Abrégé

A conductive bump structure of a circuit board includes at least one composite conductive bump formed in at least one bump preservation region on a conductive layer of the circuit board. The composite conductive bump includes a raised portion and a conductive pillar. The raised portion is raised from a top surface of the conductive layer by a height. A bottom of the conductive pillar is in contact with and is combined with a curved top surface of the raised portion, and a top of the conductive pillar is raised upwards to protrude beyond the top planar surface of the conductive layer by a protrusion height.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A stacked flexible printed circuit board assembly with a side connection section is provided, including a first flexible printed circuit board, a second flexible printed circuit board, and a curved connection section. The curved connection section is integrally connected to and between side edges of the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board is folded in a direction toward and thus stacked on the second flexible printed circuit board such that a plurality of first contact pads of the first flexible printed circuit board correspond respectively to a plurality of second contact pads of the second flexible printed circuit board. A height adjustment layer or an adhesive layer is provided between the first flexible printed circuit board and the second flexible printed circuit board to suit the need of thickness in plugging or soldering.

Classes IPC  ?

• H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 7/00 - CIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES - Détails de construction communs à différents types d'appareils électriques
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. A resin-based conductive adhesive layer is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The resin-based conductive adhesive layer is pressed to bond between the conductive paste coating zone and a top insulation layer such that the conductive paste coating zone and the resin-based conductive adhesive layer achieve electrical connection therebetween.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A signal attenuation reduction structure for a flexible circuit board includes a conductive paste coating zones formed on surfaces of high-frequency signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to a pair of high-frequency signal lines or covers a plurality of pairs of the high-frequency signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/02 - Circuits imprimés - Détails
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques

Abrégé

A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat

Abrégé

Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/42 - Trous de passage métallisés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage

Abrégé

A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/42 - Trous de passage métallisés

Abrégé

An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/14 - Association structurale de plusieurs circuits imprimés

Abrégé

Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.

Classes IPC  ?

• H03H 7/38 - Réseaux d'adaptation d'impédance
• H01P 1/22 - Atténuateurs
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/34 - Connexions soudées

Abrégé

Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H01B 7/08 - Câbles plats ou à ruban
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly. In other applications, a reinforcement plate is included to reinforce the terminal distribution section of the flexible circuit board.

Classes IPC  ?

• H01R 35/02 - Connecteurs de ligne flexibles
• H01R 12/61 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés flexibles, à des câbles plats ou à rubans ou à des structures similaires
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 5/02 - Enveloppes, coffrets ou tiroirs pour appareils électriques - Détails

Abrégé

Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• B29C 53/04 - Cintrage ou pliage de plaques ou de feuilles

Abrégé

A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H02G 15/08 - Jonctions de câbles
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.

Classes IPC  ?

• H03H 7/38 - Réseaux d'adaptation d'impédance
• H01P 1/22 - Atténuateurs
• H01P 3/02 - Guides d'ondes; Lignes de transmission du type guide d'ondes à deux conducteurs longitudinaux
• H05K 1/00 - Circuits imprimés

Abrégé

An attenuation reduction grounding pattern structure for connection pads of a flexible circuit board includes a plurality of high frequency connection pads formed on a component surface of a substrate and a plurality of differential mode signal lines arranged on the substrate and connected to the high frequency connection pads. The substrate has a grounding surface forming a grounding layer. The grounding layer includes an attenuation reduction grounding pattern structure formed at a location corresponding to the transition zone and including a hollowed area and a protruded portion. The protruded portion extends a predetermined length in a direction from the grounding layer toward the high frequency connection pads and along the adjacent high frequency connection pads to reach the transition zone. The protruded portion and the high frequency connection pads form a polarization-direction-varying electric field in the transition zone.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/34 - Connexions soudées

Abrégé

A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Classes IPC  ?

