A self-referencing interferometric microscope uses near-common-path, common component beam separators to produce two beams that illuminate the sample at different angles. Two return beams collected from the sample interfere at the image plane to produce an interferometric image of the sample comprising fringes across the image. The image can be processed to determine the topography of the sample.
A self-referencing interferometric microscope uses near-common-path, common component beam separators to produce two beams that illuminate the sample at different angles. Two return beams collected from the sample interfere at the image plane to produce an interferometric image of the sample comprising fringes across the image. The image can be processed to determine the topography of the sample.
G01B 9/02017 - Interféromètres caractérisés par la configuration du parcours du faisceau avec plusieurs interactions entre l’objet ciblé et les faisceaux lumineux, p. ex. les réflexions des faisceaux provenant de positions différentes
A microscope is configured for brightfield and darkfield illumination using Kohler illumination. An illuminator provides a first radiation pattern that passes through the microscope's objective lens for brightfield illumination and provides at least one second radiation pattern that also passes through the objective lens for darkfield illumination.
A method and system for measuring bump height differences. The method comprises performing first measurements of height differences between bumps and corresponding areas of an upper surface of a layer, by illuminating the bumps and the corresponding areas with a first radiation. The method includes preforming second measurements of height differences between a subgroup of the bumps and a subgroup of the corresponding areas, by illuminating the subgroup of the bumps and the subgroup of the corresponding areas with a second radiation. The method further comprises determining first measurement errors, based on the first measurements and the second measurements, and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
G01N 21/95 - Recherche de la présence de criques, de défauts ou de souillures caractérisée par le matériau ou la forme de l'objet à analyser
G01N 21/956 - Inspection de motifs sur la surface d'objets
A self-referencing interferometric microscope uses near-common-path, common component beam separators to produce two beams that illuminate the sample at different angles. Two return beams collected from the sample interfere at the image plane to produce an interferometric image of the sample comprising fringes across the image. The image can be processed to determine the topography of the sample.
A wafer inspection system employing reflected bright-field microscopy can be adapted with polarizing optics and a mirror to detect polarization-altering defects (such as micropipes) in semiconductor wafers. The polarization-altering defects can be located within the bulk of the semiconductor wafer and can be imaged as bright features on a darker background. The system can also be used for conventional bright-field inspection of non-polarization-altering defects such as contaminants and inclusions.
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
7.
SEMICONDUCTOR INSPECTION TOOL SYSTEM AND METHOD FOR WAFER EDGE INSPECTION
A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.
A wafer inspection system employing reflected bright-field microscopy can be adapted with polarizing optics and a mirror to detect polarization-altering defects (such as micropipes) in semiconductor wafers. The polarization-altering defects can be located within the bulk of the semiconductor wafer and can be imaged as bright features on a darker background. The system can also be used for conventional bright-field inspection of non-polarization-altering defects such as contaminants and inclusions.
An inspection system and method are presented for edge and bevel inspection of a semiconductor structure using and an optical system defining: a tangential imaging providing back-light tangential illumination propagating along a tangential illumination path with respect to a contour outline of a contour region of an edge of the structure and substantially along a detection path of a tangential imaging sensor unit which detects at least a part of said back-light tangential illumination and generates image data indicative of a tangential image of the contour outline to enable detection of defect data of the edge, and at least dark-field imaging setup directing dark-field illumination towards the contour region along at least one dark-field illumination path and providing collection of scattering of a response of the contour region to the dark-field illumination, to enable detection of a dark-field image indicative of location of defects along said profile of the edge.
An inspection system and method are presented for edge and bevel inspection of a semiconductor structure using and an optical system defining: a tangential imaging providing back-light tangential illumination propagating along a tangential illumination path with respect to a contour outline of a contour region of an edge of the structure and substantially along a detection path of a tangential imaging sensor unit which detects at least a part of said back-light tangential illumination and generates image data indicative of a tangential image of the contour outline to enable detection of defect data of the edge, and at least dark-field imaging setup directing dark-field illumination towards the contour region along at least one dark-field illumination path and providing collection of scattering of a response of the contour region to the dark-field illumination, to enable detection of a dark-field image indicative of location of defects along said profile of the edge.
The present disclosure provides method and system 100 for classifying defects in wafer using wafer defect images, based on deep learning network. Embodiments herein uses synergy between several modalities of the wafer defect images for the classification decision. Further, by adding a mixture of modalities, information may be obtained from different sources such as color image, ICI, the black and white image, to classify the defect image. In addition to mixture of modalities, a reference image may be used for each modality. The reference image of each modality image is provided to deep learning models to concentrate on the defect itself and not on the related underlying lithography of the defect image. Further, the reference image may be provided to the training process of the deep learning models that may significantly reduce the number of labelled images and the training epochs required for convergence of the deep learning model.
The present disclosure relates to a novel semiconductor edge and bevel inspection tool system of a wafer comprising a first illumination setup, an imaging sensor unit, and a second illumination setup. At least a portion of the second illumination radiation is configured for interacting with at least a portion of the wafer edge and bevel region surface. The second illumination setup has different radiation parameters than the first illumination setup. The first and the second illumination radiations have substantially opposite directions.
A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.
A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.
A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.
A method that may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors resulting from a virtual penetration of the first illumination into the layer; wherein each bump has a corresponding area that is proximate to the bump; preforming second measurements of thickness of the layer at the corresponding areas; wherein at least some of the first measurements are executed in parallel to an executing of at least some of the second measurements; determining first measurement errors, based on the second measurements; and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
G01N 21/95 - Recherche de la présence de criques, de défauts ou de souillures caractérisée par le matériau ou la forme de l'objet à analyser
G01N 21/956 - Inspection de motifs sur la surface d'objets
17.
