pads of the first conductive layer.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
The objective of the invention is to provide a plant activator having a resistance to the wash-off and a superior handleability, transportability and storage stability. A powdery plant activator comprising, at least one compound selected from an oxo fatty acid or a derivative or a salt thereof and a hydroxy fatty acid or a derivative or a salt thereof, and an unsaturated fatty acid (excluding an oxo fatty acid and a hydroxy fatty acid).
A01N 37/36 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un contenant au moins un groupe carboxylique ou un thio-analogue, ou d'un de leurs dérivés, et un atome d'oxygène ou de soufre lié par une liaison simple, liés au même squelette carboné, cet atome d'oxygène ou de soufre ne faisant pas partie d'un groupe
A01N 37/42 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un contenant dans le même squelette carboné un groupe carboxylique ou un thio-analogue, ou un de leurs dérivés, et un atome de carbone ne comportant que deux liaisons à des hétéro-atomes, avec au plus une liaison à un halogène, p.ex. acides cétocarboxyl
A01P 21/00 - Régulateurs de croissance des végétaux
A printed wiring board includes a first conductor layer, a resin insulating layer, a second conductor layer, and a via conductor formed in an opening of the insulating layer and connecting the first conductor and second conductor layers. The second conductor layer and via conductor include a seed layer having a first portion formed on the surface of the insulating layer, a second portion formed on an inner wall surface in the opening, and a third portion formed on a portion of the first conductor layer exposed by the opening. A thickness of the first portion is greater than a thickness of the second portion and a thickness of the third portion. The seed layer includes a first layer including an alloy including copper, aluminum and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium, and a second layer formed on the first layer and including copper.
H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
68.
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
A wiring substrate includes a core substrate having a cavity penetrating through the substrate, an electronic component accommodated in the cavity such that the component is positioned closer to a first surface of the substrate than a second surface of the substrate, a sealing resin filling the cavity of the substrate such that the sealing resin is covering a surface of the component on a second surface side of the substrate and that the cavity of the substrate has a portion not filled with the sealing resin on the second surface side of the substrate, and resin insulating layers including a first resin insulating layer laminated on the first surface of the substrate and a second resin insulating layer laminated on the second surface of the substrate such that a portion of the second resin insulating layer is filling the portion of the cavity not filled with the sealing resin.
H05K 3/44 - Fabrication de circuits à âme métallique isolée
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/28 - Application de revêtements de protection non métalliques
A wiring substrate includes a first build-up part including first insulating layers and conductor layers, a second build-up part laminated to the first part and including second insulating layers and conductor layers, and via conductors including first via conductors in the first insulating layers and second via conductors in the second insulating layers. The first part is positioned closer to first surface side of the substrate than the second part. The first conductor layers include wirings having wiring width and inter-wiring distance that are smaller than wiring width and inter-wiring distance of wirings in the second conductor layers. The first insulating layers include resin and inorganic particles including first particles forming inner wall surfaces in through holes and second particles embedded in the first insulating layers having different shapes from the first particles. Each first conductor layers and via conductors includes a metal film layer and a plating film layer.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
The present invention improves the coupling efficiency between an optical component and optical wiring of a wiring board, and facilitates the mounting of the optical component. A wiring board (1) according to an embodiment comprises: an electric wiring unit (2) that includes an insulating layer and a conductor layer; an optical wiring area (A2) that is provided on one surface (2a) of the electric wiring unit (2); and a component area (A1) provided on the one surface (2a) of the electric wiring unit (2) and capable of having a component (E1) disposed thereon. The support member (7) is formed on the one surface (2a) of the electric wiring part (2) and is disposed so as to span the optical wiring area (A2) and the component area (A1).
The present invention improves the coupling efficiency between an optical component and optical wiring of a wiring board, and facilitates the mounting of the optical component. A wiring board (1) according to an embodiment comprises: an electric wiring unit (2) that includes an insulating layer and a conductor layer; an optical wiring area (A2) that is provided on one surface (2a) of the electric wiring unit (2); and a component area (A1) provided on the one surface (2a) of the electric wiring unit (2) and capable of having a component (E1) disposed thereon. Optical wiring (5) is disposed on the optical wiring region (A2), and a support substrate (6) is disposed on the optical wiring (5).
A wiring substrate includes a first wiring part including a first insulating layer and a first conductor layer laminated on the first insulating layer, and a second wiring part formed on the first part and including a second insulating layer and a second conductor layer laminated on the second insulating layer. The thickness of the second insulating layer is smaller than that of the first insulating layer. The thickness of the second conductor layer is smaller than that of the first conductor layer. The first conductor layer has a surface on the opposite side with respect to the first insulating layer such that the arithmetic mean roughness of the surface is smaller than that of a surface of the second conductor layer on the opposite side with respect to the second insulating layer. The second part is positioned closer to the outermost surface of the substrate than the first part.
