A heat transfer arrangement for use with an immersion cooling system. A support is configured to contact a heat transfer device such as a vapor chamber or spreader plate to stiffen the heat transfer device and urge the heat transfer device into contact with a heat generating device. The support includes an arm that has a first portion that extends toward a central area of the heat transfer device over and out of contact with the heat transfer device and a second portion that contacts the heat transfer device within the central area. The arm can avoid contact with the heat transfer device, including surfaces having a boiling enhancement coating configured to transfer heat to a cooling liquid.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28F 13/18 - Dispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution par application de revêtements, p. ex. absorbant les radiations ou les réfléchissantDispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution par application d'un traitement de surface, p. ex. un polissage
A liquid cooled heat exchanger includes first and second heat exchange chambers that are in thermal communication. The first heat exchange chamber is downstream of the second heat exchanges chamber and receives heat from a heat generating device, such as an electronic circuit. Heat in the first heat exchange chamber can be transferred to the second heat exchange chamber to increase the temperature of a subcooled liquid working fluid in the second heat exchange chamber. This can render a pressure drop across the heat exchanger that is relatively insensitive to a fraction of liquid that is vaporized in the first heat exchange chamber.
A liquid cooled heat exchanger includes first and second heat exchange chambers that are in thermal communication. The first heat exchange chamber is downstream of the second heat exchanges chamber and receives heat from a heat generating device, such as an electronic circuit. Heat in the first heat exchange chamber can be transferred to the second heat exchange chamber to increase the temperature of a subcooled liquid working fluid in the second heat exchange chamber. This can render a pressure drop across the heat exchanger that is relatively insensitive to a fraction of liquid that is vaporized in the first heat exchange chamber.
A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes
A heat sink for use in an immersion cooling system that includes a sintered powder structure enclosed in a porous enclosure. The porous enclosure has openings, e.g., formed by a mesh, with a size to help contain sintered powder particles that may be dislodged during operation of the heat sink.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/44 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température le dispositif complet étant totalement immergé dans un fluide autre que l'air
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
A heat sink for use in an immersion cooling system that includes a sintered powder structure enclosed in a porous enclosure. The porous enclosure has openings, e.g., formed by a mesh, with a size to help contain sintered powder particles that may be dislodged during operation of the heat sink.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
F28D 1/02 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28F 3/06 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations les moyens pouvant être fixés sur l'élément
H01L 23/44 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température le dispositif complet étant totalement immergé dans un fluide autre que l'air
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
8.
METHOD AND APPARATUS FOR FORMING LIQUID FILLED HEAT TRANSFER DEVICE
A heat transfer device includes three plates sandwiched together to form a vapor chamber or similar device. The three plates may be sealingly joined at a closed periphery to define a closed volume that contains a working fluid. One or more of the three plates may include structure to support capillary or other working fluid flow in the closed volume, e.g., a center plate may include openings and/or other structure to permit working fluid flow through and/or along the plate. An outer one of the plates may include an opening through which working fluid may be introduced into the closed volume. After filling with working fluid, the plates may be sealingly joined at one or more joints that extend chordwise across the closed periphery, e.g., so a portion of the plate that defines the opening can be removed from the device.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
9.
Method and apparatus for forming liquid filled heat transfer device
A heat transfer device includes three plates sandwiched together to form a vapor chamber or similar device. The three plates may be sealingly joined at a closed periphery to define a closed volume that contains a working fluid. One or more of the three plates may include structure to support capillary or other working fluid flow in the closed volume, e.g., a center plate may include openings and/or other structure to permit working fluid flow through and/or along the plate. An outer one of the plates may include an opening through which working fluid may be introduced into the closed volume. After filling with working fluid, the plates may be sealingly joined at one or more joints that extend chordwise across the closed periphery, e.g., so a portion of the plate that defines the opening can be removed from the device.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations
F28F 3/08 - Éléments construits pour être empilés, p. ex. pouvant être séparés pour leur nettoyage
A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.
F28F 13/06 - Dispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution en affectant le mode d'écoulement des sources de potentiel calorifique
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Providing temporary use of non-downloadable cloud-based software for the thermal aspects of product design, for use in running simulations of product thermal performance and thermal management, and for providing recommendations for thermal solutions for such products
12.
Thermosiphon with multiport tube and flow arrangement
A thermosiphon device includes one or more flat multiport tube structures having at least one section that defines a plurality of flow channels and at least one web that extends from the section in a plane of the flat multiport tube structures. The flow channels may function as condensing channels, e.g., in a counterflow device, or as evaporation channels. A multiport tube structure may include two sections that each define a plurality of flow channels and the two sections may be joined by a web that extends between the sections in the plane of the multiport tube structure. The sections may function as condensing channels, as evaporation channels, or one section may function as a set of evaporation channel and the other section may function as a set of condensing channels. Multiport tube sections may alternately function as a vapor supply path or liquid return path.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 1/053 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide avec canalisations tubulaires les canalisations étant rectilignes
F28F 1/12 - Éléments tubulaires ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des saillies, avec des évidements ces moyens étant uniquement à l'extérieur de l'élément tubulaire
A thermosiphon device includes an evaporator section that is formed as a single integrated part including one or more evaporation channels and a liquid return path, and/or includes a condenser section that is formed as a single integrated part including one or more condensing channels and a vapor supply path. A single manifold may include vapor and liquid chambers that are separate from each other and that fluidly connect evaporation channels with the vapor supply path and fluidly connect condensing channels with the liquid return path, respectively. Portions of the evaporator or condenser section that define the liquid return path or vapor supply path, respectively, may be free of any fins or other thermal transfer structure.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
H01L 23/367 - Refroidissement facilité par la forme du dispositif
37 - Services de construction; extraction minière; installation et réparation
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Cold plates; cooling loops for cooling apparatus; heat sinks for cooling or heating apparatus; heat exchangers; manifolds and cooling distribution units for heat removal. Installation of heat removal and cooling systems. Design of heat removal and cooling systems; development of heat removal and cooling systems.
37 - Services de construction; extraction minière; installation et réparation
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Cold plates; cooling loops for cooling apparatus; heat sinks for cooling or heating apparatus; heat exchangers; manifolds and cooling distribution units for heat removal. Installation of heat removal and cooling systems. Design of heat removal and cooling systems; development of heat removal and cooling systems.
A fluid mover includes a chamber with one or more outlet openings, first and/or second fluidic diaphragm(s) having a fluid-moving portion movable in the chamber to cause fluid to move at the outlet opening, and a coil assembly magnetically coupled to the fluidic diaphragm to move the movable portion of the fluidic diaphragm(s) in response to a current in the coil. A spring portion of the fluidic diaphragm(s) may be separate from the fluid-moving portion and be arranged to exert a spring bias on the fluid-moving portion. The spring portion may include two or more spring elements that each includes a chord portion and a radial portion. The chord portion may be attached to the chamber housing at opposite ends, and the radial portion may extend radially inward from the chord portion from an intermediate point between the opposite ends to a center of the diaphragm.
A thermosiphon device includes one or more flat multiport tube structures having at least one section that defines a plurality of flow channels and at least one web that extends from the section in a plane of the flat multiport tube structures. The flow channels may function as condensing channels, e.g., in a counterflow device, or as evaporation channels. A multiport tube structure may include two sections that each define a plurality of flow channels and the two sections may be joined by a web that extends between the sections in the plane of the multiport tube structure. The sections may function as condensing channels, as evaporation channels, or one section may function as a set of evaporation channel and the other section may function as a set of condensing channels. Multiport tube sections may alternately function as a vapor supply path or liquid return path.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 1/053 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide avec canalisations tubulaires les canalisations étant rectilignes
A thermosiphon device (1) including one or more multi-port tubes (5) that form both an evaporator section (11) and a condenser section (10) for the device. The one or more tubes may be flat tubes with multiple, parallel flow channels, and may be bent to form a bend (13) between the evaporator and condenser sections of the tube(s). One or more flow channels (22) of the tube at the bend may provide a vapor flow path or a liquid flow path between the evaporator and condenser sections.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
A thermosiphon device including one or more multi-port tubes that form both an evaporator section and a condenser section for the device. The one or more tubes may be flat tubes with multiple, parallel flow channels, and may be bent to form a bend between the evaporator and condenser sections of the tube(s). One or more flow channels of the tube at the bend may provide a vapor flow path or a liquid flow path between the evaporator and condenser sections.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
21.
EVAPORATOR AND CONDENSER SECTION STRUCTURE FOR THERMOSIPHON
A thermosiphon device (10) includes a closed loop evaporator section (2) having one or more evaporation channels (22) that are fed by a liquid return path (21), and a condenser section (1) with one or more condensing channels (12). The condenser section may include a vapor supply path (11) that is adjacent one or more condensing channels, e.g., located between two sets of condensing channels. Evaporator and/or condenser sections may be made from a single, flat bent tube, which may be bent about an axis parallel to the plane of the flat tube to form a turnaround and/or twisted about an axis along a length of the tube at the tube ends. A single tube (25) may form both evaporator and condenser sections of a thermosiphon device, and an axially extending wall (23) inside the tube in the evaporator section may separate an evaporator section from a liquid return section.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
A thermosiphon device includes an evaporator section that is formed as a single integrated part including one or more evaporation channels and a liquid return path, and/or includes a condenser section that is formed as a single integrated part including one or more condensing channels and a vapor supply path. A single manifold may include vapor and liquid chambers that are separate from each other and that fluidly connect evaporation channels with the vapor supply path and fluidly connect condensing channels with the liquid return path, respectively. Portions of the evaporator or condenser section that define the liquid return path or vapor supply path, respectively, may be free of any fins or other thermal transfer structure.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
23.
PLANAR COIL AND SUPPORT FOR ACTUATOR OF FLUID MOVER
A fluid mover includes a chamber with one or more outlet openings, first and/or second fluidic diaphragm(s) having a portion movable in the chamber to cause fluid to move at the outlet opening, and a coil assembly magnetically coupled to the fluidic diaphragm to move the movable portion of the fluidic diaphragm(s) in response to a current in the coil. The coil assembly includes a coil with an opening, and a plug may be positioned in the opening and/or a support may be positioned around a periphery of the coil. The plug and/or the support may have a magnetic permeability greater than one and be arranged so magnetic field lines created by the coil pass through the plug and/or support. The coil, plug and/or support may define a flat surface, e.g., such that a uniform gap is present between the diaphragm(s) and the coil, plug and/or support.
A fluid mover includes a chamber with one or more outlet openings, first and/or second fluidic diaphragm(s) having a portion movable in the chamber to cause fluid to move at the outlet opening, and a coil assembly magnetically coupled to the fluidic diaphragm to move the movable portion of the fluidic diaphragm(s) in response to a current in the coil. The coil assembly includes a coil with an opening, and a plug may be positioned in the opening and/or a support may be positioned around a periphery of the coil. The plug and/or the support may have a magnetic permeability greater than one and be arranged so magnetic field lines created by the coil pass through the plug and/or support. The coil, plug and/or support may define a flat surface, e.g., such that a uniform gap is present between the diaphragm(s) and the coil, plug and/or support.
H02K 33/16 - Moteurs avec un aimant, un induit ou un système de bobines à mouvement alternatif, oscillant ou vibrant avec des induits polarisés se déplaçant dans des directions opposées par inversion de la tension appliquée au système à une seule bobine
F04B 45/04 - Pompes ou installations de pompage, ayant des organes de travail flexibles, spécialement adaptées pour fluides compressibles ayant des organes flexibles du genre plat, p. ex. des diaphragmes
F04B 43/04 - Pompes ayant un entraînement électrique
25.
HEAT SINK ASSEMBLY WITH FRAME CLIP FOR FULLY ASSEMBLED ATTACHMENT TO HEAT GENERATING COMPONENT
An assembly for engaging a heat sink with an electrical component heat source includes a first retaining device with a frame that defines an opening to receive at least a portion of the heat sink and/or the heat source. The frame may be assembled with a heat sink and a retainer element arranged to resiliently bias the heat sink into contact with the heat source, and thereafter the heat sink assembly may be engaged with a heat source. A contact plate of the heat sink may be positioned into the opening of the frame from a top of the frame, i.e., inserted in a top-down direction, and the frame may be arranged for engagement with a tool to mount the fully assembled heat sink, frame and retainer element combination to the heat source.
A diaphragm (2) for a fluid mover, such as a synthetic jet device, includes separate concentric substrate sections (2a, 2b). The substrate sections (2a, 2b) may be joined together by a resilient material at a junction (16) between the sections (2a, 2b), and the sections (2a, 2b) may include intermeshed cantilever tabs (18). The substrate sections (2a, 2b) may be joined to resist pressure-induced ballooning or similar deformation, yet allow for relatively large axial deformation. A fluid mover comprising such a diaphragm (2) is also disclosed.
F04B 43/00 - "Machines", pompes ou installations de pompage ayant des organes de travail flexibles
F04B 45/04 - Pompes ou installations de pompage, ayant des organes de travail flexibles, spécialement adaptées pour fluides compressibles ayant des organes flexibles du genre plat, p. ex. des diaphragmes
F04B 43/02 - "Machines", pompes ou installations de pompage ayant des organes de travail flexibles ayant des organes flexibles du genre plat, p. ex. des diaphragmes
Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.
B25G 3/00 - Fixation des manches sur les ustensiles
F16D 1/00 - Accouplements pour établir une liaison rigide entre deux arbres coaxiaux ou d'autres éléments mobiles d'une machine
F28F 9/26 - Dispositions pour raccorder des sections différentes des éléments d'échangeurs de chaleur, p. ex. de radiateur
H01L 23/40 - Supports ou moyens de fixation pour les dispositifs de refroidissement ou de chauffage amovibles
B23P 15/26 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'échangeurs de chaleur
F16B 21/12 - Dispositifs sans filetage pour empêcher le mouvement relatif selon l'axe d'une broche, d'un ergot, d'un arbre ou d'une pièce analogue par rapport à l'organe qui l'entoureFixations à ergots et douilles largables sans filetage à parties séparées par goupilles d'arrêt ou goupilles fendues enfoncées dans des trous
F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations
F16B 21/06 - Dispositifs de fixation largables à action rapide
F16B 21/08 - Dispositifs de fixation largables à action rapide dans lesquels la broche ou l'ergot ont une partie élastique
28.
SYSTEM AND METHOD FOR COOLING HEAT GENERATING COMPONENTS
An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
A system and method for deploying a heat harvesting system and for harvesting heat from a geothermal well using one or more heat pipes. A heat exchanger may receive heat from one or more heat pipes for transfer to a heat receiving component. The heat pipes may be thermally coupled to the heat exchanger via a thermal gap material having a relatively low thermal conductivity. A mounting component may engage heat pipes and define a thermal gap between the heat pipes and heat exchanger. A heat spreader, having a relatively high thermal conductivity, may be used to transfer heat from the heat pipes to the thermal gap material and help define a working temperature for the heat pipes. A heat pipe deployment system may include anti-buckling supports and/or a guide to help keep the heat pipes from buckling and to guide the heat pipes into corresponding well bores during deployment.
A thermal transfer device comprising a thermal transfer surface and a passageway for conducting a thermal transfer fluid from an inlet to an outlet while passing in thermal contact with the thermal transfer surface. The passageway has at least two spiral passages and a connection channel connecting the at least two spiral passages to permit flow of the heat transfer fluid from a first spiral passage to a second spiral passage; thereby forming a path for the flow of the thermal fluid from the inlet, through the passageway, along the first spiral passage to the connection channel, then along the connection channel to the second spiral passage, and then to the outlet.
F28D 7/02 - Appareils échangeurs de chaleur comportant des ensembles de canalisations tubulaires fixes pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation les canalisations étant enroulées en hélice
F28D 9/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes en forme de plaques ou de laminés pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation
F28F 3/06 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations les moyens pouvant être fixés sur l'élément
F28F 13/12 - Dispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution en affectant le mode d'écoulement des sources de potentiel calorifique en créant une turbulence, p. ex. par brassage, par augmentation de la force de circulation
F28F 1/40 - Éléments tubulaires ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des saillies, avec des évidements les moyens étant uniquement à l'intérieur de l'élément tubulaire
F28F 3/08 - Éléments construits pour être empilés, p. ex. pouvant être séparés pour leur nettoyage
F28F 1/36 - Éléments tubulaires ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des saillies, avec des évidements ces moyens étant uniquement à l'extérieur de l'élément tubulaire et s'étendant obliquement les moyens étant des ailettes enroulées en hélice ou des spirales de fils
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes
An assembly for engaging a heat sink with an electrical component heat source includes a first retaining device with a frame that defines an opening to receive at least a portion of the heat sink and/or the heat source. The frame may form an interrupted loop around the opening with first and second free ends that are movable to adjust a size of the opening. Movement of the free ends may be performed by hand, and without the use of tools, allowing for tool free engagement/disengagement with the heat source. The free ends or other portion of the first retaining device may be engaged by a second retaining device to keep the first retaining device engaged with the heat source and/or heat sink. The second retaining device may also, or alternately, engage with the first retaining device to resiliently bias the heat sink into contact with the heat source.
Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.
A thermal transfer device including a thermally conductive support structure to be secured to a substrate having at least two types of heat sources. The support structure has a plurality of apertures, one for each first heat source. Each aperture accommodates an individual heat sink configured to make thermal contact with a first heat source. Each heat sink fits in its aperture, and is attached to the support structure by at least one spring mount for holding the heat sink in place. Preferably, the spring mount includes a plurality of springs disposed about the heat sink to provide a balanced downward force on the heat sink. The support structure has a bottom surface receiving a thermal transfer medium to provide thermal contact between the second heat sources and the support structure, thereby allowing for dissipation of the heat generated by the second heat sources through the support structure.
A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states.
A thermal transfer device comprising a thermal transfer surface and a passageway for conducting a thermal transfer fluid from an inlet to an outlet while passing in thermal contact with the thermal transfer surface. The passageway has at least two spiral passages and a connection channel connecting the at least two spiral passages to permit flow of the heat transfer fluid from a first spiral passage to a second spiral passage; thereby forming a path for the flow of the thermal fluid from the inlet, through the passageway, along the first spiral passage to the connection channel, then along the connection channel to the second spiral passage, and then to the outlet.
F28D 9/04 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes en forme de plaques ou de laminés pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation les canalisations étant formées par des plaques ou des laminés enroulés en spirale
An assembly for a heat sink having a contact plate with opposing first and second faces, a plurality of fins extending from the first face of the contact plate, and a plurality of gaps between the fins. A retaining device has a first pair of opposing sides and a second pair of opposing sides, the first and second pairs of opposing sides surrounding an opening, the first pair of opposing sides having primary framing members, at least some of the primary framing members having a first end at a respective side and a distal free end, with at least one engagement member positioned proximate the distal free ends. The primary framing members define a receiving space for the heat sink. A metal spring is configured in a closed shape cross-section for engagement with the retaining device. The metal spring has a pair of elongated sides, a pair of truncated sides and heat sink engagement regions. The heat sink engagement regions are positioned against the contact plate when the metal spring is engaged with the retaining device, to urge the contact plate towards the engagement members. The assembly is particularly well suited for use with ball grid array packages to interface electronic components in such packages with the heat sink.
A fluid-cooled heat sink (1) for electronic components having a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid. The heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5). The heat sink (1) having a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).
A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface.
A fluid energy transfer device, including a chamber for receiving a fluid, at least a portion of the chamber comprising a movable portion relative to another portion of the chamber, the movable portion being adapted to change the volume of the chamber from a first volume to a second volume by movement of the movable portion. The device further includes an actuator attached to the movable portion, wherein the displacements of the movable portion can be larger than the displacement of the actuator.
F04B 17/00 - Pompes caractérisées par leur combinaison avec des machines motrices ou moteurs particuliers qui les entraînent ou par leur adaptation à ceux-ci
Photovoltaic solar panels are cooled below ambient air temperature with a positive energy balance using a cooling fluid flowing through a flat chamber of substantially uniform thickness provided against the back surface of each panel. The chamber thickness and other dimensions of the flat chamber are chosen so that, for a predetermined mass flow rate through the chamber in a given temperature range, a laminar flow regime is maintained. Obstacles which provide varying flow patterns may be provided in the chamber to disturb the boundary layer and improve heat transfer to the fluid. Since laminar flow minimizes the energy required to. move the fluid, there is very little parasitic drain of the power produced by the solar panel.
F24J 2/10 - munis de réflecteurs comme éléments de concentration
H01L 31/052 - Moyens de refroidissement directement associés ou intégrés à la cellule PV, p.ex. éléments Peltier intégrés pour refroidissement actif ou puits thermiques directement associés aux cellules PV
A fluid-cooled heat sink (1) for electronic components comprises a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid; the heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5); the heat sink (1) comprising a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).