• H01K 3/10 - Machines à cet effet
• H05K 3/42 - Trous de passage métallisés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H01B 7/08 - Câbles plats ou à ruban
• H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p.ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires géné; Dispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes; Bornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
• H01R 12/59 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires
• H01R 43/02 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour connexions soudées

Abrégé

A rigid-flexible circuit board includes at least one flexible circuit board and at least one rigid circuit board. The flexible circuit board includes a flexible-board substrate, a plurality of flexible circuit board differential mode signal lines, at least one flexible circuit board grounding line, a flexible circuit board insulation layer formed on the upper surface of the flexible-board substrate and covering the flexible circuit board differential mode signal lines and the flexible circuit board grounding line. The rigid circuit board is stacked on the stacking section of the flexible circuit board. A shielding layer is formed on the flexible circuit board insulation layer of the flexible circuit board and corresponds to the extension section of the flexible circuit board. The shielding layer further extends from the extension section to the stacking section. An impedance control structure is formed on the shielding layer to control the impedance of the flexible circuit board differential mode signal lines.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.

Classes IPC  ?

• H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p.ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires géné; Dispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes; Bornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes

Abrégé

A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section. The first section, the second section, and the extension section include at least one fold line.

Classes IPC  ?

• H01B 7/08 - Câbles plats ou à ruban
• H02G 15/08 - Jonctions de câbles
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés

Abrégé

A composite flexible circuit planar cable includes a flat cable, a first section, and a second section. The flat cable includes a plurality of straight line like parallel and non-jumping conductor lines. At least one jumping line is formed on the first section to interchangeably connect a selected conductive line of the first section to an another selected conductive line. The second section may also form at least one jumping line to interchangeably connect a selected conductive line of the second section to an another selected conductive line. Through such a jumping line, electrical connection can be formed between signal terminals and corresponding and interchanged signal terminals. The plurality of conductor lines of the flat cable includes at least a pair of differential signal conductor lines, a grounding line, and a power line.

Classes IPC  ?

• H01B 7/08 - Câbles plats ou à ruban
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H01R 12/62 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés rigides ou à des structures similaires
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

Disclosed is a flexible circuit cable with at least two bundled wire groups. The circuit cable has first and second ends respectively connected to first and second connection sections. The circuit cable includes a cluster section, which is formed of a plurality of cluster wires formed by slitting the circuit cable, in an extension direction of the cable, at a predetermined cut width. The cluster section includes at least two independent bundles, which are formed by dividing the cluster wires of the circuit cable into different signal groups according to electrical signals transmitted therethrough. Bundling members are used to the cluster wires of the independent bundles according to predetermined bundling modes. Further, the circuit cable has a surface forming a shielding conductive layer for electromagnetic interference protection and impedance control for internal signals of the circuit cable.

Classes IPC  ?

• H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme

Abrégé

A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.

Classes IPC  ?

• H01B 7/08 - Câbles plats ou à ruban
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés

Produits et services

Retail and sales Services of touch panels, semiconductor chips, semiconductor carriers, interface cards for data processing equipment in the form of printed circuits, microcircuits, integrated circuit sockets, printed circuit boards, electric connectors, terminal plates, bus bars, Isolative cover layer for electric cables, electric cables, electric wires, Magnet wires, electric wires for labeling wires, labeling parts for labeling electric wires, supporting frame for electric wires, electric wires with insulation layer, electric wires for telephone line, Connection sleeves for coaxial cable, Insulation sleeves for coaxial cable, coaxial cable, fiber cable, transducer, optical fiber, integrated circuit cards, antennas, communication port for computer, integrated circuit, electric switch. Providing repair, installation, and servicing of touch panels, semiconductor chips, semiconductor carriers, interface cards for data processing equipment in the form of printed circuits,microcircuits, integrated circuit sockets, printed circuit boards, electric connectors, terminal plates, bus bars, Isolative cover layer for electric cables, electric cables, electric wires, Magnet wires, electric wires for labeling wires, labeling parts for labeling electric wires, supporting frame for electric wires, electric wires with insulation layer, electric wires for telephone line, Connection sleeves for coaxial cable, Insulation sleeves for coaxial cable, coaxial cable, fiber cable, transducer, optical fiber, integrated circuit cards, antennas, communication port for computer, integrated circuit, electric switch. Consultancy, Design and development of touch panels, semiconductor chips, semiconductor carriers, interface cards for data processing equipment in the form of printed circuits, microcircuits, integrated circuit sockets, printed circuit boards, electric connectors, terminal plates, bus bars, Isolative cover layer for electric cables, electric cables, electric wires, Magnet wires, electric wires for labeling wires, labeling parts for labeling electric wires, supporting frame for electric wires, electric wires with insulation layer, electric wires for telephone line, Connection sleeves for coaxial cable, Insulation sleeves for coaxial cable, coaxial cable, fiber cable, transducer, optical fiber, integrated circuit cards, antennas, communication port for computer, integrated circuit, electric switch.

Produits et services

ON-LINE RETAIL STORE SERVICES FEATURING TOUCH PANELS, SEMICONDUCTOR CHIPS, SEMICONDUCTOR CARRIERS, INTERFACE CARDS FOR DATA PROCESSING EQUIPMENT IN THE FORM OF PRINTED CIRCUITS, MICROCIRCUITS, INTEGRATED CIRCUIT SOCKETS, PRINTED CIRCUIT BOARDS, ELECTRIC CONNECTORS, TERMINAL PLATES, BUS BARS, ISOLATIVE COVER LAYER FOR ELECTRIC CABLES, ELECTRIC CABLES, ELECTRIC WIRES, MAGNET WIRES, ELECTRIC WIRES FOR LABELING WIRES, LABELING PARTS FOR LABELING ELECTRIC WIRES SUPPORTING FRAME FOR ELECTRIC WIRES, ELECTRIC WIRES WITH INSULATION LAYER, ELECTRIC WIRES FOR TELEPHONE LINE, CONNECTION SLEEVES FOR COAXIAL CABLE, INSULATION SLEEVES FOR COAXIAL CABLE, COAXIAL CABLE, FIBER CABLE, TRANSDUCER, OPTICAL FIBER, INTEGRATED CIRCUIT CARDS, ANTENNAS, COMMUNICATION PORT FOR COMPUTER, INTEGRATED CIRCUIT, ELECTRIC SWITCH CONSULTANCY, DESIGN AND DEVELOPMENT OF COMPUTER HARDWARE IN THE NATURE OF TOUCH PANELS, SEMICONDUCTOR CHIPS, SEMICONDUCTOR CARRIERS, INTERFACE CARDS FOR DATA PROCESSING EQUIPMENT IN THE FORM OF PRINTED CIRCUITS, MICROCIRCUITS, INTEGRATED CIRCUIT SOCKETS, PRINTED CIRCUIT BOARDS, ELECTRIC CONNECTORS, TERMINAL PLATES, BUS BARS, ISOLATIVE COVER LAYER FOR ELECTRIC CABLES, ELECTRIC CABLES, ELECTRIC WIRES, MAGNET WIRES, ELECTRIC WIRES FOR LABELING WIRES, LABELING PARTS FOR LABELING ELECTRIC WIRES, SUPPORTING FRAME FOR ELECTRIC WIRES, ELECTRIC WIRES WITH INSULATION LAYER, ELECTRIC WIRES FOR TELEPHONE LINE, CONNECTION SLEEVES FOR COAXIAL CABLE, INSULATION SLEEVES FOR COAXIAL CABLE, COAXIAL CABLE, FIBER CABLE, TRANSDUCER, OPTICAL FIBER, INTEGRATED CIRCUIT CARDS, ANTENNAS, COMMUNICATION PORT FOR COMPUTER, INTEGRATED CIRCUIT, ELECTRIC SWITCH

Abrégé

A multilayer stacked circuit arrangement with localized separation section, has a first flat cable and first signal transmission lines arranged on the first flat cable. A second flat cable is stacked on and bonded to the first flat cable. The second flat cable further has signal transmission lines arranged on it. A bonding substance layer is formed between a first non-separation section of the first flat cable and a second non-separation section of the second flat cable for properly stacking the first and second flat cables where the separation sections are spaced apart from each other. A conductive via extends between the first non-separation section and the second non-separation section. At least some of the second signal transmission lines of the second flat cable are connected through the conductive via to the first signal transmission lines of the first flat cable.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés

Abrégé

Disclosed is a detachment and displacement protection structure for insertion of flexible circuit flat cable. An inserter positioning section is formed on a flexible circuit flat cable and coupled with an inserter, which includes a metal member and a plastic member. In assembling, the plastic member is first positioned on a first surface of the inserter positioning section of the flexible circuit flat cable, and then the metal member is fit over the plastic member. A detachment and displacement protection structure is provided on the inserter positioning section to constrain the inserter from displacing and detaching in a flat cable extension direction due to being acted upon by an external force when the inserter is positioned on the inserter positioning section.

Classes IPC  ?