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
A wiring substrate includes a first wiring part including a first insulating layer and a first conductor layer laminated on the first insulating layer, and a second wiring part including a second insulating layer and a second conductor layer laminated on the second insulating layer. The thickness of the second insulating layer is smaller than that of the first insulating layer. The thickness of the second conductor layer is smaller than that of the first conductor layer. The first conductor layer includes first wirings including differential wirings having the minimum wiring width of larger than 5 μm and minimum inter-wiring distance of larger than 7 μm. The second conductor layer includes second wirings having the maximum wiring width of 5 μm or less and the maximum inter-wiring distance of 7 μm or less. The second part is positioned closer to the outermost surface of the substrate than the first part.
A method for manufacturing a wiring substrate includes forming first conductor pads and second conductor pads having a shorter inter-pad distance than the first conductor pads, forming a second insulating layer covering the first conductor pads and the second conductor pads, forming first via holes exposing the first conductor pads, applying a first desmear treatment such that residues are removed from the first via holes, forming second via holes in the second insulating layer after the first desmear treatment such that the second via holes expose the second conductor pads, applying a second desmear treatment such that residues are removed from the second via holes, forming first via conductors in the first via holes such that the first via conductors are formed on the first conductor pads, and forming second via conductors in the second via holes such that the second via conductor are formed on the second conductor pads.
A method for manufacturing a wiring substrate includes forming conductor pads on a surface of an insulating layer, positioning, on or in the insulating layer, an electronic component having electrode pads, forming a second insulating layer covering the surface of the insulating layer, conductor pads and electronic component, forming first via holes exposing the conductor pads, applying a first desmear treatment to the second insulating layer such that residues are removed from the first via holes, forming second via holes in the second insulating layer after the first desmear treatment such that the second via holes expose the electrode pads of the electronic component positioned on or in the insulating layer, applying a second desmear treatment to the second insulating layer such that residues are removed from the second via holes, forming first via conductors in the first via holes, and forming second via conductors in the second via holes.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/498 - Connexions électriques sur des substrats isolants
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer and including a signal wiring, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer has an opening such that the opening is exposing a portion of the first conductor layer and that the via conductor is formed in the opening of the resin insulating layer, and the resin insulating layer includes inorganic particles and resin such that the resin is forming the surface of the resin insulating layer.
The objective of the invention is to provide an agent for increasing a plant functional component content, which is capable of increasing a content of the plant functional component by being adequately sprayed to the plant or injected into the soil without using stress cultivation conditions or plants with high content of functional component, and a method for manufacturing the same. An agent for increasing a plant functional component content comprising a fatty acid metabolite obtainable by a metabolism of a fatty acid with 4-30 carbon atoms by proteobacteria under a dissolved oxygen concentration of 0.1-8 mg/L, and a method for manufacturing an agent for increasing a plant functional component content comprising a fatty acid metabolite, comprising a step for a fatty acid metabolism wherein a fatty acid with 4-30 carbon atoms is subjected to a proteobacterial metabolization under a dissolved oxygen concentration of 0.1-8 mg/L.
A01G 7/06 - Traitement des arbres ou des plantes en cours de croissance, p.ex. pour prévenir la décomposition du bois, pour teinter les fleurs ou le bois, pour prolonger la vie des plantes
C05F 11/08 - Engrais organiques comportant l'addition de cultures bactériennes, de mycélium ou similaires
C12P 1/04 - Préparation de composés ou de compositions, non prévue dans les groupes , utilisant des micro-organismes ou des enzymes; Procédés généraux de préparation de composés ou de compositions utilisant des micro-organismes ou des enzymes utilisant des bactéries
A wiring substrate includes first conductor pads formed on a surface of an insulating layer, second conductor pads formed on the surface of the insulating layer, a second insulating layer covering the surface of the insulating layer and first and second conductor pads, first via conductors formed in first via holes penetrating through the second insulating layer such that the first via conductors are formed on the first conductor pads, and second via conductors formed in second via holes penetrating through the second insulating layer such that the second via conductors are formed on the second conductor pads. The first and second conductor pads are formed such that an annular width amount of each second conductor pad is smaller than an annular width amount of each first conductor pad and that a haloing amount in each second conductor pad is smaller than a haloing amount in each first conductor pad.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
Provided is a heat transfer suppression sheet in which even if an elastic sheet is pressed in the thickness direction thereof, excessive outward bulging of end surfaces parallel to the thickness direction can be suppressed, and a decrease in insulation performance due to a decrease in thickness can be suppressed. A heat transfer suppression sheet (10) has: an elastic sheet (11) having a pair of main surfaces (11a) orthogonal to the thickness direction and end surfaces (11b) substantially parallel to the thickness direction; and a bulge-suppressing sheet (12) continuously disposed at least along the end surfaces (11b). The tensile strength of the bulge-suppressing sheet (12) is preferably 20 MPa to 150 MPa, inclusive.
H01M 50/293 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
Provided is a heat transfer suppression sheet capable of suppressing particle fall-off and maintaining excellent heat insulating properties. A heat transfer suppression sheet (10) comprises: a heat-insulating material (11) including inorganic particles; a resin film (12) in which the heat-insulating material (11) is enclosed and which has a plurality of first holes (14); and a coating material (13) stacked on the resin film (12) and coating at least some of the plurality of first holes (14).
H01M 50/291 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
H01M 50/293 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
A coil substrate includes a flexible substrate, and a coil including a first wiring formed on a first surface of the flexible substrate and a second wiring formed on a second surface of the flexible substrate on the opposite side with respect to the first surface. The flexible substrate is formed to be wound around an axis extending in an orthogonal direction orthogonal to a longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape, and the coil is formed such that the first wiring has a first orthogonal part extending along the orthogonal direction, that the second wiring has a second orthogonal part extending along the orthogonal direction, and that at least one of the first orthogonal part and the second orthogonal part has at least one slit formed along the orthogonal direction.
A wiring substrate includes an insulating layer including a first layer and a second layer, and a conductor layer including a metal film formed on a surface of the second layer of the insulating layer such that the conductor layer includes a conductor pattern. The first layer includes resin and first inorganic particles, the second layer includes resin and second inorganic particles at the content rate that is lower than the content rate of the first inorganic particles in the first layer, and the thickness of the first layer is 90% or more of the thickness of the insulating layer. The second layer of the insulating layer includes a composite layer having the thickness in the range of 0.1 to 0.3 μm, and the composite layer includes part of the metal film in the conductor layer formed in gaps between the second inorganic particles and resin in the second layer.
A printed wiring board includes a base substrate, an electronic component accommodated in a cavity formed in the substrate, a resin insulating layer formed on the substrate such that the insulating layer is covering the electronic component, a conductor layer formed on the insulating layer, and via conductors formed in the insulating layer and each including a seed layer and an electrolytic plating layer formed on the seed layer such that the via conductors are connecting the conductor layer and electrodes of the electronic component. The insulating layer includes resin and inorganic particles and has via holes in which the via conductors is formed respectively such the inorganic particles include first inorganic particles having smooth surfaces and second inorganic particles embedded in the insulating layer and that an inner wall surface of each of the via holes includes the resin and the smooth surfaces of the first inorganic particles.
A wiring substrate includes a first build-up part including first insulating layers, first conductor layers formed on the first insulating layers, and first via conductors formed in the first insulating layers, and a second build-up part laminated to the first build-up part and including second insulating layers, second conductor layers formed on the second insulating layers, and second via conductors formed in the second insulating layers. A wiring width and an inter-wiring distance of wirings in the first conductor layers of the first build-up part are smaller than a wiring width and an inter-wiring distance of wirings in the second conductor layers of the second build-up part, and the first build-up part is formed such that the first insulating layers include insulating resin and inorganic particles and that the insulating resin in the first insulating layers forms the surfaces of the first insulating layers covered by the first conductor layers.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
85.
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
A wiring substrate includes a substrate, and a conductor layer formed on the substrate and including copper such that the conductor layer is patterned. The conductor layer is formed such that the upper surface of the conductor layer has a width that is equal to or larger than a width of the lower surface of the conductor layer and that the width of the lower surface is larger than the minimum width of a middle portion of the conductor layer between the upper surface and the lower surface.
A wiring substrate includes insulating layers including inorganic particles and resin, conductor layers formed on first surfaces of the insulating layers, respectively, and including the outermost conductor layer and a conductor layer, and via conductors formed in the insulating layers such that the via conductors are connecting the conductor layers formed on the first surfaces of the insulating layers. The conductor layers are formed such that the outermost conductor layer includes first conductor pads positioned to mount a first component and second conductor pads positioned to mount a second component and that the conductor layer includes first wiring patterns connecting the first conductor pads and the second conductor pads, and the insulating layers are formed such that the first surfaces of the insulating layers are formed of the resin and do not have exposed surfaces of the inorganic particles.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
87.
INORGANIC FIBER MAT PRODUCTION METHOD AND INORGANIC FIBER MAT
An inorganic fiber mat production method characterized by comprising: an opening step in which a first inorganic fiber molded body derived from a needled mat and a second inorganic fiber molded body derived from a sheet-type mat are used, the first inorganic fiber molded body and the second inorganic fiber molded body are opened, and inorganic fibers are obtained; and a sheet formation step in which sheet formation of an inorganic fiber mat is performed using a slurry including the opened inorganic fibers.
D04H 1/732 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes caractérisés par la méthode de formation des voiles ou couches, p.ex. par la réorientation des fibres les fibres étant disposées au hasard par courant de fluide, p.ex. flux d'air
A method for producing an inorganic-fiber mat, characterized by comprising: a fibrillation step in which a first inorganic-fiber molded object, which is derived from a needle mat containing an adhered organic binder, is fibrillated to obtain inorganic fibers; and a wet-lay sheet formation step in which a slurry containing the fibrillated inorganic fibers is used to form an inorganic-fiber mat by the wet-lay method.
C04B 38/00 - Mortiers, béton, pierre artificielle ou articles de céramiques poreux; Leur préparation
D04H 1/732 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes caractérisés par la méthode de formation des voiles ou couches, p.ex. par la réorientation des fibres les fibres étant disposées au hasard par courant de fluide, p.ex. flux d'air
D21B 1/04 - Matières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p.ex. fibres
D21B 1/12 - Matières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p.ex. fibres par l'emploi de vapeur
A printed wiring board includes a laminate including resin insulating layers and conductor layers, and via conductors formed in via holes of the resin insulating layers and each including a seed layer and an electrolytic plating layer formed on the seed layer such that the via conductors connect the conductor layers adjacent to each other and that the via conductors include a first via conductor and a second via conductor formed on the first via conductor in a lamination direction of the laminate. The resin insulating layers include resin and inorganic particles such that the inorganic particles include first inorganic particles having smooth surfaces and second inorganic particles embedded in the resin insulating layers and that an inner wall surface of each of the via holes in the resin insulating layers includes the resin and the smooth surfaces of the first inorganic particles.
A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that each of the coils includes wirings formed on the first surface of the flexible substrate and wirings formed on the second surface of the flexible substrate. The coils include an N-th coil forming an N-th phase and an (N+1)-th coil formed adjacent to the N-th coil and forming an (N+1)-th phase different from the N-th phase, and each coil is formed such that an inter-wiring distance between the wirings forming the N-th coil and the wirings forming the (N+1)-th coil is larger than an inter-wiring distance between the wirings forming the N-th coil, and the inter-wiring distance between the wirings forming the N-th coil and the wirings forming the (N+1)-th coil is larger than an inter-wiring distance between the wirings forming the (N+1)-th coil.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre constitués par des conducteurs imprimés
91.
HEAT INSULATING MATERIAL, AND METHOD FOR PRODUCING HEAT INSULATING MATERIAL
This heat insulating material comprises a molded body including a carbon fiber and a scale-like graphite, the heat insulating material being characterized in that the carbon fiber and the scale-like graphite are bonded via a carbonaceous binder, and the scale-like graphite is included in at least a half area in the thickness direction of the molded body.
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
B32B 5/26 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse un autre couche également étant fibreuse ou filamenteuse
C04B 35/83 - Fibres de carbone dans une matrice carbonée
C04B 38/00 - Mortiers, béton, pierre artificielle ou articles de céramiques poreux; Leur préparation
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
B32B 5/26 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse un autre couche également étant fibreuse ou filamenteuse
C04B 35/83 - Fibres de carbone dans une matrice carbonée
C04B 38/00 - Mortiers, béton, pierre artificielle ou articles de céramiques poreux; Leur préparation
Provided are: a heat transfer suppression sheet that has excellent heat transfer suppression performance when a battery is in a normal state or an abnormal state, and an excellent holding ability to prevent falling out from between battery cells, and is further capable of coping with changes in the spacing between the battery cells without deteriorating the heat transfer suppression performance; and a battery pack including the heat transfer suppression sheet. A heat transfer suppression sheet (1) has a layer containing a shrinkable organic material, on a surface of a base material (10) containing inorganic particles, and is curved at least in part in cross-sectional shape, and, in the curved part, the amount of shrinkage in a surface direction of a surface of an inner arc face (5) is greater than the amount of shrinkage in a surface direction of a surface of an outer arc face (6).
