A crystal resonator device with a thermistor according to one or more embodiments may include: a package including an upper housing and a lower housing; a crystal resonator plate housed in the upper housing; a thermistor housed in the lower housing; and a lid hermetically sealing the upper housing. Excitation electrodes of the crystal resonator plate are each constituted of a plurality of metal film layers, and a main layer thereof is made of Au. The thermistor has a single plate-like thermistor element as a base material. Working electrodes of the thermistor are each constituted of a plurality of metal film layers, and a main layer thereof is made of Au.
A thermistor-mounting piezoelectric resonator device according to one or more embodiments may include includes: a sandwich type device; and a thin plate-like thermistor mounted on an outer surface of a first sealing member of the sandwich type device. The thin plate-like thermistor is located to be superimposed on at least a part of a vibrating part of the sandwich type device in plan view. A piezoelectric resonator plate of the sandwich type device includes: the vibrating part; an external frame part surrounding an outer periphery of the vibrating part; and a support part supporting the vibrating part by connecting the vibrating part to the external frame part. The thin plate-like thermistor is located to be superimposed on the external frame part on two sides, facing each other, of the sandwich type device.
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
A piezoelectric vibration device that can be firmly joined to an external substrate in a position as close as possible to the external substrate. A piezoelectric vibration device in which at least an oscillator and an integrated circuit element on a substrate on a first mounting surface and an external connection terminal electrically connected to an external substrate on a second mounting surface extending in parallel to the one of the principal surfaces. The substrate includes a recessed portion in the second mounting surface. The external connection terminal is arranged in the recessed portion and is configured such that a gap is provided between an outer edge of the external connection terminal and a side surface of the recessed portion.
Provided is a piezoelectric vibration device capable of suppressing leakage of molten flux or molten solder from the piezoelectric vibration device during reflow. A piezoelectric vibration device 1 comprises: a substrate 2; a piezoelectric vibrator 3 and an electronic component 4 that are mounted on an upper surface 2a of the substrate 2; and a sealing resin 5 that is molded on the upper surface 2a so as to cover the piezoelectric vibrator 3 and the electronic component 4. External connection terminals (45a to 45d) are formed on the outer bottom surface of the piezoelectric vibrator 3. Piezoelectric vibrator-mounting pads (52a to 52d), to which the external connection terminals (45a to 45d) are joined via solder H, are formed on the upper surface 2a. The sides of the sealing resin 5 and the sides of the piezoelectric vibrator 3 face each other in plan view, and a distance Ld that is the minimum among distances (La to Ld) between the sides facing each other of the sealing resin 5 and the piezoelectric vibrator 3 is 10% or more of the dimension (L51) of the sealing resin 5 in the length direction of the minimum length Ld.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
A piezoelectric resonator device according to one or more embodiments may include at least a core section. The core section includes: a three-ply structured crystal resonator in which a vibrating part is hermetically sealed; and a heater IC as a heating element. At least whole of a second main surface of a second sealing member of the crystal resonator is thermally coupled to the heater IC.
A quartz diaphragm 10 comprises a vibrating section 11, an outer frame section 12, and a retaining section 13. A cutout section 10a is provided between the vibrating section 11 and the outer frame section 12. An electrode formed on one principal surface is connected to an electrode formed on another principal surface via internal wiring 17 formed in an inner wall surface of the outer frame section 12. If a region of the cutout section 10a sandwiched between the inner wall surface of the outer frame section 12 and an outer wall surface of the vibrating section 11 is considered a first region A1, a region of the cutout section 10a, excluding the first region A1 from the space and sandwiched between the inner wall surface of the outer frame section 12 and the outer wall surface of the retaining section 13 is considered a second region A2, and a region sandwiched between the inner wall surfaces of the outer frame section 12 is considered a third region A3, the internal wiring 17 is formed at a position on the inner wall surface of the outer frame section 12 facing at least the second region A2 or the third region A3.
A doubly rotated quartz diaphragm comprising: a vibrating part 11 having first and second excitation electrodes 111, 112 formed on the obverse and reverse surfaces thereof; and an outer frame part 12 provided to the outer periphery of the vibrating part 11, wherein a penetrating portion 10a that penetrates in the thickness direction is provided between the vibrating part 11 and the outer frame part 12, the vibrating part 11 and the outer frame part 12 are connected by a holding part 13 extending in the Z'-axis direction at an end of the vibrating part 11 in the X'-axis direction orthogonal to the Z'-axis, and end electrodes 16, 17 where the ends of the vibrating part 11 in the Z'-axis direction on both main surfaces are configured to have the same electric potential are formed on the vibrating part 11 along opposing edges of the vibrating part 11 that extend in the X'-axis direction.
Provided is a piezoelectric vibration device in which the peel strength of an external connection terminal with respect to a resin substrate is improved. This piezoelectric vibration device 1 has at least: a vibration element 2; a mold part 12 that protects at least the vibration element 2; and a substrate 11 that is rectangular in plan view, the substrate 11 being configured from a first mounting surface 11a that has a wiring pattern on one main surface, and a second mounting surface 11b that is connected to the wiring pattern on the other main surface parallel to the one main surface and has a plurality of external connection terminals 11g for connecting to an external substrate. At least one of the plurality of external connection terminals 11g is connected to an anchor part 11k at a position overlapping the external connection terminal 11g as seen in a direction perpendicular to the second mounting surface 11b, the anchor part 11k being a metal member that is bonded to the side surface of a hole or recess extending from the second-mounting-surface 11b side of the substrate 11 toward the first-mounting-surface 11a side thereof.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
9.
METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATION DEVICE, PIEZOELECTRIC VIBRATION DEVICE, AND SHEET SUBSTRATE
Provided is a method for manufacturing a piezoelectric vibration device using a sheet substrate, the device making it possible to measure the properties of piezoelectric vibration pieces on an individual basis. This manufacturing method manufactures a plurality of piezoelectric vibration devices using a sheet substrate 1 in which a plurality of bases 10 accommodating piezoelectric pieces are continuous in a matrix pattern and integrally molded. External connection terminals 61-64 including a pair of first and second external connection terminals 61, 62 for piezoelectric vibration pieces are formed on the outer bottom surface of the base 10, and on the outer bottom surface of the sheet substrate 1, the first external connection terminal 61 of the base 10 is electrically connected to the third external connection terminal 63 of the base 10 on the right side adjacent to said base 10. The manufacturing method includes a cutting step for cutting the electrical connection between the first external connection terminal 61 and the third external connection terminal 63 on the sheet substrate 1 by means of energy beams.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
10.
CRYSTAL RESONATOR AND METHOD FOR MANUFACTURING THE SAME
In a crystal resonator (100), a crystal resonator plate (10) includes: a vibrating part (11); an external frame part (12) provided at a side of an outer periphery of the vibrating part (11); and a penetrating part (10a) provided between the vibrating part (11) and the external frame part (12) so as to penetrate the crystal resonator plate (10) in a thickness direction of the crystal resonator plate (10). An inclined surface (11c) is provided at an end part of the vibrating part (11) at the side of the penetrating part (10a) so as to protrude in the thickness direction and to be inclined with respect to a vibrating surface (11b) of the vibrating part (11).
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
11.
PIEZOELECTRIC RESONATOR PLATE AND PIEZOELECTRIC RESONATOR DEVICE
A crystal resonator plate according to one or more embodiments may include: a vibrating part; an external frame part surrounding an outer periphery of the vibrating part; and a support part connecting the vibrating part to the external frame part. A plurality of crystal faces is formed on respective side surfaces of the external frame part and the support part. The respective side surfaces are connected to a connecting part of the external frame part and the support part. A plurality of ridge lines is formed by the plurality of crystal faces. An intersection blocking part is provided on the connecting part of the external frame part and the support part, on at least one side of a first main surface side and a second main surface side thereof, to block intersection of two or more of the ridge lines on the connecting part.
A piezoelectric vibration device is provided that includes a piezoelectric vibration piece and a housing in which the piezoelectric vibration piece is containable. The piezoelectric vibration device further has electrically conductive pads formed on a surface of the housing to which the piezoelectric vibration piece is mountable. The piezoelectric vibration piece is bonded to the electrically conductive pads using metal bumps. An outer surface of the cabinet opposite to the mounting surface is dented toward the mounting surface so as to form a space that overlaps with the electrically conductive pads in plan view.