Dark field illumination based on laser illuminated phosphor
An illumination module may include a laser diode array configured to emit laser radiation; a phosphor illumination unit that is configured to emit phosphor radiation following an exposure to the laser radiation; a multiple-angle illumination unit; and intermediate optics that is configured to convey the phosphor radiation to the multiple-angle illumination unit. The multiple-angle illumination unit is configured to receive the phosphor radiation and to dark field illuminate a region of a sample wafer from multiple angles during inspection of the wafer.
A method for measuring height differences between tops of multiple bumps of an upper surface of a layer, the method may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors; and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
G01N 21/95 - Recherche de la présence de criques, de défauts ou de souillures caractérisée par le matériau ou la forme de l'objet à analyser
G01N 21/956 - Inspection de motifs sur la surface d'objets
09 - Appareils et instruments scientifiques et électriques
Produits et services
Computerized systems for visual inspection; automatic
optical inspection machine; optical inspection systems;
optical devices; optical apparatus and instruments; optical
position sensors; interferometers; infrared sensors;
triangulation sensors; confocal sensors; optical inspection
apparatus for industrial use; metrology device used in
manufacturing control of semiconductor devices and
materials.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Computerized systems for visual inspection; automatic
optical inspection machine; optical inspection systems;
optical devices; optical apparatus and instruments; optical
position sensors; interferometers; infrared sensors;
triangulation sensors; confocal sensors; optical inspection
apparatus for industrial use; metrology device used in
manufacturing control of semiconductor devices and
materials.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Computerized systems consisting of computer machine hardware and recorded computer software for visual inspection; automatic optical inspection machine; optical inspection systems comprised of optical inspection machine hardware and recorded computer software for processing and analyzing a captured image; optical position sensors; interferometers; infrared sensors; optical position sensors, namely, triangulation sensors; electrical sensors in the nature of confocal sensors for measuring displacement, distance, position, and thickness not for medical use; optical inspection apparatus for industrial use; all of the foregoing for use in manufacturing processes; none of the foregoing for use in the fields of health or medicine
09 - Appareils et instruments scientifiques et électriques
Produits et services
Computerized systems consisting of computer machine hardware and recorded computer software for visual inspection; automatic optical inspection machine; optical inspection systems comprised of optical inspection machine hardware and recorded computer software for processing and analyzing a captured image; optical position sensors; interferometers; infrared sensors; optical position sensors, namely, triangulation sensors; electrical sensors in the nature of confocal sensors for measuring displacement, distance, position, and thickness not for medical use; optical inspection apparatus for industrial use; all of the foregoing for use in manufacturing processes; none of the foregoing for use in the fields of health or medicine
An optical module that may include (a) a first light source unit that comprises a first phosphor light source unit that is configured to convert first laser radiation to a first phosphor radiation of a first spectral signature; (b) a second light source unit that comprises a second phosphor light source unit that is configured to convert second laser radiation to a second phosphor radiation of a second spectral signature; and (c) an optical combiner that comprises multiple frequency selective prisms and is configured to (i) receive phosphor radiation emitted from any of the first and second light source units, and (ii) output an output radiation that is a combination of the phosphor radiation received from the any of the first and second light source units.
A system, an illumination module of the system, and a method for operating the illumination module, that uses a phosphor illuminated by a laser diode to create a dark field illumination module for wafer inspection and defect detection, having at least one laser diode array combined to illuminate the same spot at desired spot size over a phosphor material with desired characteristics.
F21K 9/64 - Agencements optiques intégrés dans la source lumineuse, p. ex. pour améliorer l’indice de rendu des couleurs ou l’extraction de lumière en utilisant des moyens de conversion de longueur d’onde distincts ou espacés de l’élément générateur de lumière, p. ex. une couche de phosphore éloignée
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
A method that may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors resulting from a virtual penetration of the first illumination into the layer; wherein each bump has a corresponding area that is proximate to the bump; preforming second measurements of thickness of the layer at the corresponding areas; wherein at least some of the first measurements are executed in parallel to an executing of at least some of the second measurements; determining first measurement errors, based on the second measurements; and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
G01B 11/02 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
G01N 21/95 - Recherche de la présence de criques, de défauts ou de souillures caractérisée par le matériau ou la forme de l'objet à analyser
G01N 21/956 - Inspection de motifs sur la surface d'objets
A method for measuring height differences between tops of multiple bumps of an upper surface of a layer, the method may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors; and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
G01B 11/02 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
G01N 21/95 - Recherche de la présence de criques, de défauts ou de souillures caractérisée par le matériau ou la forme de l'objet à analyser
G01N 21/956 - Inspection de motifs sur la surface d'objets
27.
Method and system for classifying defects in wafer using wafer-defect images, based on deep learning
The present disclosure provides method and system 100 for classifying defects in wafer using wafer defect images, based on deep learning network. Embodiments herein uses synergy between several modalities of the wafer defect images for the classification decision. Further, by adding a mixture of modalities, information may be obtained from different sources such as color image, ICI, the black and white image, to classify the defect image. In addition to mixture of modalities, a reference image may be used for each modality. The reference image of each modality image is provided to deep learning models to concentrate on the defect itself and not on the related underlying lithography of the defect image. Further, the reference image may be provided to the training process of the deep learning models that may significantly reduce the number of labelled images and the training epochs required for convergence of the deep learning model.
A method for detecting defects in a thinned die, the method may include inspecting the thinned die with a two-dimensional inspection module, to find suspected defects that appear as non-reflecting regions that fulfill a size condition; measuring, using a depth measurement module, a depth of the suspected defects; and defining a suspected defects as a defects when the depth parameter exceeds a depth threshold.
