Systems, methods, and devices for measuring tilt and/or misalignment of one substrate with respect to a second substrate are disclosed, for example, using thin-film interference. For example, an apparatus may include a substrate having a plurality of pedestals, each having a predefined height. A portion of the plurality of pedestals may be configured to engage and distance the substrate from a second underlying substrate. The plurality of pedestals may be further configured to indicate an alignment of the substrate with the underlying second substrate based on a spectrum of light emitted from the plurality of pedestals.
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p. ex. marques de repérage, schémas de test
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
G01B 11/27 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des angles ou des cônesDispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes pour tester l'alignement des axes
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p. ex. automatique
Systems, methods, and devices for measuring tilt and/or misalignment of one substrate with respect to a second substrate are disclosed, for example, using thin-film interference. For example, an apparatus may include a substrate having a plurality of pedestals, each having a predefined height. A portion of the plurality of pedestals may be configured to engage and distance the substrate from a second underlying substrate. The plurality of pedestals may be further configured to indicate an alignment of the substrate with the underlying second substrate based on a spectrum of light emitted from the plurality of pedestals.
G01B 11/27 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des angles ou des cônesDispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes pour tester l'alignement des axes
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
Systems, apparatuses, and methods for detachable fiber connector (FC) for optical coupling based on a coarse alignment and fine alignment are described. A photonic plug may be horizontally inserted into a receptacle and coarsely aligned with a photonic integrated circuit (PIC). The photonic plug may be moved vertically in the direction of the PIC. First fine alignment features, of the photonic plug, may engage second fine alignment features, associated with the PIC, aligning the photonic plug and the PIC. Systems, Mechanisms, and methods for retaining and for releasing the detachable connectors are also described.
Electro-optical systems and methods are described including a photonic substrate optically coupled to a photonic integrated circuit (PIC). The photonic substrate and the PIC may comprise one or more optical elements. A mechanical aligner may be coupled to the photonic substrate. The mechanical aligner may be configured to align an optical element (e.g., optical fiber) to optically couple the optical element to the PIC via the one or more optical elements.
Apparatus and method for detachably connecting at least one optical fiber of a detachable photonic plug to a photonic integrated circuit (PIC). The apparatus may include a receptacle configured to receive a detachable photonic plug configured to couple at least one optical fiber to a photonic integrated circuit (PIC); and a photonic bump of the PIC, the photonic bump may include a least one fine alignment feature. The method may include mounting a receptacle over at least a portion of the PIC; after completion of the mounting, inserting the detachable photonic plug into the receptacle; and after the detachable photonic plug is inserted in the receptacle, securing the detachable photonic plug in the receptacle.
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
Optical connectors are described. The optical connectors may be configured to couple light beams and signals between optical components, for example, waveguides, optical fibers, transceivers, etc. The optical connectors may be configured to couple light beams with a transceiver of a photonic substrate. The connector may comprise a curved mirror. The curved mirror may be configured to interface light beams between an optical focusing element of the photonic substrate and a transceiver of the photonic substrate. A mode of the light beams may be converted.
Systems, apparatuses, and methods for optical and electrical packaging of semiconductor dies are disclosed. The semiconductor packages may include a first semiconductor die and a second semiconductor die. A spacer may be disposed between the first and second semiconductor dies. The spacer may enable electrical and optical connection of the first and second semiconductor dies. The package may further include an optical fiber connected to one or more of the first or second semiconductor dies. The optical and electrical schemes used herein may enable compact, and convenient packaging of electronically and optically connected components.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
Systems, apparatuses, and methods are described for semiconductor substrate probing and testing. Specifically, systems, apparatuses, and methods are described for electrically probing and optically probing a substrate in parallel. The parallel probing is enabled by a surface coupling optical arrangement utilizing a photonic bump.
Systems, apparatuses, and methods for detachable fiber connector (FC) for optical coupling based on a coarse alignment and fine alignment are described. A photonic plug may be horizontally inserted into a receptacle and coarsely aligned with a photonic integrated circuit (PIC). The photonic plug may be moved vertically in the direction of the PIC. First fine alignment features, of the photonic plug, may engage second fine alignment features, associated with the PIC, aligning the photonic plug and the PIC. Systems, Mechanisms, and methods for retaining and for releasing the detachable connectors are also described.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/38 - Moyens de couplage mécaniques ayant des moyens d'assemblage fibre à fibre
H01L 31/0232 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails Éléments ou dispositions optiques associés au dispositif
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01S 5/02251 - Découplage de lumière utilisant des fibres optiques
H01S 5/02326 - Dispositions pour le positionnement relatif des diodes laser et des composants optiques, p. ex. rainures dans le support pour fixer des fibres optiques ou des lentilles
H01S 5/02325 - Composants intégrés mécaniquement aux éléments de montage ou aux micro-bancs optiques
Systems, apparatuses, and methods for detachable fiber connector (FC) for optical coupling based on a coarse alignment and fine alignment are described. A photonic plug may be horizontally inserted into a receptacle and coarsely aligned with a photonic integrated circuit (PIC). The photonic plug may be moved vertically in the direction of the PIC. First fine alignment features, of the photonic plug, may engage second fine alignment features, associated with the PIC, aligning the photonic plug and the PIC. Systems, Mechanisms, and methods for retaining and for releasing the detachable connectors are also described.
