Abrégé

A water block includes a main body and a heat transfer assembly. The heat transfer assembly includes a condensation plate coupled with the main body. The condensation plate has a condensation flow channel. The heat transfer assembly also includes a heat-absorbing plate that is coupled with one side of the condensation plate facing away the main body. The heat-absorbing plate has an evaporation flow channel. The heat transfer assembly further includes a flow guide plate that is disposed between the condensation plate and the heat-absorbing plate. The flow guide plate has a plurality of communication holes, and the evaporation flow channel is in fluid communication with the condensation flow channel via the communication holes.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

Liquid-flow cooling device for cooling heat source comprises pump body comprising pump housing with a liquid flow chamber and impeller rotatably located therein, and water-cooling head fitted to pump housing and having heat exchange chamber and thermal contact face. Heat exchange chamber is connected to liquid flow chamber of pump housing, and thermal contact face faces away from heat exchange chamber. Axis of impeller is perpendicular to a normal to the thermal contact face. Water-cooling head comprises multiple cooling fins in heat exchange chamber. Cooling fins comprise multiple densely distributed cooling fins arranged side by side adjacently to each other and multiple sparsely distributed cooling fins arranged side by side adjacently to each other. Densely distributed cooling fins located at one side of sparsely distributed cooling fins. Interval between any two adjacent densely distributed cooling fins is smaller than interval between any two adjacent sparsely distributed cooling fins.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F04D 1/04 - Pompes hélicocentrifuges
• F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges

Abrégé

A heat dissipation module for cooling an optical transceiver module includes a cold plate having an internal flow channel and a heat absorption surface, the internal flow channel having an inlet port and an outlet port, and the heat absorption surface configured to thermally contact the optical transceiver module, an inlet pipe having a first end connected to the inlet port and a second end connected to a cooling device, and an outlet pipe having a first end connected to the outlet port and a second end connected to the cooling device, the outlet pipe is configured to be in fluid communication with the inlet pipe through the internal flow channel and the cooling device, and the outlet pipe, the internal flow channel, the cooling device and the inlet pipe form a cooling circulation loop.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A blade structure configured to be mounted to a fan frame is disclosed. The blade structure comprises a hub rotatably disposed on a fan frame, and a plurality of blades, each blade comprising a first blade portion and a second blade portion, the first blade portion and the second blade portion being connected to the hub and arranged in an axial direction of the hub. The first blade portion and the second blade portion each include a first side, the first sides of the first blade portion and the second blade portion being directly connected with one another and connected to the hub. A fan device incorporating the blade structure is also disclosed.

Classes IPC  ?

• F04D 25/08 - Ensembles comprenant des pompes et leurs moyens d'entraînement le fluide énergétique étant l'air, p. ex. pour la ventilation
• F04D 25/06 - Ensembles comprenant des pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité

Abrégé

A fan device comprises a fan frame and a fan blade structure. The fan frame includes a bottom portion and at least one side portion connected to the bottom portion, the at least one side portion arranged around a receiving space, the at least one side portion having a hollow structure in fluid communication with the receiving space. The fan blade structure is rotatably mounted to the bottom portion and located within the receiving space, the fan blade structure at least partially extending into the hollow structure.

Classes IPC  ?

• F04D 29/52 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes axiales
• F04D 19/00 - Pompes à flux axial spécialement adaptées aux fluides compressibles
• F04D 29/32 - Rotors spécialement adaptés aux fluides compressibles pour pompes à flux axial

Abrégé

A fan blade including a hub portion and a plurality of first blade portions. The hub portion being rotatably disposed in the fan frame and having an opening, the first blade portions being connected to the hub portion. A driving component disposed in the fan frame and connected to the hub portion, the driving component being configured to drive the hub portion to rotate relative to the fan frame. A guiding component secured to the hub portion, the guiding component including a cover portion having at least one hole, the hole being in fluid communication with the opening, and the driving component being disposed on a side of the cover portion away from the opening, and at least one guiding portion connected to the cover portion and disposed at the hole.

Classes IPC  ?

• F04D 25/08 - Ensembles comprenant des pompes et leurs moyens d'entraînement le fluide énergétique étant l'air, p. ex. pour la ventilation
• F04D 19/00 - Pompes à flux axial spécialement adaptées aux fluides compressibles
• F04D 29/54 - Moyens de guidage du fluide, p. ex. diffuseurs
• F04D 29/58 - RefroidissementChauffageRéduction du transfert de chaleur

Abrégé

A liquid multi-nozzle jet-impingement cooling device may include a microjet multi-nozzle plate, outlet plate, inlet plate, outlet flow plate and cover plate. The cover plate is coupled to the outlet flow plate, which is coupled to the inlet plate, which is coupled to the outlet plate, which is coupled to the microjet multi-nozzle plate. A first inlet through hole of the cover plate is fluidly and an outlet through hole of one or more sub-outlet plenums of the cover plate are respectively fluidly coupled to a chamber of the microjet multi-nozzle plate. The chamber is sealably mounted on a surface of a processor. A plurality of third inlet orifice arrays of the microjet multi-nozzle plate directs liquid coolant to the surface of the processor and a plurality of first outlet orifice arrays of the microjet multi-nozzle plate directs liquid coolant away from the surface of the processor.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A coupling assembly for a blind mate fluid coupling includes a housing unit with a through channel extending axially and a first recessed portion at a first end. A slide plate is disposed in the first recessed portion and movable in a first radial direction perpendicular to the axial direction, the slide plate having an opening. A slide base has a flat portion and a sleeve portion extending through the opening of the slide plate. The slide base is movable in a second radial direction perpendicular to both the axial direction and the first radial direction. The sleeve portion includes a tapered channel with a gradually narrowing diameter towards the flat portion. An inlet valve is at least partially disposed in the tapered channel and is movable in the axial direction and angularly pivotable within the tapered channel. This two-stage floating mechanism could accommodate radial, axial, and angular misalignment during blind mate coupling operations.

Classes IPC  ?

• F16L 37/50 - Accouplements du type à action rapide réglablesAccouplements du type à action rapide permettant un déplacement des parties raccordées

Abrégé

A liquid pump unit includes a chassis having a chassis box and a catch-pin with a retaining cut-out disposed in the chassis box, a pump assembly removably mounted in the chassis box, and a latch mechanism. The latch mechanism includes a latch having a main body portion pivotally mounted at a first location of the pump assembly, with a hook and an abutment protrusion projecting from opposite sides of the main body portion. A lever includes a pivot portion pivotally mounted at a second location on the pump assembly and an extension portion connected to the pivot portion. A bar has opposite first and second pivot ends pivotally connected to the main body portion and the extension portion, respectively. Rotation of the lever relative to the pump assembly and abutment of the abutment protrusion against the catch-pin cooperatively drive the hook to engage with the retaining cut-out.

Classes IPC  ?

• H01R 13/629 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz
• F16B 1/00 - Dispositifs pour assembler des éléments structuraux ou parties de machines ou bien pour empêcher tout mouvement relatif entre eux
• H01R 13/00 - Détails de dispositifs de couplage des types couverts par les groupes ou

Abrégé

A composite fan blade includes a metal member and a plastic member. The metal member has a binding portion and a plurality of blade portions circumferentially arranged around the binding portion. The plastic member is at least partially secured to the binding portion to form a hub structure. The binding portion includes a substrate and a plurality of connecting plates circumferentially arranged around the substrate. Each connecting plate has an inner surface and an opposite outer surface, with the blade portions protruding from the outer surfaces of the corresponding connecting plates. A notch is formed between any two adjacent connecting plates.

Classes IPC  ?

• F04D 29/32 - Rotors spécialement adaptés aux fluides compressibles pour pompes à flux axial
• F04D 29/02 - Emploi de matériaux spécifiés
• F04D 29/38 - Ailettes
• F04D 29/64 - MontageAssemblageDémontage des pompes axiales

Abrégé

A heat dissipation module for cooling an optical transceiver module includes a thermal conductive base having a heat dissipation surface and a heat absorption surface, wherein the heat absorption surface is configured to thermally contact the optical transceiver module, and a heat pipe having an evaporation end and a condensation end, the evaporation end disposed on the heat dissipation surface, and the condensation end configured to connect to a heat dissipation device, wherein the heat pipe is configured to contain liquid working fluid and gaseous working fluid, the evaporation end is configured to absorb heat from the thermal conductive base to convert the liquid working fluid into the gaseous working fluid, and the condensation end is configured to cool the gaseous working fluid into the liquid working fluid.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A proportional valve includes a casing and a valve trim. The casing has at least one fluid inlet, a fluid outlet, at least one first connection passageway, at least one second connection passageway and an accommodating space. The first connection passageway is connected with the fluid inlet. The second connection passageway is connected with the fluid outlet. The valve trim is located in the accommodating space, including a flow splitter an adjusting rotor. The flow splitter has at least one third connection passageway and at least one fourth connection passageway. The third connection passageway is connected with the first connection passageway. The fourth connection passageway is connected with the second connection passageway. The adjusting rotor has a channel and at least one blocking portion. The adjusting rotor is rotatably disposed on the flow splitter so that the blocking portion blocks a part of the third connection passageway.