There may be provided a method for determining three dimensional (3D) defect information, the method may include performing a two-dimensional (2D) inspection of an area of a wafer to generate 2D defect information related to defects of the area of the wafer; estimating 3D defect information regarding the defects of the area of the wafer, wherein the estimating is based on the 2D defect information related to defects of the area of the wafer, and a mapping between 2D defect information and 3D defect information, wherein the mapping is generated using a supervised deep learning machine process.
There may be provided a method for inspecting a top redistribution layer conductors of an object. The top redistribution layer (RDL) is positioned above at least one lower RDL and above at least one other dielectric layer. The method may include (i) illuminating the object with radiation, the at least one lower dielectric layer significantly absorbs the radiation; (ii) generating, by a detector, detection signals that represent radiation reflected from the object, and (iii) processing, by a processor, the detection signal to provide information about the top RDL. The processing may include distinguishing detection signals related to the top RDL from detection signals related to the at least one lower RDL.
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/488 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées
H01L 21/22 - Diffusion des impuretés, p. ex. des matériaux de dopage, des matériaux pour électrodes, à l'intérieur ou hors du corps semi-conducteur, ou entre les régions semi-conductricesRedistribution des impuretés, p. ex. sans introduction ou sans élimination de matériau dopant supplémentaire
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
A method for automatic defect classification, the method may include (i) acquiring, by a first camera, at least one first image of at least one area of an object; (ii) processing the at least one first image to detect a group of suspected defects within the at least one area; (iii) performing a first classification process for initially classifying the group of suspected defects; (iii) determining whether a first subgroup of the suspected defects requires additional information from a second camera for a completion of a classification; (iv) when determining that the first subgroup of the suspected defects requires additional information from the second camera then: (a) acquiring second images, by the second camera, of the first subgroup of the suspected defects; and (b) performing a second classification process for classifying the first subgroup of suspected defects.
A method for estimating a thickness related to multiple conductive structural elements of an object, the method includes estimating a height difference between an upper surface of a conductive structural element and an upper surface of a photoresists layer portion that surrounds the conductive structural element, to provide multiple height differences; estimating thicknesses of the multiple photoresists layer portions, based at least on the second part of the emitted radiation; and calculating thickness values related to the multiple conductive structural elements, wherein the calculating is based at least on the multiple height differences and on the estimated thickness of the multiple photoresists layer portions.
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
There may be provided a method for evaluating an object, that may include evaluating a region of the object by a first evaluation module to provide first evaluation results that are related to multiple sites of the region; finding, using a mapping between values of first evaluation results and values of second evaluation results, (a) a first site of the multiple sites that does not require an evaluation by a second evaluation module, and (b) a second site of the multiple sites that requires an evaluation by the second evaluation module; wherein the second evaluation module is more reliable than the first evaluation module; evaluating the second site by the second evaluation module to provide second evaluation results of the second sites; estimating, based on first evaluation results of the first site and on the mapping, a state of the first site; and providing an evaluation of the region based on the state of the first site, and on the second evaluation result of the second site.
An inspection system for inspecting a semiconductor substrate, the inspection system may include an inspection unit that comprises a partially blocking bright field unit and a non-blocking bright field unit; wherein the partially blocking bright field unit is configured to block any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along a first axis, of an area of the wafer, (b) the specular reflection propagates along a second axis, (c) the first axis and the second axis are symmetrical about a normal to the area of the wafer, and (d) the normal is parallel to an optical axis of the partially blocking bright field unit; and wherein the non-blocking bright field unit is configured to pass to the image plane any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along the first axis, of an area of the wafer, (b) the specular reflection propagates along the second axis, (c) the first axis and the second axis are symmetrical about the normal, and (d) the normal is parallel to the optical axis of the partially blocking bright field unit.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
G01N 21/956 - Inspection de motifs sur la surface d'objets
A method for automatic defect classification, the method may include (i) acquiring, by a first camera, at least one first image of at least one area of an object; (ii) processing the at least one first image to detect a group of suspected defects within the at least one area; (iii) performing a first classification process for initially classifying the group of suspected defects; (iii) determining whether a first subgroup of the suspected defects requires additional information from a second camera for a completion of a classification; (iv) when determining that the first subgroup of the suspected defects requires additional information from the second camera then: (a) acquiring second images, by the second camera, of the first subgroup of the suspected defects; and (b) performing a second classification process for classifying the first subgroup of suspected defects.
A method for inspecting a group of dies of a wafer, wherein the wafer comprises a group of wafer segments, wherein each wafer segment comprises a die of the group of dies, a molded material that surrounds the die and redistribution layer (RDL) conductors that are coupled to the die and are positioned above the die and the molded material, wherein the method includes the steps of: receiving design information about the RDL conductors of each wafer segment of the group of wafer segments; obtaining, during a setup process, first images of the group of wafer segments; wherein the obtaining of the first images comprises illuminating the group of wafer segments with radiation and detecting radiation scattered or reflected from the group of wafer segments as a result of the illuminating; generating reference information based on the design information about the RDL conductors of one or more wafer segments of the group of wafer segments and at least one first image of the one or more first images; acquiring, during an inspection process, a second image of each wafer segment of the group of wafer segments; and evaluating each wafer segment of the group of wafer segments based on the second image of the wafer segment and the reference information of the wafer segment.