Apparatus, system and method for optical coupling, optical integration, electro optical coupling, and electro-optical packaging describe propagation of optical signal through optical coupler via series of mirrors or reflectors. The apparatus, system and method for optical coupling comprising: a first optical waveguide; a first turning mirror proximate to the first optical waveguide configured to redirect an optical signal from the first optical waveguide; a first curved mirror configured to substantially collimate the optical signal from the first turning mirror; a second curved mirror configured to focus the substantially collimated optical signal from the first curved mirror; and a second optical waveguide configured to receive the optical signal.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic and optical communications instruments and components, namely, optical data links; Electronic and optical communications instruments and components, namely, optical receivers; Electronic and optical communications instruments and components, namely, optical transceivers; Electronic and optical communications instruments and components, namely, optical transmitters; Optical semiconductors; Semiconductor chip sets for use in integrated photonics applications; Semiconductor chips; Semiconductor devices; Semiconductor wafers
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
G02B 6/43 - Dispositions comprenant une série d'éléments opto-électroniques et d'interconnexions optiques associées
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
G02B 6/38 - Moyens de couplage mécaniques ayant des moyens d'assemblage fibre à fibre
G02B 6/138 - Circuits optiques intégrés caractérisés par le procédé de fabrication en utilisant la polymérisation
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 6/34 - Moyens de couplage optique utilisant des prismes ou des réseaux
22.
METHOD OF MAKING AND USING A BACKSIDE OPTICAL COUPLER FOR COUPLING OF SINGLE-MODE FIBER TO A SILICON PHOTONICS CHIP
A method comprising: stamping imprint material that was deposited on a silicon photonics (SiPh) chip and at least in a cavity thereof to form a curved mirror shape and a tilted flat mirror shape; coating at least a portion of each the curved mirror shape and the tilted flat mirror shape with a reflective material to form a first curved mirror and first tilted flat mirror; and mounting the SiPh chip in a flip-chip orientation to a substrate.
A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
G02B 6/38 - Moyens de couplage mécaniques ayant des moyens d'assemblage fibre à fibre
G02B 6/138 - Circuits optiques intégrés caractérisés par le procédé de fabrication en utilisant la polymérisation
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 6/34 - Moyens de couplage optique utilisant des prismes ou des réseaux
24.
METHOD OF MAKING AND USING A BACKSIDE OPTICAL COUPLER FOR COUPLING OF SINGLE-MODE FIBER TO A SILICON PHOTONICS CHIP
A method comprising: stamping imprint material that was deposited on a silicon photonics (SiPh) chip and at least in a cavity thereof to form a curved mirror shape and a tilted flat mirror shape; coating at least a portion of each the curved mirror shape and the tilted flat mirror shape with a reflective material to form a first curved mirror and first tilted flat mirror; and mounting the SiPh chip in a flip-chip orientation to a substrate.
A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.
Electro-optical systems and methods are described including a photonic substrate optically coupled to a photonic integrated circuit (PIC). The photonic substrate and the PIC may comprise one or more optical elements. A mechanical aligner may be coupled to the photonic substrate. The mechanical aligner may be configured to align an optical element (e.g., optical fiber) to optically couple the optical element to the PIC via the one or more optical elements.
Apparatus and method for detachably connecting at least one optical fiber of a detachable photonic plug to a photonic integrated circuit (PIC). The detachable photonic plug comprises: a detachable plug die; an optically transparent spacer coupled to the detachable plug die; and at least one optical fiber held between the detachable plug die and the spacer. On the PIC side, apparatus includes a receptacle adapted to receive a detachable photonic plug adapted to couple at least one optical fiber to a photonic integrated circuit (PIC); and a photonic bump of the PIC, the photonic bump having a least one fine alignment feature. The method comprises permanently mounting a receptacle over at least a portion of the PIC; after completion of mounting, inserting the detachable photonic plug into the receptacle; and after the detachable photonic plug is inserted in the receptacle, securing the detachable photonic plug in the receptacle.
