Provided in the present application are a server power source and an electronic device. The server power source comprises a DC-DC circuit, which comprises a direct-current filter circuit, a first resonance circuit and a first control circuit, wherein an input end and a first output end of the direct-current filter circuit are respectively connected to a high-voltage direct-current input end and an input end of the first resonance circuit, and a first output end of the first resonance circuit outputs a first low-voltage direct current; a second output end of the direct-current filter circuit and a second output end of the first resonance circuit are respectively connected to a first controller and a second controller of the first control circuit; and a third output end of the direct-current filter circuit is connected to an input end of a first auxiliary power source circuit, and a first output end and a second output end of the first auxiliary power source circuit respectively output a second low-voltage direct current and a third low-voltage direct current. Provided is a server power source that outputs a direct current after a direct current is input, and the server power source supports usage on a direct-current power supply site, overcomes an existing defect whereby direct-current power supply is not supported, and expands the usage range of the power source.
The present disclosure provides a wind power generation apparatus, including: at least two support platforms, stacked along a first direction; a wind turbine and a support frame, arranged between two adjacent support platforms; where the support frame is connected between the two adjacent support platforms; the wind turbine is detachably connected to one of the two adjacent support platforms, and spaced apart from the support frame and the other of the two adjacent support platforms. In an embodiment of the present disclosure, a difficulty of disassembling the wind turbine in the wind power generation apparatus may be reduced.
The present disclosure relates to a container structure and a server cluster, where the container structure includes: a box, in which a cold air channel and a hot air channel that are in communication with each other are formed; and a heat exchanger, disposed on the box and configured to exchange heat with air output from the hot air channel; where the heat exchanger has a heat exchange channel and an air channel, which are spaced apart; the heat exchange channel is respectively communicated with the cold air channel and the hot air channel, and can transmit air after heat exchange to the cold air channel; and an air exit and an air entrance of the air channel are disposed on adjacent sides of the heat exchanger.
The present disclosure provides a wind power generation apparatus, including: a tower body; at least two wind power generators arranged on the tower body and stacked along an extending direction of the tower body; where, a rotation shaft of each wind power generator is parallel to the extending direction and a bottom of each wind power generator is connected with a first connecting member; two first connecting members at the bottoms of two adjacent wind power generators are connected through at least two second connecting members, and an arrangement direction of the second connecting members is different from that of the first connecting members. In embodiments of the present disclosure, the power generation efficiency of the wind power generation apparatus can be improved while reducing the floor space of the wind power generation apparatus and enhancing its stability.
F03D 3/02 - Mécanismes moteurs à vent avec axe de rotation sensiblement perpendiculaire au flux d'air pénétrant dans le rotor comportant plusieurs rotors
F03D 3/00 - Mécanismes moteurs à vent avec axe de rotation sensiblement perpendiculaire au flux d'air pénétrant dans le rotor
F03D 9/25 - Mécanismes moteurs à vent caractérisés par l’appareil entrainé l’appareil étant un générateur électrique
F03D 13/20 - Dispositions pour monter ou supporter des mécanismes moteurs à ventPylônes ou tours pour des mécanismes moteurs à vent
H02K 7/18 - Association structurelle de génératrices électriques à des moteurs mécaniques d'entraînement, p. ex. à des turbines
The present disclosure provides a cooling system connected to liquid cooling equipment. The cooling system includes: a chiller unit including a plate evaporator, a compressor, and a dry cooler; where the plate evaporator, the compressor and the dry cooler form a first medium circuit, a refrigerant medium is circulated in the first medium circuit, the plate evaporator and a cooling water source form a second medium circuit, and cooling water supplied by the cooling water source is circulated in the second medium circuit; and a control device, configured to control the connection of the first medium circuit and the disconnection of the second medium circuit, where the thermal load of the liquid cooling equipment exchanges heat with the refrigerant medium in the plate evaporator; or, configured to control the disconnection of the first medium circuit and the connection of the second medium circuit.
The present disclosure provides a circuit board assembly, relating to the field of electronic devices, the circuit board assembly includes: a circuit board; a chip, fixedly connected to the circuit board; a current-carrying component, fixedly connected to the circuit board; a heat dissipation component, fixedly connected to the chip and the current-carrying component. The heat dissipation component of this circuit board assembly has a larger connection area, which improves the connection reliability of the heat dissipation component.
The present disclosure provides a heat dissipation apparatus for cooling a chipset, including: a sealed liquid cooling tank; a phase-change working medium infused in an interior of the liquid cooling tank; an exhaust port provided in an outer wall of the liquid cooling tank, and the liquid cooling tank is connectable with a sucking pump through the exhaust port; when the sucking pump extracts gas in the liquid cooling tank, air pressure in the liquid cooling tank is reduced from a first value to a second value. The heat dissipation apparatus disclosed in the present application can realize effective heat dissipation of heating devices at a low rated temperature.
Provided are a chip power supply circuit and an electronic device, which relate to the field of power supply technologies. The chip power supply circuit includes: at least two chip domains, where the at least two chip domains are sequentially connected, and in two adjacent chip domains, a ground port of a previous-stage chip domain is connected to a primary power supply port of a next-stage chip domain; and at least one voltage conversion circuit, where in the two adjacent chip domains, the ground port of the previous-stage chip domain is connected to a secondary power supply port of the next-stage chip domain through a voltage conversion circuit of the at least one voltage conversion circuit, and the voltage conversion circuit is configured to output a target voltage to the secondary power supply port.
G06F 1/26 - Alimentation en énergie électrique, p. ex. régulation à cet effet
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
12.
FLOATING WIND POWER GENERATION PLATFORM AND FLOATING WIND POWER GENERATION SYSTEM
The present application discloses a floating wind power generation platform and a floating wind power generation system. The floating wind power generation platform includes a plurality of hulls and at least one transverse connection structure; where the plurality of hulls are spaced apart along a horizontal direction, two ends of each transverse connection structure are connected to two adjacent hulls respectively, a support frame extends upwards from the top of each hull, adjacent support frames are symmetrically provided in directions away from their respective centers of gravity, and the support frame has an installation position for installation of a wind turbine.
B63B 35/44 - Constructions, magasins, plates-formes de forage ou ateliers flottants, p. ex. portant des appareils séparateurs huile-eau
F03D 13/25 - Dispositions pour monter ou supporter des mécanismes moteurs à ventPylônes ou tours pour des mécanismes moteurs à vent spécialement adaptés à l’installation offshore
The present application provides a power distribution apparatus. The power distribution apparatus comprises: a power distribution apparatus body, switches, switch portions, and power interfaces. The switches are integrated into the power distribution apparatus, and are used for information exchange between devices. The switch portions are used for controlling the power interfaces, and the power interfaces are configured to be connected to power lines of the devices, so that the power distribution apparatus distributes power to the devices. The switches are integrated into the power distribution apparatus by means of structure integration, and during installation, the power distribution apparatus and the switches are integrated into one component from original two independent components, greatly shortening the installation and transformation working hours, and directly saving the labor cost. In addition, according to the power distribution apparatus into which the switches are integrated, the power lines of the power distribution apparatus can be sorted into a whole bundle, improving the convenience during installation, maintenance and replacement.
The present application provides a circuit rearrangement method and apparatus, an electronic device, a storage medium, and a program product. The method comprises: acquiring a hardware description of a first circuit, the hardware description being used for representing logic relationships between devices in the first circuit; on the basis of the hardware description, rearranging circuit structures of a plurality of first sub-circuits in the first circuit, and obtaining a plurality of second sub-circuits, the plurality of first sub-circuits and the plurality of second sub-circuits being a plurality of sub-circuits connected in series; traversing the plurality of second sub-circuits, and obtaining a plurality of candidate circuit topologies, each candidate circuit topology among the plurality of candidate circuit topologies comprising at least one second sub-circuit; and determining an optimal topology of the first circuit from among the plurality of candidate circuit topologies, the optimal topology being a circuit topology having the lowest layout cost among the plurality of candidate circuit topologies, and the layout cost being determined on the basis of at least the number of diffusion gaps. According to the present application, circuit rearrangement efficiency is improved.