G06F 11/22 - Détection ou localisation du matériel d'ordinateur défectueux en effectuant des tests pendant les opérations d'attente ou pendant les temps morts, p. ex. essais de mise en route
An aperture stop that includes a non-circular region that comprises at least one opaque region and at least one opening region; wherein each point in the at least one opening region is (a) mapped to an angle of illumination and (b) is associated with a corresponding point in the at least one opaque region that. mapped to an angle of specular reflectance from the angle of illumination mapped to the opening point.
A system for measuring heights of multiple structures of an object, the system may include an illumination module that is configured to illuminate the object by a light strip that is spatially incoherent; multiple cameras; a collection module that is configured to collect light that is reflected from the object and to distribute the light to the multiple cameras; wherein the collection module has an elongated field of view that has a longitudinal axis that is parallel to the light strip; wherein the multiple cameras are configured to generate, during a height measurement process, detection signals indicative of heights of the multiple structures; a mechanical stage for introducing a movement, during the height measurement process, between the object and each one of the illumination module and the collection module; and a processor that is configured to process the detection signals to determine the heights of the multiple structures.
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
An inspection system for inspection a surface of a substrate, the inspection system may include an interface for holding the substrate; a movement mechanism for moving the interface, thereby moving the substrate between different positions; a bright field light source that is configured to illuminate different bright field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; at least one dark field light source that is configured to illuminate different dark field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; and a camera that is configured to: (a) generate bright field detection signals in response to light that is detected by the camera as a result of the illumination of the different bright field illuminated parts; and (b) generate dark field detection signals in response to light that is detected by the camera as a result of the illumination of the different dark field illuminated parts; and wherein light that is detected by the camera as the result of the illumination of the different bright field illuminated parts and as the result of the illumination of the different dark field illuminated parts does not include an image of the camera.
An inspection system having an expanded angular coverage, the inspection system may include a line camera; a first curved mirror; a second curved mirror; a first focusing lens that is positioned between the first mirror and an object; a second focusing lens that is positioned between the second mirror and the object; a first light source that is configured to direct a first part of a first light beam towards the first curved mirror and a second part of the first light beam towards the first focusing lens; a second light source that is configured to direct a first part of a second light beam towards the second curved mirror and a second part of the second light beam towards the second focusing lens.
H04N 5/369 - Transformation d'informations lumineuses ou analogues en informations électriques utilisant des capteurs d'images à l'état solide [capteurs SSIS] circuits associés à cette dernière
A method for printing on a substrate, the method may include determining actual locations of substrate holes; printing a first ink on an object at locations that correspond to the actual locations of the substrate holes and curing the first ink to provide a holes mask; and wherein after the substrate is positioned on the object so that holes mask seals bottoms of the substrate holes then printing the second ink on the substrate thereby forming a predefined pattern on the substrate.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
B41J 3/407 - Machines à écrire ou mécanismes d'impression ou de marquage sélectif caractérisés par le but dans lequel ils sont construits pour le marquage sur des matériaux particuliers
An adaptable end effector may include a substrate interface may be configured to support a substrate. The substrate interface may include multiple groups of vacuum openings that are associated with a plurality of types of substrates. A vacuum system may be configured to supply vacuum only to one or more selected groups of vacuum openings that are associated with a given type of substrates when the adaptable end effector supports a substrate of the given type of substrates.
B66C 1/02 - Éléments ou dispositifs de prise de la charge adjoints aux mécanismes de levage, de descente ou de halage, ou adaptés pour être utilisés avec ces mécanismes et transmettant les efforts à des articles ou à des groupes d'articles par succion
B25B 11/00 - Porte-pièces ou dispositifs de mise en position non couverts par l'un des groupes , p. ex. porte-pièces magnétiques, porte-pièces utilisant le vide
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
B25J 15/06 - Têtes de préhension avec moyens de retenue magnétiques ou fonctionnant par succion
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
43.
System and a method for automatic recipe validation and selection
A system, a non-transitory computer program product and a method for selecting an inspection recipe, the method includes: (i) obtaining an image of a structural element of the semiconductor device; (ii) calculating multiple types of distances between the image of the structural element and each of a plurality of reference images obtained by applying a plurality of inspection recipes; and (iii) automatically selecting at least one selected inspection recipe out of the plurality of inspection recipes based on values of the multiple types of distances.
A multiple mode evaluation system that includes a multiple mode imager that is arranged to perform a single scan of a substrate while alternating between different optical modes thereby producing different sets of images of areas of the substrate, each set of images being associated with a single optical mode of image acquisition; wherein the different optical modes differ from each other by at least one optical characteristic.
A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
G01N 21/956 - Inspection de motifs sur la surface d'objets
A formulation is provided, which comprises a thermosetting resin mixture comprising at least one of: an amine resin, an epoxy resin and a phenolic resin; an ultraviolet (UV) curable acrylate mixture comprising at least one of a mono- or di-functional acrylic monomer and a tri- or poly- functional acrylic oligomer, and further comprising at least one adhesion promoting acrylic-based monomer; at least one electrically conductive colorant; and at least one UV sensitive photoinitiator. The formulation may be used to coat-protect defects in a wafer piece sample from abrasion by ion milling.
Methods, systems and produced printed substrates are provided, which include substrates composed of one or more materials which are treated by an intermediate layer for normalizing surface energies and a digitally printed formulation adapted to the normalized surface energies. Surface energy normalization may be carried out by physical processes or by selective chemical processes. In an example, a self-assembled monolayer is applied to the surface of a printed circuit board to control ink jet dots by reducing copper surface energy and to improve ink adhesion. The self-assembled monolayer binds via an α group selectively and covalently to the copper on the board and binds via a hydrophobic ω group to solder mask ink that is applied to the board. The ω group participates in the solidification process of the ink.
A system, that includes a hybrid sensor that comprises: a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
An illumination module that may include a LED driver; a group of light emitting diodes (LEDs) that comprises at least one LED; the group of LED is coupled to the LED driver; wherein the LED driver is arranged to activate the group of LEDs by driving a high current short duration driving signal; and wherein the group of LEDs is arranged to emit at least one light pulse in response to the high current short duration driving signal.
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
G01N 21/95 - Recherche de la présence de criques, de défauts ou de souillures caractérisée par le matériau ou la forme de l'objet à analyser
G01N 21/956 - Inspection de motifs sur la surface d'objets
G01N 21/94 - Recherche de souillures, p. ex. de poussières
50.
Wafer inspection system and a method for translating wafers
A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
A method for wafer registration, the method may include: moving a wafer by an X-Y stage and acquiring wafer edge area images; and processing the wafer edge area images to locate an edge of the wafer. A system that includes a camera, an X-Y stage for moving a wafer; wherein the camera is arranged to acquire wafer edge area images; and a processor that is arranged to process the wafer edge area images to locate an edge of the wafer.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating material to be applied on an electrical circuit that comprises at least one three dimensional structure to be coated by the coating material; wherein the multiple iteration printing scheme is responsive to a shape and size of the at least one three dimensional structure; and performing multiple printing iterations of the coating material, according to the multiple iteration printing scheme; wherein at least one printing iteration is followed by at least partially curing the coating material printed during the at least one printing iteration.
B05D 5/12 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers pour obtenir un revêtement ayant des propriétés électriques spécifiques
A system and a method for milling and inspecting an object. The method may include performing at least one iteration of a sequence that includes: milling, by a particle beam, a first surface of the object, during a first surface milling period; obtaining, by an electron detector, an image of a second surface of the object during at least a majority of the first surface milling period; wherein the object is expected to comprise an element of interest (EOI) that is positioned between the first and second surfaces; milling, by the particle beam, the second surface of the object during a second surface milling period; wherein each of the first surface milling period and the second surface milling period has a duration that exceeds a long duration threshold; obtaining by the electron detector an image of the first surface of the object during at least a majority of the second surface milling period.
A system and a method may be provided. The system may include an illumination module arranged to illuminate an object by short pulses of light that form at least one spot on the object; a collection module that comprises a sensor that is arranged to generate detection signals representative of three dimensional information about the object: and a mechanical stage that is arranged to introduce a movement between the object and at least one of the collection module and the illumination module.
System, computer readable medium and method. The system includes (i) a data obtaining module arranged to obtain data about at least one portion of an inspected article; and (ii) a processor arranged to perform at least one processing operation of the data out of: (a) processing the data to provide the inspection recipe; and (b) processing the data, while utilizing the inspection recipe, to detect defects; wherein the inspection recipe comprises multiple zones of multiple types of zones; wherein a zone of a first type of zones differs from a zone of a second type of zone.
An inspection system and a method. The method may include: illuminating the object with impinging light of a first polarization; performing a polarization based filtering of (a) multiple-reflected light signals, each multiple-reflected light signal being reflected from at least two different bevel side surfaces of the object, and (b) additional light signals, each additional light signal being reflected from a single element of the object, such as to suppress the multiple-reflected light signals, and to provide polarization based filtered light signals; and detecting the polarization based filtered light signals.
G01J 4/00 - Mesure de la polarisation de la lumière
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
A method for inspecting an object and an inspection system, the system includes: at least one primary light source followed by at least one illumination path imaging lens adapted to direct at least one primary light beam towards an area of an inspected object; at least one secondary light source followed by at least one collimating component and at least one concentrating component adapted to direct at least one secondary light beam towards the area; wherein the at least one primary light beam and the at least one secondary light beam illuminate the area such that substantially each point within an imaged portion of the area is illuminated over a large angular range characterized by substantially uniform intensity; a collection path that comprises an image sensor, a beam splitter path and a collection path imaging lens; wherein the beam splitter is positioned between the area and between the collection path imaging lens; and wherein the at least one collimating component defines a central aperture through which the at least one primary light beam propagates.
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
59.
Advanced inspection method utilizing short pulses LED illumination
An illumination module that may include a LED driver; a strip cable comprising multiple conductors that have a high ratio form factor and a low impedance and a low inductance factor; the forms factor is a ratio between a width of the strip cable and a thickness of the strip cable; a group of light emitting diodes (LEDs) that comprises at least one LED; the group of LED is coupled to the LED driver via the strip cable; wherein the LED driver is arranged to activate the group of LEDs by driving a high current short duration driving signal via the strip cable; and wherein the group of LEDs is arranged to emit at least one light pulse in response to the high current short duration driving signal.
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
60.
Process control and manufacturing method for fan out wafers
A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.
An optical inspection system, the system includes: (i) an image sensor; and (ii) a single optical element, that at least partially surrounds an edge of an inspected object; wherein the optical element is adapted to direct light from different areas of the edge of the inspected object towards the image sensor so that the image sensor concurrently obtains images of the different areas.
An inspection system and a method for defect detection, the method includes: generating a first beam that comprises a near infrared spectral component and a visible light component; directing at least the near infrared spectral component of the first beam towards an inspected object; directing, towards a sensor, a near infrared spectral component of a second beam generated from the illuminating of the inspected object; wherein the sensor is sensitive to visual light radiation and to near infrared radiation; generating, by the sensor, detection signals that are responsive to the near infrared component of the second beam; and detecting defects in the inspected object by processing the detection signals.
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
A method, system and a computer program product for evaluating contact elements, the method includes: acquiring images of multiple groups of contact elements, wherein each group of contact element was expected to be contacted during a test by the same group of probes so as to form multiple probe marks; and evaluating at least one characteristic of a first contact element in response to a comparison between a number of potential probe marks that appear in the image of a first contact element and a number of potential probe marks that appear in an image of a second contact element.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
G01R 31/20 - Préparation des articles ou des spécimens pour faciliter le test
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
A system and a method for method for printing a solder mask on a printed circuit board (PCB), the method includes: acquiring images of multiple areas of a PCB by an inspection unit while the PCB is supported by a mechanical stage; determining spatial differences between a model of the PCB and the PCB based on the images; determining solder mask ink deposition locations based on (i) the spatial differences, and (ii) locations of the model of the PCB that should be coated with the solder mask ink; and printing solder mask ink on the solder mask deposition locations by a printing unit, while the PCB is supported by the mechanical stage.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
Method and inspection system. The inspection system includes: (i) a stage, for supporting an inspected object and for moving the inspected object by a movement that is characterized by speed variations; (ii) a signal generator, for generating triggering pulses at a fixed frequency regardless of the speed variations; (iii) a stage location generator, for providing location information indicative of a location of the stage at points of time that are determined by the triggering pulses; (iv) a strobe illuminator for illuminating areas of the inspected object in response to the triggering pulses; (v) a camera for acquiring images of areas of the inspected object in response to the triggering pulses; wherein overlaps between the images of the areas of the inspected object are characterized by overlap variations; and (vi) a processor for associating location information to the acquired images.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
66.
System and method for height triangulation measurement
A method for height triangulation measurement particularly for measuring the height of an object on a surface, the method includes: a) illuminating said object from a known angle with a narrow strip of light, having a large numerical aperture along said light strip and a small numerical aperture perpendicular to said light strip; b) imaging said object from a known angle having a large numerical aperture along said light strip and a small numerical aperture perpendicular to said light strip, having an image of said object illuminated by said light strip; and c) calculating the height of said object from the location of said light strip on said image.
There is provided a chuck that includes a supporting element that is connected to a closing element. An upper surface of the supporting element includes a chemically etched zone and an un-etched zone. The chemically etched zone includes multiple upper areas that are surrounded by trenches. At least one pressurized gas conduit is formed in the supporting element so as to enable pressurized gas provided to a lower surface of the supporting element to propagate through the trenches. The un-etched zone is shaped in response to a shape of an object to be placed on the supporting element. The un-etched zone reduces pressurized gas leakage from the un-etched zone and the closing element reduces pressurized gas leakage from a lower surface of the supporting element when the object is placed on the chuck in alignment with the un-etched zone and pressurized gas is provided to the chuck.
A method for analyzing probe mark, the method includes: scanning the probe mark by multiple spots; evaluating a probe mark characteristic in response to detection signals generated by multiple sensors of the chromatic confocal system that is characterized by a sub-micron axial resolution.
A system and a method are provided. The system includes: four longitudinal transferors that comprise multiple tunnels through which the objects propagate and multiple stopping elements for temporally stopping the propagation of the objects through the multiple tunnels; wherein the four longitudinal transferor utilize gas pressure differentials to convey the objects through the tunnels; wherein at least one longitudinal transferor has a transparent movable portion that when placed in a certain position at least a substantial portion of at least one tunnel is exposed; wherein when the transparent movable portion is placed in another position it substantially seals the at least one tunnel; and three rotation modules configured to rotate objects about a longitudinal axis of the objects; wherein each rotating module is located between two longitudinal transferors.
An inspection method and an inspection system, the inspection system includes: (i) a first group of sensors, for sensing light components of a first light band of an image of an area of an inspected object, and for generating first detection signals reflecting sensed light components of the first light band; (ii) a second group of sensors, for sensing light components of a second light band of the image of the area of the inspected object, wherein the second light band differs from the first light band, and for generating second detection signals reflecting sensed light components of the second light band; (iii) optics, for projecting the image of the area of the inspected object towards the first group of sensors and towards the second array of sensors; and (iv) a processing unit, coupled to the first and second group of sensors, for detecting defects based on the first or second detection signals.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
71.
Method and system for defect detection using transmissive bright field illumination and transmissive dark field illumination
A method for defect detection using transmissive bright field and transmissive dark field illumination, the method includes: determining a relationship between at least one transmissive bright field illuminator (92) characteristic and at least one transmissive dark field illuminator (91) characteristic in response to at least one characteristic of each defect type out of multiple defect types that should be detected during a defect detection session and in response to at least one phenomenon to be ignored of during the defect detection session; setting the at least one transmissive bright field illuminator (92) characteristic and the at least one transmissive dark field illuminator (91) characteristic according to the determination; illuminating an at least partially transparent object by the transmissive dark field illuminator and by the transmissive bright field illuminator; detecting light that passes through the at least partially transparent object to provide detection signals, and processing the detected signals in order to detect defects.
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
72.
Dark field illuminator and a dark field illumination method
A dark field illuminator that includes: (i) a light source adapted to provide ring of light characterized by uniform intensity distribution; (ii) a collimating ring adapted to receive the ring of light and to direct collimated light beams towards an area of an inspected object such that different points within the area are illuminated by identical cones of light characterized by an incidence angle; and wherein the collimating ring and the light source are co-centric to an optical axis of the dark field illuminator.
A system includes a first supporting element, a first supporting element rotation module, a controller and a first optical head. The controller is configured to control a rotation of the first supporting element by the first supporting element rotation module. The first supporting element is coupled to the first optical head. The first supporting element rotation module is configured to rotate the first supporting element until text that is imprinted on a first side of a semiconductor wafer is located within a field of view of the first optical head. Semiconductors wafers of different size have text located at different locations. A method for obtaining a text imprinted on a first side of a semiconductor wafer, the method includes: determining a location of the text based on a size of the semiconductor wafer; rotating a first supporting element that is coupled to a first optical head until the text is located within a field of view of the first optical head; obtaining an image of the text by the first optical head; and translating the image of the text into text.
A wafer inspection system and a method for inspecting a wafer. The method includes: acquiring multiple frames that cover a first area that comprises a die and a first surrounding area that surrounds the die; wherein the frames partially overlap to provide overlap areas; and processing a sequence of decomposed images of overlap areas such as to align mutually misaligned frames and generating a die reference image.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
75.
SYSTEMS AND METHOD FOR IMAGING MULTIPLE SIDES OF OBJECTS
A system for acquiring multiple images of objects, the system includes: four longitudinal transferor that comprise multiple tunnels through which the objects propagate to four imaging areas; wherein the four longitudinal transferor utilize gas pressure differentials to convey the electrical circuits through the tunnels; wherein at least one longitudinal transferor has a movable portion that when placed in a certain position exposes at least a substantial portion of at least one tunnel; three rotation modules configured to rotate objects about a longitudinal axis of the objects; wherein each rotating is located between two longitudinal transferor; and imager, configured to obtain, in each of the four imaging areas, an image of the objects.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
76.
Wafer inspection system and a method for translating wafers [PD]
A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
A method for preparation of a colored ink that includes: preparing a white formulation that comprises sub-micron inorganic pigment; preparing a colored formulation that comprises sub-micron organic pigment; and mixing and grinding the white ink formulation and the colored ink formulation to provide a colored ink formulation suitable for jet ink applications. A colored ink that includes white sub-micron inorganic pigment and colored sub-micron organic pigment; wherein the colored ink is characterized by a high (color) hiding power and color density, and can meet the requirements of the PCB industry.
A method for inspecting a diced object that comprises multiple dies, the method includes: acquiring multiple images of multiple portions of the diced object, starting from a first portion that comprises an alignment area and continuing through adjacent portions of the diced object; assigning a die index to each die of the multiple dies of the diced object, starting from a die of the first portion and continuing through adjacent portions of the diced object; associating between dies of the diced object and a dies of a reference object in response to the assigned indexes and locations of the dies of the diced object; wherein the reference object is not diced; and comparing between a die of the diced object and another die while taking into account an association between the die of the diced object and a reference object die.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
79.
Inspection system and a method for detecting defects based upon a reference frame
A method for inspecting objects and an inspection system, the system includes: an image acquisition unit adapted to acquire multiple images, according to a predefined image acquisition scheme, of multiple portions of a diced wafer that comprises multiple dice; and a processor adapted to locate multiple unique features within the multiple images, at least partially during the acquisition of images; associate multiple unique features with multiple dice, at least partially during the location of multiple unique features; determine multiple transformations between multiple die coordinate systems and a global coordinate system, in response to a locations of unique features and their associations with multiple dice, at least partially during an association between multiple unique features with multiple dice; and detect defects in response to a comparison between dice and corresponding reference dice, in response to the transformations, at least partially during the determination of the multiple transformations.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
An apparatus for printing PCBs includes both solder mask ink and notation ink printing subsystems within the same unit. Notation ink and solder mask ink may be applied by a single apparatus or by separate apparatuses, such as an ink jet printer, and may be dried by a single drying mechanism or by separate drying mechanisms. The apparatus may also be equipped with a flipping station to allow dual-sided printing and/or a curing station to complete the PCB printing process.
B41L 13/12 - Appareils de polycopie par stencil, à usage de bureau ou autres fins commerciales à des fins particulières, p. ex. pour reproduire des caractères Braille
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
A method for macro inspection, the method includes: (i) concurrently illuminating a current group of spaced apart object sub areas; wherein light reflected in a specular manner from a certain object sub area of the current group of object sub areas is expected to be detected by a certain sensor element of a current group of spaced apart sensor elements that correspond to the current group of spaced apart object sub areas; wherein the object sub areas are spaced apart so as to reduce a probability of a detection of non-specular light from the object; wherein each image sub area comprises multiple pixels; (ii) obtaining image information from the current group of spaced apart sensor elements; and (iii) processing at least a portion of the image information to provide an inspection result.
A method for measuring a depth of a narrow hole, the method includes: obtaining from a chromatic confocal sensor a group of height measurements taken along an imaginary line that crosses the narrow hole; ignoring height measurements attributed to optical artifacts and blind measurement points and calculating an inverted parabolic estimate of a sub-group of the height measurements; wherein a top of the parabolic estimate is representative of a height of a bottom of the narrow hole.
A method, system and computer program product for controlling a manufacturing process of an electronic circuit, the method includes: calculating at least one layer misalignment between layers of an electrical circuit that are expected to be mutually aligned; wherein the layers are manufactured by at least a direct imaging device that exposes a photo-resistive material to radiation to provide a pattern; selecting, in response to the at least one layer misalignment and in response to at least one allowable misalignment threshold, a selected response out of: manufacturing at least one additional layer of the electrical circuit; and stopping the manufacturing process of the electrical circuit; and participating in executing the selected response.
A system for measuring a height of a protuberance on a surface of an electric circuit, the system includes optics and a processor that are adapted to generate height estimations by applying a triangulation process and select a selected protuberance in response to a selection rule.
G01R 31/02 - Essai des appareils, des lignes ou des composants électriques pour y déceler la présence de courts-circuits, de discontinuités, de fuites ou de connexions incorrectes de lignes
85.
OPTICAL INSPECTION SYSTEM USING MULTI-FACET IMAGING
An optical inspection system, the system includes: (i) an image sensor; and (ii) a single optical element, that at least partially surrounds an edge of an inspected object; wherein the optical element is adapted to direct light from different areas of the edge of the inspected object towards the image sensor so that the image sensor concurrently obtains images of the different areas.
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
86.
METHOD AND SYSTEM FOR EVALUATING LOCAL DISTORTIONS
A method for evaluating local distortions of a lower layer of a printed circuit board, the method includes: receiving image information representative of lower layer portions that are viewed through drilled holes in an upper layer; wherein the holes are drilled by a drilling system that is more accurate than a mechanical element that introduces a mechanical movement during an optical acquisition of optical image information; and determining local distortions of the lower layer in response to the image information.
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
87.
METHOD AND SYSTEM FOR VERIFYING SUSPECTED DEFECTS OF A PRINTED CIRCUIT BOARD
A system and a method for verifying suspected defects of a printed circuit board, the system includes: (i) a camera (200) that includes a processor (210) and a group of light sensing elements (220), whereby the group of light sensing elements is adapted to generate first image information (310) representative of light arriving from the printed circuit board (102); whereby the processor is adapted to select a portion of the first image information to provide second image information (320), in response to (a) a displayed image related parameter; (b) a size of the first image information; and (c) second image information transmission limitation; and (ii) a bandwidth limited communication channel adapted to convey the second image information from the camera
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
A method for determining a height of an area cell, the method includes: scanning a line of light over multiple area cells of an object that form an area and obtaining multiple images; wherein each image comprises detection signals associated with at least one area cell; determining a height of an area cell in response to a comparison between image information of different images that is associated with the area cell.
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
89.
METHOD AND SYSTEM FOR IMAGING AN ELECTRICAL CIRCUIT
A system and a method for imaging an electrical circuit, the method includes: selectively activating an image sensor and introducing a mechanical movement between the electrical circuit and the image sensor so as to acquire multiple mutually parallel strips of elongated irregular hexagonal frames of portions of the electrical circuit; wherein two elongated edges of each elongated irregular hexagonal frame are substantially longer than other edges of the elongated irregular hexagonal frame.
An illumination system that includes: (i) a first rectangular light emitting diode array that emits quasi-collimated light; and (ii) first concentrating optics that comprises at least one total internal reflection lens portion and at least one refractive lens portion. The quasi-collimated light from the first rectangular light emitting diode array is directed by the first concentrating optics towards an object to form a line of light on the object.
G01N 21/25 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes
G01N 21/84 - Systèmes spécialement adaptés à des applications particulières
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
F21V 5/04 - Réfracteurs pour sources lumineuses de forme lenticulaire
A device. and a method for supporting an optical component (240) of an optical evaluation system, the device includes: (a) a supporting element (220) that includes a sloped portion (222); (b) at least one movement control component (210) that is coupled to the sloped portion; and (c) a movable element (230), adapted to move along the at least one movement control component; wherein the movable element is adapted to support the optical component; wherein when the movable element supports the optical component a center Of gravity of a combination of the movable element and the optical component is positioned above, the sloped portion or in proximity to the sloped portion.
A method, system and a computer program product for evaluating contact elements, the method includes: acquiring images of multiple groups of contact elements, wherein each group of contact element was expected to be contacted during a test by the same group of probes so as to form multiple probe marks; and evaluating at least one characteristic of a first contact element in response to a comparison between a number of potential probe marks that appear in the image of a first contact element and a number of potential probe marks that appear in an image of a second contact element.
A chuck that includes a supporting element that is connected to a closing element. An upper surface of the supporting element includes a chemically etched zone and an un-etched zone. The chemically etched zone includes multiple upper areas that are surrounded by trenches. At least one pressurized gas conduit is formed in the supporting element so as to enable pressurized gas provided to a lower surface of the supporting element to propagate through the trenches. The un-etched zone is shaped in response to a shape of an object to be placed on the supporting element. The un-etched zone reduces pressurized gas leakage from the un-etched zone and the closing element reduces pressurized gas leakage from a lower surface of the supporting element when the object is placed on the chuck in alignment with the un-etched zone and pressurized gas is provided to the chuck.
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
94.
A SUPPORTING SYSTEM AND A METHOD FOR SUPPORTING AN OBJECT
A supporting system, the system includes a vertically movable chuck and a stationary chuck; wherein the vertically movable chuck and the stationary chuck are concentric; wherein the vertically movable chuck vertically moves between an upper position and a lower position; wherein when the vertically movable chuck is positioned at the upper position an upper surface of the vertically movable chuck is higher than an upper surface of the stationary chuck and when the vertically movable chuck is positioned at the lower position the upper surface of the vertically movable chuck is lower than the upper surface of the stationary chuck.
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
95.
METHOD AND SYSTEM FOR DEFECT DETECTION USING TRANSMISSIVE BRIGHT FIELD ILLUMINATION AND TRANSMISSIVE DARK FIELD ILLUMINATION
A method for defect detection using transmissive bright field and transmissive dark field illumination, the method includes: determining a relationship between at least one transmissive bright field illuminator (92) characteristic and at least one transmissive dark field illuminator (91) characteristic in response to at least one characteristic of each defect type out of multiple defect types that should be detected during a defect detection session and in response to at least one phenomenon to be ignored of during the defect detection session; setting the at least one transmissive bright field illuminator (92) characteristic and the at least one transmissive dark field illuminator (91) characteristic according to the determination; illuminating an at least partially transparent object by the transmissive dark field illuminator and by the transmissive bright field illuminator; detecting light that passes through the at least partially transparent object to provide detection signals, and processing the detected signals in order to detect defects.
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