F16L 59/04 - Dispositions utilisant des charges sèches, p.ex. de la ouate minérale
F16L 59/12 - Dispositions des supports de l'isolation des parois ou des corps isolés, p.ex. par des entretoises d'écartement placées entre le tuyau et le matériau d'isolation thermique; Dispositions spécialement adaptées pour le support des corps isolés
A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
A coil substrate includes a flexible substrate, and a coil including a first wiring formed on a first surface of the flexible substrate and a second wiring formed on a second surface of the flexible substrate on the opposite side with respect to the first surface of the flexible substrate. The coil is formed such that an inter-wiring distance of the first wiring formed on the first surface of the flexible substrate is larger than an inter-wiring distance of the second wiring formed on the second surface of the flexible substrate.
H02K 3/04 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p.ex. avec des conducteurs en barre
H02K 3/32 - Enroulements caractérisés par la configuration, la forme ou la réalisation de l'isolement
H02K 7/00 - Dispositions pour la mise en œuvre d'énergie mécanique associées structurellement aux machines dynamo-électriques, p.ex. association structurelle avec des moteurs mécaniques d'entraînement ou des machines dynamo-électriques auxiliaires
96.
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
A wiring substrate includes an insulating layer including inorganic particles and resin, a seed layer formed on a surface of the insulating layer, and a conductor layer including a conductor pattern and formed on the seed layer. The surface of the insulating layer is a roughened surface formed such that the roughened surface of the insulating layer has exposed portions of the inorganic particles and resin with gaps at interfaces where the inorganic particles and the resin are in contact, and the seed layer is formed on the roughened surface of the insulating layer such that the seed layer is formed along the exposed portions of the inorganic particles and resin exposed on the roughened surface of the insulating layer and is not formed in the gaps at the interfaces where the inorganic particles and the resin are in contact.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
A mat material including: a base mat containing inorganic fibers and having a first main surface and a second main surface; and a sheet material disposed on at least one of the first main surface or the second main surface, wherein the sheet material is a stacked sheet material in which longitudinally oriented fibers and transversely oriented fibers are stacked, the sheet material has openings surrounded by the longitudinally oriented fibers and the transversely oriented fibers, and an average opening area of the sheet material is more than 0 mm2/piece and 0.7 mm2/piece or less.
B32B 5/12 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments caractérisés par la disposition relative des fibres ou filaments des couches adjacentes
B01D 46/24 - Séparateurs de particules utilisant des corps filtrants creux et rigides, p.ex. appareils de précipitation de poussières
B01D 53/94 - Epuration chimique ou biologique des gaz résiduaires des gaz d'échappement des moteurs à combustion par des procédés catalytiques
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
B32B 29/02 - Produits stratifiés composés essentiellement de papier ou de carton adjacent à une couche fibreuse ou filamenteuse
Provided are: a heat transfer suppression sheet including an elastic body, said sheet being able to handle swelling of a battery cell caused by normal charging/discharging, and being able to demonstrate elastic performance at the time of thermal runaway; and a battery pack including this heat transfer suppression sheet. The heat transfer suppression sheet (10) includes an elastic body (1) that is in a compressed state at less than 90°C and is released from the compressed state at 90°C or greater. The compressed state of the elastic body (1) is maintained by a binder substance. An insulation material (5) may be layered thereon, and in such a case, the compressed state may be maintained by a heat shrinkable enclosure (20). Furthermore, the elastic body (1) may be configured from a plurality of elastic body fragments (1A).
A wiring board according to an embodiment of the present invention comprises: a first wiring board 11 including first insulating layers 111, first conductor layers 112, and first via conductors 113; and a second wiring board 12 including second insulating layers 211, second conductor layers 212, and second via conductors 213. The second wiring board 12 is mounted on the first wiring board 11. The minimum value of the wire width of wires FW2 included in the second conductor layers 212 is smaller than the minimum value of the wire line width of wires FW1 included in the first conductor layers 112. The minimum value of the wire spacing of the wires FW2 is smaller than the minimum value of the wire spacing of the wires FW1. The wire width of the wires FW2 is 3 μｍ or less, and the aspect ratio of the wires FW2 is 2.0-4.0.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A printed wiring board includes a conductor layer including a pad, a first resin insulating layer laminated on the conductor layer, a first conductor layer formed on the first resin insulating layer and including a first seed layer and a first electrolytic plating layer, a second resin insulating layer laminated on the first insulating layer such that the second resin insulating layer is covering the first conductor layer, and a second conductor layer formed on the second resin insulating layer and including a second seed layer and a second electrolytic plating layer. The first conductor layer is formed such that the first seed layer is an electroless plating layer and the first electrolytic plating layer formed on the first seed layer, and the second conductor layer is formed such that a second seed layer is a sputtering layer and the second electrolytic plating layer formed on the second seed layer.