G06F 30/398 - Vérification ou optimisation de la conception, p. ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
The present application provides an NTT circuit, an NTT method, and an electronic device. The NTT circuit comprises a first storage module, a first operation module, a first rotation module, and a second storage module. The first storage module is configured to store J4pieces of first data. The J4pieces of first data is divided into J2first data arrays. Each first data array comprises J×J pieces of first data. J is a positive integer. The first operation module is configured to execute an NTT operation on the basis of each first data array to obtain a first operation result. The first rotation module is configured to transform the first operation result on the basis of a first rotation factor to obtain a first transformation result. The first transformation result comprises J×J pieces of second data. The second storage module is configured to store J4pieces of second data corresponding to the J2 first data arrays. By means of the present application, the computing resources required by an NTT operation are reduced, and power consumption is reduced.
Provided in the present application are an analog-to-digital converter apparatus and an analog foreground correction method. The apparatus comprises: a capacitor array, which comprises a quantization capacitor array and an array of capacitors to be corrected; a comparator circuit, which is configured to compare an output voltage of the capacitor array with a predetermined voltage and output a comparison result; and a logic control circuit, which is configured to control, within a correction time period, a ground voltage to be sequentially and electrically connected to each capacitor to be corrected in the array of capacitors to be corrected from a least significant bit to a most significant bit, generate, on the basis of a corresponding comparison result output by the comparator circuit, an error code of each capacitor to be corrected, control, within a quantization time period, a common-mode voltage to be input into the capacitor array, and obtain a correction code on the basis of the corresponding comparison result output by the comparator circuit and the error code, and control, on the basis of the correction code, a plurality of target quantization capacitors in the quantization capacitor array to be electrically connected to the ground voltage or a reference voltage, wherein the sum of the weights of the plurality of target quantization capacitors is equal to the correction code.
The present application discloses a floating-type wind power generation platform and a floating-type wind power generation system. The floating-type wind power generation platform includes a first transverse connector and multiple floating support components, where the multiple floating support components are arranged at intervals on the water surface in a horizontal direction, and the first transverse connector includes a first connecting rod and an outward-extending plate, the first connecting rod has both ends connected to two adjacent floating support components, and the outward-extending plate extends from the outer side wall of the first connecting rod in a direction away from the center of the first connecting rod.
B63B 35/44 - Constructions, magasins, plates-formes de forage ou ateliers flottants, p. ex. portant des appareils séparateurs huile-eau
F03D 13/25 - Dispositions pour monter ou supporter des mécanismes moteurs à ventPylônes ou tours pour des mécanismes moteurs à vent spécialement adaptés à l’installation offshore
A containerized data center includes: a data container, including a container body, and a side wall of the container body is provided with a vent; a heat dissipation module, installed on an outer wall of the container body, and provided corresponding to the vent; where the heat dissipation module includes a housing, a fan and a heat exchanger; the housing is sealed and connected to the outer wall of the container body and is communicated with the vent; both the fan and the heat exchanger are provided in the housing, where the fan guides the air in the container body to the heat exchanger, and the heat exchanger is connected with a liquid cooling source. The containerized data center provided has a simple structure, easy assembly, high heat dissipation efficiency, good heat dissipation effect, low energy consumption and pollution-free nature.
A server cooling system relates to a technical field of server heat dissipation and solves problems of high manufacturing costs, large maintenance workload, and high energy consumption of existing server cooling systems. The server cooling system includes a flow divider, a heat exchange device, a first temperature sensor, a second temperature sensor, a control device, and a circulating pump. The server cooling system is configured to dissipate heat from a server cluster, and the cooling liquid is divided by the flow divider before the cooling liquid cools servers, such that the cooling liquid flows through each server in the server cluster through different pipelines, realizing centralized heat dissipation of the servers, reducing the manufacturing cost of the server cooling system, and lowering the maintenance workload and energy consumption of the server cooling system.
The present application discloses a supercomputing center system, which includes a wind-powered vessel, and a damping device, at least one supercomputing device, a control device, and a wind power generation device that are arranged on the hull of the wind-powered vessel. The damping device is configured to maintain the stability of the hull; the supercomputing device is configured to perform operations; the control device controls the wind power generation device to generate power and adjusts the angles of the damping device based on real-time sea condition information; and the wind power generation device supplies power to the supercomputing device, the damping device, and the control device.
F03D 13/25 - Dispositions pour monter ou supporter des mécanismes moteurs à ventPylônes ou tours pour des mécanismes moteurs à vent spécialement adaptés à l’installation offshore
F03D 7/02 - Commande des mécanismes moteurs à vent les mécanismes moteurs à vent ayant l'axe de rotation sensiblement parallèle au flux d'air pénétrant dans le rotor
F03D 9/11 - Combinaisons des mécanismes moteurs à vent avec un appareil emmagasinant de l’énergie emmagasinant de l’énergie électrique
F03D 13/10 - Assemblage de mécanismes moteurs à ventDispositions pour l’érection de mécanismes moteurs à vent
F03D 13/20 - Dispositions pour monter ou supporter des mécanismes moteurs à ventPylônes ou tours pour des mécanismes moteurs à vent
F03D 80/00 - Détails, composants ou accessoires non prévus dans les groupes
F03D 80/80 - Disposition des composants dans les nacelles ou les tours
Provided in the present application are a server power source and an electronic device. The server power source comprises a DC-DC circuit, which comprises a direct-current filter circuit, a first resonance circuit and a first control circuit, wherein an input end and a first output end of the direct-current filter circuit are respectively connected to a high-voltage direct-current input end and an input end of the first resonance circuit, and a first output end of the first resonance circuit outputs a first low-voltage direct current; a second output end of the direct-current filter circuit and a second output end of the first resonance circuit are respectively connected to a first controller and a second controller of the first control circuit; and a third output end of the direct-current filter circuit is connected to an input end of a first auxiliary power source circuit, and a first output end and a second output end of the first auxiliary power source circuit respectively output a second low-voltage direct current and a third low-voltage direct current. Provided is a server power source that outputs a direct current after a direct current is input, and the server power source supports usage on a direct-current power supply site, overcomes an existing defect whereby direct-current power supply is not supported, and expands the usage range of the power source.
The present application relates to the technical field of containers and discloses a container module and a container system. The container module includes at least two box bodies, a first baffle and a second baffle, where the at least two box bodies are provided at intervals, an air inlet and an air outlet are respectively provided at two opposite sides of the box bodies, and the air outlets of two adjacent box bodies are provided opposite each other; the first baffle surrounds the outer periphery of the at least two box bodies, and is configured to prevent hot air from entering areas between the box bodies; the second baffle is provided at the top of the box bodies, and is configured to prevent hot air from impacting the box bodies. The container module of the present application may effectively solve the problem of hot air interference through reasonable layout of the box bodies and setting of the baffles without dispersing the layout of the box bodies, and improves the heat dissipation efficiency of the container module, thereby improving the space utilization rate of the data center site.
A heat dissipation control system, a heat dissipation method, and an immersion liquid cooling system are provided. The heat dissipation control system includes a radiator, a circulation pump, a fan, dry coolers, a temperature sensor, a first and a second variable-frequency drivers, and a heat dissipation controller. The temperature sensor is used for collecting a secondary-side liquid supply temperature. The heat dissipation controller is used for generating a control signal for the first and the second variable-frequency drivers based on a difference value between the secondary-side liquid supply temperature and a preset temperature. The first variable-frequency driver is used for controlling a frequency of the circulation pump so as to adjust a flow rate of a coolant flowing into the radiator. The second variable-frequency driver is used for activating or deactivating at least one of the dry coolers, and controlling a frequency of the fan.