Classes IPC  ?

• F16K 11/074 - Soupapes ou clapets à voies multiples, p. ex. clapets mélangeursRaccords de tuyauteries comportant de tels clapets ou soupapesAménagement d'obturateurs et de voies d'écoulement spécialement conçu pour mélanger les fluides dont toutes les faces d'obturation se déplacent comme un tout comportant uniquement des tiroirs à éléments de fermeture articulés à pivot à faces d'obturation planes
• F16K 27/04 - Structures des logementsMatériaux utilisés à cet effet des tiroirs
• F16K 31/04 - Moyens de fonctionnementDispositifs de retour à la position de repos électriquesMoyens de fonctionnementDispositifs de retour à la position de repos magnétiques utilisant un moteur

Abrégé

A heat dissipating device that includes a first plate and a second plate opposite the first plate and connected to the first plate by two opposite sidewalls. The first plate and the second plate are connected to each other at longitudinally opposite ends thereof, longitudinally extending ends of the first plate and the second plate are connected to each other by sidewalls, and the first plate, the second plate and the sidewalls enclosing an internal space of the heat dissipating device. The heat dissipating device also includes a first wick structure disposed in the internal space and contacting inner surfaces of at least one of the first plate and the second plate. The first wick structure extends longitudinally between the longitudinally opposite ends of the first plate and the second plate, and the first wick structure at least partially defines a first vapor flow channel of the heat dissipating device

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• B23P 15/26 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'échangeurs de chaleur

Abrégé

A fan structure includes a housing extending along a first axis, a fan blade rotatably disposed within the housing and along the first axis, and a gear assembly. The gear assembly includes a sun gear coaxially arranged with the fan blade, a ring gear disposed on an inner wall of the housing, a plurality of planet gears meshing between the sun gear and the ring gear, and a decorative plate mounted on the planet gears. When the fan blade is driven to generate airflow, rotation of the fan blade drives the sun gear to rotate, the rotating sun gear causes the planet gears to revolve between the sun gear and the ring gear, and the revolving planet gears drive the decorative plate to rotate.

Classes IPC  ?

• F04D 25/02 - Ensembles comprenant des pompes et leurs moyens d'entraînement
• F16H 1/46 - Systèmes consistant en plusieurs trains d'engrenages, chacun comportant des engrenages orbitaux
• F16H 57/02 - Boîtes de vitessesMontage de la transmission à l'intérieur

Abrégé

A liquid pump unit includes a chassis box having a front opening and a back panel that includes fluid and electrical interfaces. The liquid pump unit also includes a tray box that supports a pump assembly. The pump assembly includes fluid couplers and electrical connectors respectively configured to mate with the fluid and electrical interfaces. The liquid pump unit further includes a latch mechanism disposed between the chassis box and the tray box. The latch mechanism includes a rotatable lever, a latch and a connecting bar. The latch is configured to engage a catch-pin that protrudes from the back panel. Rotation of the lever drives the connecting bar to actuate the latch to engage the catch-pin and cause the fluid couplers and electrical connectors to respectively connect with the fluid and electrical interfaces.

Classes IPC  ?

• F04B 53/22 - Dispositions pour l'assemblage ou le démontage rapide
• F04B 53/16 - Carcasses d'enveloppeCylindresChemises de cylindre ou culassesConnexions des tubulures pour fluide
• F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
• F04D 29/40 - Carters d'enveloppeTubulures pour le fluide énergétique
• F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
• F04D 29/58 - RefroidissementChauffageRéduction du transfert de chaleur
• F04D 29/60 - MontageAssemblageDémontage
• F04D 29/62 - MontageAssemblageDémontage des pompes radiales ou hélicocentrifuges
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A chassis assembly includes a first frame and a second frame movably disposed on the first frame. At least one first connector is disposed on the first frame, and at least one second connector is disposed on the second frame, the connectors being positioned between the first and second frames. At least one magnetic element is positioned between the first and second frames, and at least one electromagnet assembly is positioned between the first and second frames in correspondence with the magnetic element. The electromagnet assembly includes a magnetic conductor and a coil wound around the magnetic conductor. In an unenergized state, magnetic attraction between the magnetic element and the magnetic conductor causes the first and second connectors to mate. In an energized state, magnetic repulsion between the magnetic element and the magnetic conductor causes the first and second connectors to separate.

Classes IPC  ?

• H01F 7/08 - Électro-aimantsActionneurs comportant des électro-aimants avec armatures
• H01F 7/126 - Support ou montage
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

According to some aspects of the present disclosure, a fan structure includes a support, a fan mounted on the support, and a thermochromic material disposed on or in the support or the fan, and including multiple portions, each portion having a respective color-transition temperature at which the respective portion changes between a respective first color state and a respective second color state, the color-transition temperatures of the multiple portions being different from each other.

Classes IPC  ?

• F04D 19/00 - Pompes à flux axial spécialement adaptées aux fluides compressibles
• F04D 29/02 - Emploi de matériaux spécifiés

Abrégé

A water-cooling plate and a method of forming thereof where the water-cooling plate comprises at least one cooling plate body comprising a first heat-conducting square tube and a second heat-conducting square tube. The first heat-conducting square tube has a first flow channel, a fluid inlet, and a first fluid communication port. The fluid inlet and the first fluid communication port are in communication with the first flow channel. The second heat-conducting square tube is connected to the first heat-conducting square tube and has a second flow channel, a second fluid communication port, and a fluid outlet. The fluid outlet and the second fluid communication port are in communication with the second flow channel. The first flow channel is in communication with the second flow channel through the first fluid communication port and the second fluid communication port.

Classes IPC  ?

• F28F 3/12 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux
• F28F 9/02 - Boîtes de distributionPlaques d'extrémité

Abrégé

A piping assembly includes a tube having a first end and a second end, a first leak-detection wire and a second leak-detection wire that are embedded within the tube during a molding process, a resistor electrically connected between first ends of the leak-detection wires, and a monitoring device electrically connected to second ends of the leak-detection wires to monitor a resistance of a leak detection circuit formed by first leak-detection wire, the resistor, and the second leak-detection wire.

Classes IPC  ?

• G01M 3/18 - Examen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique pour tuyaux, câbles ou tubesExamen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique pour raccords ou étanchéité de tuyauxExamen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique pour soupapes

Abrégé

A water cooling assembly for pump installation includes a base having a heat exchange chamber, a plurality of fins positioned in the heat exchange chamber, and a cover member covering the heat exchange chamber. The cover member includes an upper surface and a lower surface opposite to each other. At least one first inlet and at least one first outlet extends through both the upper surface and the lower surface to communicate with the heat exchange member fluidly. A cover member channel is formed on the upper surface without penetrating the lower surface, the cover member being in fluid communication with the first outlet.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A piping assembly includes a tube having a first end and a second end, a first leak-detection wire and a second leak-detection wire that are embedded within the tube during a molding process and are electrically isolated from one another during normal operations, and a monitoring device that is electrically connected to first ends of the leak-detection wires to form an open circuit and is configured to monitor the open circuit for a change from an open state to a closed state. The open circuit changes to the closed state when a rupture occurs in the tube and liquids create a conductive path, forming a closed circuit through the first leak-detection wire, the second leak-detection wire, the monitoring device and the liquids.

Classes IPC  ?

• G01M 3/16 - Examen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique
• G01M 3/18 - Examen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique pour tuyaux, câbles ou tubesExamen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique pour raccords ou étanchéité de tuyauxExamen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique pour soupapes

Abrégé

A liquid cooling head including a housing having a gas chamber and a liquid chamber that are separated from each other, a fan blade rotatably disposed in the gas chamber, a pump impeller rotatably disposed in the liquid chamber, and a motor including a circuit board, a stator assembly, a blade rotor, and an impeller rotor, wherein the circuit board is disposed in the gas chamber, the stator assembly is disposed on the circuit board, the blade rotor and the impeller rotor are respectively disposed on the fan blade and the pump impeller, and the blade rotor and the impeller rotor are configured to generate magnetic fields with the same stator assembly to rotate the fan blade and the pump impeller.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A fan device includes a fan frame having an inner annular surface and a coupling groove, the inner annular surface defining a receiving space, and the coupling groove being recessed inward from the inner annular surface. The fan device also includes a fan blade assembly rotatably disposed within the fan frame and located in the receiving space. The fan device further includes a metal annular frame coupled to the coupling groove and positioned between the fan frame and the fan blade assembly. The fan frame includes a first annular engagement portion disposed in the coupling groove, and the metal annular frame includes a second annular engagement portion disposed on a side adjacent to the coupling groove. The metal annular frame surrounds the fan blade assembly and is mechanically retained within the coupling groove.

Classes IPC  ?

• F04D 29/52 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes axiales
• F04D 19/00 - Pompes à flux axial spécialement adaptées aux fluides compressibles
• F04D 25/06 - Ensembles comprenant des pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
• F04D 29/02 - Emploi de matériaux spécifiés
• F04D 29/64 - MontageAssemblageDémontage des pompes axiales

Abrégé

A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire

Abrégé

A liquid cooling assembly includes a first cold plate with a first port and a third port, and a second cold plate with a second port and a fourth port. An inner wall in a housing of each port surrounds a cavity. A first tube is in fluid communication with both the first port and the second port. Each of a first connector and a second connector has diameter portion and a narrow diameter portion, wherein the narrow diameter portions are coupled to opposite ends of the first tube and placed in the first port and the second port, the wide diameter portion is placed in the first port and the second port and includes grooves with O-rings, and each end of the first tube has a portion placed in the housing and spaced apart from the inner wall of the housing by a gap.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

Manifold comprises flow-splitting tube, two externally-connected tubes, and two covers. Flow-splitting tube has two flow paths which are not connected to each other, multiple flow-splitting ports and multiple confluence ports. The flow-splitting ports are connected to one flow path. The confluence ports are connected to the other flow path. The first externally-connected tube has a first externally-connected flow path connected to one flow path. The second externally-connected tube has a second externally-connected flow path connected to the other flow path. The first externally-connected tube and the second externally-connected tube are respectively fitted to two opposite sides of the flow-splitting tube. One cover is arranged at one side of the first externally-connected tube, and forms the first externally-connected flow path together with the first externally-connected tube. Another cover is arranged at one side of the second externally-connected tube, and forms the second externally-connected flow path together with the second externally-connected tube.

Classes IPC  ?

• F16L 41/03 - Ensembles de branchements, p. ex. d'une seule pièce, soudés à l'autogène, rivetés comportant des pièces d'assemblage pour quatre tuyaux ou plus
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes
• F28F 3/06 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations les moyens pouvant être fixés sur l'élément

Abrégé

A liquid cooling system including a direct liquid cooling loop, system board, and cooling distribution unit is provided. The direct cooling loop includes a flexible tubing section, proximal fitting, distal fitting, and cold plate. A proximal connection end of the flexible tubing section is coupled to a proximal fitting attachment end of the proximal fitting via a proximal lap joint. A distal connection end of the flexible tubing section is coupled to a distal fitting attachment end of the distal fitting via a distal lap joint. The flexible tubing section is fluidly in communication with at least one of an inlet and outlet of the cold plate. A first integrated circuit component of the system board is physically and thermally coupled to the direct liquid cooling loop via the cold plate. The cooling distribution unit is fluidly in communication with the direct liquid cooling loop, providing a working fluid thereto.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A loop thermosiphon assembly may include a thermal interface component configured to be coupled to a heat source to be cooled, a channel coupled to the thermal interface component, a first vapor channel coupled to the channel, and one or more coolant pipes coupled to the first vapor channel and the channel. The channel includes a vapor barrier and a second vapor channel. The first vapor channel is in communication with the thermal interface component via the second vapor channel. The one or more coolant pipes is in communication with the thermal interface component via the vapor barrier. The second vapor channel and the first vapor channel direct vaporized liquid coolant upwards and away from the thermal interface component and heat source, and the one or more coolant pipes and the vapor barrier direct liquefied vapor coolant downwards and toward the thermal interface component and the heat source.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire

Abrégé

A cooling device containing a cooling liquid includes a heat dissipation plate assembly and a pump. The heat dissipation plate assembly comprises a first plate and a second plate. The first plate features a recessed structure for thermally coupling with a heat source. The second plate covers the recessed structure to form a heat dissipation channel including an inlet and an outlet, among others. The heat dissipation channel accommodates the cooling liquid. The pump is in communication with both the inlet and outlet and serves to circulate the cooling liquid through the channel.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement

Abrégé

A liquid cooling pumping unit including a cover, rotor, housing, driver, flow spray plate, and thermal plate is provided. The cover is configured above the housing, the housing above the base, and the base above the thermal plate. A first fluid chamber is defined by a chamber of the cover and an annular chamber of the housing. An inlet of the housing is in fluid connection with the first fluid chamber. A second fluid chamber is defined by the flow spray plate and a recess of the thermal base. An outlet of the base is in fluid connection with the second fluid chamber. An impeller of the rotor is rotatable in the first fluid chamber. The driver is configured above the base and under the housing, driving the rotor to rotate with respect to the housing. The first fluid chamber is in fluid communication with the second fluid chamber.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
• F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
• G06F 1/20 - Moyens de refroidissement

Abrégé

A fan blade design includes a hub and a plurality of blades connected to the hub. Each of the blades is a swept-back blade and has a leading edge and a trailing edge disposed opposite the leading edge. The trailing edge includes a first concave arc segment and a second concave arc segment, the first concave arc segment being positioned closer to the hub than the second concave arc segment. A chord length of the first concave arc segment is greater than a chord length of the second concave arc segment.

Classes IPC  ?

• F04D 29/38 - Ailettes
• F04D 25/08 - Ensembles comprenant des pompes et leurs moyens d'entraînement le fluide énergétique étant l'air, p. ex. pour la ventilation
• F04D 29/32 - Rotors spécialement adaptés aux fluides compressibles pour pompes à flux axial
• F04D 29/66 - Lutte contre la cavitation, les tourbillons, le bruit, les vibrations ou phénomènes analoguesÉquilibrage

Abrégé

A composite heat dissipation mechanism is provided for dissipating heat from heat sources. The mechanism includes an air-cooling heat dissipation assembly and a liquid-cooling heat dissipation assembly. The air-cooling heat dissipation assembly includes an airflow generator with a first air outlet, and a first heat dissipation fin disposed adjacent to the first air outlet and thermally coupled to the heat sources. The liquid-cooling heat dissipation assembly includes a heat-conducting flow pipe thermally coupled to the first heat dissipation fin and configured to accommodate a cooling fluid, and a fluid driver in communication with the heat-conducting flow pipe to form a circulation flow path. The fluid driver is configured to drive the cooling fluid to circulate within the circulation flow path.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A hub assembly for a liquid cooling radiator having two pipeline joints that each includes a ring groove on an outer surface. The hub assembly including a hub base having a mounting portion that is disposed between two connecting portions, each connecting portion being configured to partially surround one of the pipeline joints at the respective ring groove, and two clamping structures that each connect to one of the connecting portions and are configured to partially surround one of the pipeline joints at the respective ring groove, wherein the hub base is secured to the liquid cooling radiator by clamping the pipeline joints between the respective clamping structures and the respective connection portions.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs

Abrégé

A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs

Abrégé

A liquid cooling assembly thermally coupled to multiple heat sources, includes a first heat dissipation assembly including a first base having a first thermal contact surface and a first inner surface positioned opposite to one another, the first thermal contact surface is thermally coupled to one of the heat sources, and a plurality of first fins protrude from the first inner surface, a second heat dissipation assembly including a second base have a second thermal contact surface and a second inner surface positioned opposite to one another, the first thermal contact surface is thermally coupled to one of the heat sources, the first inner surface and the second inner surface are facing toward to each other, and a plurality of second fins protrude from the second inner surface, and a splitter disposed between the first and the second heat dissipation assembly, ends of the first fins and the second fins are connected to the splitter.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A two-phase immersion cooling device includes a coolant tank defining a liquid region for retaining a working fluid and a vapor region above it. A condenser is at least partially disposed in the vapor region. A heat transfer enhancer is positioned in the liquid region and thermally coupled to a heat dissipating component. The heat transfer enhancer includes a directed flow opening, an upper surface, and containment walls. A redirection flow orifice is formed on the upper surface or the containment wall. A pressure enhanced region is adjacent to the upper surface and in communication with a boiling region below. An accelerated flow region is formed beneath the directed flow opening, and a recycling flow region is defined between a containment wall and a tank side wall.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A liquid cooling system includes a cold plate, a first water block and a second water block, a first radiator and a second radiator, a plurality of first fans and at least one second fan, a plurality of first pipes connecting the first water block and the second water block to the first radiator, and a plurality of second pipes connecting the cold plate to the second radiator, respectively configured to circulate a first working fluid and a second working fluid within the liquid cooling system to dissipate heat from connected components, and a thermoelectric cooler module having a hot side and a cold side that are opposite each other. The cold side is thermally coupled to the first water block, and the hot side is thermally coupled to the cold plate.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

An immersion cooling device for dissipating heat includes a base portion having a heat absorbing surface and a heat dissipating surface, a fin portion that arranged on the heat dissipating surface of the base portion, and a covering portion that forms a vapor chamber around the fin portion on the base portion. The covering portion can include a liquid inlet channel and a liquid outlet channel that are connected to the vapor chamber. Further, the fin portion can include a inlet section that is located adjacent to the liquid inlet channel and an outlet section that is located adjacent to the liquid outlet channel, and a cavity that is formed over the outlet section.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A coupling assembly for a blind mate fluid coupling includes a housing, a sliding base disposed within the housing, the sliding base having an internal passage with a first portion and a second portion connected at a middle opening, the internal passage extend in an axial direction, the second portion has a larger diameter than the first portion, the sliding base being movable in a radial direction that is perpendicular to the axial direction and relative to the housing, and an inlet valve that is at least partially disposed in the internal passage, the inlet valve being movable in the axial direction within the internal passage and angularly pivotable at the first portion.