• H01R 12/24 -

Abrégé

Disclosed is a structure of electromagnetic wave resistant connector for flexible flat cable. A flexible flat cable defines an insertion device mounting section to which an insertion device is mounted. The insertion device includes a metal member that is at least partly formed of a metal material. The flexible flat cable forms thereon conductive traces on which an insulation layer is provided. The insulation layer has a surface, which forms, in at least a portion thereof, a conductive shielding layer. The conductive shielding layer extends to the insertion device mounting section, so that when the insertion device is mounted to the insertion device mounting section, electrical connection is formed between the metal member of the insertion device and the conductive shielding layer.

Classes IPC  ?

• H01R 12/24 -

Abrégé

Disclosed is a structure for precision control of electrical impedance of signal transmission circuit board. A substrate forms thereon a plurality of first signal transmission lines, and a first covering insulation layer is formed on a first surface of the substrate to cover a surface of each first signal transmission lines and each spacing section formed between adjacent first signal transmission lines. Each first signal transmission lines can transmit a differential mode signal or a common mode signal. At least one first flattening insulation layer is formed between a surface of the first covering insulation layer and a first conductive shielding layer so that the first flattening insulation layer fills up the height difference between the surface of each first signal transmission line and the spacing section associated with each first signal transmission line to thereby ensure a consistent distance between the signal transmission lines and the conductive shielding layer for realizing precision control of electrical impedance of the signal transmission circuit board.

Classes IPC  ?

• H03H 7/38 - Réseaux d'adaptation d'impédance
• H05K 1/00 - Circuits imprimés

Produits et services

touch panels; semiconductor chips; semiconductor carriers; interface cards for data processing equipment in the form of printed circuits; microcircuits; integrated circuit sockets; printed circuit boards; electric connectors; terminal plates; bus bars.

Abrégé

A bundled flexible circuit cable with water resistant structure is provided, in which a flexible substrate forms a cluster section having a lap section. In the lap section, a plurality of flat cable components that collectively form the cluster section is arranged to stack by substantially paralleling each other and corresponding up and down and is bonded and positioned by being applied with an adhesive material. The flat cable components are enclosed by a water resistant component at the lap section, whereby water, liquids, and contaminants are prevented from moving through gaps present in the bundled flexible substrate to get into the enclosure of an electronic device so as to realize protection against water, humidity, and dust. A tubular member or a wrapping member is further provided to fit over a section of the cluster section other than the lap section in order to facilitate extension through a holed mechanism device, such as a hinge, and to improve resistance against flexing and bending. The adhesive material can be a material containing conductive particles therein. Further, the substrate of the flexible circuit cable can be of such a design that a shielding layer is included and in electrical connection with a grounding line, whereby the shielding layer enclosing each of the lapped flat cable components in the water resistant structure is electrically connected to the water resistant component containing a conductive substance or the device enclosure to realize protection against electromagnetic interference.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés

Abrégé

A flat cable includes an enclosure sleeve that encloses a selected section of a cluster section of a flexible substrate. The enclosure sleeve has opposite ends respectively coupled to a first water resistant member and a second water resistant member. Each water resistant member includes a base forming a hollow channel and an insertion end extending from the base. The insertion end is fit to an inside or outside wall of an end of the enclosure sleeve. The first water resistant member, the second water resistant member, and the enclosure sleeve are combined together to form a water resistant section. When the flexible substrate is subjected to a stretching force in an extension direction or a torque applied in a rotation direction, the flexible substrate is allowed to undergo relative displacement with respect to the first water resistant member, the second water resistant member, and the enclosure sleeve.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés

Abrégé

A flexible printed circuit board with waterproof structure includes a flexible substrate that has a first surface having a first metal layer bonded thereon. The first metal layer forms a covered area and at least one mounting zone. A bonding strength enhancing structure is formed on the mounting zone. A first insulation layer is formed on the covered area of the upper surface of the first metal layer in such a way to expose the mounting zone. A water resistant member is bonded to the bonding strength enhancing structure and a second surface of the flexible substrate.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés

Abrégé

Disclosed is a double-side-conducting flexible-circuit flat cable with cluster section, which includes a flexible circuit substrate, a first electrical conduction path, a second electrical conduction path, a plurality of first and second conductive contact zones. The flexible circuit substrate has a first surface and a second surface and includes, in an extension direction, a first connection section, a cluster section, and at least one second connection section. The cluster section is composed of a plurality of clustered flat cable components formed by slitting in the extension direction. The first and second electrical conduction paths are respectively formed on the first and second surfaces of the flexible circuit substrate and each extends along one of the clustered flat cable components of the cluster section. The plurality of first and second conductive contact zones are respectively arranged on the first and second surfaces of the flexible circuit substrate at the first connection section. Each of the first and second conductive contact zones extends along one of the electrical conduction paths of the cluster section toward the second connection section.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés

Abrégé

A flexible flat circuit cable includes first and second flexible circuit substrates extending in an extension direction. The first flexible circuit substrate has a first surface forming a first conductor layer and an insulation layer, and the second flexible circuit substrate has a first surface forming a second conductor layer and an insulation layer. A bonding material layer is applied at a predetermined section between the first flexible circuit substrate and the second flexible circuit substrate to bond the first and second flexible circuit substrates together in such a way to maintain a predetermined spacing distance between the first and second flexible circuit substrate and forming a gapped segment at sections where no bonding material is applied. The first and second flexible circuit substrates form a cluster section within the gapped segment, which has opposite ends respectively forming first and second connected sections each of which forms a connection plug or is provided with a connector.

Classes IPC  ?

• H01B 7/08 - Câbles plats ou à ruban

Abrégé

Provided is a circuit board based connector with raised projection section, which is formed by applying substrate bonding and formation techniques to make a connector that features a raised projection section. The circuit substrate has an end that is provided with conductive terminals and an opposite end that is provided with flat cable connection terminals for connection with a flat cable. The circuit substrate has a first surface on which the projection section is formed. A shielding layer covers the projection section and a portion of the first surface. The circuit substrate has a second surface on which a second shielding layer is selectively formed. When the circuit substrate is inserted into an insertion space defined in a connection socket with the conductive terminals thereof, the shielding layer and the projection section of the circuit substrate are put into engagement with and thus retained by the insertion space of the connection socket to thereby fix within the connection socket.

Classes IPC  ?

• H01R 13/648 - Dispositions de protection par mise à la terre ou par blindage sur les dispositifs de couplage

Abrégé

A shielded insertion and connection structure for a flat cable connector includes a receiving housing and a hold-down member. The receiving housing forms a receiving compartment and two side walls formed at opposite ends of the receiving compartment. The hold-down member has opposite ends that respectively form pivot structures for pivotal coupling to the side walls and rotation between an open position and a holding position. The hold-down member is made of metal and the receiving housing is at least partly made of metal to form a conduction section, which is connected to a grounding terminal. When the hold-down member is at the open position and a circuit flat cable is inserted into the receiving compartment, the hold-down member is operated to depress and hold the circuit flat cable and the hold-down member is put in electrical connection with the grounding terminal through the conduction section.

Classes IPC  ?

• H01R 12/24 -

Abrégé

Provided is a flexible-circuit-board cable having a positioning structure. A connection zone is defined in a free end of the flexible-circuit-board cable and is provided with a plurality of conductive contacts. The connection zone has a first surface on which at least one projection section is formed and a second surface. A shielding layer overlaps the projection section and a portion of the first surface. The second surface of the connection zone is also bonded to a shielding layer. When the connection zone of the flexible-circuit-board cable is inserted into an insertion space defined in a connector, the first and second local zones of the connection zone formed by the shielding layers and the projection section are put into engagement with and thus positioned and retained by walls on opposite sides of the insertion space of the connector to thereby fix within the connector.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés

Abrégé

Disclosed is a flexible-circuit flat cable with cluster section, including at least one cluster section, at least one slip section, a first connection section, and a second connection section. The first connection section is set at a first end of the cluster section. The slip section has a first end connected to a second end of the cluster section and a second end at which the second connection section is set. The four sections are all provided with a plurality of signal transmission lines corresponding to and connecting each other. The first connection section and the second connection section are selectively provided with a connector or a plugging end. Further, the cluster section includes a cluster structure composed of a plurality of clustered flat cable components that are formed by slitting in a direction parallel to extension direction of a flexible circuit board to impose free and independent flexibility for bending to each clustered flat cable component.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés

Abrégé

Disclosed is a flat signal transmission cable with bundling structure, including at least one flexible circuit. The flexible circuit includes a plurality of clustered flat cable components that are formed by slitting in a direction parallel to extension direction of the flexible circuit to impose free and independent flexibility for bending to each clustered flat cable component. At least one bundling structure is formed on a lateral side edge of a predetermined clustered flat cable component of the cluster section of the flexible circuit. The bundling structure forms a fastening section. When the clustered flat cable components of the cluster section of the flexible circuit are stacked to form a bundled structure, the bundling structure bundles the plurality of clustered flat cable components and is secured by being fastened by the fastening section.