A fan testing system, including an adjustable load apparatus, a fan board, a power supply apparatus, and a control apparatus, the control apparatus is connected to the power supply apparatus, the fan board, and the adjustable load apparatus, and the power supply apparatus is connected to the adjustable load apparatus and the fan board; the fan board includes multiple connection ports, and the connecting ports are configured to connect to a to-be-tested fan. Based on the fan testing system, by means of adjusting a resistance value of the adjustable load apparatus by the control apparatus to simulate a device in a practical scenario, and controlling the power supply apparatus to supply power to the adjustable load apparatus as well as the to-be-tested fan connected to the fan board by the control apparatus, the fan testing system is enabled to test whether the to-be-tested fan is qualified in different application scenarios.
The present disclosure provides a heat dissipation regulation system. The system includes a first temperature acquisition unit configured to collect an outlet water temperature of a water outlet of a heat absorption unit; a second temperature acquisition unit configured to collect an inlet water temperature of a water inlet of the heat absorption unit; a flow rate measurement unit configured to measure flow rate of circulating cooling water flowing in or out of the heat absorption unit; a circulating water pipeline including a temperature-stabilizing water branch pipeline and a cooling water branch pipeline connected in parallel between the water inlet and the water outlet of the heat absorption unit; a plurality of regulating valves, arranged in the temperature-stabilizing water branch pipeline and the cooling water branch pipeline, respectively; a controller, electrically connected with the first temperature acquisition unit, the second temperature acquisition unit and the plurality of regulating valves.
It relates to the technical field of cooling devices, a cooling integrated system configured to cool a computing device provided with a cooling channel, which includes a housing and a cooling apparatus integrally packaged inside the housing. The cooling apparatus includes a heat exchange mechanism, a liquid inlet pipe, a liquid return pipe, and a delivery pump. The heat exchange mechanism and the cooling channel are communicated by the liquid inlet pipe, and the heat exchange mechanism and the cooling channel are communicated by the liquid return pipe. The delivery pump is installed on the liquid inlet pipe and/or the liquid return pipe and configured to circulate coolant between the heat exchange mechanism and the cooling channel to cool the computing device. The cooling apparatuses in the cooling integrated system of the embodiments of the present application are integrally configured.
The present application provides a heat dissipation control method based on a cooling tower, including: in response to a heat dissipation control request, obtaining a cooling tower identifier in the heat dissipation control request, and collecting target heat dissipation information of a cooling tower corresponding to the cooling tower identifier; if it is detected that the target heat dissipation information meets a dry-cooling heat dissipation requirement, controlling a dry-cooling heat dissipation system to operate; if it is detected that the target heat dissipation information meets a wet-cooling heat dissipation requirement, controlling a wet-cooling heat dissipation system to operate; if it is detected that the target heat dissipation information meets neither the dry-cooling heat dissipation requirement nor the wet-cooling heat dissipation requirement, controlling the wet-cooling heat dissipation system and the dry-cooling heat dissipation system to operate simultaneously.
A logic control circuit, a flip-flop, and a pulse generating circuit, where, the logic control circuit includes: a first MOS transistor, a second MOS transistor, a third MOS transistor, and an output circuit, a first end of the first MOS transistor is connected to a power supply, and a second end is connected to a first end of the second MOS transistor, a second end of the second MOS transistor is connected to a first end of the third MOS transistor, and a second end of the third MOS transistor is grounded. The second end of the first MOS transistor is also used to connect to a first end of an output circuit. A second end of the output circuit serves as an output terminal of the logic control circuit, and is also used to connect to a control terminal of the first MOS transistor.
The present application provides a container and a container data center. The container includes a box, a heat dissipation pipeline, a coil component, a supply component, and an extraction component. The box has an accommodating cavity, and the heat dissipation pipeline, the coil component, the supply component and the extraction component are all located outside the box. The heat dissipation pipeline has an air inlet end and an air outlet end. Two ends of the coil component are respectively connected to the supply component and the extraction component. A cooling medium for cooling high-temperature gas flows inside the coil component and is used to cool the high-temperature gas entering the heat dissipation pipeline from the accommodating cavity. The cooling medium becomes a defective medium after contacting and exchanging heat with the high-temperature gas, and the extraction component is configured to discharge the defective medium.
The present application provides a container and a data center of the container. A box is provided with an accommodating cavity for placing an electronic device, and a heat dissipation pipeline includes a housing with a cooling cavity, where the cooling cavity is filled with cooling liquid, and high-temperature gas in the accommodating cavity enters the cooling cavity through an inlet, and low-temperature gas in the cooling cavity generated after heat exchange with the cooling liquid enters the accommodating cavity through an outlet for cooling the electronic device to form heat dissipation circulation.
The present disclosure provides a tension-leg floating offshore platform, including a floating body assembly and a detachable temporary floating body; where, during a process of the floating body assembly being towed to an operating sea area, the temporary floating body is movably installed on the floating body assembly; after the floating body assembly is moored to the operating sea area, the temporary floating body is separated from the floating body assembly. The tension-leg floating offshore platform provided in the present disclosure enables the tension-leg floating offshore platform to maintain stability during its installation process.
The present application provides a fluid immersion cooling system, including a housing, a circuit board and a partition. There are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in an accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole. There are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board. Areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.
The present application discloses a boarding apparatus for an offshore platform, including a lifting apparatus and a track structure; the track structure is connected to a platform main body of the offshore platform and extends beyond the platform main body; the lifting apparatus is connected to the track structure, and the lifting apparatus is at least movable along the track structure with a moored sea transporting apparatus; the lifting apparatus includes a ride-on assembly for lifting transportation of a ride-on object between the track structure and the sea transporting apparatus. This thus overcomes the impossibility of boarding caused by marine environmental factors and improves boarding efficiency, and avoids damage caused by the collision between the sea transporting apparatus and the offshore platform when the sea transporting apparatus is berthed at the platform.
B63B 27/14 - Aménagement des équipements de bord pour l'embarquement ou le débarquement des cargaisons ou des passagers des rampes, coupées ou échelles extérieures
B63B 27/30 - Aménagement des équipements de bord pour l'embarquement ou le débarquement des cargaisons ou des passagers pour le transfert entre des navires en mer ou entre un navire et un poste situé en mer
The present disclosure provides a wind power generation apparatus, including a fan configured to obtain wind energy; a first generator, connected with the fan and a load and configured to convert the wind energy obtained by the fan into first electric energy and output the first electric energy to the load; a gas storage module, connected between the first generator and the load and configured to store or release gas; where when an output power of the first generator is greater than a load power of the load, the first generator drives the gas storage module to store a gas; and when the output power of the first generator is lower than the load power, the gas storage module releases a stored gas to generate second electric energy and output the second electric energy to the load.
F03D 9/17 - Combinaisons des mécanismes moteurs à vent avec un appareil emmagasinant de l’énergie emmagasinant l’énergie dans des fluides sous pression
37.
METHOD FOR PLACING GRAVITU ANCHOR AND FLOATING BODY
The present application provides a method for placing a gravity anchor and a floating body. The method includes: fixing a gravity anchor on a floating body when the floating body is located in a dock; sinking the gravity anchor from the floating body to water bottom when the floating body is at a target position. Through the present application, the placement difficulty and cost of the gravity anchor are reduced.
The present application provides a vertical axis wind turbine and a floating body. The vertical axis wind turbine includes a tower, a main shaft, a supporting rod and a blade; where the main shaft is connected with the tower, and the main shaft is provided to be rotatable around a central axis of the tower; the blade is connected to the main shaft by the supporting rod; the tower is retractable. In the present application, the tower and the blade of the vertical axis wind turbine can be contracted, or the tower and the blade can be put down after contraction, or the tower and the blade can be contracted and then stored below a deck, thus reducing the space occupied by the vertical axis wind turbine on the deck of the floating body to meet different operation requirements of the floating body.