Provided is a tuning-fork-type piezoelectric vibrating piece that can improve the reproducibility of frequency measurement. This tuning-fork-type piezoelectric vibrating piece (10) comprises: a crystal vibration piece (20) that has a base (21), first and second vibrating arms (22, 23), and an external junction (24); a pair of first and second vibration electrodes (31, 32) that are formed on the first and second vibrating arms (22, 23); first and second extraction electrodes (33, 34) that are extracted from the first and second vibration electrodes (31, 32) to the base (21) and the external junction (24); and first and second electroconductive junctions (41, 42) that are provided to the first and second extraction electrodes (33, 34). The entirety of the first and second electroconductive junctions (41, 42) is provided so as to be present biased only in a first region on the side where the first vibrating arm (22) is located, with a virtual center line (L1) that passes through the center between the first and second vibrating arms (22, 23) and extends in the elongation direction of the first and second vibrating arms (22, 23) being used as a reference line, from among regions of the external junction (24).
Provided is a piezoelectric vibration device that can confirm the characteristics of a piezoelectric vibrator without removing a mold resin. A piezoelectric vibration device 1 comprises: at least a vibrator 2; a mold part 12 protecting at least the piezoelectric vibrator 2; and a substrate 11 configured with, on one main surface thereof, a first mounting surface 11a having a wiring pattern including a plurality of connection terminals 11d and a second mounting surface 11b having a plurality of external connection terminals 11g. The piezoelectric vibration device 1 is covered by the mold part 12 such that at least the piezoelectric vibrator 2 is included, and at least the piezoelectric vibrator 2 is connected to the plurality of connection terminals 11d. The substrate 11 has, on the second mounting surface side, an inspection terminal 11k that electrically connects with a connection terminal 11d on which the piezoelectric vibrator 2 is mounted without interposing an external connection terminal 11g.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
One or more embodiments of the disclosure may be an oven-controlled crystal oscillator that may include a core section hermetically encapsulated inside a thermal insulation package. The core section includes at least: an oscillation IC; a crystal resonator; and a heater IC. The core section is mounted on a core substrate that is mechanically connected to the package by a non-conductive adhesive. The core section and the package are electrically connected to each other by wire bonding. A space is provided between the core substrate and a bottom surface of the package.
H03B 5/36 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique l'élément actif de l'amplificateur comportant un dispositif semi-conducteur
H03B 5/04 - Modifications du générateur pour compenser des variations dans les grandeurs physiques, p. ex. alimentation, charge, température
16.
THIN-PLATE THERMISTOR AND THIN-PLATE THERMISTOR-MOUNTED PIEZOELECTRIC VIBRATION DEVICE
Provided is a thin-plate thermistor in which cracks and chipping do not easily occur in end portions. A thin-plate thermistor 5 comprises a single-plate thermistor flat plate 51, a common electrode 52 serving as a relay electrode formed on a first main surface 51a of the thermistor flat plate 51, and a first split electrode 53a and a second split electrode 53b serving as working electrodes formed so as to be split on a second main surface 51b by the second main surface 51b of the thermistor 51. On the first main surface 51a of the thermistor flat plate 51, the surface roughness is lower at end portions than at a center portion.
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
17.
THIN-PLATE THERMISTOR AND THIN-PLATE THERMISTOR-MOUNTED PIEZOELECTRIC VIBRATION DEVICE
Provided is a thin-plate thermistor in which the resistance characteristics of the thin-plate thermistor are improved in consideration of the surface roughness of one surface and the other surface of a thermistor flat plate. A thin-plate thermistor 5 comprises: a single-plate thermistor flat plate 51 including a second main surface 51b and a first main surface 51a that is on the opposite to the second main surface 51b and has a greater surface roughness than that of the second main surface 51b; a first split electrode 53a and a second split electrode 53b that are formed on the second main surface 51b and are split on the second main surface 51b; and a common electrode 52 formed on the first main surface 51a.
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
An oven-controlled crystal oscillator according to one or more embodiments may include a core section hermetically encapsulated in a package for thermal insulation, wherein the core section is supported by the package via a core substrate, and the core section has a layered structure in which at least an oscillation IC, a crystal resonator and a heater IC are laminated in sequence.
H03B 5/04 - Modifications du générateur pour compenser des variations dans les grandeurs physiques, p. ex. alimentation, charge, température
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03L 1/02 - Stabilisation du signal de sortie du générateur contre les variations de valeurs physiques, p. ex. de l'alimentation en énergie contre les variations de température uniquement
H03L 1/04 - Détails structurels destinés à maintenir la température constante
An OCXO according to one or more embodiments may include a core section hermetically encapsulated in a heat insulation package. The core section includes: an oscillation IC; a crystal resonator; and a heater IC. The core section is supported by the package via a core substrate. The OCXO further includes a capacitor as an electronic component for adjustment, which is attached to the package by soldering. The core section is vacuum-sealed in a sealed space of the package, while the capacitor is disposed in a space other than the sealed space.
H03B 5/04 - Modifications du générateur pour compenser des variations dans les grandeurs physiques, p. ex. alimentation, charge, température
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
An OCXO according to one or more embodiments may include a core section hermetically encapsulated inside a heat insulation package. The core section includes: an oscillation IC; a crystal resonator; and a heater IC, and furthermore is supported by the package via a core substrate. The core substrate is mechanically connected to the package by a non-conductive adhesive. The core section and the package are electrically connected to each other by wire bonding using wires.
H03B 5/04 - Modifications du générateur pour compenser des variations dans les grandeurs physiques, p. ex. alimentation, charge, température
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
This carbon dioxide capture module comprises an absorption part having an amine-based absorbent capable of absorbing carbon dioxide, and a filter part that allows air to pass therethrough and blocks liquid, wherein: the filter part is located between the absorption part and air surrounding the carbon dioxide capture module; and the amine-based absorbent is a polymeric amine having a number average molecular weight of at least 500, or a polymer of an amine monomer and a dicarboxylic acid monomer, the polymer having a number average molecular weight of at least 500.
B01D 53/14 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par absorption
B01D 53/18 - Unités d'absorptionDistributeurs de liquides
In a crystal oscillator 101, hermetic sealing is performed by sandwiching a crystal vibration plate 2, on which first and second excitation electrodes 221, 222 are formed, between first and second sealing members 3, 4 disposed above and below the crystal vibration plate, and joining respective sealing portions thereof. In the first sealing member 3, a fourth through-hole 323 penetrating from a first principal surface 311 side to a second principal surface 312 side is formed, the opening area of an opening 323a on the first principal surface 311 side of the fourth through-hole 323 is formed larger than the opening area of an opening 323b on the second principal surface 312 side, and the width W2 of a sealing surface-side opening peripheral electrode 323c is larger than the width W1 of an outer surface-side opening peripheral electrode 37a in a Z'-axis direction.
A piezoelectric resonator device according to one or more embodiments may be provided, in which a crystal resonator plate includes a cutout part between a vibrating part and an external frame part, and a metal film formed on a first main surface of a first sealing member is electrically connected to an external electrode terminal formed on a second main surface, which does not face an internal space, of a second sealing member via a first internal wiring formed on an inner wall surface of the external frame part.
A quartz crystal vibration plate 2 comprises an outer frame part 23 and a vibrating part 22 formed to be thinner than the outer frame part 23. A perforation 2a is formed between the outer frame part 23 and the vibrating part 22. The outer frame part 23 and the vibrating part 22 are connected by a holding part 24 formed to be thinner than the outer frame part 23. A connecting portion 25 which is in one main surface of the outer frame part 23 and is connected to the holding part 24 is provided with a flat region 25b formed flush with the holding part 24 and an inclined region 25a inclined with respect to the flat region 25b. At the connecting portion 25-side end 24a of the holding part 24, at least regions 24b, 24c on the penetrating part 2a side are provided contiguous to the flat area 25b.
Provided is a high-quality pressure switch. The present invention comprises: a base substrate 2; a lid substrate 3 that, by being bonded to the base substrate 2, forms an airtight space between the lid substrate 3 and the base substrate 2; a deformable diaphragm 5 that is formed at a position corresponding to the airtight-space of the lid substrate 3; a lid-side movable contact electrode 8 that is disposed on the diaphragm 5 and serves as a movable contact; and a base-side fixed contact electrode 11 that faces the lid-side movable contact electrode 8 with a prescribed gap therebetween and serves as a fixed contact. An electrical connection is toggled by the lid-side movable contact electrode 8 and the base-side fixed contact electrode 11 coming into contact or separating due to deformation of the diaphragm 5. The base substrate 2, the lid substrate, and the diaphragm 5 are each formed from quartz or glass.
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
H01H 35/34 - Interrupteurs actionnés par le changement de pression du fluide, par les ondes de pression du fluide, ou par le changement d'écoulement du fluide actionnés par un diaphragme
This temperature-compensation-type piezoelectric actuator (100) has a rock crystal vibration element (111) in which frequency temperature characteristics change according to at least a tertiary function, a temperature compensation circuit (130) that outputs a tertiary-function electrical signal for compensating for the frequency temperature characteristics of the rock crystal vibration element (111), and an oscillation circuit (112) to which the rock crystal vibration element (111) and a variable-capacitance element are connected and via which an output electrical signal from the temperature compensation circuit (130) is inputted to the variable-capacitance element. The temperature compensation circuit (130): generates a pseudo-tertiary-function electrical signal; and calculates an electrical signal that represents the difference between the pseudo-tertiary-function electrical signal and an ideal tertiary-function electrical signal, in which the pseudo-tertiary-function electrical signal is approximated using a tertiary function. A difference correction electrical signal corresponding to the electrical signal that represents the difference is added to the temperature compensation circuit (130).
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
The present invention comprises a heat collecting device that holds a heating medium heated by sunlight. The heat collecting device holds the heating medium in a space between a module housing body and an exterior body so as surround a housing space in which a carbon dioxide collection module having an absorber is housed. The absorber of the carbon dioxide collection module absorbs carbon dioxide and causes the absorbed carbon dioxide to be desorbed by heating.
B01D 53/14 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par absorption
F24S 50/40 - Agencements pour commander les collecteurs de chaleur solaire sensibles à la température
F24S 60/30 - Agencements pour l’emmagasinage de la chaleur collectée par les collecteurs de chaleur solaire emmagasinant la chaleur dans un liquide
F24S 23/74 - Agencements pour concentrer les rayons solaires pour les collecteurs de chaleur solaire avec des réflecteurs avec des surfaces réfléchissantes en forme d’auge ou sous forme cylindro-parabolique
A carbon dioxide capture module comprising an absorption unit having an amine-based absorber capable of absorbing carbon dioxide, and a filter unit that is capable of transmitting air and prevents transmission of the amine-based absorber, the filter unit being positioned between the amine-based absorber and air surrounding the carbon dioxide capture module.
B01D 53/14 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par absorption
In an Oven-Controlled Xtal Oscillator (OCXO) in which a core portion (5) is hermetically sealed inside a package (2) for heat insulation: the core portion (5) is configured to include, at least, an oscillation IC (51), a crystal resonator (50), and a heater IC (52); a core board (4) is disposed on a bottom surface of the core portion (5); a bottom surface of the core board (4) is bonded to the core board (4) by means of an electrically non-conductive adhesive (55); the core board (4) is bonded to the package (2) by means of an electrically non-conductive adhesive (7); and an opening (402) is provided in the core board (4), in a region below the core portion (5).
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
30.
METHOD FOR ADJUSTING FREQUENCY OF PIEZOELECTRIC OSCILLATION DEVICE, AND PIEZOELECTRIC OSCILLATION DEVICE
A crystal oscillator (100) has a frequency adjustment metal film (36) comprising a metal underlayer (36a) and a metal layer (36b) formed on the first main surface (301) of a second sealing member (30). In frequency adjustment of the crystal oscillator (100), the frequency adjustment metal film (36) is irradiated with a laser from outside the second sealing member (30) and the metal underlayer (36a) is heated up, whereby at least part of the metal layer (36b) is evaporated by melting and deposited onto a second excitation electrode (112). Irradiation by the beam begins from outside the region of the metal layer (36b). In the scanning direction of the beam, the end portion of the metal layer (36b) is located so as to be on the inside of the end portion of the metal underlayer (36a).
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
31.
PIEZOELECTRIC OSCILLATOR AND PIEZOELECTRIC OSCILLATION DEVICE
In the present invention, a bonding pad for wire bonding is formed on the outer surface of a first sealing plate of a piezoelectric oscillator having the first sealing plate and a second sealing plate, which are joined to the two main surfaces of a piezoelectric oscillation plate. Non-joining regions that are not joined to each other are provided to part of the outer peripheral portion of one sealing plate among the first and second sealing plates and to part of the outer peripheral portion of the piezoelectric oscillation plate. The bonding pad overlaps the non-joining region in plan view.
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
32.
PIEZOELECTRIC VIBRATION DEVICE AND METHOD FOR ADJUSTING FREQUENCY OF PIEZOELECTRIC VIBRATION DEVICE
Provided is a method for adjusting the frequency of a quartz oscillator (100), wherein: a metal film (36) for frequency adjustment that comprises a base metal layer (36a) and a metal layer (36b) layered thereon is formed on a first principal surface (301) of a second sealing member (30) facing a second excitation electrode (112); and the second sealing member (30) is formed from quartz. Frequency adjustment is performed by: irradiating the metal film (36) for frequency adjustment with a laser from outside the second sealing member (30); and allowing the laser to pass through the interior of the second sealing member (30) to heat the base metal layer (36a) so that at least part of the metal layer (36b) is caused to vaporize, by melting, and adhere to the second excitation electrode (112). At such time, the melting temperature of the base metal layer (36a) is higher than the melting temperature of the metal layer (36b), and the difference between the melting temperatures of the base metal layer (36a) and the metal layer (36b) is at least 1500K.
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
This piezoelectric vibration device comprises: a piezoelectric vibrator including a piezoelectric vibration plate, and first and second sealing plates that hermetically seal a vibrating portion of the piezoelectric vibration plate; a base on which the piezoelectric vibrator is mounted; and a lid body bonded to the base and forming a housing space in which the piezoelectric vibrator mounted on the base is housed. In the piezoelectric vibrator, one of the sealing plates is bonded to the base by means of a bonding material. Only a central region of the one sealing plate is bonded to the base by means of the bonding material.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
A crystal oscillation device (Xtl) with a thermistor comprises: a package (1) including an upper accommodating portion (11A) and a lower accommodating portion (11B); a crystal oscillating plate (2) accommodated in the upper accommodating portion (11A); a thermistor (4) accommodated in the lower accommodating portion (11B); and a lid (3) for hermetically sealing the upper accommodating portion (11A). Excitation electrodes (21, 22) of the crystal oscillating plate (2) comprise a plurality of metal films and have a main layer comprising Au, the thermistor (4) has a single-plate thermistor base plate (40) as a substrate, and working electrodes (41, 42) of the thermistor (4) comprise a plurality of metal films and have a main layer comprising Au.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
35.
TEMPERATURE SENSOR-EQUIPPED CRYSTAL OSCILLATOR DEVICE
A crystal oscillator plate (1) comprises an AT-cut crystal oscillator plate, and as a whole, has a rectangular, plate-like shape. The crystal oscillator plate (1) comprises an oscillating part (11), holding parts (13, 13t) connected to the oscillating part (11), and a frame body section (12) which is connected to the holding parts (13, 13t) and is positioned along the outer periphery of the oscillating part (11). Other than the holding parts (13, 13t), through-holes (14) are formed perimetrically between the oscillating part (11) and the frame body section (12). In addition, a thermistor flat single panel (40) is surface-bonded as a temperature sensor (4) onto a first sealing member (2) via a conductive resin adhesive (R1) and a resin adhesive (R2). The thermal conductivity of the conductive resin adhesive (R1) is greater than the thermal conductivity of the resin adhesive (R2).
A thermistor-mounted piezoelectric vibration device (1) is provided with a sand device (2), and a thin-plate thermistor (5) which is mounted on an outside surface of a first sealing member (20) in the sand device (2). The thin-plate thermistor (5) is disposed so as to overlap with at least a portion of a vibration section (13) of the sand device (2) in plan view. Furthermore, a piezoelectric vibration plate (10) in the sand device (2) has the vibration section (13), an outer frame section (14) which encloses the outer periphery of the vibration section (13), and a retention section (15) which retains the vibration section (13) by linking the vibration section (13) and the outer frame section (14). The thin-plate thermistor (5) is disposed so as to overlap the outer frame section (14) on two mutually opposing sides of the sand device (2).
Provided is a piezoelectric oscillation device that can firmly join to an external substrate at a location as close to the external substrate as possible. Provided is a piezoelectric oscillation device 1 in which at least an oscillator 2 and an integrated circuit element 10 having an oscillation-generating circuit are mounted on a substrate 11 having a wiring pattern that includes a plurality of pads on a first mounting surface 11a, which is one main surface of a pair of main surfaces, the substrate 11 also having an external connection terminal 11d that is electrically connected to a wiring pattern on a second mounting surface 11b, which is the other main surface parallel to the one main surface, and that is electrically connected to an external substrate P. The substrate 11 has a recess 11g in the second mounting surface 11b. The external connection terminal 11d is located within the recess 11g and a gap G is provided between the outer edges of the external connection terminal 11d and the side surfaces 11i of the recess 11g.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/04 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
38.