Classes IPC  ?

• F16L 37/53 - Accouplements du type à action rapide réglablesAccouplements du type à action rapide permettant un déplacement des parties raccordées autorisant un réglage ou un déplacement uniquement autour de l'axe de l'un des tuyaux
• F16L 37/40 - Accouplements du type à action rapide avec moyens pour couper l'écoulement du fluide avec un obturateur dans une seule des deux extrémités de tuyau avec un clapet dont l'ouverture se fait automatiquement au moment de l'accouplement

Abrégé

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.

Classes IPC  ?

• F28D 1/03 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide avec des canalisations en forme de plaques ou de laminés
• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes

Abrégé

Immersion-type heat dissipating device thermally coupled to heat source includes heat conductor and boiling enhancement layer. The heat conductor includes a plurality of fin portions and a base portion, which is thermally coupled to the heat source and has heat receiving surface and heat dissipating surface opposite to each other. The fin portions protrude from the heat dissipating surface of the base portion. The boiling enhancement layer, which is disposed on at least part of the heat dissipating surface and at least part of the fin portions, includes at least one first metal portion and at least one second metal portion. A specific surface area of the at least one first metal portion is larger than a specific surface area of the at least one second metal portion.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A thermal testing tool comprises a base, a back plate, a heating assembly and a first sealing member. The back plate is arranged on the base and, together with the base, encloses a first accommodating recess and a second accommodating recess. The second accommodating recess is located at a periphery of the first accommodating recess. The heating assembly comprises a heating sheet. At least a portion of the heating sheet is located in the first accommodating recess. The first sealing member is arranged in the second accommodating recess and located at a periphery of at least a portion of the heating sheet.

Classes IPC  ?

• G01N 25/48 - Recherche ou analyse des matériaux par l'utilisation de moyens thermiques en recherchant la production de quantités de chaleur, c.-à-d. la calorimétrie, p. ex. en mesurant la chaleur spécifique, en mesurant la conductivité thermique sur une solution, sorption ou réaction chimique n'impliquant pas une oxydation par combustion ou catalyse
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A liquid pump unit may include a chassis, pump assembly, and filter device. A front panel, bottom panel, and back panel of the chassis define an interior space therewithin. The liquid pump unit may include a pump assembly including a pump, pump pipe system, and liquid connector system. The pump pipe system is fluidly coupled to the pump at a first end and fluidly coupled to the liquid connector system at a second end. The pump and the pump pipe system are disposed in the interior space. The liquid connector system is coupled to the back panel and enabled for a cooling fluid to flow therethrough. The filter device is fluidly coupled between the pump pipe system and liquid connector system and enabled to mechanically remove solid particles from the cooling fluid flowing through the liquid pump unit. The liquid pump unit and the liquid connector system are vertically disposed.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A cooling system assembly may include a heatsink unit and a water block unit. The heatsink unit is configured to enable a first cooling liquid to undergo a phase-change. The heatsink unit includes a heat pipe heatsink comprising a first thermal transfer surface and a second thermal transfer surface. The second thermal transfer surface is opposite the first thermal transfer surface. The first thermal transfer surface is configured to enable a heat to be transported from at least one packaged integrated circuit to the heat pipe heatsink. The water block unit is configured to enable a second cooling liquid to flow through the water block unit. The water block unit is thermally coupled to the second thermal transfer surface. The second thermal transfer surface is configured to enable the heat to be further transported from the heat pipe heatsink to the water block unit.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A heat sink includes a thermally conductive base. The thermally conductive base has a first surface, a second surface, a guiding surface and an accommodating recess. The second surface faces away from the first surface. The guiding surface are connected to the first surface and the second surface. The guiding surface is not perpendicular to the first surface and the second surface. The accommodating recess is located at the first surface. The thermally conductive base has an inner bottom surface and an inner annular side surface which surround and form the accommodating recess. The inner annular side surface is connected to the inner bottom surface. The accommodating recess accommodates a heat source. The inner bottom surface is thermally coupled to the heat source.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A cooling system assembly may include a housing and two pump assemblies. The housing includes two pump cavities, each, disposed parallel against each other, and an inlet and outlet. Each two pump cavities includes a pump cavity inlet and pump cavity outlet. Each two pump assemblies is disposed in each two pump cavities and includes an impeller casing and a liquid driving assembly. Each liquid driving assembly includes a power source and an impeller. Each impeller casing includes a driving chamber, driving chamber inlet, and driving chamber outlet. Each power source respectively drives each impeller to rotate relative to each driving chamber. Each impeller casing defines an inlet chamber separate from the driving chamber. Each driving chamber is fluidly connected to the inlet via each driving chamber inlet, each inlet chamber, and each pump cavity inlet. The outlet is fluidly connected to each driving chamber.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A cooling system assembly may include a three-dimensional heat exchanger and liquid cooling unit. The three-dimensional heat exchanger includes a vapor chamber having a first thermally conductive plate and second thermally conductive plate, together, forming a liquid-tight chamber. The liquid-tight chamber includes a first sub-chamber and second sub-chamber encircling the first sub-chamber. The first thermally conductive plate includes a first thermal transfer surface configured to couple to a packaged integrated circuit on an opposite side of the first sub-chamber. The liquid cooling unit includes at least one coolant-carrying channel thermally coupled to an outside surface of the second sub-chamber. When coupled to the at least one packaged integrated circuit, the three-dimensional heat exchanger transports heat away from the at least one packaged integrated circuit and the liquid cooling unit transports heat away from the three-dimensional heat exchanger.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire

Abrégé

A liquid pump unit includes a chassis with a tray box and a chassis box. The chassis box has a front opening, a back panel, and a bay for receiving the tray box. The back panel includes a chassis-outlet coupler, a chassis-inlet coupler, and at least one chassis-electrical connector. A pump assembly is mounted on the tray box and includes an outlet coupler, an inlet coupler, and at least one electrical connector, each removably connected to corresponding chassis couplers. A latch mechanism having a lever, bar, latch, and catch-pin secures the tray box within the chassis. The latch is rotatable to engage or release the catch-pin, allowing the latch mechanism to lock or release.

Classes IPC  ?

• F04B 53/22 - Dispositions pour l'assemblage ou le démontage rapide
• F04B 53/16 - Carcasses d'enveloppeCylindresChemises de cylindre ou culassesConnexions des tubulures pour fluide
• F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
• F04D 29/40 - Carters d'enveloppeTubulures pour le fluide énergétique
• F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
• F04D 29/58 - RefroidissementChauffageRéduction du transfert de chaleur
• F04D 29/60 - MontageAssemblageDémontage
• F04D 29/62 - MontageAssemblageDémontage des pompes radiales ou hélicocentrifuges
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A light emitting fan device may include a magnetic component, fan frame, fan assembly, decorative plate, and driving circuit board. The driving circuit board, the magnetic component and the fan assembly are disposed in the interior cavity. The decorative plate includes an identifying indicia and is coupled to the fan assembly. The fan frame includes a sensing component configured to detect a first magnetic field direction and generate a first signal and a second magnetic field direction and generate a second signal of the magnetic component. The driving circuit board includes a plurality of light sources and controller integrated circuit. The plurality of light sources emit light that is directed toward the decorative plate. The identifying indicia permits at least some light to pass therethrough. The controller integrated circuit is configured to receive the first signal and the second signal and turn “ON” and “OFF” the plurality of light sources.

Classes IPC  ?

• F21V 33/00 - Combinaisons structurales de dispositifs d'éclairage avec d'autres objets, non prévues ailleurs
• F04D 19/00 - Pompes à flux axial spécialement adaptées aux fluides compressibles
• F04D 25/06 - Ensembles comprenant des pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
• F04D 29/00 - Parties constitutives, détails ou accessoires
• F21V 3/04 - GlobesVasquesVerres de protection caractérisés par les matériaux, traitements de surface ou revêtements
• F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage
• F21Y 115/10 - Diodes électroluminescentes [LED]

Abrégé

A heat exchange device may include a fin stack, plurality of heat pipes, and thermally conductive substrate. The fins stack includes a plurality of fins defining a stacked direction. The plurality of heat pipes have a fin stack portion, transportation portion, and substrate portion. The transportation portion is between the fin stack portion and the substrate portion. The thermally conductive substrate includes a top surface and bottom surface. The fin stack portion is coupled to each plurality of fins and the substrate portion is coupled to the top surface. The bottom surface is configured to couple to at least one packaged integrated circuit. The transportation portion includes at least one bend defining a gap between the fin stack and the top surface. A direction of the stacked direction is along a plane of the top surface.

Classes IPC  ?