F03D 13/20 - Dispositions pour monter ou supporter des mécanismes moteurs à ventPylônes ou tours pour des mécanismes moteurs à vent
F03D 13/25 - Dispositions pour monter ou supporter des mécanismes moteurs à ventPylônes ou tours pour des mécanismes moteurs à vent spécialement adaptés à l’installation offshore
39.
CHASSIS, ELECTRONIC APPARATUS AND CHASSIS EXHAUST METHOD
The present disclosure relates to a chassis, an electronic apparatus and a chassis exhaust method. The chassis includes: a housing, forming an accommodating cavity, where the accommodating cavity is configured for accommodating cooling liquid and a heating component immersed in the cooling liquid; a condenser, disposed in the accommodating cavity and configured for condensing the cooling liquid in a gas phase; a cooling liquid interface, disposed on the housing; and an exhaust component, located on the housing and at least configured for exhausting gas in the accommodating cavity when the cooling liquid is injected into the accommodating cavity through the cooling liquid interface.
The present application discloses a computing apparatus and a heat dissipation apparatus, where the computing apparatus includes: a circuit board, a first surface of which is provided with at least one computing unit; a first heat dissipation assembly, arranged on a second surface of the circuit board, the second surface being opposite to the first surface; and at least one second heat dissipation assembly, correspondingly arranged on a package of the at least one computing unit, respectively. Through the present application, a heat dissipation efficiency of the computing apparatus can be improved.
A heat dissipation apparatus, includes: a heat spreading structure and a first surface heat dissipation structure; where the heat spreading structure at least includes a first surface and a second surface which are oppositely arranged, the first surface is connected with a package of a chip to be heat dissipated; and the first surface heat dissipation structure is formed on the second surface by a copper powder spraying process. In the present disclosure, by the copper powder spraying process, the first surface heat dissipation structure formed has a higher adhesion strength, and a morphology of the first surface heat dissipation structure can be adjusted, thereby increasing the number of vaporization core and enhancing the boiling heat exchange effect of the heat dissipation apparatus.
A cooling apparatus and an electronic device, where, the cooling apparatus includes: a condensing part and a sealing part, where the sealing part can accommodate a cooling liquid, and a circuit board mounted with a heat-producing element can be immersed in the cooling liquid; and the condensing part includes a condensing tube and an air cooling structure used for dissipating heat of the condensing tube, the condensing tube is connected with the sealing part, and the air cooling structure is provided on at least one side of the condensing tube.
A supercomputing device, an in-place detection method for a computing power board, and a storage medium are provided. The supercomputing device includes: at least one computing power board including a first-type signal pin and a second-type signal pin, where the first-type signal pin has a different length from that of the second-type signal pin; a computing power board interface inserted into the computing power board interface; a level detection circuit electrically connected to the computing power board interface; and a master control circuit being connected to the level detection circuit, where the level detection circuit is configured to detect a first level signal corresponding to the first-type signal pin and a second level signal corresponding to the second-type signal pin, and the master control circuit determines in-place information of the computing power board based on the first level signal and the second level signal.
The present application provides a cooling device. The cooling device includes a first plate and a second plate. A first surface of the first plate is provided with a runner. The runner is configured for accommodating a fluid. The runner has a zigzag shape. The first surface of the first plate is in contact with the second plate. The cooling device of the present application has an enhanced heat dissipation performance.
The present application discloses a sand removal device for a cooling tower and the sand removal device comprises a flushing assembly and a cyclone sand removal assembly. The flushing assembly comprises a first pipeline with a plurality of water outlets, and the first pipeline is used to spray liquid towards the bottom of the cooling tower through the plurality of water outlets. The cyclone sand removal assembly is used to extract the liquid at the bottom of the cooling tower, perform a sand removal treatment on the liquid and then discharge the sand-removed liquid into the bottom of the cooling tower. Through the present application, the sand removal effect on the liquid can be improved.
The present application provides a cooling device. The cooling device includes a first plate body and a second plate body, where a first surface of the first plate body is provided with a flow channel, the flow channel is configured to accommodate fluid, the flow channel includes at least two straight segments and at least one bent segment, the at least two straight segments are communicated via the at least one bent segment, the first surface of the first plate body is in contact with the second plate body. The cooling device of the present application has an enhanced heat dissipation performance.
F28F 3/04 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations les moyens faisant partie intégrante de l'élément
The present disclosure relates to the field of electronic devices, and provides a circuit board assembly. The circuit board assembly comprises: a circuit board; a chip, which is fixedly connected to the circuit board; a flow-through member, which is fixedly connected to the circuit board; and a heat dissipation member, which is fixedly connected to the chip and is fixedly connected to the flow-through member. The heat dissipation member of the circuit board assembly has a large connection area, which improves the reliability of connection of the heat dissipation member.
The present disclosure relates to a chip module, a circuit board and an electronic device. The chip module includes: a chip; a heat-dissipating metal sheet, and a thermal conductive layer located between the chip and the heat-dissipating metal sheet, where a thermal conductive material included in the thermal conductive layer is a phase change material or a thermal conductive paste.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
50.
METHOD FOR MANUFACTURING TRANSISTOR DEVICE, AND TRANSISTOR DEVICE
Embodiments of the present disclosure provide a method for manufacturing a transistor device, and a transistor device. The method for manufacturing a transistor device includes: injecting, into a channel of at least one first transistor located in an electrical break (EB) region, doping ions of a different type from the first transistor, and/or injecting, into a channel of at least one second transistor located outside the EB region, doping ions of a same type as the second transistor; and forming the transistor device based on the first transistor and the second transistor into which doping ions have been injected.
H01L 21/265 - Bombardement par des radiations ondulatoires ou corpusculaires par des radiations d'énergie élevée produisant une implantation d'ions
H01L 27/06 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration non répétitive
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/66 - Types de dispositifs semi-conducteurs
51.
Dynamic latch, semiconductor chip, computing power board and computing device
Provided is a dynamic latch, including: a substrate; a data transmission unit, including a first transmission gate and a second transmission gate, in which an input end of the first transmission gate is connected to an input end of the second transmission gate, and an output end of the first transmission gate is connected to an output end of the second transmission gate; a data output unit, including a first inverter, in which an input end of the first inverter is connected to the output ends of the two transmission gates, a first region of the substrate is adjacent to a second region thereof and oxide diffusion regions in two regions are continuous, drain regions of the two transmission gates are respectively located on opposite sides in the first region, and source regions of the two transmission gates are located between the drain regions of the two transmission gates.
Provided are a power distribution unit and a rack system. The power distribution unit includes: a terminal block (1) having an input terminal (11) for power supply and a lead-out terminal (12) for power supply; at least one wiring pad (2) respectively electrically connected to the lead-out terminal (12); a plurality of power output terminal groups (3), each power output terminal group (3) being composed of at least one power output terminal (31), and each power output terminal (31) being electrically connected to a respective wiring pad (2); and a plurality of switch mechanisms (4) provided in such a way that a switch mechanism (4) is correspondingly provided for a power output terminal group (3), where the switch mechanism (4) causes the corresponding power output terminal group (3) to be electrically connected to or electrically disconnected from the corresponding wiring pad (2).
Provided is a server (100), which is applicable to the technical field of electronic devices. The server (100) includes a server main body (110), a power supply (120), and a heat conduction layer (130), where the server main body (110) includes a chassis (111), a first circuit board assembly (112), and a heat dissipation fan assembly (113); the first circuit board assembly (112) is installed in the chassis (111); and the heat dissipation fan assembly (113) is installed on the chassis (111) to dissipate heat of the first circuit board assembly (112). The power supply (120) is installed on one side of the chassis (111); and the heat conduction layer (130) is arranged between the power supply (120) and the chassis (111) to conduct heat generated by the power supply (120) to the chassis (111).
A delay circuit, a pulse generation circuit, a chip, and a server is disclosed. The delay circuit includes a control unit and at least two delay sub-circuits. Input ends of the delay sub-circuits are connected to each other. Output ends of the delay sub-circuits are connected to each other. The output end of each delay sub-circuit is connected to an input end of an adjacent delay sub-circuit through a switch unit. Each delay sub-circuit includes a delay unit and a switch unit. The delay unit is configured to perform delay processing on an input pulse signal. The switch unit is configured to control the delay sub-circuit to or not to be connected. The control unit is connected to all the switch units, and is configured to separately control a plurality of switch units to be turned on or off, so as to perform corresponding delay processing on the pulse signal.
H03K 5/134 - Dispositions ayant une sortie unique et transformant les signaux d'entrée en impulsions délivrées à des intervalles de temps désirés utilisant une chaîne de dispositifs actifs de retard avec des transistors à effet de champ
H03K 5/00 - Transformation d'impulsions non couvertes par l'un des autres groupes principaux de la présente sous-classe
H03K 17/687 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
55.
Electronic device control method and apparatus, electronic device, and storage medium
Embodiments of the present disclosure provide an electronic device control method and apparatus, an electronic device, and a storage medium. The electronic device control method includes: selecting a target mode from optional modes of a fan of an electronic device, the optional modes including a cleaning mode and a heat dissipation mode, where in the cleaning mode, the fan provides at least two different air strengths, and in the heat dissipation mode, the fan provides a single air strength when a heat dissipation level is not switched; generating a control signal based on the target mode; and controlling, based on the control signal, the fan to provide an air strength.
A connector, a connector assembly, a liquid cooled plate, and a liquid cooled server, where the connector includes a first connector body, a ball body, and a mesh baffle, where an annular protrusion part is provided inside the first connector body and forms an annular through-hole, and the ball body is disposed in a hollow inner cavity and is limited by the annular protrusion part and the mesh baffle; when fluid enters from a first inlet, the ball body is away from the annular through-hole to form an opened passage, and when the fluid enters from a first outlet, the ball body blocks the annular through-hole to form a closed passage. The connector assembly includes a first connector and a second connector, the first connector adopts the connector above, the second connector includes a cut elastic retaining ring for dividing the elastic retaining ring into a plurality of blades.
The present application is applicable to the field of power distribution. Disclosed are a power distribution unit and distribution equipment. The power distribution unit comprises a unit body, a three-phase plug and a single-phase plug, wherein the unit body is provided with a first load socket, which has a three-phase interface, a first neutral wire interface and a first ground wire interface; and both the three-phase plug and the single-phase plug are adapted to the first load socket. The power distribution unit provided in the present application can take into account both a single-phase output and a three-phase output, such that even in the case of switching between load electrical devices, the power distribution unit can also meet the usage requirements of different load electrical devices, without the need for replacing the power distribution unit and mounting another one. The power distribution unit is convenient to use, and costs are relatively low.
The present application discloses a floating-type wind power generation platform and a floating-type wind power generation system. The floating-type wind power generation platform comprises a first transverse connecting member and a plurality of floating supporting components; the plurality of floating supporting components are arranged at intervals on a water surface in the horizontal direction; the first transverse connecting member comprises a first connecting rod and outward extending plates; two ends of the first connecting rod are respectively connected to two adjacent floating supporting components; the outward extending plates extend from the outer sidewall of the first connecting rod in the direction away from the center of the first connecting rod.
F03D 13/25 - Dispositions pour monter ou supporter des mécanismes moteurs à ventPylônes ou tours pour des mécanismes moteurs à vent spécialement adaptés à l’installation offshore
59.
MANUFACTURING METHOD FOR HIGH-BANDWIDTH DIE, AND HIGH-BANDWIDTH DIE
Provided in the present disclosure are a manufacturing method for a high-bandwidth die, and a high-bandwidth die. The method comprises: bonding a first metal layer of a first wafer with a first metal layer of a second wafer; thinning a silicon substrate layer of the second wafer until a first FEOL dielectric layer of the second wafer is exposed; building a first BEOL dielectric layer on the first FEOL dielectric layer; building, on the first BEOL dielectric layer, a second metal layer of the second wafer; and bonding the second metal layer of the second wafer with a metal layer of a third wafer.
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
A fan inspection system (100), comprising an adjustable load device (110), a fan board (120), a power supply device (130) and a control device (140). The control device is connected to the power supply device, the fan board and the adjustable load device; the power supply device is connected to the adjustable load device and the fan board; the fan board comprises a plurality of connection ports (121); the connection ports are used for connecting fans to be inspected. According to the fan inspection system, the resistance value of the adjustable load device is adjusted by the control device to simulate an apparatus in an actual scenario, and the power supply device is controlled by the control device to supply power to the adjustable load device and the fans to be inspected connected to the fan board, so that the fan inspection system can inspect whether the fans to be inspected are qualified in different application scenarios.
A computing device test method and apparatus, an electronic device, and a storage medium. The method comprises: performing validity check on a computing device under test, to determine whether said computing device is valid (101); when said computing device is valid, acquiring pre-configured working point information in said computing device (102); and carrying out a pattern test locally on said computing device according to the working point information, and in the test process, refusing to obtain frequency operation gear information of said computing device by connecting to a production server of said computing device, and refusing to update the pre-configured working point information of said computing device (103).
G06F 11/22 - Détection ou localisation du matériel d'ordinateur défectueux en effectuant des tests pendant les opérations d'attente ou pendant les temps morts, p. ex. essais de mise en route
Disclosed in the present application is a supercomputing center system, comprising a windship, and damping devices, at least one supercomputing device, a control device, and a wind turbine which are provided on the body of the windship. The damping devices are used for maintaining the stability of the body; the supercomputing device is used for performing operation; according to real-time sea condition information, the control device controls the wind turbine to generate power and adjusts the angles of the damping devices; and the wind turbine supplies power to the supercomputing device, the damping devices, and the control device.
B63B 17/00 - Éléments, détails ou accessoires de navires, non prévus ailleurs
H02J 3/38 - Dispositions pour l’alimentation en parallèle d’un seul réseau, par plusieurs générateurs, convertisseurs ou transformateurs
F03D 9/25 - Mécanismes moteurs à vent caractérisés par l’appareil entrainé l’appareil étant un générateur électrique
F03D 9/32 - Mécanismes moteurs à vent spécialement adaptés à l’installation dans des endroits particuliers sur des objets mobiles, p. ex. des véhicules
The present application discloses a floating wind power generation platform and a floating wind power generation system. The floating wind power generation platform comprises a plurality of boat bodies and at least one transverse connecting structure; the plurality of boat bodies are arranged at intervals in the horizontal direction; two ends of each transverse connecting structure are connected to two adjacent boat bodies, respectively; the top of each boat body extends upwards to form a supporting frame; adjacent supporting frames are symmetrically arranged in the directions away from respective centers of gravity; and mounting positions used for mounting fans are formed on the supporting frames.
A server cooling system (1000), relating to the technical field of server heat dissipation, and solving the problems that existing server cooling systems have high manufacturing costs, large maintenance workload, and high energy consumption. The server cooling system (1000) comprises a flow divider (1020), a heat exchange device (1030), a first temperature sensor (1040), a second temperature sensor (1050), a control device (1060), and a circulating pump (1220). The server cooling system (1000) is used for heat dissipation of a server cluster, and a cooling liquid is divided by the flow divider (1020) before the cooling liquid cools servers, such that the cooling liquid flows through the servers in the server cluster through different pipelines, centralized heat dissipation of the servers is realized, the manufacturing cost of the server cooling system (1000) is reduced, and the maintenance workload and energy consumption of the server cooling system (1000) are reduced.
The present disclosure provides a client upgrading method and apparatus, a terminal device, and a storage medium. The method comprises: acquiring first version information of a first client, the first version information being used for indicating the current version of the first client; according to the first version information, determining that the first client is to be updated; acquiring a first update file of the first client, the first update file being an installation file of the latest version of the first client; and transmitting the first update file to a main process.
A circuit board and an electronic device, for solving the problem that molten solder is prone to flowing into a via hole (102). The circuit board comprises a substrate (100); the substrate (100) comprises a first plane and a second plane that are oppositely arranged; a first pad part is formed on the first plane, a second pad part is formed on the second plane, and at least one via hole (102) passing through the substrate (100) is formed at the position of the first pad part of the substrate (100); the second pad part at least comprises an outer side pad (101); the outer side pad (101) is located outside the at least one via hole (102), and a solder mask structure (103) is provided between the outer side pad (101) and the at least one via hole (102); the solder mask structure (103) is used for separating the outer side pad (101) from the at least one via hole (102). Since the solder mask structure (103) separates the outer side pad (101) from the via hole (102), the solder of the outer side pad (101) is prevented from flowing into the via hole (102), so that an impact on components of the first pad part is avoided, and the quality of the circuit board is improved.
The present application relates to the technical field of cooling devices, and provides a cooling integrated system, which is used for cooling a computing device provided with a cooling channel. The cooling integrated system comprises a housing and a cooling apparatus integrated and packaged in the housing; the cooling apparatus comprises a heat exchange mechanism, a liquid inlet pipe, a liquid return pipe, and a conveying pump; the liquid inlet pipe is communicated with the heat exchange mechanism and the cooling channel; the liquid return pipe is communicated with the heat exchange mechanism and the cooling channel; the conveying pump is mounted on the liquid inlet pipe and/or the liquid return pipe; and the conveying pump is used for conveying a cooling liquid to circularly flow between the heat exchange mechanism and the cooling channel of a server so as to cool the server. The cooling apparatus in the cooling integrated system is arranged in a connected manner, and a user does not need to connect the cooling apparatus and the cooling channel of the server.
The present application provides a logic control circuit, a trigger, and a pulse generation circuit. The logic control circuit comprises: a first MOS transistor, a second MOS transistor, a third MOS transistor and an output circuit; a first end of the first MOS transistor is connected to a power supply, and a second end of the first MOS transistor is connected to a first end of the second MOS transistor; a second end of the second MOS transistor is connected to a first end of the third MOS transistor, and a second end of the third MOS transistor is grounded; the second end of the first MOS transistor is further used for connecting to a first end of the output circuit, a second end of the output circuit serves as the output end of a logic control circuit, and a second end of the output circuit is further used for connecting to a control end of the first MOS transistor; a control end of the second MOS transistor is used for receiving a first clock signal, a control end of the third MOS transistor is used for receiving a second clock signal, the second clock signal and the first clock signal have the same waveform and the second clock signal is delayed by a preset duration relative to the first clock signal. The present application simplifies a circuit design so as to reduce energy consumption, and can reduce the delay between receiving a clock signal and generating a pulse signal.
The present application relates to a heat sink, a circuit board module and an electronic device. The heat sink is configured for the heat dissipation of an electronic component. The heat sink comprises a base, a plurality of fins, and a positioning column, wherein the plurality of fins are all connected to the base, and the positioning column is connected to the base; a heat conduction face, which is configured to be fitted to an electronic component, is formed on the base; and the positioning column is located on the same side of the base as the heat conduction face, and is configured to connect to a circuit board. The function of fixing a heat sink is achieved by providing the positioning column in the heat sink and connecting same to the circuit board, thereby making the connection between the heat sink and the electronic component firmer.
A positioning method for a faulty chip on a computing device, a device, and a storage medium. The positioning method comprises: sending a first broadcast command to chips on a computing device at a first baud rate, such that the chips respond to the first broadcast command and return first response information (S101); determining the number of chips according to the first response information, and if the number of chips is equal to a preset number, sending positioning information to the chips, such that the positioning information is written into the chips (S102); changing a working baud rate of the chips to a second baud rate by means of a configuration command, the second baud rate being greater than the first baud rate (S103); sending a second broadcast command to the chips at the second baud rate, such that the chips respond to the second broadcast command and return second response information, the second response information comprising the positioning information (S104); and positioning a faulty chip according to the second response information (S105). In this way, a chip having a damaged PLL circuit in a computing device can be quickly positioned.
The present application relates to the technical field of packaging. Disclosed in the present application are chip packaging methods and a chip. A method comprises: providing a semiconductor device to be packaged and a first substrate, the first substrate comprising a first pad; adding a first packaging material to a surface of the first pad so as to form a bonding layer, attaching to the first pad a base of said semiconductor device by means of the bonding layer, and performing surface packaging processing on said semiconductor device and the first pad; forming bump structures on the surface of said semiconductor device facing away from the base; providing a second substrate, attaching the bump structures to the second substrate, and performing flip packaging processing on said semiconductor device and the second substrate; and, by means of a second packaging material, performing plastic packaging processing on said semiconductor device. The embodiments of the present application aim to improve the heat dissipation efficiency and the heat dissipation effect of a chip, thereby prolonging the service life of the chip.
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/367 - Refroidissement facilité par la forme du dispositif
A computing apparatus and method for proof of work, and a chip are provided. The computing apparatus includes: N selectors, respectively configured to obtain N groups of first input quantities; and N first compressors, respectively connected to the N selectors, and respectively configured to receive the N groups of first input quantities sent by the N selectors, and to receive a same second input quantity, wherein each first compressor is configured to sequentially perform compression processing on the second input quantity and each first input quantity in one group of first input quantities, and compression processing results of the N first compressors each is used to obtain a proof-of-work result.
H04L 9/00 - Dispositions pour les communications secrètes ou protégéesProtocoles réseaux de sécurité
G06F 16/2458 - Types spéciaux de requêtes, p. ex. requêtes statistiques, requêtes floues ou requêtes distribuées
H04L 9/32 - Dispositions pour les communications secrètes ou protégéesProtocoles réseaux de sécurité comprenant des moyens pour vérifier l'identité ou l'autorisation d'un utilisateur du système
The present application discloses a power supply circuit, a chip and an electronic device. The circuit comprises: a power module, configured to supply power to a computing chip in serial connection; a first power management module, connected with the power module and the computing chip, and configured to supply power to a core of the computing chip according to a voltage provided by the power module; and at least one second power management module, connected with the power module and the computing chip, and configured to supply power to at least one voltage domain of the computing chip according to the voltage provided by the power module correspondingly before the first power management module supplies power to the core.
A chip power supply circuit and an electronic device are provided. The chip power supply circuit includes: one or more chips each comprising a first power supply pin and a second power supply pin; a first voltage regulator circuit connected to the first power supply pin of a corresponding chip of the one or more chips; and a second voltage regulator circuit, where the first power supply pin of the corresponding chip of the one or more chips is connected to the second power supply pin of the corresponding chip via the second voltage regulator circuit, and the second voltage regulator circuit is configured to convert the first voltage into a second voltage. The first voltage regulator circuit and the second voltage regulator circuit are respectively located on different sides of at least one of the one or more chips.
Provided are a chip, a series power supply circuit, a data processing device, and a computer server. The chip includes a plurality of units to be powered, the plurality of units to be powered are connected in parallel, and a voltage domain forms on each unit to be powered. Each unit to be powered is connected to a voltage regulation unit in series, and during power-on of the chip, the voltage regulation unit is regulated to control power-on time of the plurality of units to be powered.
The present disclosure relates to a case, an electronic device and a case exhaust method. The case comprises: a housing, which forms an accommodation cavity configured to accommodate a cooling liquid and a heat generation component immersed in the cooling liquid; a condenser, which is arranged in the accommodation cavity and is configured to condense the cooling liquid in a gas phase; a cooling liquid connector, which is arranged on the housing; and an exhaust component, which is located on the housing and configured to at least discharge gas in the accommodation cavity when the cooling liquid is introduced into the accommodation cavity through the cooling liquid connector.
The embodiments of the present disclosure provide a fastener, a heat dissipation module and an electronic device. The fastener comprises a stem and an insulating limiting member. The stem comprises a first portion and a second portion connected to the first portion. The insulating limiting member is sleeved on the second portion.
The present disclosure relates to a chip array and an electronic device. The chip array comprises: a computing power board and at least two types of chips, wherein the first type of chips of the at least two types of chips are arranged in a first area of the computing power board, and the second type of chips of the at least two types of chips are arranged in a second area of the computing power board, and the power consumption of the first type of chips is greater than the power consumption of the second type of chips; and the heat dissipation priority of the first area is greater than the heat dissipation priority of the second area.
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p. ex. d'air
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
Provided in the present disclosure are a cooling device and an electronic apparatus. The cooling device comprises a condensation part and a sealed part, wherein the sealed part can contain a cooling liquid, and the cooling liquid can submerge a circuit board on which a heating element is mounted; and the condensation part comprises a condensation pipe and an air cooling structure that is used for dissipating heat of the condensation pipe, the condensation pipe being in communication with the sealed part, and the air cooling structure being arranged on at least one side of the condensation pipe.
A liquid cooling server (100), comprising a server body (110), a power supply (120), a water distributor (130), and a pipeline assembly (140). The server body (110) comprises at least two computing power units (111). Each computing power unit (111) comprises a computing power piece (1111) and a first liquid cooling radiator (1112) for dissipating heat of the computing power piece (1111). The first liquid cooling radiator (1112) comprises first liquid inlets (1103) and first liquid outlets (1104). The power supply (120) comprises an electric control board (121) and a second liquid cooling radiator (122) for dissipating heat of the electric control board (121). The water distributor (130) is mounted on the server body (110). The at least two first liquid inlets (1103) or the at least two first liquid outlets (1104) are connected to the water distributor (130) by means of the pipeline assembly (140). Heat of both the server body and the power supply is dissipated by means of water cooling, and energy consumption is reduced. After a fan is removed, the liquid cooling server has good sealing performance so as to improve the overall reliability of the liquid cooling server. Moreover, the water distributor is arranged to reduce the number of water pipes connected to an external water path system, so that the field deployment efficiency can be improved.
The present disclosure relates to a chip module, a circuit board, and an electronic device. The chip module comprises: a chip; a heat dissipation metal sheet; and a heat conduction layer, which is located between the chip and the heat dissipation metal sheet. The heat conduction material contained in the heat conduction layer is a phase change material or a thermal paste.
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
Embodiments of the present application provide a chip module and a circuit board. The chip module comprises: a chip; a heat dissipation metal sheet; a heat conduction layer located between the chip and the heat dissipation metal sheet, wherein the heat conduction material contained in the heat conduction layer is a phase change material layer or a thermal paste; and a fixing assembly used for maintaining the relative position of the heat dissipation metal sheet and the chip.
The present disclosure relates to a working voltage processing method and apparatus, an electronic device and a storage medium, which are applied to a processing module on a computing power board. The method comprises: collecting a working voltage of a load on a computing power board; determining whether the minimum working voltage of the load in the current time period exceeds a storage voltage or not, wherein the storage voltage is the minimum working voltage of the load in the historical time period; and in the case that the minimum working voltage in the current time period exceeds the storage voltage, updating the minimum working voltage of the current time period into the storage voltage, wherein the storage voltage is at least used for determining whether the load on the computing power plate works in the over-frequency state or not. According to the present disclosure, over-frequency identification can be realized by means of the working voltage of the load on the computing power board, the identification speed is high, the accuracy is high, and then the over-frequency of the computing power board can be avoided as much as possible.
Embodiments of the present disclosure provide a voltage monitoring method and apparatus, an electronic device and a storage medium. The voltage monitoring method comprises: acquiring a voltage value of the load on a hashboard; determining whether the voltage value is less than a first value; when the voltage value is less than the first value, performing power supply protection on a power supply according to the voltage value.
H02H 3/24 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à une baisse ou un manque de tension
87.
DYNAMIC LATCH, SEMICONDUCTOR CHIP, COMPUTING POWER BOARD, AND COMPUTING DEVICE
Provided in the present application are a dynamic latch, a semiconductor chip, a computing power board, and a computing device. The dynamic latch comprises a substrate; a data transmission unit, which is arranged in a first area of the substrate, and comprises a first transmission gate and a second transmission gate, wherein an input end of the first transmission gate is connected to an input end of the second transmission gate, and an output end of the first transmission gate is connected to an output end of the second transmission gate; and a data output unit, which is arranged in a second area of the substrate, and comprises a first inverter, an input end of the first inverter being connected to the output ends of the two transmission gates, wherein the first area is adjacent to the second area, and oxide diffusion in the two areas is continuous; and drain electrode areas of the two transmission gates are respectively located on two opposite sides in the first area, and source electrode areas of the two transmission gates are located between the drain electrode areas of the two transmission gates. A parasitic transistor cannot be parasitized in the dynamic latch, so as to eliminate electric leakage of the parasitic transistor, thereby ensuring that the logic of the dynamic latch is correct.
The present application provides a dynamic latch, a semiconductor chip, a computing power board, and a computing device. The dynamic latch comprises: a substrate; a transmission gate, disposed in a first region of the substrate; and a data output unit, disposed in a second region of the substrate and comprising a first inverter, an input end of the first inverter being connected to an output end of the transmission gate, wherein the first region is adjacent to the second region and oxide diffusion regions within the two regions are continuous. A source region of the first inverter is located on the side close to the first region in the second region, and a drain region of the first inverter is located on the side away from the first region in the second region. In a manufacturing manner for the semiconductor device, by means of the configuration that the source region of the first inverter in the dynamic latch is close to the transmission gate and the drain region is away from the transmission gate, the electric leakage caused by a parasitic transistor can be effectively reduced, so that it is ensured that the logic of the dynamic latch is correct.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 27/092 - Transistors à effet de champ métal-isolant-semi-conducteur complémentaires
A power distribution unit and a shelf system. The power distribution unit comprises: a terminal block (1) having an input end (11) for electric power, and a lead-out end (12) for electric power; at least one wiring board (2) electrically connected to the lead-out end (12), respectively; a plurality of power output terminal groups (3), each power output terminal group (3) consisting of at least one power output terminal (31), and each power output terminal (31) being electrically connected to the wiring board (2), respectively; and a plurality of switch mechanisms (4) provided so as to correspond to the power output terminal groups (3), the switch mechanisms (4) enabling the corresponding power output terminal groups (3) to be electrically connected to or disconnected from the wiring board (2).
A server (100), which is applicable to the technical field of electronic devices. The server (100) comprises a server body (110), a power supply (120), and a heat conduction layer (130), wherein the server body (110) comprises a case (111), a first circuit board assembly (112), and a heat dissipation fan assembly (113); the first circuit board assembly (112) is mounted in the case (111); and the heat dissipation fan assembly (113) is mounted on the case (111) for heat dissipation of the first circuit board assembly (112). The power supply (120) is mounted on one side of the case (111); and the heat conduction layer (130) is arranged between the power supply (120) and the case (111) for conducting heat generated by the power supply (120) to the case (111). The heat dissipation fan assembly (113) on the server body (110) dissipates heat generated by the power supply (120), thus avoiding the arrangement of a fan on the power supply (120), so that the power supply (120) maintains a good sealing performance; and problems such as corrosion of the power supply (120) and a high failure rate of the fan of the power supply (120) can be solved, thereby improving the reliability of the power supply (120), reducing the energy consumption and noise of a whole machine, improving the overall efficiency of the system, and lowering the cost.
The present application relates to the technical field of liquid cold servers, and discloses a connector, a connector assembly, a liquid cold plate, and a liquid cold server. The connector comprises a first connector body, a ball body, and a mesh baffle; annular raised parts are provided in the first connector body in a protruding manner; and the annular raised parts form an annular through hole; the ball body is provided in a hollow inner cavity and is limited by means of the annular raised parts and the mesh baffle; when a fluid enters from a first inlet, the ball body is away from the annular through hole to form an open channel; and when the fluid enters from a first outlet, the ball body blocks the annular through hole to form a closed channel. The connector assembly comprises a first connector and a second connector; the first connector is the connector above; the second connector comprises a notch elastic check ring used for dividing an elastic check ring into a plurality of blades; when the first connector is connected to the second connector, an ejector pin part props up the elastic check ring to form an open channel; and when being disconnected, the elastic check ring is closed to form a closed channel, so as to ensure that the fluid at the first connector and the fluid at the second connector do not splash.
The present application discloses a flow guide cover and a server having the same. The flow guide cover includes an annular frame, a flow directing member, an air collecting ring, a plurality of first air guide vanes and a plurality of second air guide vanes. The flow directing member is arranged inside the annular frame and comprises a first surface and a second surface which are arranged opposite to each other, the first surface having an area greater than that of the second surface. The air collecting ring is arranged surrounding an outer periphery of the flow directing member, located between the flow directing member and the annular frame, and spaced apart from the flow directing member and the annular frame respectively. When the flow guide cover of the present application is used in conjunction with a fan, heat can be dissipated more evenly.
A chip sorting method, comprising: step S401, a sorting machine (12) obtains position information of a current chip in a feeding tray (123); step S402, the sorting machine (12) determines grouping information of the current chip according to a mapping relationship between position information of a chip to be sorted in the feeding tray (123) and grouping information of the chip to be sorted; and step S403, the current chip is placed into a discharging tray (124) at a sorting position corresponding to the grouping information of the current chip, wherein the discharging tray (124) is configured to place one or more grouped chips. A chip sorting apparatus (700), comprising an obtaining module (701), a determination module (702), and a control module (703). A testing and sorting system (10), comprising a testing machine (11) and a sorting machine (12). A sorting machine (12), comprising a processor and a memory. A computer-readable storage medium, wherein the readable storage medium stores an executable program, and when the executable program is executed by the processor, the chip sorting method is implemented. The sorting machine (12) determines the grouping information of each chip according to the position of the chip on the feeding tray (123), and then places the chip into the corresponding discharging tray (124) without repeatedly testing the chip, such that the sorting of the grouped chips can be completed, and the test efficiency is improved.
B07C 5/34 - Tri en fonction d'autres propriétés particulières
B07C 5/344 - Tri en fonction d'autres propriétés particulières selon les propriétés électriques ou magnétiques
B07C 5/36 - Appareils trieurs caractérisés par les moyens qu'ils utilisent en vue de la distribution
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
The present application relates to the technical field of device heat dissipation, and specifically discloses a hashboard and a data processing device. The hashboard comprises a circuit board, a liquid cooling plate, and multiple heat-generating component sets. The circuit board has a first surface and a second surface opposite the first surface. A liquid flow channel is provided in the liquid cooling plate, the liquid flow channel having a liquid inlet and a liquid outlet. The liquid cooling plate is stacked on the first surface. The multiple heat-generating component sets are arranged on the second surface at intervals along an extension direction of the liquid flow channel, the positions of the multiple heat-generating component sets corresponding to positions of the liquid flow channel. At a position close to the liquid inlet, a liquid flow path between two adjacent heat-generating component sets is smaller than a liquid flow path between two adjacent heat-generating component sets close to the liquid outlet. The hashboard and the data processing device provided in the present application have excellent uniform temperature, cooling and heat dissipation performance, thereby ensuring the performance of heat-generating component sets on the hashboard, as well as the computing performance and service life of the data processing device.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01M 10/613 - Refroidissement ou maintien du froid
A supercomputing device, an in-place detection method for a computing power board (110), and a storage medium. The supercomputing device comprises: at least one computing power board (110), the computing power board (110) comprising a first-type signal pin (111) and a second-type signal pin (112), wherein the length of the first-type signal pin (111) is different from that of the second-type signal pin (112); a computing power board interface (120), wherein the computing power board (110) is inserted into the computing power board interface (120); a level detection circuit (130), the level detection circuit (130) being electrically connected to the computing power board interface (120); and a master control circuit (140), the master control circuit (140) being connected to the level detection circuit (130), wherein the level detection circuit (130) is used for detecting a first level signal corresponding to the first-type signal pin (111) and a second level signal corresponding to the second-type signal pin (112), and the master control circuit (140) determines in-place information of the computing power board (110) according to the first level signal and the second level signal. By means of the device, in-place information of the computing power board (110) can be accurately detected.
G06F 1/18 - Installation ou distribution d'énergie
G06F 11/22 - Détection ou localisation du matériel d'ordinateur défectueux en effectuant des tests pendant les opérations d'attente ou pendant les temps morts, p. ex. essais de mise en route
98.
DELAY MODULATION CIRCUIT AND METHOD, CHIP, AND SERVER
Disclosed in the present invention are a delay modulation circuit and method, a chip, and a server. The delay modulation circuit comprises: a delay circuit for outputting a delayed first pulse signal; a delay reference unit for outputting a corresponding second pulse signal according to a clock signal; a comparison signal generation unit for outputting a corresponding comparison signal according to the first pulse signal and the second pulse signal; and a control module for generating a corresponding control signal according to the comparison signal to adjust, according to the control signal, the delay time of the delay circuit for delay processing. The comparison signal represents a deviation between the first pulse signal and the second pulse signal to generate the corresponding control signal, and the current delay time of the delay circuit is adjusted according to the control signal to reduce the gap between the current delay time and preset delay time, thereby avoiding the distortion of the duty ratio of the first pulse signal generated by the delay circuit, and ensuring the accuracy of the first pulse signal.
H03K 5/134 - Dispositions ayant une sortie unique et transformant les signaux d'entrée en impulsions délivrées à des intervalles de temps désirés utilisant une chaîne de dispositifs actifs de retard avec des transistors à effet de champ
99.
ELECTRONIC DEVICE CONTROL METHOD AND APPARATUS, AND ELECTRONIC DEVICE AND STORAGE MEDIUM
Provided in the embodiments of the present disclosure are an electronic device control method and apparatus, and an electronic device and a storage medium. The electronic device control method comprises: selecting a target mode from optional modes of a fan of an electronic device, wherein the optional modes comprise a cleaning mode and a heat dissipation mode, in the cleaning mode, the fan provides at least two different air strengths, and in the heat dissipation mode, the fan provides a single air strength when a heat dissipation level is not switched; generating a control signal according to the target mode; and according to the control signal, controlling the fan to provide an air strength.
Provided in the embodiments of the present disclosure are an electronic device control method and apparatus, and an electronic device and a storage medium. The electronic device control method comprises: selecting a target mode from optional modes of a fan of an electronic device, wherein the optional modes comprise a cleaning mode and a heat dissipation mode, in the cleaning mode, the fan provides at least two different air strengths, and in the heat dissipation mode, the fan provides a single air strength when a heat dissipation level is not switched; generating a control signal according to the target mode; and according to the control signal, controlling the fan to provide an air strength.