METHOD FOR ADJUSTING FREQUENCY OF PIEZOELECTRIC VIBRATION DEVICE, AND PIEZOELECTRIC VIBRATION DEVICE
In the method for adjusting a frequency of a crystal vibrator (100), a frequency adjustment metal film (36), which is composed of a substrate metal layer (36a) and a metal layer (36b) laminated on the substrate metal layer, is formed on a first main surface (301) opposite to a second excitation electrode (112) of a second sealing member (30), and the second sealing member (30) is made of crystal. Frequency adjustment is performed by: irradiating the frequency adjustment metal film (36) with a laser beam from the outside of the second sealing member (30); transmitting the laser beam through the inside of the second sealing member (30), heating the substrate metal layer (36a), and evaporating at least a portion of the metal layer (36b) through melting thereof; and attaching the metal layer to the second excitation electrode (112).
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
Provided is a piezoelectric vibration device comprising a piezoelectric vibrating reed and a housing including a storing portion storing the piezoelectric vibrating reed, wherein an electrically conductive pad is formed on a mounting surface of the storing portion on which the piezoelectric vibrating reed is mounted, and the piezoelectric vibrating reed is bonded to the electrically conductive pad by means of a metal bump. An outer surface of the housing opposite the mounting surface is recessed toward the mounting surface side, forming a space in a region overlapping the electrically conductive pad in plan view.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H01L 23/04 - ConteneursScellements caractérisés par la forme
H03B 5/30 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
Provided is a piezoelectric vibration device that supresses warping of a sealing member during resin molding. A piezoelectric vibration device 1 comprises: a vibrator 2 in which at least a vibrating portion 5 is sealed with a first sealing member 7 and a second sealing member 8 which are sealing members; an integrated circuit element 10 which is at least an electronic component element; a substrate 11 having a mounting surface 11a with the vibrator 2 and the integrated circuit element 10 mounted thereon; and a mold portion 12 covering at least the vibrator 2 with resin. The vibrator 2 includes a protection member 9 covering a part or all of at least one of the first sealing member 7 and the second sealing member 8.
Provided are a piezoelectric vibration device and a method for manufacturing a piezoelectric vibration device that enable filling of the interior of a holding member with nitrogen gas or the like, without increasing tact time. The method comprises: a sealing material-attached member preparation step S110 for preparing a lid member 10 or a holding member 2 of which one has, in a part of a portion thereof that contacts the other, the sealing material configured in a rectangular frame-like shape in plan view, at least one corner portion 11c of the sealing material 11 having an increased-thickness portion thicker than portions thereof other than the corner portion 11c; a lid member mounting step S120 for contacting the increased-thickness portion with the other to mount the lid member 10 to the holding member 2, the molding member 2 having a piezoelectric element 7 bonded thereto; a tacking step S130 for heating the lid member 10 mounted to the holding member 2 to melt a part of the increased-thickness portion to tack the lid member 10 and the holding member 2 to each other; and a sealing step S140 for melting the sealing material 11 including the increased-thickness portion to seal the lid member 10 and the holding member 2.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
An oven-controlled crystal oscillator according to one or more embodiments includes a core section having at least an oscillation IC, a crystal resonator, and a heater IC. The core section is hermetically encapsulated in a heat-insulating package. The core section is supported by the package via a core substrate. The core substrate is connected to the package outside a region where the core section is provided in plan view.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03L 1/04 - Détails structurels destinés à maintenir la température constante
Provided are a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method by which a plurality of piezoelectric elements can be respectively disposed at predetermined positions in predetermined orientations on a plurality of holding members. The piezoelectric vibration device manufacturing apparatus comprises a suction head moving apparatus 12 for reciprocating a plurality of suction heads 20 simultaneously. The plurality of suction heads 20 respectively suction piezoelectric elements P using suction nozzles 28. At least one of a suction-head horizontal movement mechanism 21, a suction-head vertical movement mechanism 24, and a suction-head rotational movement mechanism 26, on the basis of information about the position of a plurality of piezoelectric elements P respectively suctioned by the plurality of suction nozzles 28 and information about the position of a plurality of holding members H supplied to a holding member supply position Sh, adjusts the position of the suction nozzles 28 each independently and separately so that the piezoelectric elements P respectively being suctioned by the plurality of suction nozzles 28 can be disposed on the corresponding holding members H.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
A thin-film heater according to one or more embodiments may include an insulated substrate and metal wiring patterned thereon to extend between both terminals of the metal wiring. The metal wiring has a resistance of 10Ω or less between the terminals. The metal wiring includes a heat-generating layer made of a material that recrystallizes at a temperature of 200° C. or lower.
H05B 3/34 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes flexibles, p. ex. grillages ou tissus chauffants
H05B 3/12 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
45.
PIEZOELECTRIC DIAPHRAGM AND PIEZOELECTRIC VIBRATION DEVICE
A crystal oscillation plate (10) is provided with an oscillating portion (11), an outer frame portion (12) surrounding the periphery of the oscillating portion (11), and a holding portion (13) coupling the oscillating portion (11) and the outer frame portion (12). A plurality of crystalline surfaces are formed on a side surface of the outer frame portion (12) and on a side surface of the holding portion (13), the side surfaces connecting to a connection part between the outer frame portion (12) and the holding portion (13). The crystalline surfaces form a plurality of ridge lines. At least one of a first main surface side and a second main surface side of the connection part between the outer frame portion (12) and the holding portion (13) is provided with an intersection-preventing portion that prevents intersection of two or more of the ridge lines at the connection part.
The piezoelectric vibration plate includes a piezoelectric substrate, a first driving electrode and a second driving electrode formed on main surfaces on both sides of the piezoelectric substrate, and a first mounting terminal and a second mounting terminal respectively connected to the first driving electrode and the second driving electrode. The first and second mounting terminals each have a metal film for mounting purpose formed on the piezoelectric substrate and a metal film for driving purpose formed on the metal film for mounting purpose. The metal films for mounting purpose each include a solder-resistant metal film. The metal films for driving purpose are formed in continuity with the first and second driving electrodes and constitute the first and second driving electrodes.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
47.
PIEZOELECTRIC VIBRATION DEVICE AND MANUFACTURING METHOD THEREFOR
Metal films for first and second mounting terminals are formed at ends on both sides of a piezoelectric vibration plate across a vibrating portion, and first and second mounting terminals connected to these metal films are formed on outer surfaces of resin films adhered to the piezoelectric vibration plate. In case the metal films for first and second mounting terminals on both sides of the vibrating portion are desirably reduced in size in order to enlarge the vibrating portion, an adequate joining area for mounting purpose is still secured for the first and second mounting terminals formed on the outer surfaces of the resin films.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.
H03B 5/04 - Modifications du générateur pour compenser des variations dans les grandeurs physiques, p. ex. alimentation, charge, température
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
49.
PIEZOELECTRIC DIAPHRAGM AND PIEZOELECTRIC VIBRATION DEVICE
A crystal diaphragm (10) is provided with a vibration unit (11), an outer frame (12) which surrounds the outer periphery of the vibration unit (11), and a holding unit (13) which links the vibration unit (11) and the outer frame (12), wherein flat sections (13a, 13b) are provided on each of a pair of facing first and second primary surfaces of the holding unit (13), and on one flat section (13b), the width of the holding unit (13) in the width direction is greater than that of the other flat section (13a).
Provided is a quartz resonator (100), wherein a quartz vibration plate (10) is provided with a vibration part (11) and an outer frame (12) provided to the outer periphery of the vibration part (11), a penetrating part (10a) penetrating in the thickness direction of the quartz vibration plate (10) is provided between the vibration part (11) and the outer frame (12), and an inclined surface (11c) that protrudes in the thickness direction and that is inclined relative to a vibration surface (11b) of the vibration part (11) is provided to a penetrating-part (10a)-side end section of the vibration part (11).
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
51.
PIEZOELECTRIC RESONATOR PLATE AND PIEZOELECTRIC RESONATOR DEVICE
A crystal resonator plate according to one or more embodiments may include: a vibrating part; an external frame part surrounding the outer periphery of the vibrating part; and a support part connecting the vibrating part to the external frame part. A first excitation electrode is formed on a first main surface of the vibrating part. A second excitation electrode is formed on a second main surface of the vibrating part. The second excitation electrode includes a pair of parallel sides parallel to each other. The first excitation electrode includes protruding parts that protrude outward from a part between the parallel sides the second excitation electrode in plan view. The protruding parts each have an outer edge shape that is not along the parallel sides in plan view.
In an OCXO (1) having a core section (5) enclosed in a sealed state in the interior of a heat-insulating package (2): the core section (5) is configured to include at least an oscillating IC (51), a crystal oscillator (50), and a heater IC (52); the core section (5) is mounted on a core substrate (4); this core substrate (4) is mechanically bonded to the package (2) with a non-conductive adhesive (7); the core section (5) and the package (2) are electrically bonded by wire bonding; and a space (2d) is provided between the core substrate (4) and a bottom surface of the package (2).
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
In an oven-controlled crystal oscillator (OCXO) (1), a core portion (5) is enclosed in a heat-insulating package (2) in a sealed state. The core portion (5) comprises an oscillating IC (51), a crystal vibrator (50), and a heater IC (52), and is supported on the package (2) with a core substrate (4) therebetween. The OCXO (1) includes a capacitor (9) as an adjustment electronic component which is attached to the package (2) by soldering. The core portion (5) is vacuum-sealed in a sealed space (recessed portion (2a)) of the package (2). The capacitor (9) is disposed outside (recessed portion (2e)) the sealed space.
H01L 23/04 - ConteneursScellements caractérisés par la forme
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
In an oven-controlled crystal oscillator (OCXO) (1), a core portion (5) is enclosed in a heat-insulating package (2) in a sealed state. The core portion (5) comprises an oscillating IC (51), a crystal vibrator (50), and a heating IC (52), and is supported on the package (2) with a core substrate (4) therebetween. The core substrate (4) is mechanically joined to the package (2) by means of a non-electrically conductive adhesive (7). The core portion (5) and the package (2) are electrically connected by wire bonding using a wire (6a, 6b).
H01L 23/04 - ConteneursScellements caractérisés par la forme
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
When a thick frequency adjustment metal film of a tuning fork-type vibration piece is irradiated with a beam on a wafer for frequency coarse adjustment, projections are possibly formed on a roughened end of the frequency adjustment metal film. Such projections are pressurized and pushed down not to chip off under any impact, so that the risk of frequency fluctuations is suppressed.
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
The piezoelectric oscillation device is equipped with at least a core (5). The core (5) includes: a crystal oscillator (50) which has a three-layer structure and in which an oscillation part (11) is hermetically sealed; and a heater IC (52) that serves as a heating element. The entirety of a second main surface (302) of at least a second sealing member (30) of the crystal oscillator (50) is thermally coupled to the heater IC (52).
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
Among a plurality of electrodes for mounting purpose, all of the electrodes for mounting purpose but two paired ones of the electrodes for mounting purpose that are connected to driving electrodes each have a wiring pattern for use in electrical connection between terminals for external connection and mounting terminals of IC. These wiring patterns each have a constricted portion smaller in width than the other portions that prevents the conduction of heat.
Provided is a piezoelectric vibration device in which a crystal vibrating plate (10) has a cut-out portion (10a) provided between a vibrating portion (11) and an outer frame portion (12). A metal film (28) is formed on a first major surface (201) of a first sealing member (20). The metal film (28) is electrically connected to an external electrode terminal (32) formed on a second major surface (302) of a second sealing member (30) on a side not facing the internal space, via a first internal wire (105) formed on an inner wall surface (105) of the outer frame portion (12).
An AT-cut crystal vibration plate has, at its both ends, first and second castellations that interconnect first mounting terminals and also interconnect second mounting terminals formed on main surfaces on both sides of this plate. The first and second castellations respectively have first and second cutouts, and these cutouts each have an end surface extending along Z′ axis of crystal and located on a −X-axis side. The end surfaces each include a first inclined face inclined in a manner that protrudes from one of the main surfaces toward the −X-axis side, and a second inclined face inclined in a manner that protrudes from the other main surface toward the −X-axis side. The angle made by the first inclined face and the second inclined face is an obtuse angle.
A piezoelectric vibrating device according to the present invention is provided with: a piezoelectric vibration plate having first and second driving electrodes respectively formed on main surfaces on both sides thereof, the piezoelectric vibration plate further having first and second mounting terminals that are respectively connected to the first and second driving electrodes. The piezoelectric vibrating device is also provided with first and second sealing members respectively joined to the main surfaces on both sides of the piezoelectric vibration plate in a manner that the first and second driving electrodes of the piezoelectric vibration plate are covered with these sealing members. At least one of the first and second sealing members includes a film made of a resin.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
61.
Piezoelectric resonator device having a through hole and through electrode for conduction with an external electrode terminal
In a piezoelectric resonator device according to one or more embodiments, an internal space for hermetically sealing a vibrating part including a first excitation electrode and a second excitation electrode of a crystal resonator plate is formed by bonding a first sealing member and a second sealing member respectively to the crystal resonator plate. A through hole is formed in the second sealing member. A through electrode is formed along an inner wall surface of the through hole to establish conduction between an electrode formed on a first main surface and an external electrode terminal formed on a second main surface. A corrosion resistance structure to solder is formed on the through electrode that establishes conduction between the electrode and the external electrode terminal with a conductive metal other than Au.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/125 - Moyens d'excitation, p. ex. électrodes, bobines
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
Provided is a thermostatic-bath-type piezoelectric oscillator in which the amount of heat emitted by a heater for maintaining the temperature of a core part can be kept as small as possible. A thermostatic-bath-type piezoelectric oscillator (1) in which a core part (5) having at least an oscillation IC (51), a crystal oscillator (50), and a heater IC (52) is enclosed in a sealed state inside a heat insulation package (2), wherein the core part (5) is supported on the package (2) with a core substrate (4) interposed therebetween, and, as seen in plan view, the core substrate (4) is connected to the package (2) outside the region in which the core part (5) is provided.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
This piezoelectric vibration device comprises: a piezoelectric vibration plate having first and second excitation electrodes on the two main surfaces and first and second metal films respectively connected to the first and second excitation electrodes; and first and second sealing members joined to the main surfaces of the piezoelectric vibration plate so as to cover the first and second excitation electrodes of the piezoelectric vibration plate. At least one of the first and second sealing members is a resin film, and in the resin film, a remaining region other than a joined region that is joined to the corresponding main surface of the piezoelectric vibration plate is joined to a part of an inner surface which is contiguous to the main surface to which the resin film is joined.
H01L 23/10 - ConteneursScellements caractérisés par le matériau ou par la disposition des scellements entre les parties, p. ex. entre le couvercle et la base ou entre les connexions et les parois du conteneur
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic components; programmed data-carrying electronic
circuits; electronic timing and synchronizing circuits;
electronic filters used for electronic circuits;
piezoelectric filters; resonators; resonators adapted for
use in computers; crystal resonators; piezoelectric
resonators; electronic resonators used for electronic
circuits; oscillators; oscillators adapted for use in
computers; crystal oscillators; piezoelectric oscillators;
electronic oscillators used for electronic circuits; crystal
filters; temperature sensors; infrared sensors; electronic
sensors used for measuring physical quantity; gyro sensors;
acceleration sensors; optical low pass filters for use in
video cameras, digital still cameras, security cameras and
digital single-lens reflex cameras; crystal plates for LCD
projectors; crystal phase plate for LCD projectors; optical
thin films used as color compensation filters for various
image pickup devices for optical machines and apparatus;
optical filters; wave plates, namely, wave plates used as
parts of optical machines and apparatus for use in
separating the polarizing properties of light, and
depolarizers, which transform the rays of light that become
linearly polarized after passing through the double
refraction plates into non-polarized rays of light, used as
parts of optical machines and apparatus; polarizers, namely,
optical plates, which convert natural light into
polarization, used as parts of optical machines and
apparatus; piezoelectric type sensors; pressure sensors;
hybrid integrated circuit; measuring and testing machines
and instruments.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic components; programmed data-carrying electronic
circuits; electronic timing and synchronizing circuits;
electronic filters used for electronic circuits;
piezoelectric filters; resonators; resonators adapted for
use in computers; crystal resonators; piezoelectric
resonators; electronic resonators used for electronic
circuits; oscillators; oscillators adapted for use in
computers; crystal oscillators; piezoelectric oscillators;
electronic oscillators used for electronic circuits; crystal
filters; temperature sensors; infrared sensors; electronic
sensors used for measuring physical quantity; gyro sensors;
acceleration sensors; optical low pass filters for use in
video cameras, digital still cameras, security cameras and
digital single-lens reflex cameras; crystal plates for LCD
projectors; crystal phase plate for LCD projectors; optical
thin films used as color compensation filters for various
image pickup devices for optical machines and apparatus;
optical filters; wave plates, namely, wave plates used as
parts of optical machines and apparatus for use in
separating the polarizing properties of light, and
depolarizers, which transform the rays of light that become
linearly polarized after passing through the double
refraction plates into non-polarized rays of light, used as
parts of optical machines and apparatus; polarizers, namely,
optical plates, which convert natural light into
polarization, used as parts of optical machines and
apparatus; piezoelectric type sensors; pressure sensors;
hybrid integrated circuit; measuring and testing machines
and instruments.
Provided is a thermostatic bath-type piezoelectric oscillator capable of stabilizing an oscillation frequency. In a thermostatic bath-type piezoelectric oscillator (1) in which a core part (5) is encapsulated inside a heat insulating package (2) in a seated state, the core part (5) is supported by the package (2) via a core substrate (4), and the core part (5) is configured so that at least an oscillation IC (51), a crystal oscillator (50), and a heater IC (52) are stacked in this order.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
In a piezoelectric resonator device according to an embodiment, an internal space is formed by bonding a first sealing member to a crystal resonator plate and bonding a second sealing member to the crystal resonator plate. The internal space hermetically seals a vibrating part including a first excitation electrode and a second excitation electrode of the crystal resonator plate. Seal paths that hermetically seal the vibrating part of the crystal resonator plate are formed to have an annular shape in plan view. A plurality of external electrode terminals is formed on a second main surface of the second sealing member to be electrically connected to an external circuit board. The external electrode terminals are respectively disposed on and along an external frame part surrounding the internal space in plan view.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
In a crystal oscillator accordance to an embodiment, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.
H01L 41/053 - Montures, supports, enveloppes ou boîtiers
H01L 41/083 - Eléments piézo-électriques ou électrostrictifs avec une structure empilée ou multicouche
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/13 - Moyens d'excitation, p. ex. électrodes, bobines pour réseaux se composant de matériaux piézo-électriques ou électrostrictifs
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
H01L 41/18 - Emploi de matériaux spécifiés pour des éléments piézo-électriques ou électrostrictifs
H03B 5/34 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique l'élément actif de l'amplificateur étant un tube à vide
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic components, namely, programmed data-carrying electronic circuits, electronic timing and synchronizing circuits, electronic filters used for electronic circuits, piezoelectric filters, resonators, resonators adapted for use in computers, crystal resonators, piezoelectric resonators, electronic resonators used for electronic circuits, oscillators, oscillators adapted for use in computers, crystal oscillators, piezoelectric oscillators, electronic oscillators used for electronic circuits; electronic components in the nature of crystal filters used for electronic circuits; temperature sensors; infrared sensors; electronic sensors used for measuring physical quantity; gyro sensors, namely, gyroscopes, gyrometers, and gyrocompasses; acceleration sensors; piezoelectric type sensors for measuring pressure, acceleration, angle, temperature, and humidity, not for medical use; pressure sensors; optical apparatus and instruments, namely, optical filters; optical low pass filters for use in video cameras, digital still cameras, security cameras and digital single- lens reflex cameras; filters for optical devices, namely, optical thin films used as color compensation filters for various image pickup devices; heat radiation substrate for electronic products, namely, crystal plates used for heat radiation for LCD projectors; filters for optical devices, namely, crystal phase plate for filtering light for LCD projectors; optical instruments in the nature of wave plates, namely, wave plates for use in separating the polarizing properties of light, and depolarizers, which transform the rays of light that become linearly polarized after passing through the double refraction plates into non-polarized rays of light; polarizers, namely, optical plates, which convert natural light into polarization; hybrid integrated circuits
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic components, namely, programmed data-carrying electronic circuits, electronic timing and synchronizing circuits, electronic filters used for electronic circuits, piezoelectric filters, resonators, resonators adapted for use in computers, crystal resonators, piezoelectric resonators, electronic resonators used for electronic circuits, oscillators, oscillators adapted for use in computers, crystal oscillators, piezoelectric oscillators, electronic oscillators used for electronic circuits; electronic components in the nature of crystal filters used for electronic circuits; temperature sensors; infrared sensors; electronic sensors used for measuring physical quantity; gyro sensors, namely, gyroscopes, gyrometers, and gyrocompasses; acceleration sensors; piezoelectric type sensors for measuring pressure, acceleration, angle, temperature, and humidity, not for medical use; pressure sensors; optical apparatus and instruments, namely, optical filters; optical low pass filters for use in video cameras, digital still cameras, security cameras and digital single- lens reflex cameras; filters for optical devices, namely, optical thin films used as color compensation filters for various image pickup devices; heat radiation substrate for electronic products, namely, crystal plates used for heat radiation for LCD projectors; filters for optical devices, namely, crystal phase plate for filtering light for LCD projectors; optical instruments in the nature of wave plates, namely, wave plates for use in separating the polarizing properties of light, and depolarizers, which transform the rays of light that become linearly polarized after passing through the double refraction plates into non-polarized rays of light; polarizers, namely, optical plates, which convert natural light into polarization; hybrid integrated circuits
71.
CONSTANT TEMPERATURE BATH-TYPE PIEZOELECTRIC OSCILLATOR
[Problem] To provide a constant temperature bath-type piezoelectric oscillator with which it is possible to reduce cost while highly accurately controlling both the temperature of a heating element and the piezoelectric vibration of a piezoelectric vibrator. [Solution] In a constant temperature bath-type piezoelectric oscillator 1 comprising a core part 5 that has a heater IC 52, an oscillator IC 51, and a crystal vibrator 50, the core part 5 is supported by a package 2 via an interposer 4 and is hermetically sealed in the package 2.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
72.
THIN-FILM HEATER, METHOD OF PRODUCING THIN-FILM HEATER, AND THERMOSTATIC OVEN PIEZOELECTRIC OSCILLATOR
A thin-film heater (10) has a metal wiring (12) that has been patterned between two terminals, over an insulating substrate (11). The metal wiring (12) has a heat-generating layer (12A) formed of a material where recrystallization occurs at a temperature of 200°C or below, the resistance value between the two terminals being 10Ω or below. The heat-generating layer (12A) is formed through: a film-forming step for forming a metal film by vacuum deposition in a state where the insulating substrate (11) is preheated to 200°C or above; and a patterning step for patterning the formed metal film by etching.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H05B 3/12 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur
H05B 3/16 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur le conducteur étant monté sur une base isolante
H05B 3/20 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes
H05B 3/26 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes non flexibles le conducteur chauffant monté sur une base isolante
73.
PIEZOELECTRIC VIBRATION DEVICE AND MANUFACTURING METHOD THEREFOR
In this invention, a first and second mounting terminals, which are connected to metal films for the first and second mounting terminals formed on both end portions of a piezoelectric vibration plate that sandwich a vibration part, are each formed on the outer surface of a film bonded to the piezoelectric vibration plate. Consequently, even if the sizes of the metal films for the first and second mounting terminals on both sides of the vibration part are reduced in order to enlarge the vibration part, it is possible to secure a bonding region for mounting of each of the first and second mounting terminals formed on the outer surface of a resin film.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
74.
PIEZOELECTRIC VIBRATION PLATE, PIEZOELECTRIC VIBRATION DEVICE, AND METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATION DEVICE
Comprised are first and second excitation electrodes formed on both main surfaces of a piezoelectric substrate, and first and second mounting terminals respectively connected to the first and second excitation electrodes, wherein the first and second mounting terminals have a metal film for mounting that includes a solder resistant metal film formed on the piezoelectric substrate, and a metal film for excitation that configures the first and second excitation electrodes formed to respectively be continuous with the first and second excitation electrodes on this metal film for mounting.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic components; programmed data-carrying electronic
circuits; electronic timing and synchronizing circuits;
electronic filters used for electronic circuits;
piezoelectric filters; resonators; resonators adapted for
use in computers; crystal resonators; piezoelectric
resonators; electronic resonators used for electronic
circuits; oscillators; oscillators adapted for use in
computers; crystal oscillators; piezoelectric oscillators;
electronic oscillators used for electronic circuits; crystal
filters; temperature sensors; infrared sensors; electronic
sensors used for measuring physical quantity; gyro sensors;
acceleration sensors; optical low pass filters for use in
video cameras, digital still cameras, security cameras and
digital single-lens reflex cameras; crystal plates for LCD
projectors; crystal phase plate for LCD projectors; optical
thin films used as color compensation filters for various
image pickup devices; optical filters; wave plates, namely,
wave plates for use in separating the polarizing properties
of light, and depolarizers which transform the rays of light
that become linearly polarized after passing through the
double refraction plates into non-polarized rays of light;
polarizers, namely, optical plates which convert natural
light into polarization; piezoelectric type sensors;
pressure sensors; hybrid integrated circuit; measuring and
testing machines and instruments.
76.
LID MATERIAL FOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING LID MATERIAL, AND LIGHT-EMITTING DEVICE
A light-emitting device (10) houses an LED chip (13) in a cavity (111) of a ceramic package (11) and seals an opening of the cavity (111) with a crystal lid (12). A lid material (20) before being sealed is obtained by using the crystal lid (12) as a lid body and forming a first metallization film (41) on a sealing surface of the crystal lid (12). The first metallization film (41) includes: a first metal layer (411) that is formed directly on the crystal lid (12); and an alloy layer (43) that contains a brazing material (Au-Sn) on the first metal layer (411). The first metal layer (411) has a single-layer structure that is formed from a Ti film having a film thickness of 20-700 nm.
H01L 23/08 - ConteneursScellements caractérisés par le matériau du conteneur ou par ses propriétés électriques le matériau étant un isolant électrique, p. ex. du verre
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
77.
LID MATERIAL FOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING LID MATERIAL
A light-emitting device (10) stores an LED chip (13) inside a cavity (111) of a ceramic package (11), and an opening of the cavity (111) is sealed with a crystal lid (12). A lid material (20) before sealing has the crystal lid (12) as a lid body and has a first metallized film (41) formed on a sealing face of the crystal lid (12) as an undercoat film. The first metallized film (41) includes a first metal layer (411) directly formed on the crystal lid (12), and a second metal layer (412) formed on the first metal layer (411). The first metal layer (411) has a single layer structure comprising a Ti film having a thickness of 20 to 700 nm. The second metal layer (412) has a layered structure in which a Ni-Ti film (4121) and an Au film (4122) are layered in order from the side near the first metal layer (411).
A through hole formed in an AT-cut crystal plate includes an inclined surface (72) that extends from a peripheral area toward a penetrating part (71) in a center part of the through hole. The inclined surface (72) includes: a first crystal surface S1 that extends from the penetrating part (71) toward the peripheral area of the through hole in a −Z′ and a +X directions; a second crystal surface S2 that extends from the penetrating part (71) toward the peripheral area of the through hole in the −Z′ and the +X directions and that contacts with the first crystal surface S1 in the +Z′ and the +X directions of the first crystal surface S1; and a third crystal surface S3 that contacts with the second crystal surface S2 in the +X direction of the second crystal surface S2 and that contacts with the main surface of the AT-cut crystal plate. A compensation surface Sc is formed between the main surface of the AT-cut crystal plate and the three crystal surfaces Si to S3 to prevent first and second ridge lines L1 and L2 from reaching the main surface of the AT-cut crystal plate.
[Problem] To reduce spurious signals and improve electrical characteristics in a piezoelectric vibration plate with a frame, in which a vibration unit and an outer frame are linked by a holding unit, and in a piezoelectric vibration device provided with such a piezoelectric vibration plate. [Solution] This quartz vibration plate 10 is provided with a vibration unit 11, an outer frame 12 which encloses the outer periphery of the vibration unit 11, and a holding unit 13 which links the vibration unit 11 and the outer frame 12. A first excitation electrode 111 is formed on one primary surface of the vibration unit 11, and a second excitation electrode 112 is formed on the other primary surface of the vibration unit 11. The second excitation electrode 112 has parallel sides 112e, 112g parallel to each other. The first excitation electrode 111 has projections 111c, 111d which, seen in planar view, project outside of the area between the parallel sides 112e, 112g of the second excitation electrode 112, and the protrusions 111c, 111d have an outer edge shape not along the parallel sides 112e, 112g in planar view.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic components, namely, programmed data-carrying electronic circuits, electronic timing and synchronizing circuits, electronic filters used for electronic circuits, piezoelectric filters, resonators, resonators adapted for use in computers, crystal resonators, piezoelectric resonators, electronic resonators used for electronic circuits, oscillators, oscillators adapted for use in computers, crystal oscillators, piezoelectric oscillators, electronic oscillators used for electronic circuits; electronic components in the nature of crystal filters used for electronic circuits; temperature sensors; infrared sensors; electronic sensors used for measuring physical quantity; gyro sensors, namely, gyroscopes, gyrometers, and gyrocompasses; acceleration sensors; piezoelectric type sensors for measuring pressure, acceleration, angle, temperature, and humidity, not for medical use; pressure sensors; optical apparatus and instruments, namely, optical filters; optical low pass filters for use in video cameras, digital still cameras, security cameras and digital single- lens reflex cameras; filters for optical devices, namely, optical thin films used as color compensation filters for various image pickup devices; heat radiation substrate for electronic products, namely, crystal plates used for heat radiation for LCD projectors; filters for optical devices, namely, crystal phase plate for filtering light for LCD projectors; optical instruments in the nature of wave plates, namely, wave plates for use in separating the polarizing properties of light, and depolarizers which transform the rays of light that become linearly polarized after passing through the double refraction plates into non-polarized rays of light; polarizers, namely, optical plates which convert natural light into polarization; hybrid integrated circuits
Mounting electrodes other than a pair of mounting electrodes connected to exciting electrodes are each provided with a wire pattern connecting an external connection terminal with an IC mounting terminal. The wire pattern includes a constricted portion with a reduced width to prevent transfer of heat.
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/58 - Dispositions électriques structurelles non prévues ailleurs pour dispositifs semi-conducteurs
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
According to the present invention, on both ends of an AT-cut crystal diaphragm, first and second castellations that connect first mounting terminals to each other and connect second mounting terminals to each other on both main surfaces are formed. First and second notched sections of the first and second castellations each have an end surface extending along the Z' axis of the crystal and located on the -X axis side, each end surface having a first inclined surface that is inclined so as to project from one main surface toward the -X axis side, and a second inclined surface that is inclined so as to project from the other main surface toward -X axis side. The first inclined surface and the second inclined surface form an obtuse angle.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
A piezoelectric vibrating device of the present invention is provided with: a piezoelectric vibration plate that has first and second excitation electrodes respectively formed on both main surfaces, and has first and second mounting terminals respectively connected to the first and second excitation electrodes; and first and second sealing members respectively joined to both main surfaces of the piezoelectric vibration plate so as to respectively cover the first and second excitation electrodes of the piezoelectric vibration plate. At least one of the first and second sealing members is a film made of resin.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
This piezoelectric vibration device is provided with an inner space in which a vibrating section (11) of a crystal diaphragm (10) that includes a first excitation electrode (111) and a second excitation electrode (112) is hermetically sealed by joining a first sealing member (20) to the crystal diaphragm (10) and by joining a second sealing member (30) to the crystal diaphragm (10). A through-hole (33) is formed in the second sealing member (30), and formed on the inner wall face of the through-hole (33) is a through-electrode (331) for electrically connecting an electrode (34) formed on a first main face (301) to an external electrode terminal (32) formed on a second main face (302). The through-electrode (331) is provided with a structure which is corrosion-resistant to solder (120), and the through-electrode (331) electrically connects the electrode (34) of the first main face (301) to the external electrode terminal (32) of the second main face (302) by means of an electrically conductive metal other than silver (Au).
H01L 23/04 - ConteneursScellements caractérisés par la forme
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
Provided is a piezoelectric vibrating device in which a first seal member (20) and a crystal vibrating plate (10) are joined, and a second seal member (30) and the crystal vibrating plate (10) are joined to provide an internal space (C1) in which a vibrating portion (11) of the crystal vibrating plate (10) including a first excitation electrode (111) and a second excitation electrode (112) is sealed in an air-tight manner. A seal path (115,116) sealing the vibrating portion (11) of the crystal vibrating plate (10) in an air-tight manner is formed in an annular shape in plan view. A plurality of external electrode terminals (32) for electrical connection to an external circuit board are formed on a second major surface (302) of the second seal member (30). The external electrode terminals (32) are disposed along an outer frame portion (W1) surrounding the internal space (C1) in plan view.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
A quartz oscillator (101), wherein a quartz vibration plate (2), a first sealing member (3) covering a first excitation electrode of the quartz vibration plate (2), and a second sealing member (4) covering a second excitation electrode of the quartz vibration plate (2) are bonded by a bonding pattern layer, and an internal space, in which a vibration part (22) of the quartz vibration plate (2) including the first excitation electrode and the second excitation electrode is hermetically sealed, is formed. The bonding pattern layer includes: a sealing pattern layer (e.g., vibration-side first bonding pattern (251)), which is formed in an annular shape so as to enclose the vibration part (22) in plan view, thereby hermetically sealing the internal space; and an electroconductive pattern layer (e.g., connection bonding patterns (253)) for electrically connecting wiring and the electrodes. The electroconductive pattern layer is disposed in a closed space surrounded by the sealing pattern layer. The sealing pattern layer is imparted with a GND potential when the quartz oscillator (101) operates.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
87.
Tuning fork-type vibrator and manufacturing method for the same
A tuning fork-type vibration piece is provided, in which a cushioning portion is formed on the base of a package and allowed to contact parts for contact of arm portions which are any parts but their edges, and the parts for contact of the arm portions that contact the cushioning portion are electrodeless regions, which prevents the risk of frequency fluctuations caused by any electrode being chipped off by contact with the cushioning portion.
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
88.
Crystal resonator plate and crystal resonator device
In a crystal resonator plate (2), a support part (24) extends from only one corner part positioned in the +X direction and in the −Z′ direction of a vibrating part (22) to an external frame part (23) in the −Z′ direction. The vibrating part (22) and at least part of the support part (24) form an etching region (Eg) having a thickness thinner than a thickness of the external frame part (23). A stepped part is formed at a boundary of the etching region (Eg), and a first lead-out wiring (223) is formed over the support part (24) to the external frame part (23) so as to overlap with the stepped part. At least part of the stepped part that is superimposed on the first lead-out wiring (223) is formed so as not to be parallel to the X axis in plan view.
A tuning fork-type vibration piece is provided, in which a cushioning portion is formed on the base of a package to make contact with abutting portions of arm portions which are any parts but their edges, and the abutting portions of the arm portions allowed to contact the cushioning portion are electrodeless regions including no electrode, which prevents the risk of frequency fluctuations that may occur in case an electrode is chipped off by possible contact with the cushioning portion.
When a thick frequency adjustment metal film of a tuning fork-type vibration piece is irradiated with a beam on a wafer for frequency coarse adjustment, projections are possibly formed on a roughened end of the frequency adjustment metal film. Such projections are pressurized and pushed down not to chip off under any impact, so that the risk of frequency fluctuations is suppressed.
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
A crystal oscillator includes: a crystal resonator plate having a first excitation electrode and a second excitation electrode. A first sealing member covers the first excitation electrode of the crystal resonator plate. A second sealing member covers the second excitation electrode of the crystal resonator plate. An internal space is formed by bonding the first sealing member to the crystal resonator plate and the second sealing member to the crystal resonator plate, and seals a vibrating part of the crystal resonator plate. First and second shield electrodes are connected to a fixed potential (e.g. GND potential) in the internal space.
Main surface electrodes formed on main surfaces on front and back sides of vibrating arms are electrically coupled via through electrodes formed in a stem portion so as to penetrate through front and back surfaces thereof. One of the main surface electrodes of the vibrating arm is electrically coupled to side surface electrodes through a routing wiring formed by way of a crotch part between roots of the vibrating arms, and the one of the main surface electrodes is further electrically coupled to the other one of the main surface electrodes through the side surface electrodes.
H03H 9/13 - Moyens d'excitation, p. ex. électrodes, bobines pour réseaux se composant de matériaux piézo-électriques ou électrostrictifs
G04C 3/12 - Horloges ou montres électromécaniques indépendantes d'autres garde-temps et dans lesquelles le mouvement est entretenu par des moyens électriques dans lesquelles le mouvement est régulé par un oscillateur mécanique autre qu'un pendule ou un balancier, p. ex. par un diapason entraîné par des moyens piézo-électriquesHorloges ou montres électromécaniques indépendantes d'autres garde-temps et dans lesquelles le mouvement est entretenu par des moyens électriques dans lesquelles le mouvement est régulé par un oscillateur mécanique autre qu'un pendule ou un balancier, p. ex. par un diapason entraîné par des moyens magnétostrictifs
In a crystal oscillator, a crystal resonator and an IC chip are hermetically sealed in a package. The crystal resonator includes: a crystal resonator plate including a first excitation electrode formed on a first main surface, and a second excitation electrode, which makes a pair with the first excitation electrode, formed on a second main surface; a first sealing member covering the first excitation electrode of the crystal resonator plate; and a second sealing member covering the second excitation electrode of the crystal resonator plate. A vibrating part including the first excitation electrode and the second excitation electrode of the crystal resonator plate is hermetically sealed by bonding the first sealing member to the crystal resonator plate, and the second sealing member to the crystal resonator plate.
H01L 23/08 - ConteneursScellements caractérisés par le matériau du conteneur ou par ses propriétés électriques le matériau étant un isolant électrique, p. ex. du verre
H03B 5/36 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique l'élément actif de l'amplificateur comportant un dispositif semi-conducteur
A crystal resonator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) that covers the first excitation electrode of the piezoelectric resonator plate (2); and a second sealing member (4) that covers the second excitation electrode of the piezoelectric resonator plate (2). The first sealing member (3) is bonded to the piezoelectric resonator plate (2) while the second sealing member (4) is bonded to the piezoelectric resonator plate (2) so that an internal space (13), which hermetically seals a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2), is formed. Plating films (51, 52) are formed respectively on both the first sealing member (3) and the second sealing member (4), on respective surfaces opposite to surfaces to be bonded to the piezoelectric resonator plate (2).
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
H03B 5/36 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique l'élément actif de l'amplificateur comportant un dispositif semi-conducteur
95.
Piezoelectric resonator device and system-in-package module including the same
A crystal oscillator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) covering the first excitation electrode of the piezoelectric resonator plate (2); a second sealing member (4) covering the second excitation electrode of the piezoelectric resonator plate (2); and an internal space (13) formed by bonding the first sealing member (3) to the piezoelectric resonator plate (2) and by bonding the second sealing member (4) to the piezoelectric resonator plate (2), so as to hermetically seal a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2). An electrode pattern (371) including a mounting pad for wire bonding is formed on an outer surface (first main surface (311)) of the first sealing member (3).
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H10N 30/071 - Montage de parties piézo-électriques ou électrostrictives avec des éléments semi-conducteurs ou avec d’autres éléments de circuit sur un substrat commun
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/04 - ConteneursScellements caractérisés par la forme
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
This piezoelectric vibration device is provided with: a piezoelectric vibrator including a plurality of external connection terminals and a plurality of mounting electrodes; and an integrated circuit element which includes a plurality of mounting terminals connected to the plurality of mounting electrodes and is mounted on the piezoelectric vibrator. At least one of the mounting electrodes connected to the external connection terminals has a wiring pattern which, in a mounting region for the integrated circuit element, extends to the inside of the mounting terminals of the integrated circuit element.
H03B 5/32 - Production d'oscillation au moyen d'un amplificateur comportant un circuit de réaction entre sa sortie et son entrée l'élément déterminant la fréquence étant un résonateur électromécanique un résonateur piézo-électrique
A through hole formed in an AT cut crystal sheet has an inclined surface (72) from a surrounding part toward a through bore (71) in a center part. The inclined surface (72) has: a first crystal surface S1 that extends in the -Z' direction and the +X direction from the through bore (71) to the surrounding part of the through hole; a second crystal surface S2 that extends in the -Z' direction and the +X direction from the through bore (71) to the surrounding part of the through hole, and contacts the first crystal surface S1 in the +Z' direction and the +X direction; and a third crystal surface S3 that contacts the second crystal surface S2 in the +X direction, and contacts the main surface of the AT cut crystal sheet. A compensation surface Sc is formed between the three crystal surfaces S1-S3 and the main surface of the AT cut crystal sheet, the compensation surface Sc preventing a first ridgeline L1 and a second ridgeline L2 from reaching the main surface of the AT cut crystal sheet.
An object is to provide a frequency adjustment method for a piezoelectric resonator device that is applicable to a microminiaturized device and that can adjust the frequency without deteriorating the accuracy of frequency adjustment. A frequency adjustment method for a tuning-fork quartz resonator is applicable to a tuning-fork quartz resonator that includes a tuning-fork quartz resonator piece having a pair of resonator arms 31, 32 and metallic adjustment films W formed on the resonator arms. The frequency adjustment method adjusts the frequency by reduction of a mass of the metallic adjustment films W. The frequency adjustment method includes: a rough adjustment step for roughly adjusting the frequency by partially thinning or removing the metallic adjustment films W; and a fine adjustment step for finely adjusting the frequency by at least partially thinning or removing products W1, W2 derived from the metallic adjustment film W during the rough adjustment step.
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
On the inner surface of a package in which two piezoelectric filter elements are housed, a shield electrode facing both electrodes of an input electrode and an output electrode of a piezoelectric substrate of each of the piezoelectric filter elements is formed. A gap between both the electrodes of the piezoelectric substrate and the shield electrode on the inner surface of the package is set to 100 μm or more.
An AT-cut crystal resonator plate includes: a vibrating part having a rectangular shape in plan view that is disposed on a center of the AT-cut crystal resonator plate and that has excitation electrodes respectively formed on a first and a second main surfaces; a cut-out part having a rectangular shape in plan view that is formed along an outer periphery of the vibrating part; an external frame part having a rectangular shape in plan view that is formed along an outer periphery of the cut-out part; and a connecting part that connects the vibrating part to the external frame part and that extends, in a Z′ axis direction of the vibrating part, from one end part of a side of the vibrating part along an X axis direction. The connecting part includes wide parts whose widths gradually increase only toward the external frame part.