• F28D 7/16 - Appareils échangeurs de chaleur comportant des ensembles de canalisations tubulaires fixes pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation les canalisations étant espacées parallèlement

Abrégé

A liquid cooling device includes a thermal conduction base, a thermal conduction cover and at least one piercing component. The thermal conduction base has a liquid storage space and a thermal contact surface. The thermal contact surface faces away from the liquid storage space. The thermal conduction cover is disposed on the thermal conduction base, and covers the liquid storage space. The at least one piercing component is located in the liquid storage space, and has a plurality of protrusions. The plurality of protrusions face the thermal contact surface.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A light emitting multi fan device may include a mount rack, fan frame, light guide plate, plurality of fans, and plurality of fixing assemblies. The plurality of fans is rotatably coupled to a rack frame of the mount rack. The fan frame is coupled to the mount rack and respectively surrounds each plurality of fans. The light guide plate is coupled to the fan frame and the rack frame. Each plurality of fixing assemblies includes a locking element and a receiving through hole. The locking element protrudes from the fan frame and the receiving through hole extends through the rack frame. The plurality of fixing assemblies is configured to enable the fan frame to lock the light guide plate between the fan frame and the rack frame via a pushing force.

Classes IPC  ?

• F21V 33/00 - Combinaisons structurales de dispositifs d'éclairage avec d'autres objets, non prévues ailleurs
• F04D 25/16 - Combinaisons de plusieurs pompes
• F04D 29/64 - MontageAssemblageDémontage des pompes axiales
• F21V 8/00 - Utilisation de guides de lumière, p. ex. dispositifs à fibres optiques, dans les dispositifs ou systèmes d'éclairage
• F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage

Abrégé

A cooling system assembly may include a water block unit and liquid cooling unit. The water block unit is configured for phase-change of a first cooling fluid and the liquid cooling unit is configured to be flow through by a second cooling fluid. The water block unit includes a first thermal transfer surface and second thermal transfer surface. The first thermal transfer surface is configured to couple to a packaged integrated circuit. The liquid cooling unit includes a liquid plate heat exchanger comprising a liquid cooling water block coupled to the second thermal transfer surface. The first thermal transfer surface is thermally coupled to the packaged integrated circuit, whereby the water block unit transports heat away from the packaged integrated circuit. The liquid cooling water block is thermally coupled to the second thermal transfer surface, whereby the liquid cooling unit transports heat away from the water block unit.

Classes IPC  ?

• F28F 9/02 - Boîtes de distributionPlaques d'extrémité
• F17D 1/08 - Systèmes de canalisation pour liquides ou produits visqueux
• F24F 7/06 - Ventilation avec réseau de gaines à circulation d'air forcée, p. ex. par un ventilateur
• F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations

Abrégé

A variable-part liquid cooling pumping unit including a water block set, flow guiding plate, and water block cover of a water block unit, and a chamber body of a pump housing assembly of a pump unit is provided. The chamber body includes an impeller cavity inlet, flow adjusting disc, impeller cavity, and impeller cavity outlet opening. Inlet and outlet ports are positioned on a same side. More than one water block unit and pump unit are provided and interchangeable. During operation, working fluid is sucked via the inlet port through the impeller cavity inlet, pass the flow adjusting disc, into the impeller cavity, to a plurality of curved blades of an impeller of a rotor assembly unit. From there, the working fluid travels through the impeller cavity outlet opening, flow guiding plate, and water block set, before exiting through the flow guiding plate, and outlet port.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F04D 1/00 - Pompes à flux radial, p. ex. pompes centrifugesPompes hélicocentrifuges
• F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
• F04D 29/44 - Moyens de guidage du fluide, p. ex. diffuseurs
• F28F 3/12 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux
• G06F 1/20 - Moyens de refroidissement

Abrégé

A three-dimensional heat transfer device includes a first thermal conductive shell, a second thermal conductive shell that connects the first thermally conductive shell to form a liquid-tight chamber, a plurality of heat pipes disposed on the first thermally conductive shell, and in fluid communication with the liquid-tight chamber, at least one thermally conductive assembly of a hot area arranged in the liquid-tight chamber and disposed on the second thermally conductive shell, the at least one thermally conductive assembly of hot area includes a plurality of extended thermally conductive structures of hot area, and at least one thermally conductive assembly of a cold area arranged adjacent to the at least one thermally conductive assembly of hot area includes at least two extended thermally conductive structures of cold area that are separated to form a pressure drop notch therebetween.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire

Abrégé

An immersion cooling system includes an immersion tank and at least one electronic device. The immersion tank is configured to accommodate a coolant. The at least one electronic device is disposed in the immersion tank, and includes a cage assembly, at least one motherboard and a plurality of expansion cards. The cage assembly includes a fixed frame and at least one movable frame. The at least one movable frame are movably disposed on the fixed frame. The at least one motherboard is mounted on the at least one movable frame. The plurality of expansion cards are mounted on the at least one motherboard.

Classes IPC  ?

• H05K 7/14 - Montage de la structure de support dans l'enveloppe, sur cadre ou sur bâti
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A fan device may include a fan frame, fan assembly, and plurality of mount component assemblies. The fan assembly is rotatably disposed in the fan frame. Each plurality of mount component assemblies includes a fixing assembly, and mount assembly. The fixing assembly is disposed on the fan frame. The mount assembly includes a mount component, and bracket. The bracket is fixed to the mount component. The bracket includes a material having a second hardness and the mount component includes a material having a third hardness. The second hardness is greater than the third hardness. The mount assembly is fixedly locked to the fixing assembly via the bracket, driven by a pushing force.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• C08K 7/14 - Verre
• F04D 25/06 - Ensembles comprenant des pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
• F04D 29/34 - Montage des ailettes

Abrégé

A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber comprises an upper and lower casing having an upper and lower chamber surface, respectively. The upper and lower chamber surfaces define a plurality of obstructers forming a plurality of braided channels therearound. When heat from a greater temperature heat source and a lower temperature heat source is applied to respective contact surfaces of the lower casing, via the plurality of obstructers and braided channels, respectively, the working fluid and liquid vapor slugs/bubbles travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A heating assembly includes a heating sheet including a first insulating layer and a heating wire disposed on the heat sheet, and a wiring sheet including an insulating base layer disposed on the first insulating layer and a wiring cable disposed on the insulating base layer, the wiring cable is electrically connected to the heating wire, wherein the wiring cable has an impedance value that is lower than an impedance value of the heating wire.

Classes IPC  ?

• H05B 3/26 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes non flexibles le conducteur chauffant monté sur une base isolante
• H01B 7/02 - Disposition de l'isolement
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A cooling system block assembly may include a cooling system block and a circuit board assembly. The cooling system block includes a plurality of attachment members and one or more positioning members. The circuit board assembly is fixed to the cooling system block via the plurality of attachment members. The circuit board assembly includes a socket and a plate. The socket includes one or more positioning hubs and the plate includes a plurality of attachment hubs. The one or more positioning members is disposed within the one or more positioning hubs and the plurality of attachment members is fixed within the plurality of attachment hubs. When the one or more positioning members is disposed within the one or more positioning hubs and the plurality of attachment members is not fixed within the plurality of attachment hubs, the plurality of attachment members is vertically aligned with the plurality of attachment hubs.

Classes IPC  ?

• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/40 - Supports ou moyens de fixation pour les dispositifs de refroidissement ou de chauffage amovibles
• H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs

Abrégé

A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

Classes IPC  ?

• H10W 40/47 -
• G06F 1/20 - Moyens de refroidissement

Abrégé

A captive screw includes a sleeve and a screwing member. The sleeve includes a body portion and a positioning protrusion. The positioning protrusion protrudes from the body portion, and forms a channel. The screwing member includes a head portion, a neck portion and a threaded portion. The neck portion connects the head portion and the threaded portion. The neck portion passes through the channel. The head portion and the threaded portion are located on the positioning protrusion. The threaded portion includes a wider section and a narrower section. The wider section is connected to the neck portion. The narrower section is connected to the wider section. The diameter of the channel is less than a major diameter of the wider section. The diameter of the channel is greater than or equal to a major diameter of the narrower section and a minor diameter of the wider section.

Classes IPC  ?

• F16B 41/00 - Dispositions contre la perte des boulons, écrous, broches ou goupillesDispositions empêchant toute action non autorisée sur les boulons, écrous, broches ou goupilles
• F16B 5/02 - Jonction de feuilles ou de plaques soit entre elles soit à des bandes ou barres parallèles à elles par organes de fixation utilisant un filetage

Abrégé

A storage assembly includes a heat dissipation device and a storage. The heat dissipation device includes a thermally conductive block, a heat sink and a plurality of heat pipes. An end of each of the heat pipes is thermally coupled with the thermally conductive block, and another end of each of the heat pipes is thermally coupled with the heat sink. The storage is thermally coupled with the thermally conductive block.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A heat dissipating device that includes a first plate and a second plate opposite the first plate and connected to the first plate by two opposite sidewalls. The first plate and the second plate are connected to each other at longitudinally opposite ends thereof, longitudinally extending ends of the first plate and the second plate are connected to each other by sidewalls, and the first plate, the second plate and the sidewalls enclosing an internal space of the heat dissipating device. The heat dissipating device also includes a first wick structure disposed in the internal space and contacting inner surfaces of at least one of the first plate and the second plate. The first wick structure extends longitudinally between the longitudinally opposite ends of the first plate and the second plate, and the first wick structure at least partially defines a first vapor flow channel of the heat dissipating device.

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• B23P 15/26 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'échangeurs de chaleur

Abrégé

This disclosure relates to a manufacturing method of a vapor chamber that includes the following steps. Form a containing space and a flow channel on a first cover. Place a second cover on the first cover, such that the first cover and the second cover together form a chamber at the containing space of the first cover and form a passage at the flow channel of the first cover. Enlarge part of the passage so as to create a circular passage portion and a flat passage portion in the passage. Insert a degassing tube into the circular passage portion of the passage. Draw gas from the chamber and fill working fluid into the chamber via the degassing tube. Seal a joint between the chamber and the flat passage portion by a resistance-welding process. Cut off parts of the first cover and the second cover that surround the passage.

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• B23P 15/26 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'échangeurs de chaleur
• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs

Abrégé

A fan assembly including at least one fan device and a first attachment device. The at least one fan device includes a frame, an impeller, a driving component and at least one in-built electrical port. The impeller is rotatably disposed at the frame. The driving component is configured to drive the impeller to rotate relative to the frame. The at least one in-built electrical port is disposed at the frame and electrically connected to the driving component. The first attachment device includes a first casing, a first external electrical port and a terminal cable. The first casing is detachably mounted at the frame. The first external electrical port is disposed at the first casing and detachably assembled with the at least one in-built electrical port. An end of the terminal cable is electrically connected to the first external electrical port.

Classes IPC  ?

• F04D 25/06 - Ensembles comprenant des pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
• F04D 19/00 - Pompes à flux axial spécialement adaptées aux fluides compressibles
• F04D 29/52 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes axiales
• F04D 29/60 - MontageAssemblageDémontage
• F04D 25/16 - Combinaisons de plusieurs pompes
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A heat exchanger mounting device including a device plate, at least one securing device, and at least one cage is provided. The at least one securing device includes a barrel and pin. A first barrel end of the barrel is incorporated in at least one opening of the device plate. An augmented head of the pin extends at least partially through and rotatable in the barrel. The at least one cage is mounted on a heat exchanger. The augmented head extends through a cage opening of the at least one cage in a first direction. The augmented head rotates within the at least one cage in a second direction to secure the at least one securing device to the heat exchanger. The weight of the heat exchanger is substantially supported by the at least one securing device by way of the at least one cage and augmented head.

Classes IPC  ?

• F28D 9/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes en forme de plaques ou de laminés pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation
• F28F 1/40 - Éléments tubulaires ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des saillies, avec des évidements les moyens étant uniquement à l'intérieur de l'élément tubulaire
• F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations

Abrégé

A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

Classes IPC  ?

• F28D 15/00 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations
• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire

Produits et services

Central processing unit (CPU) coolers; thermal modules for use in computers designed to manage and regulate cooling system temperature; heat sinks and parts, namely, heat pipe for use in computers; heat sinks and parts, namely, heat pipe for use in electronic part components; heat sinks and parts, namely, vapor chamber for use in computers; heat sinks and parts, namely, vapor chamber for use in electronic part components; heat sinks for use in computers; heat sinks for use in electronic part components; liquid cooling systems for computers comprised of water cooled heat sinks, pumps, radiators, tubes, liquid supply mechanisms, reservoir fans and cooling blocks and parts; liquid cooling systems for use in computers, namely, all-in-one (AIO) liquid coolers for computer chips; liquid cooling systems for use in computers comprised of a water block, pump, radiator, liquid coolant, fans, and tubing; liquid cooling systems for use in computers comprised of a reservoir, pump, fan, cooling liquid, and heat exchanging interface; liquid cooling systems for use in computers in the nature of central processing units; liquid cooling systems for use in electronic parts, namely, all-in-one (AIO) liquid coolers for integrated circuits; liquid cooling systems for electronic parts comprised of a reservoir, pump, cooling liquid, fan, and heat exchanging interface; internal cooling fans for computers; external cooling fans for computers; cooling fans for use in electronic components; computer peripherals; computer servers; communications servers in the nature of computer hardware; computer network servers; digital media servers; network servers; IP video servers; network access server hardware; servers for web hosting; video servers

Abrégé

A vapor chamber including a first plate, second plate, plurality of first support structures, plurality of second support structures, and at least one tubular heat transfer structure is provided. The first plate and the second plate define an interior cavity having a first, second, and third portion, the first, second, and third portion each have a first, second, and third depth, respectively, the plurality of first support structures is disposed in the first portion, the plurality of support structures is disposed in the second portion and the third portion, respectively, the at least one tubular heat transfer structure is disposed in the first portion and includes a first working fluid having a first working fluid circulation path, the first portion, the second portion, and the third portion include a second working fluid having a second working fluid circulation path different from the first working fluid circulation path.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A vapor chamber including a first plate, second plate, plurality of support structures, and plurality of heat transfer structures is provided. The first plate and the second plate define an interior cavity having a first portion, a pair of second portions, and a pair of third portions. The pair of second portions and pair of third portions surround the first portion. A length of the pair of third portions defines a longitudinal direction and is greater than a width of the pair of second portions. The plurality of heat transfer structures is disposed in the first portion and the plurality of support structures is disposed throughout the interior cavity. A position of the structure length of each of the plurality of heat transfer structures is in line with the longitudinal direction so that working fluid flows from the pair of third portions to and through the first portion unhindered.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs

Abrégé

A light emitting fan device including a main fan frame, fan assembly, first light guide ring, second light guide ring, light emitting assembly, and securing fan frame ring is provided. The main fan frame includes an inner annular side plate encompassing the fan assembly, and an outer annular side plate. The inner and the outer annular side plates define a mounting space therebetween. The light emitting assembly is disposed on the second light guide ring. The first light guide ring, second light guide ring, and securing fan frame ring are arranged at least partly in the mounting space. A second exterior light circumferential edge, second exterior side light surface, and elongated extended side light surface of the second light guide ring, and a first exterior light circumferential edge and first exterior side light surface of the first light guide ring are illuminated by the plurality of light sources.

Classes IPC  ?

• F21V 33/00 - Combinaisons structurales de dispositifs d'éclairage avec d'autres objets, non prévues ailleurs
• F21V 15/04 - Montages élastiques, p. ex. amortisseurs

Abrégé

A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28F 3/06 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations les moyens pouvant être fixés sur l'élément

Abrégé

A liquid cooling pump unit including a pump unit and water block unit is provided. The pump unit includes a chamber body and rotor assembly unit. The rotor assembly unit is mounted to and in fluid communication with the chamber body. The pump unit is mounted to and in fluid communication with the water block unit. The chamber body includes a chamber bottom having a chamber side including a pair of velocity enhancing openings. The pair of velocity enhancing openings is configured so that the working fluid flows from the rotor assembly unit to the water block unit via the pair of velocity enhancing openings. The rotor assembly unit is configured to increase a pressure and flow of working fluid flowing through the water block unit. The pair of velocity enhancing openings is configured to increase a velocity of the flow of working fluid to the water block unit.

Classes IPC  ?

• F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
• F04D 1/00 - Pompes à flux radial, p. ex. pompes centrifugesPompes hélicocentrifuges

Abrégé

A heat sink is provided. The heat sink includes a cylindrical body and a plurality of fins. The fins are connected to and protruding from the cylindrical body. At least a part of the plurality of fins each include a first protrusion portion and a second protrusion portion, a distal edge of the first protrusion portion is located farther away from a central axis of the cylindrical body than a distal edge of the second protrusion portion. In addition, the disclosure also provides a heat dissipation device having the heat sink.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement

Abrégé

A proportional valve includes a casing and a valve trim. The casing has at least one fluid inlet, a fluid outlet, at least one first connection passageway, at least one second connection passageway and an accommodating space. The first connection passageway is connected with the fluid inlet. The second connection passageway is connected with the fluid outlet. The valve trim is located in the accommodating space, including a flow splitter an adjusting rotor. The flow splitter has at least one third connection passageway and at least one fourth connection passageway. The third connection passageway is connected with the first connection passageway. The fourth connection passageway is connected with the second connection passageway. The adjusting rotor has a channel and at least one blocking portion. The adjusting rotor is rotatably disposed on the flow splitter so that the blocking portion blocks a part of the third connection passageway.

Classes IPC  ?

• F16K 11/074 - Soupapes ou clapets à voies multiples, p. ex. clapets mélangeursRaccords de tuyauteries comportant de tels clapets ou soupapesAménagement d'obturateurs et de voies d'écoulement spécialement conçu pour mélanger les fluides dont toutes les faces d'obturation se déplacent comme un tout comportant uniquement des tiroirs à éléments de fermeture articulés à pivot à faces d'obturation planes
• F16K 27/04 - Structures des logementsMatériaux utilisés à cet effet des tiroirs
• F16K 31/04 - Moyens de fonctionnementDispositifs de retour à la position de repos électriquesMoyens de fonctionnementDispositifs de retour à la position de repos magnétiques utilisant un moteur

Abrégé

A two-phase immersion cooling apparatus including a coolant tank, at least one condenser, a heat transfer enhancer, and at least one heat dissipating component is provided. Vapor and liquid regions are formed in the coolant tank. Pressure enhanced and boiling regions are formed in the heat transfer enhancer. Accelerated flow and at least one recycling flow region are formed between the heat transfer enhancer and coolant tank. The at least one condenser is in thermal communication with the vapor region. The pressure enhanced and boiling regions and accelerated flow and at least one recycling flow region, are in fluid communication thereamong. A temperature and pressure within the pressure enhanced and boiling regions is greater than that within the at least one recycling flow region, maximizing heat absorption and enhancing vapor bubble nucleation, and accelerating fluid circulation from the at least one recycling flow region to the boiling region.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A liquid cooling pumping unit including a cover, rotor, housing, driver, flow spray plate, and thermal plate is provided. The cover is above the housing, the housing above the base, and the base above the thermal plate. A first fluid chamber is defined by a chamber of the cover and an annular chamber of the housing. An inlet of the housing is in fluid connection with the first fluid chamber. A second fluid chamber is defined by the flow spray plate and a recess of the thermal base. An outlet of the base is in fluid connection with the second fluid chamber. An impeller of the rotor is rotatable in the first fluid chamber. The driver is above the base and under the housing, driving the rotor to rotate with respect to the housing. The first fluid chamber is in fluid communication with the second fluid chamber.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
• F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
• G06F 1/20 - Moyens de refroidissement

Abrégé

A thinned pump includes a casing, a rotor assembly and a stator assembly. The casing includes a base and a cover. The cover covers the base so as to form a fluid chamber together, the cover has an inlet channel and an outlet channel, and the inlet channel and the outlet channel are in fluid communication with the fluid chamber. The rotor assembly includes an impeller and a magnetic component. The impeller is rotatably disposed in the casing, and the magnetic component is embedded into the impeller. The stator assembly includes a plurality of magnetically conductive pillars and a plurality of coils. The magnetically conductive pillars are mounted at one side of the base located opposite to the fluid chamber, and the coils are respectively disposed on the magnetically conductive pillars.

Classes IPC  ?

• F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
• F04D 25/06 - Ensembles comprenant des pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité

Abrégé

A water cooling assembly is configured to be mounted at an electrical connector of a circuit board. The water cooling assembly includes a mounting plate and a water cooling radiator. The mounting plate includes a mounting portion and a plugging portion. The plugging portion is connected to a side of the mounting portion, and the plugging portion is configured to be inserted into the electrical connector of the circuit board. The water cooling radiator is fastened to the mounting portion of the mounting plate.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement
• G06F 1/18 - Installation ou distribution d'énergie

Abrégé

A control valve includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.

Classes IPC  ?

• F16K 5/10 - Dispositifs pour le réglage additionnel du débit
• F16K 5/04 - Robinets à boisseau consistant seulement en un dispositif obturateur dont au moins une des faces d'obturation a la forme d'une surface de solide de révolution plus ou moins complète, le mouvement d'ouverture et de fermeture étant essentiellement rotatif dont les boisseaux sont à surface cylindriqueLeurs garnitures d'étanchéité
• F16K 11/076 - Soupapes ou clapets à voies multiples, p. ex. clapets mélangeursRaccords de tuyauteries comportant de tels clapets ou soupapesAménagement d'obturateurs et de voies d'écoulement spécialement conçu pour mélanger les fluides dont toutes les faces d'obturation se déplacent comme un tout comportant uniquement des tiroirs à éléments de fermeture articulés à pivot à faces d'obturation épousant la surface d'un solide de révolution
• F04B 49/22 - Commande des "machines", pompes ou installations de pompage ou mesures de sécurité les concernant non prévues dans les groupes ou présentant un intérêt autre que celui visé par ces groupes par clapets
• F16K 3/26 - Robinets-vannes ou tiroirs, c.-à-d. dispositifs obturateurs dont l'élément de fermeture glisse le long d'un siège pour l'ouverture ou la fermeture à faces d'obturation en forme de surfaces de solides de révolution avec corps de tiroir cylindrique le passage du fluide se faisant par le corps du tiroir
• F16K 5/06 - Robinets à boisseau consistant seulement en un dispositif obturateur dont au moins une des faces d'obturation a la forme d'une surface de solide de révolution plus ou moins complète, le mouvement d'ouverture et de fermeture étant essentiellement rotatif dont les boisseaux sont à surface sphériqueLeurs garnitures d'étanchéité
• F16K 5/12 - Dispositions pour modifier la façon dont le débit varie pendant le fonctionnement du robinet ou de la vanne

Abrégé

A liquid cooling heat exchange casing including a chassis having a first side is provided. The first side includes a first inlet flow passageway system having a first inlet liquid coolant opening, a first outlet flow passageway system having a first outlet liquid coolant opening, a plurality of adapters, and at least one radiator. The at least one radiator is mounted to the first inlet flow passageway system via a radiator inlet and one of the plurality of adapters and to the first outlet flow passageway system via a radiator outlet and another of the plurality of adapters. A cooling fluid flows from the first inlet liquid coolant opening, through the first inlet flow passageway system, through the at least one radiator, and through the first outlet flow passageway system, to the first outlet liquid coolant opening, before being circulated to repeat the flow process again.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Central processing unit (CPU) coolers; thermal modules sold as a unit comprised of temperature sensors and computer heat sinks, heat pipes, vapor chambers, internal cooling fans, and thermal pads, for use in computers designed to manage and regulate cooling system temperature; heat sinks and parts, namely, heat pipe for use in computers; heat sinks and parts, namely, heat pipe for use in electronic part components; heat sinks and parts, namely, vapor chamber for use in computers; heat sinks and parts, namely, vapor chamber for use in electronic part components; heat sinks for use in computers; heat sinks for use in electronic part components; liquid cooling systems for computers, comprised of, water cooled heat sinks, pumps, radiators, tubes, liquid supply mechanisms, reservoir fans and cooling blocks and parts; liquid cooling systems for use in computers, namely, all-in-one (AIO) liquid coolers for computer chips; liquid cooling systems for use in computers sold as a unit comprised of internal cooling fans, cooling blocks, pumps, radiators, liquid coolant, and tubing; liquid cooling systems for computers sold as a unit comprised of internal cooling fans, and also including reservoirs, pumps, cooling liquid, and a heat exchanging interface; liquid cooling systems for use in computers, namely, central processing unit coolers; liquid cooling systems for use in electronic parts, namely, all-in-one (AIO) liquid coolers for integrated circuits; liquid cooling systems for use in computers sold as a unit, namely, internal cooling fans, reservoirs, pumps, cooling liquid, and a heat exchanging interface; internal cooling fans for computers; computer peripherals in the nature of external cooling fans for computers; internal cooling fans for use in electronic components; computer peripherals in the nature of computer casings, namely, computer cases, computer chassis, and computer hard drive enclosures; computer servers; communications servers being computer hardware; computer network servers; digital media servers; network servers; IP video servers; network access server hardware; servers for web hosting; video servers

Abrégé

A universal mounting mechanism including a mounting bracket configured to mount a liquid-cooling heat exchange apparatus to a substrate or an electronic component and at least one universal fastener assembly is provided. The at least one universal fastener assembly is orthogonally assembled through the mounting bracket. The liquid-cooling heat exchange apparatus includes a first liquid-cooling heat exchange apparatus having a first waterblock set or a second liquid-cooling heat exchange apparatus having a second waterblock set. The first waterblock set has a first block thickness, and the second waterblock set has a second block thickness. The substrate or the electronic component includes receiving portions having a fastened thickness. A thickness of the second block thickness and the fastened thickness is greater than a thickness of the first block thickness and the fastened thickness.

Classes IPC  ?

• F28F 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.

Classes IPC  ?

• F28F 3/12 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F28F 3/14 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux par séparation, p. ex. par soufflage, de deux tôles accolées de manière à créer un certain nombre de canaux de circulation

Produits et services

(Based on Intent to Use) Central processing unit (CPU) coolers; computer servers; communications servers being computer hardware; digital media servers; IP video servers; network access server hardware; servers for web hosting; video servers; (Based on 44(e)) Thermal modules sold as a unit comprised of temperature sensors, computer heat sinks, heat pipes, vapor chambers, internal cooling fans, and thermal pads, for use in computers designed to manage and regulate cooling system temperature; heat sinks and parts, namely, heat pipe for use in computers; heat sinks and parts, namely, heat pipe for use in electronic part components; heat sinks and parts, namely, vapor chamber for use in computers; heat sinks and parts, namely, vapor chamber for use in electronic part components; heat sinks for use in computers; heat sinks for use in electronic part components; liquid cooling systems for computers comprised of water cooled heat sinks, pumps, radiators, tubes, liquid supply mechanisms, reservoir fans and cooling blocks and parts; liquid cooling systems for use in computers, namely, all-in-one (AIO) liquid coolers for computer chips; liquid cooling systems for use in computers, namely, all-in-one (AIO) liquid coolers for integrated circuits; liquid cooling systems for use in computers sold as a unit comprised of internal cooling fans, cooling blocks, pumps, radiators, liquid coolant, and tubing; liquid cooling systems for computers sold as a unit comprised of internal cooling fans, reservoirs, pumps, cooling liquid, and a heat exchanging interface; liquid cooling systems for use in computers, namely, central processing unit coolers; liquid cooling systems for use in computers sold as a unit consisting of internal cooling fans, reservoirs, pumps, cooling liquid, and a heat exchanging interface; internal cooling fans for computers; computer peripherals in the nature of external cooling fans for computers; internal cooling fans for use in electronic parts; computer peripherals in the nature of computer casings, namely, computer cases, computer chassis, and computer hard drive enclosures; computer servers; computer network servers; network servers

Produits et services

(Based on Intent to Use) Central processing unit (CPU) coolers; computer servers; communications servers being computer hardware; digital media servers; IP video servers; network access server hardware; servers for web hosting; video servers; (Based on 44(e)) Thermal modules sold as a unit comprised of temperature sensors, computer heat sinks, heat pipes, vapor chambers, internal cooling fans, and thermal pads, for use in computers designed to manage and regulate cooling system temperature; heat sinks and parts, namely, heat pipe for use in computers; heat sinks and parts, namely, heat pipe for use in electronic part components; heat sinks and parts, namely, vapor chamber for use in computers; heat sinks and parts, namely, vapor chamber for use in electronic part components; heat sinks for use in computers; heat sinks for use in electronic part components; liquid cooling systems for computers comprised of water cooled heat sinks, pumps, radiators, tubes, liquid supply mechanisms, reservoir fans and cooling blocks and parts; liquid cooling systems for use in computers, namely, all-in-one (AIO) liquid coolers for computer chips; liquid cooling systems for use in computers, namely, all-in-one (AIO) liquid coolers for integrated circuits; liquid cooling systems for use in computers sold as a unit comprised of internal cooling fans, cooling blocks, pumps, radiators, liquid coolant, and tubing; liquid cooling systems for computers sold as a unit comprised of internal cooling fans, reservoirs, pumps, cooling liquid, and a heat exchanging interface; liquid cooling systems for use in computers, namely, central processing unit coolers; liquid cooling systems for use in computers sold as a unit consisting of internal cooling fans, reservoirs, pumps, cooling liquid, and a heat exchanging interface; internal cooling fans for computers; computer peripherals in the nature of external cooling fans for computers; internal cooling fans for use in electronic parts; computer peripherals in the nature of computer casings, namely, computer cases, computer chassis, and computer hard drive enclosures; computer servers; computer network servers; network servers

Abrégé

The disclosure provides a manufacturing method of a flat heat exchanger. The manufacturing method includes flattening a round heat pipe to a flat heat pipe, welding a first part of the flat heat pipe, and welding a second part of the flat heat pipe. After welding the second part of the flat heat pipe, the manufacturing method further includes cutting off part(s) of the first part or the second part of the flat heat pipe and trimming the flat heat pipe. Before welding the first part or the second part of the flat heat pipe, there is no pipe shrinkage process performed on the flat heat pipe.

Classes IPC  ?

• F28F 1/02 - Éléments tubulaires de section transversale non circulaire
• B23K 26/21 - Assemblage par soudage

Abrégé

A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.

Classes IPC  ?

• B01D 53/26 - Séchage des gaz ou vapeurs
• F25B 21/02 - Machines, installations ou systèmes utilisant des effets électriques ou magnétiques utilisant l'effet PeltierMachines, installations ou systèmes utilisant des effets électriques ou magnétiques utilisant l'effet Nernst-Ettinghausen
• F28F 23/00 - Caractéristiques relatives à l'utilisation de matériaux servant pour échange intermédiaire de chaleur, p. ex. emploi de compositions spécifiées

Abrégé

The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28F 3/12 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux
• F28F 13/08 - Dispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution en affectant le mode d'écoulement des sources de potentiel calorifique en faisant varier la section transversale des canaux d'écoulement
• F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A light-emitting fan includes a fan frame, a light-permeable impeller mounted on the fan frame, a first and a second light source assembly. The light-permeable impeller includes a hub and blades. The hub includes a top plate and an annular side plate. The annular side plate is connected to the top plate, the top plate and the annular side plate together form an accommodation space. The annular side plate has an annular side surface facing away from the accommodation space and an inclined incident surface facing away from the annular side surface and non-parallel to the annular side surface. The blades are connected to the annular side surface. The first light source assembly is located in the accommodation space and configured to emit light to the top plate. The second light source assembly is located in the accommodation space and configured to emit light to the inclined incident surface.

Classes IPC  ?

• F21V 33/00 - Combinaisons structurales de dispositifs d'éclairage avec d'autres objets, non prévues ailleurs
• F04D 29/66 - Lutte contre la cavitation, les tourbillons, le bruit, les vibrations ou phénomènes analoguesÉquilibrage
• F04D 29/32 - Rotors spécialement adaptés aux fluides compressibles pour pompes à flux axial
• F04D 19/00 - Pompes à flux axial spécialement adaptées aux fluides compressibles

Abrégé

A multi-material boss, configured for fastening of a fastener thereto, being a feature of a die cast part, comprising a boss cylinder, an augmenting cylinder, and a filler metal layer is provided. The boss cylinder is made of the same material as the die cast part having a first hardness, and has a first interior. The augmenting cylinder is made of an augmenting material having a second hardness, is fixedly secured in the first interior of the boss cylinder, and has a second interior defined by a second cylindrical shaped wall, a base rim, and a second opening. The second hardness is greater than the first hardness. The fastener is fastened to the multi-material boss via the second opening of the augmenting cylinder having the higher liquidus temperature and greater hardness.

Classes IPC  ?

• F16B 37/06 - Dispositifs pour fixer les écrous à des surfaces, p. ex. à des feuilles, à des plaques par soudage ou rivetage
• B23K 1/00 - Brasage ou débrasage
• F16B 33/02 - Tracé du filetageProfils de filetage particuliers
• B23K 103/20 - Alliages ferreux et aluminium ou ses alliages

Abrégé

This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• F28F 3/12 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

(Based on Intent to Use) Central processing unit (CPU) coolers; computer servers; communications servers being computer hardware; digital media servers; IP video servers; network access server hardware; servers for web hosting; video servers; (Based on 44(e)) Thermal modules sold as a unit comprised of temperature sensors, computer heat sinks, heat pipes, vapor chambers, internal cooling fans, and thermal pads, for use in computers designed to manage and regulate cooling system temperature; heat sinks and parts, namely, heat pipe for use in computers; heat sinks and parts, namely, heat pipe for use in electronic part components; heat sinks and parts, namely, vapor chamber for use in computers; heat sinks and parts, namely, vapor chamber for use in electronic part components; heat sinks for use in computers; heat sinks for use in electronic part components; liquid cooling systems for computers comprised of water cooled heat sinks, pumps, radiators, tubes, liquid supply mechanisms, reservoir fans and cooling blocks and parts; liquid cooling systems for use in computers, namely, all-in-one (AIO) liquid coolers for computer chips; liquid cooling systems for use in computers, namely, all-in-one (AIO) liquid coolers for integrated circuits; liquid cooling systems for use in computers sold as a unit comprised of internal cooling fans, cooling blocks, pumps, radiators, liquid coolant, and tubing; liquid cooling systems for computers sold as a unit comprised of internal cooling fans, reservoirs, pumps, cooling liquid, and a heat exchanging interface; liquid cooling systems for use in computers, namely, central processing unit coolers; liquid cooling systems for use in computers sold as a unit consisting of internal cooling fans, reservoirs, pumps, cooling liquid, and a heat exchanging interface; internal cooling fans for computers; computer peripherals in the nature of external cooling fans for computers; internal cooling fans for use in electronic parts; computer peripherals in the nature of computer casings, namely, computer cases, computer chassis, and computer hard drive enclosures; computer servers; computer network servers; network servers

Abrégé

A light-emitting fan includes a fan frame, an impeller, a circuit board and a light-emitting component. The impeller includes a light guiding hub and a plurality of blades. The light guiding hub is disposed on the fan frame. The light guiding hub has an outer top surface, an outer annular surface, an inner annular surface, and a recess. The outer annular surface is connected to the outer top surface, the inner annular surface faces away from the outer annular surface. The blades are connected to the outer annular surface. The recess is located at the inner annular surface so as to form a light guiding protrusion of the light guiding hub. The circuit board is disposed on the fan frame. The light-emitting component is disposed on the circuit board. Light generated by the light-emitting component is emitted from the outer top surface through the light guiding protrusion.

Classes IPC  ?

• F21V 33/00 - Combinaisons structurales de dispositifs d'éclairage avec d'autres objets, non prévues ailleurs
• F04D 29/00 - Parties constitutives, détails ou accessoires
• F04D 19/00 - Pompes à flux axial spécialement adaptées aux fluides compressibles

Abrégé

A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

Classes IPC  ?

• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
• H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage