Provided are: a method for producing a gold coating, by which a thick gold-coated film can be produced with high productivity; and a gold electroplating solution used in said production method. The gold electroplating solution contains a gold source and a membrane clogging inhibitor. Examples of the membrane clogging inhibitor include a heterocyclic compound and a sulfide compound. The gold electroplating solution is used in an electroplating method for depositing a metal coating on the surface of a to-be-plated object (cathode) 3 from metal ions contained within a solid electrolyte membrane S by bringing the to-be-plated object (cathode 3) into contact with a metal ion-permeable solid electrolyte membrane 5 and applying a voltage between an anode 2 and the cathode 3 in a state in which the plating solution is disposed between the solid electrolyte membrane 5 and the anode 2.
In the method for producing a plating stack, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of a third metal is deposited on the plating layer A, and then a plating layer C mainly composed of the second metal, the third metal, or a fourth metal is deposited on the plating layer B by a redox reaction. A concrete configuration of plating layers includes, for example, the plating layer A is gold, platinum or silver, the plating layer B is palladium, and the plating layer C is palladium.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
The problem of the present invention is to provide a plating stack (a stack of plating films) for applying on surface of conductor circuits or the like, the plating stack can maintain high bond strength when solder is bonded on that and can be produced stably. In the method for producing a plating stack of the present invention, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of palladium is deposited on the plating layer A, and then a plating layer C mainly composed of nickel is deposited on the plating layer B by a redox reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum or silver.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
[Problem] To provide: an electroless gold plating solution which is not susceptible to dissolution of copper from a copper material in cases where a gold plating film is formed on a base material such as a nickel film; and a method for producing an electroless gold plating film and a method for producing an electronic component, each of said methods using this electroless gold plating solution. [Solution] The above-described problem has been solved by an electroless gold plating solution which is characterized by containing a water-soluble gold salt and a fused ring compound that has a nitrogen atom in a ring. Examples of the fused ring compound may include a fused ring compound that has two or more atoms other than carbon atoms in a ring, and a fused ring compound wherein a benzene ring or a pyridine ring is fused with a five-membered heterocyclic ring that has a nitrogen atom. The fused ring compound may have a substituent such as an alkyl group having from 1 to 6 carbon atoms, a mercapto group, a hydroxy group, a carboxy group, a nitro group and a halogen group.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
Provided is a plating laminated body (laminated body of plating films) that is to be provided to the surface of a conductive circuit or the like, that can maintain high bonding strength when a soldering bond is formed on the plating laminated body, and that can be stably produced. According to the present invention, a plating layer A containing a second metal as a main component is deposited on a to-be-plated body S containing a first metal as a main component, a plating layer B containing a third metal as a main component is deposited on the plating layer A through a substitution reaction, and then, on the plating layer B, a plating layer C containing the second metal, the third metal, or a fourth metal is deposited through a redox reaction. For example, in a specific configuration of the plating layers, the plating layer A is gold, platinum, or silver, the plating layer B is palladium, and the plating layer C is palladium.
C23C 18/52 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique en utilisant des agents réducteurs pour le revêtement avec des matériaux métalliques non prévus par un seul des groupes
Provided is a plated laminate (laminate of plated films) which is applied to the surface of a conductor circuit or the like, can maintain high joining strength when solder joining is performed on the plated laminate, and can be stably manufactured. After a plated layer A containing a second metal as a main component is deposited on an object S to be plated containing a first metal as a main component, a plated layer B containing palladium as a main component is deposited on the plated layer A through a substitution reaction, and then a plated layer C containing nickel as a main component is deposited on the plated layer B through an oxidation‐reduction reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum, or silver.
C23C 18/52 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique en utilisant des agents réducteurs pour le revêtement avec des matériaux métalliques non prévus par un seul des groupes
7.
Electroless platinum plating solution and platinum film obtained using same
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
8.
ELECTROLESS PLATINUM PLATING SOLUTION AND PLATINUM FILM OBTAINED USING SAME
The present invention addresses the problem of providing an electroless platinum plating solution, which is capable of plating with high deposition efficiency, does not undergo autolysis even if the solution does not contain sulfur or heavy metals, and has excellent bath stability, and an electroless platinum plating solution capable of limiting platinum deposition outside the pattern and allowing platinum plating to be performed only at necessary sites. The present invention also addresses the problem of providing a method for producing a plated platinum film using such an electroless platinum plating solution and a pure plated platinum film that contains essentially no sulfur or heavy metals. Said problems are solved by also incorporating a specified hydroxymethyl compound represented by general formula (1) or a salt thereof in an electroless platinum plating solution with a pH of 7 or more that contains a soluble platinum salt, a complexing agent, and a compound, which is a borohydride compound, an aminoborane compound or a hydrazine compound. (1) R1-CH2-OH [R1 is a moiety comprising an aldehyde group or ketone group]
The present invention addresses the problem of providing an electrolytic nickel (alloy) plating solution which is able to fill micro holes or micro recesses 14 within an electronic circuit component with nickel or nickel alloy 18 without the generation of defects such as voids and seams and firmly join two or more electronic components together by filling micro gaps. The present invention also addresses the problem of providing a nickel or nickel alloy plating/filling method with which an electrolytic nickel (alloy) plating solution is used, a method for producing a minute three-dimensional structure, an electronic component assembly, and a production method therefor. The problems have been solved by filling the micro holes or micro recesses 14 with an electrolytic nickel (alloy) plating solution which contains a specific N-substituted pyridinium compound.
The present invention addresses the problem of providing: an electrolytic nickel (alloy) plating solution which is able to fill micro holes or micro recesses 14 within an electronic circuit component with nickel or nickel alloy 18 without the generation of defects such as voids and seams; a nickel or nickel alloy plating/filling method which uses this electrolytic nickel (alloy) plating solution; and a method for producing a three-dimensional microstructure. The above-described problem has been solved by filling the micro holes or micro recesses 14 with use of an electrolytic nickel (alloy) plating solution which contains a specific N-substituted carbonyl pyridinium compound.
The present invention addresses the problem of providing an electroless gold plating solution and an aldehyde-amine adduct supply solution, which are able to be stably used without causing a decrease in the plating rate associated with the accumulation of a side reaction product even in cases where the heating standby time of the electroless gold plating solution lasts for a long time. The present invention has solved the problem by an electroless gold plating solution which is characterized by containing (a) a gold cyanide salt, (b) a complexing agent, (c) an aldehyde compound and (d) an amine compound represented by general formula (1) and an aldehyde-amine adduct supply solution which is characterized by containing (c') an aldehyde compound and (d') an amine compound represented by general formula (1). R1-NH-R2 (1) (In general formula (1), each of R1 and R2 represents an electron-donating group; and if m is the number of carbon atoms (C) in each molecule and n is the number of secondary amino groups (-NH-) in each molecule, m and n satisfy 2 ≤ m ≤ 12 and n = 1.)
The present invention addresses the problem of providing a palladium plating solution in which occurrence of defective parts such as pin holes on a palladium coating is reduced, and in which heat resistance performance equivalent to that obtained conventionally can be obtained even when a gold plating coating formed on the palladium coating is made thinner. The problem was overcome by: a palladium plating solution containing a soluble palladium salt as a palladium source, and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one or more specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxy group, an alkoxycarbonyl group, a sulfo group, an alkoxy sulfonyl group, an amino group, an alkylamino group, a dialkylamino group, and a cyano group; and a palladium coating obtained by performing palladium plating on a nickel, nickel alloy, copper, or copper alloy coating using the palladium plating solution.
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
C23C 18/52 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique en utilisant des agents réducteurs pour le revêtement avec des matériaux métalliques non prévus par un seul des groupes
C25D 3/50 - Dépôt électrochimiqueBains utilisés à partir de solutions de métaux du groupe du platine
13.
ELECTROLYTIC GOLD PLATING SOLUTION AND GOLD-COATED FILM PRODUCED USING SAME
Provided is an electrolytic gold plating solution, in which the deposition efficiency can be improved compared with those in the conventional gold plating solutions, the time required for the deposition of a gold plating material can be shortened, the concentration of gold, which is expensive, to be contained can be reduced, and therefore can be produced at reduced cost, while keeping mechanical properties, abrasion resistance, electric properties and the like of a gold-coated film produced using the plating solution at good levels and without deteriorating the appearance of the gold-coated film. An electrolytic gold plating solution characterized by comprising a gold cyanide salt that serves as a gold source and a specific pyridinium compound in which an alkyl group is bound to a nitrogen atom located at position-1 and one to five of position-2 to position-6 are substituted by one or more specific substituents independently selected from the group consisting of an alkyl group, an aryl group, a carboxy group, an alkoxycarbonyl group, a sulfo group, an alkoxysulfonyl group, an amino group, an alkylamino group, a dialkylamino group and a cyano group; and a gold-coated film produced by carrying out the electrolytic gold plating on a nickel coating film using the electrolytic gold plating solution.
A catalyst-imparting liquid is provided. When electroless reductional palladium plating is conducted directly on a copper-based-conductor circuit material, the catalyst-imparting liquid enables an even coating film free from thickness unevenness to be deposited without bridging fine wiring lines. When the electroless reductional palladium plating is followed by electroless gold plating and then by soldering to the resultant deposit, a coating film having no voids can be formed. The catalyst-imparting liquid is used for conducting electroless reductional palladium plating on a copper-based metal. The catalyst-imparting liquid is characterized by containing, as constituent ingredients, a water-soluble gold compound, a heterocyclic compound having a five-membered ring structure including two or more nitrogen atoms, and a chelating agent having an iminodiacetic acid structure. Also provided are: a process for producing a palladium deposit on a copper-based metal, characterized by using the catalyst-imparting liquid to conduct electroless reductional palladium plating on the copper-based metal; and a palladium deposit produced on a copper-based metal by the process.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
Provided is a reduction-type electroless tin plating solution suitable for practical use, which rarely causes replacement reaction on a substrate consisting of either copper or a copper alloy, which enables high-speed stable deposition, which is stable and attains high productivity, and which causes neither breaking of a conductor nor outgrowth of tin even when the conductor has a fine form. The reduction-type electroless tin plating solution is characterized by comprising, as the essential constituents, a water-soluble tin compound, a water-soluble titanium compound, an organic complexing agent, and an organosulfur compound selected from the group consisting of mercaptans and sulfides.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
16.
ELECTROLYTIC GOLD PLATING SOLUTION AND GOLD FILM OBTAINED USING SAME
The problem is to provide an electrolytic gold plating solution suitable for nickel barrier plating while maintaining the excellent properties of the gold plating film, e.g., mechanical characteristics, corrosion resistance, and electrical characteristics, that is, the problem is to provide an electrolytic gold plating solution capable of manufacturing a stable product that limits gold deposition at ‘portions not requiring gold plating (nickel barrier portions)’ where members are mechanically constrained, and ensures satisfactory gold deposition in portions requiring gold plating, without extraneous deposition of the gold. The aforementioned problem is solved by means of an electrolytic gold plating solution that contains a gold cyanide salt as the gold source, and a heterocyclic compound having one or more nitrogen atoms in the ring and one or more nitro groups replacing a carbon atom in said ring, and by means of a gold film that is obtained by electrolytic gold plating onto a nickel film using the aforementioned electrolytic gold plating solution.
A catalyst-imparting liquid which, when used in conducting electroless reductional solder plating directly on a copper-based conductor circuit material, can give an even coating film free from thickness unevenness and enables the formation of a solder deposit having no bridge between fine wiring lines. Also provided is a solder deposit formed using the catalyst-imparting liquid. The catalyst-imparting liquid, which is for conducting electroless reductional solder plating on a copper-based metal, is characterized by comprising a water-soluble gold compound and a chelating agent. The deposit is a solder deposit formed on a copper-based metal, and is characterized by being obtained by using the catalyst-imparting liquid to conduct electroless reductional solder plating. Furthermore provided is a solder deposit formed over a copper-based metal which has gold in an amount of 3×10-5 g/cm2 or smaller on the surface thereof, the deposit having been formed on the gold.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
Disclosed is an electrolytic gold plating solution which can ensure to provide an excellent solder joint strength of a lead-free solder ball even when the solder ball is used for connection. Specifically disclosed is an electrolytic gold plating solution comprising at least gold cyanide, a dicarboxylic acid or a dicarboxylic acid salt represented by the formula (1) and a dicarboxylic acid or a dicarboxylic acid salt represented by the formula (2). [In the formula (1), -CnH2n- represents an alkylene group which may be linear or have a side chain; X1 and X2 independently represent H, Na, K or NH4; and n represents a positive integer of 0 or greater.] [In the formula (2), X3 and X4 independently represent H, Na, K or NH4; and Y represents a hydrogen atom, an alkyl group or a hydroxyalkyl group.]
The invention aims at providing a reduction-type electroless tin plating solution which is suppressed in the substitution reaction on a substrate copper or copper alloy and enables stable deposition and which is stable and good for practical use, and provides a reduction-type electroless tin plating solution characterized by comprising as the essential constituents a water-soluble tin compound, a water-soluble titanium compound, and an organic complexing agent containing trivalent phosphorus; a process for the production of tin plating films by using the tin plating solution; and tin plating films obtained by electroless plating with the solution.
C23C 18/52 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique en utilisant des agents réducteurs pour le revêtement avec des matériaux métalliques non prévus par un seul des groupes
brevets