Apparatus and method for detachably connecting at least one optical fiber of a detachable photonic plug to a photonic integrated circuit (PIC). The detachable photonic plug comprises: a detachable plug die; an optically transparent spacer coupled to the detachable plug die; and at least one optical fiber held between the detachable plug die and the spacer. On the PIC side, apparatus includes a receptacle adapted to receive a detachable photonic plug adapted to couple at least one optical fiber to a photonic integrated circuit (PIC); and a photonic bump of the PIC, the photonic bump having a least one fine alignment feature. The method comprises permanently mounting a receptacle over at least a portion of the PIC; after completion of mounting, inserting the detachable photonic plug into the receptacle; and after the detachable photonic plug is inserted in the receptacle, securing the detachable photonic plug in the receptacle.
A wideband photonic bump (WBB), including: a positive taper of a polymer waveguide configured to further expand a light beam from an inverse taper to match a fiber optical mode of an optical fiber; a curved mirror formed on a surface of the WBB configured to reflect a light beam from the optical fiber; and a tilted flat mirror configured to direct the reflected light beam to an external optical fiber, wherein the WBB is coupled on the surface of a photonic integrated circuit (PIC).
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
An optical mode coupler for mode coupling of waveguides. The optical mode coupler includes an oxide cladding layer, a waveguide channel formed on the oxide cladding layer, and a waveguide portion formed on the oxide cladding layer and partially enclosed by the waveguide channel on an end of the waveguide portion. The waveguide portion has a tapered region located on the end of the waveguide portion. The tapered region has a dual-plane tapering arrangement extending from the waveguide portion towards the waveguide channel for enhanced mode transformation efficiency.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
An electro-optical system, and method for making the electro-optical system. The electro-optical system includes a Photonic Integrated Circuit (PIC) having a laser source located on the PIC, a fiberless optical coupler located on the PIC. The fiberless optical coupler is configured to be coupled to a fiber array. The electro-optical system also includes an optical element, and a mechanical aligner. The optical element is aligned with the fiber array, via the mechanical aligner, for a light from the laser source to transmit in between the fiber array and the PIC through the optical element, when the fiberless optical coupler is coupled to the fiber array.
A wideband photonic bump (WBB), including: a positive taper of a polymer waveguide configured to further expand a light beam from an inverse taper to match a fiber optical mode of an optical fiber; a curved mirror formed on a surface of the WBB configured to reflect a light beam from the optical fiber; and a tilted flat mirror configured to direct the reflected light beam to an external optical fiber, wherein the WBB is coupled on the surface of a photonic integrated circuit (PIC).
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
A wideband photonic bump (WBB), including: a positive taper of a polymer waveguide configured to further expand a light beam from an inverse taper to match a fiber optical mode of an optical fiber; a curved mirror formed on a surface of the WBB configured to reflect a light beam from the optical fiber; and a tilted flat mirror configured to direct the reflected light beam to an external optical fiber, wherein the WBB is coupled on the surface of a photonic integrated circuit (PIC).
An electro-optical interconnection platform is provided. The platform includes an interface medium; a plurality of optical pads; a plurality of electrical pads; and at least one beam coupler adapted to optically couple at least one pair of optical pads of the plurality of optical pads, wherein the at least one pair of optical pads are placed on opposite sides of the interface medium.
An optical connector for optical coupling a plurality of optical fibers to a photonic integrated circuit (PIC) comprises a plurality of fiber trenches; a plurality of tiled flat mirrors; and a plurality of optical focusing elements; wherein each of the plurality of fiber trenches adjoins a corresponding titled flat mirror of the plurality of titled flat mirrors; and wherein each of the plurality of titled flat mirrors is placed in proximity to a corresponding optical focusing element of the plurality of optical focusing elements.
An electro-optical interconnection platform is provided. The platform includes an interface medium; a plurality of optical pads; a plurality of electrical pads; and at least one beam coupler adapted to optically couple at least one pair of optical pads of the plurality of optical pads, wherein the at least one pair of optical pads are placed on opposite sides of the interface medium.
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
An optical coupler for coupling an optical fiber to a photonic integrated circuit (PIC) is presented. The optical coupler comprises a first curved mirror included in a first substrate layer of the PIC and at a first predefined lateral distance from an optical transceiver associated with the PIC; a second curved mirror included in a second substrate layer and placed at a second predefined lateral distance from the optical fiber; and a spacer located between the first substrate layer and the second substrate layer.
An optical coupler for coupling an optical fiber to a photonic integrated circuit (PIC) is presented. The optical coupler comprises a first curved mirror included in a first substrate layer of the PIC and at a first predefined lateral distance from an optical transceiver associated with the PIC; a second curved mirror included in a second substrate layer and placed at a second predefined lateral distance from the optical fiber; and a spacer located between the first substrate layer and the second substrate layer.