Classes IPC  ?

• H01R 12/24 -

Abrégé

A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.

Classes IPC  ?

• H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
• H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques

Produits et services

ELECTRIC WIRES; ELECTRIC CABLES; ANTENNAS; SEMICONDUCTOR CARRIERS; CIRCUIT BOARDS; PRINTED CIRCUIT BOARDS; ELECTRIC CONNECTORS; TERMINAL PLATES; BUS BARS; CABLE CONNECTORS

Produits et services

ELECTRIC WIRES; ELECTRIC CABLES; ANTENNAS; CHIP CARRIERS, NAMELY, SEMICONDUCTOR CHIP HOUSINGS; CIRCUIT BOARDS; PRINTED CIRCUIT BOARDS; ELECTRIC CONNECTORS; PARTS FOR ELECTRICAL FITTINGS, NAMELY, TERMINAL PLATES; INSERTS FOR MODULE CARRIERS, NAMELY, BUS BARS; CABLE CONNECTORS

Produits et services

TOUCH PANELS; SEMICONDUCTOR CHIPS; CHIP CARRIERS, NAMELY, SEMICONDUCTOR CHIP HOUSINGS; INTERFACE CARDS FOR DATA PROCESSING EQUIPMENT IN THE FORM OF PRINTED CIRCUITS; MICROCIRCUITS; INTEGRATED CIRCUIT SOCKETS; PRINTED CIRCUIT BOARDS; ELECTRIC CONNECTORS; PARTS FOR ELECTRICAL FITTINGS, NAMELY, TERMINAL PLATES; INSERTS FOR MODULE CARRIERS, NAMELY, BUS BARS

Abrégé

A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.

Classes IPC  ?

• H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
• H01L 23/12 - Supports, p.ex. substrats isolants non amovibles

Abrégé

A signal transmission cable with adaptive contact pin reference structure includes a first cable having a connecting edge; a second cable having a connecting edge; a component lay-out section having a first lateral edge adjacent to the connecting edge of the first cable, and a second lateral edge; and an overlapping section having an inner lateral edge adjacent to the second lateral edge of said component lay-out section with a folding line formed between them, and an outer lateral edge adjacent to the connecting edge of the second cable with another folding line formed between them. Signal transmission lines included in the component lay-out section and the first cable are correspondingly connected with one another, and signal transmission lines included in the overlapping section are correspondingly connected to those included in the second cable and the component lay-out section.

Classes IPC  ?

• H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p.ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires géné; Dispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes; Bornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes

Abrégé

A foldable signal transmission cable assembly includes parallelly extended first and second cables, which are connected at opposite first and second ends by transverse first and second connecting sections, respectively, and have first and second connectors provided at the first end of the first cable and at the second end of the first or the second cable, respectively, to electrically connect to signal lines provided on the first and second cables and the first and second connecting sections. The first and second connecting sections may be bent along folding lines provided at middle points thereof, so as to turn and locate the second cable below the first cable. The first and second cables may be formed from a single-side, a double-side, a multisided, or a multilayer substrate, and may include a cluster section.

Classes IPC  ?

• H01B 7/08 - Câbles plats ou à ruban

Abrégé

A signal transmission cable is adapted to pass through a hinge assembly and includes a flexible circuit substrate. A first connection section is formed at a first end of the flexible circuit substrate and has a plurality of signal transmission lines provided thereon. A second connection section is formed at a second end of the flexible circuit substrate and has a plurality of signal transmission lines provided thereon. The cable further has a cluster section formed on the flexible circuit substrate between the first and the second connection sections, and has a plurality of signal transmission lines provided thereon to respectively connect at two ends to the signal transmission lines on the first and the second connection sections. The cluster section includes a plurality of clustered flat cables formed by cutting the flexible circuit substrate along a plurality of parallel cutting lines extended in the lengthwise direction of the flexible circuit substrate.

Classes IPC  ?

• H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme