The present invention includes a system and method for three-dimensional imaging and analysis of electronic components. Specifically, it permits rapid and reliable inspection of the lead foot angle in integrated circuit packages. A first image capturing device, a second image capturing device and a third image capturing device are arranged in a "corner shape" or "L-shape." The first image capturing device forms the corner and obtains an image of the bottom of the component. The perspective viewing angle of the second image capturing device and the perspective viewing angle of the third image capturing device are orthogonal to each other to allow accurate three-dimensional reconstruction of the lead angles and detection of flaws or bends.
The present disclosure provides a system and method to convert three- dimensional data into a two-dimensional height displacement map and extract the three- dimensional features and dimensions of a three-dimensional object using a two- dimensional image processing technique. An illumination source of the system scans across the workspace using a line laser and generates a two-dimensional height displacement map of the workspace. The individual pixel location represents an actual workspace sampled location. The pixel gray scale intensity represents the Z displacement height at the pixel location. A processing device processes the features and dimensions within two-dimensional image as a gray scale using two-dimensional image processing such as pattern match, blob, convolution and edge detection.
A method and apparatus for determining coplanarity of three-dimensional features on a substrate comprises a support for an object to be inspected in an object plane, a light source for illuminating the object, a first image capturing device having a first sensor and a first tiltable lens, a second image capturing device having a second sensor and a second tiltable lens, and an image processor to determine the coplanarity. Each tiltable lens is movable from a first variable angle to a second variable angle, with respect to its sensor, so that the respective lens plane and its sensor plane substantially intersect at the object plane in accordance with the Scheimpflug principle and the respective image is in focus across the whole field of view and of uniform light intensity.
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G02B 7/04 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement
The invention provides a die ejector (300) and a method for die alignment and ejection using said die ejector (300) during semiconductor packaging process. The die ejector (300) comprises an ejector housing (320), a needle holder (340), a plurality of ejector needles (360), and an illuminating unit (370). The illuminating unit (370), attached to the ejector housing (320), comprises a plurality of light sources (372) and a light reflective coating (374). The light emitted by the light sources (372) is directed by the light reflective coating (374) towards the lower side of a wafer (307) disposed on an adhesive film (303) above a wafer table (304). The image of the illuminated wafer (307) is captured by a vision inspection unit (480) located above the wafer (307), and is used for adjusting the position and orientation of the wafer before die ejection.
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
5.
METHOD AND APPARATUS FOR 3-DIMENSIONAL VISION AND INSPECTION OF BALL AND LIKE PROTRUSIONS OF ELECTRONIC COMPONENTS
A method for 3-dimensional vision inspection of objects, such as microelectronic components, which have protrusions as features to be inspected, such as input/output contact balls, is disclosed. The method comprising the steps of determining interior and exterior parameters of a pair of cameras, forming a rectified coordinate system from the parameters of both cameras determined above with a relative pose of second image capturing means with respect to the first image capturing means. A pair of images of the object having a plurality of co-planar protrusions on one surface are captured by the cameras system wherein image coordinates of the images are transformed into coordinates of the rectified coordinate system. Conjugate points of each protrusion are then determined for the measurement of its co- planarity and height. Various configurations of the apparatus for capturing the images and processing the image data are also disclosed.
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G06T 1/00 - Traitement de données d'image, d'application générale
H04N 7/18 - Systèmes de télévision en circuit fermé [CCTV], c. à d. systèmes dans lesquels le signal vidéo n'est pas diffusé
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c. à d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
H05K 13/08 - Contrôle de la fabrication des ensembles
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
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