A photonic integrated circuit including bond pads, RF components, a first layer stack having a doped epitaxial semiconductor layer, a second layer stack that is associated with the first layer stack, and a first set of elongated tracks of electrically conductive material that are associated with the second layer stack and in use of the photonic integrated circuit can carry an RF signal between the bond pads and the RF components. The second layer stack includes an electrical ground shield that is sandwiched between a first dielectric layer and a second dielectric layer. In use of the photonic integrated circuit, the electrical ground shield minimizes or prevents overlap between an electric field caused by the RF signal and the doped epitaxial semiconductor layer. An opto-electronic system including the photonic integrated circuit.
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
2.
SEMICONDUCTOR TUNABLE RING LASER, PHOTONIC INTEGRATED CIRCUIT AND OPTO-ELECTRONIC SYSTEM COMPRISING THE SAME
A semiconductor tunable ring laser including a laser cavity having a closed loop optical path, and an optical filter that is arranged within the laser cavity and configured as a transmission-type optical filter if the semiconductor tunable ring laser is in use. The optical filter includes a first MZI-based tunable frequency filter section including a first 2×2 MMI output splitter having an x/(100−x) split ratio with x being unequal to 50. The first 2×2 MMI output splitter provides the laser cavity with an optical monitoring port that is presented with a first non-zero fraction, T1, of optical radiation that is sufficient for wavelength locking and/or power monitoring outside the laser cavity. A PIC including the semiconductor tunable ring laser, and to an opto-electronic system comprising such a PIC.
A semiconductor tunable ring laser including a laser cavity having a closed loop optical path, and an optical filter that is arranged within the laser cavity. The optical filter includes a first MZI-based tunable frequency filter section including a 1×3 MMI input splitter providing a first non-zero fraction, T1, of optical radiation at a first optical output port of the 1×3 MMI for wavelength locking and/or power monitoring purposes outside of the laser cavity, a second fraction, T2=(1−T1)/2, of optical radiation at a second optical output port of the 1×3 MMI, and a third fraction, T3=(1−T1)/2, of optical radiation at a third optical output port of the 1×3 MMI. A PIC including the semiconductor tunable ring laser, and to an opto-electronic system including such a PIC.
A monitor photodiode for absorbing at most 5% of optical radiation to which the monitor photodiode is exposed if the monitor photodiode is in use. The monitor photodiode includes a layer stack having a semiconductor-based core layer, a semiconductor-based absorption layer, and a semiconductor-based cladding layer that is provided with an elevated elongated portion. The semiconductor-based absorption layer and the elevated elongated portion are arranged relative to each other in such a way that an overlap between a mode field of the optical radiation that is present in the semiconductor-based core layer if the monitor photodiode is in use and the semiconductor-based absorption layer results in an optical absorption of at most 5%. A PIC having a monitor photodiode, an opto-electronic system including such a PIC, and a method for fabricating the monitor photodiode.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H10F 30/221 - Dispositifs individuels à semi-conducteurs sensibles au rayonnement dans lesquels le rayonnement commande le flux de courant à travers les dispositifs, p. ex. photodétecteurs les dispositifs ayant des barrières de potentiel, p. ex. phototransistors les dispositifs étant sensibles au rayonnement infrarouge, visible ou ultraviolet les dispositifs ayant une seule barrière de potentiel, p. ex. photodiodes la barrière de potentiel étant une homojunction PN
H10F 71/00 - Fabrication ou traitement des dispositifs couverts par la présente sous-classe
5.
REFLECTIVE OPTICAL COUPLING AND BEAM PROFILE SHAPING UNIT, OPTO-ELECTRONIC ASSEMBLY AND OPTO-ELECTRONIC SYSTEM COMPRISING THE SAME
A reflective optical coupling and beam profile shaping unit including an optically transparent body having an outer surface that is provided with a first optical interface, a second optical interface, a first free form reflective area having a first magnification, and a second free form reflective area having a second magnification. Because the first magnification is different from the second magnification, an asymmetric first optical beam profile entering the optically transparent body via the first optical interface can be shaped into a symmetric second optical beam profile exiting the optically transparent body via the second optical interface. Similarly, a symmetric first optical beam profile can be shaped into an asymmetric second optical beam profile. An opto-electronic assembly including the unit, and to an opto-electronic system including the assembly.
A PIC that includes an InP-based polarization rotator having an improved design that enables at least one of an improved performance and an improved yield of the PIC due to at least one of reduced variations in critical dimensions of the InP-based polarization rotator and reduced overlay errors during fabrication of the InP-based polarization rotator of the PIC. An opto-electronic system including said PIC. A method of fabricating the PIC that includes the InP-based polarization rotator having the improved design.
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
7.
Photonic integrated circuit and opto-electronic system comprising the same
A PIC having at least three fiber-to-chip coupling locations, an InP-based polarization handling unit, at least two optical splitter-combiners, at least two optical receivers, and a plurality of semiconductor-based optical waveguides. The plurality of semiconductor-based optical waveguides are configured and arranged to optically connect a first fiber-to-chip coupling location with a first optical receiver via a first optical splitter-combiner, a second fiber-to-chip coupling location with the at least two optical receivers via the InP-based polarization handling unit and the at least two optical splitter-combiners, and a third fiber-to-chip coupling location with a second optical receiver via a second optical splitter-combiner. An opto-electronic system including said PIC.
A PIC including a plurality of optically interconnectable functional photonic blocks and a reconfigurable optical connection arrangement having a plurality of semiconductor-based optical waveguides and a plurality of controllable optical switches, at least one controllable optical switch being configurable to be in a first state allowing optical transmission or a second state preventing optical transmission. Depending on the respective first or second state of the at least one controllable optical switch, the optical connection arrangement is configured to enable at least a first set of semiconductor-based optical waveguides to provide at least one optical connection between at least two functional photonic blocks and/or a first optical access path to at least one functional photonic block. An opto-electronic system including the PIC and to a method of improved determination of an overall performance of the PIC.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
An opto-electronic system including a PIC that includes a semiconductor-based tunable laser source that can achieve single-mode lasing thereby emitting optical radiation having a predefined linewidth at a predefined operating wavelength. The PIC also includes an optical measurement unit that can receive the optical radiation emitted by said laser source, and provide a signal representative for the received optical radiation to a control unit of the opto-electronic system that is operatively connected with said laser source and the optical measurement unit. The opto-electronic system enables omitting external optical measurement equipment thereby enabling a faster and cheaper way of locking of the predefined operating wavelength of said laser and achieving the predefined linewidth. A method of improved tuning of a semiconductor-based tunable laser source of an opto-electronic system.
A semiconductor ring laser including a closed loop laser cavity and an optical gain device that is optically interconnected with the closed loop laser cavity. The optical gain device includes a first optical gain segment and a second optical gain segment. The first optical gain segment and the second optical gain segment being non-identical, optically interconnected with each other, and electrically isolated from each other. A PIC including a semiconductor ring laser and to an opto-electronic system that includes a PIC. The opto-electronic system can be one of a transmitter, a receiver, a transceiver, a coherent transmitter, a coherent receiver and a coherent transceiver. The opto-electronic system can for example, but not exclusively, be used for telecommunication applications, LIDAR or sensor applications.
A photonic integrated circuit including an InP-based substrate that is provided with a first InP-based optical waveguide and a neighboring second InP-based optical waveguide, a dielectric planarization layer that is arranged at least between the first optical waveguide and the second optical waveguide. At least between the first optical waveguide and the neighboring second optical waveguide, the dielectric planarization layer is provided with a recess that is arranged to reduce or prevent optical interaction between the first optical waveguide and the second optical waveguide via the dielectric planarization layer. At the location of the recess, the dielectric planarization layer has a first sidewall that is arranged sloped towards the first optical waveguide, and a second sidewall that is arranged sloped towards the second optical waveguide. An opto-electronic system including said PIC.
A monolithic InP-based PIC having a first photonic assembly that has a first optical splitter-combiner unit having a first end part that is optically connected with a first optical waveguide and a second end part that is optically connected with a first main photonic circuit and a first auxiliary photonic circuit. The first auxiliary photonic circuit has a first laser unit, and a first SOA. The first SOA is configurable to be in a first operational state in which the first SOA allows optical communication between the first laser unit and the first optical splitter-combiner unit, or a second operational state in which the first SOA prevents optical communication between the first laser unit and the first optical splitter-combiner unit. An opto-electronic system including the PIC.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01S 5/40 - Agencement de plusieurs lasers à semi-conducteurs, non prévu dans les groupes
H01S 5/10 - Structure ou forme du résonateur optique
H01S 5/323 - Structure ou forme de la région activeMatériaux pour la région active comprenant des jonctions PN, p. ex. hétérostructures ou doubles hétérostructures dans des composés AIIIBV, p. ex. laser AlGaAs
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
An environmentally protected PIC, including an InP-based substrate having a first surface that is at least partially provided with an InP-based optical waveguide, and a dielectric protective layer arranged to cover at least the first surface of the InP-based substrate and the InP-based optical waveguide. The dielectric protective layer is configured to protect said PIC from environmental contaminants, to enable confinement of optical radiation in the dielectric protective layer in at least one direction that is transverse to a direction of propagation of the optical radiation, and to allow exchange of the optical radiation between the InP-based optical waveguide and the dielectric protective layer. An opto-electronic system including PIC.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
An environmentally protected photonic integrated circuit, PIC, including an indium phosphide-based substrate that is at least partially covered with an epitaxial semiconductor layer. The InP-based substrate and/or the epitaxial layer are covered with a layer stack comprising different non-semiconductor layers. At least a first layer of the layer stack is provided with a through-hole that is arranged at a predetermined location. The InP-based substrate or epitaxial layer being accessible via the through-hole. The PIC including a dielectric protective layer covering the layer stack thereby provides a mechanical coupling structure. The protective layer is configured to protect the PIC from environmental contaminants. An opto-electronic system including the PIC.
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Photonic components and systems for use in optical
communication networks; electronic and optical communication
instruments and components; optical apparatus, instruments
and devices for measuring, interrogating and processing
optical signals; systems relying on Dense Wavelength
Division Multiplexing (DWDM) optical System-on-Chip
technology; indium phosphide-based photonic components;
optical circuits; photonic integrated circuits; optical
circuits with electronic circuits; opto-electronic
integrated circuits; hybrid integrated opto-electronic
circuits; monolithically integrated opto-electronic
circuits; chips with photonic components; optical
semiconductor chips; optical receivers; optical
transceivers; optical transmitters; optical modulators;
fiber-optic components; lasers for non-medical purposes;
tunable lasers for non-medical purposes; optical detectors;
high-speed optical detectors; optical sensors; optical
monitoring units; channel monitoring units; single or
multi-stage Mach-Zehnder Modulators (MZM/MZI); optical
waveguide devices; arrayed waveguide gratings (AWG); AWG
multiplexers; AWG demultiplexers; optical amplifiers;
optical multiplexers; optical demultiplexers; optical gain
equalizers; optical attenuators; optical switches; optical
routers; optical power taps; optical splitters; fiber-optic
couplers; parts and fittings for all of the aforesaid goods. Manufacturing of photonic integrated components, circuits
and systems for use in optical communication networks;
manufacturing of electronic and optical communication
instruments and components; manufacturing of optical
apparatus, instruments and devices for measuring,
interrogating and processing optical signals. Consulting in the field of engineering; design, development
and engineering of photonic integrated components, circuits
and systems for use in optical communication networks;
design, development and engineering of electronic and
optical communication instruments and components; design,
development and engineering of optical apparatus,
instruments and devices for measuring, interrogating and
processing optical signals; design and development services
for packaging; engineering services in the field of
opto-electronic systems, opto-electronic components, and
packaging; product development and engineering services for
others in the field of photonic integrated components,
circuits and systems; scientific research; physics research;
fiber-optic engineering research; research and development
services for others in the field of photonics.
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Photonic components and systems for use in optical
communication networks; electronic and optical communication
instruments and components; optical apparatus, instruments
and devices for measuring, interrogating and processing
optical signals; systems relying on Dense Wavelength
Division Multiplexing (DWDM) optical System-on-Chip
technology; indium phosphide-based photonic components;
optical circuits; photonic integrated circuits; optical
circuits with electronic circuits; opto-electronic
integrated circuits; hybrid integrated opto-electronic
circuits; monolithically integrated opto-electronic
circuits; chips with photonic components; optical
semiconductor chips; optical receivers; optical
transceivers; optical transmitters; optical modulators;
fiber-optic components; lasers for non-medical purposes;
tunable lasers for non-medical purposes; optical detectors;
high-speed optical detectors; optical sensors; optical
monitoring units; channel monitoring units; single or
multi-stage Mach-Zehnder Modulators (MZM/MZI); optical
waveguide devices; arrayed waveguide gratings (AWG); AWG
multiplexers; AWG demultiplexers; optical amplifiers;
optical multiplexers; optical demultiplexers; optical gain
equalizers; optical attenuators; optical switches; optical
routers; optical power taps; optical splitters; fiber-optic
couplers; parts and fittings for all of the aforesaid goods. Manufacturing of photonic integrated components, circuits
and systems for use in optical communication networks;
manufacturing of electronic and optical communication
instruments and components; manufacturing of optical
apparatus, instruments and devices for measuring,
interrogating and processing optical signals. Consulting in the field of engineering; design, development
and engineering of photonic integrated components, circuits
and systems for use in optical communication networks;
design, development and engineering of electronic and
optical communication instruments and components; design,
development and engineering of optical apparatus,
instruments and devices for measuring, interrogating and
processing optical signals; design and development services
for packaging; engineering services in the field of
opto-electronic systems, opto-electronic components, and
packaging; product development and engineering services for
others in the field of photonic integrated components,
circuits and systems; scientific research; physics research;
fiber-optic engineering research; research and development
services for others in the field of photonics.
17.
Photonic integrated circuit having improved electrical isolation between n-type contacts
A photonic integrated circuit including first and second opto-electronic devices that are fabricated on a semiconductor wafer having an epitaxial layer stack including an n-type indium phosphide-based contact layer that is provided with at least one selectively p-type doped tubular-shaped region for providing an electrical barrier between respective n-type contact regions of the first and second opto-electronic devices that are optically interconnected by a passive optical waveguide that is fabricated in a non-intentionally doped waveguide layer including indium gallium arsenide phosphide, the non-intentionally doped waveguide layer being arranged on top of the n-type contact layer, wherein a first portion of the at least one selectively p-type doped tubular-shaped region is arranged underneath the passive optical waveguide between the first and second opto-electronic devices. An opto-electronic system including the photonic integrated circuit.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Photonic components and systems for use in optical communication networks in the nature of optical transceivers, and parts and fittings for all the aforesaid goods; electronic and optical communication instruments and components, namely, optical transceivers, and parts and fittings for all the aforesaid goods; optical apparatus, instruments and devices for measuring, interrogating and processing optical signals, namely, optical signal processors, and parts and fittings for all the aforesaid goods; systems, consisting of digital transceivers, relying on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology, and parts and fittings for all the aforesaid goods; indium phosphide-based photonic integrated circuits, and parts and fittings for all the aforesaid goods; optical circuits, and parts and fittings for all the aforesaid goods; photonic integrated circuits, and parts and fittings for all the aforesaid goods; optical circuits with electronic circuits, and parts and fittings for all the aforesaid goods; opto-electronic integrated circuits, and parts and fittings for all the aforesaid goods; hybrid integrated opto-electronic circuits, and parts and fittings for all the aforesaid goods; monolithically integrated opto-electronic circuits, and parts and fittings for all the aforesaid goods; chips, namely semiconductor chips, with photonic components, and parts and fittings for all the aforesaid goods; optical semiconductor chips, and parts and fittings for all the aforesaid goods; optical receivers, and parts and fittings for all the aforesaid goods; optical transceivers, and parts and fittings for all the aforesaid goods; optical transmitters, and parts and fittings for all the aforesaid goods; optical modulators in the nature of optical fibers, and parts and fittings for all the aforesaid goods; lasers for use as transceiver components, and parts and fittings for all the aforesaid goods; tunable lasers for use as transceiver components, and parts and fittings for all the aforesaid goods; optical detectors, and parts and fittings for all the aforesaid goods; high-speed optical detectors, and parts and fittings for all the aforesaid goods; optical sensors, and parts and fittings for all the aforesaid goods; optical monitoring units, namely electronic devices for monitoring optical parameters, and parts and fittings for all the aforesaid goods; channel monitoring units, namely, wireless controllers to monitor optical channels, and parts and fittings for all the aforesaid goods; single and multi-stage Mach-Zehnder Modulators (MZM/MZI) for modulating the amplitude of an optical wave, and parts and fittings for all the aforesaid goods; optical waveguide devices, and parts and fittings for all the aforesaid goods; arrayed waveguide gratings (AWG); AWG multiplexers, and parts and fittings for all the aforesaid goods; AWG demultiplexers, and parts and fittings for all the aforesaid goods; optical amplifiers, and parts and fittings for all the aforesaid goods; optical multiplexers, and parts and fittings for all the aforesaid goods; optical demultiplexers, and parts and fittings for all the aforesaid goods; optical gain equalizers, and parts and fittings for all the aforesaid goods; optical attenuators, and parts and fittings for all the aforesaid goods; optical switches, and parts and fittings for all the aforesaid goods; optical network routers, and parts and fittings for all the aforesaid goods; optical power tap units for use as transceiver components, and parts and fittings for all the aforesaid goods; optical splitters for use as transceiver components, and parts and fittings for all the aforesaid goods; fiber-optic couplers, and parts and fittings for all the aforesaid goods. (1) Manufacture of photonic integrated components, circuits and communications systems, to the order and specification of others, for use in optical communication networks; manufacture of electronic and optical communication instruments and components, to the order and specification of others, for use in the fields of computer networks and mobile networking; manufacture of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals, to the order and specification of others.
(2) Consulting in the field of photonics hardware engineering; design, development and engineering of photonic integrated components, circuits and communications systems for use in optical communication networks; design, development and engineering of electronic and optical communication instruments and components in the fields of computer networking and mobile networking; design, development and engineering of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; design and development services for packaging of photonic components for optical communication; engineering services in the field of opto-electronic systems, opto-electronic components, and packaging photonic components for optical communication; product development and engineering services for others in the field of photonic integrated components, circuits and communications systems; scientific research in the field of photonics hardware; physics research; fiber-optic engineering research; research and development services for others in the field of photonics.
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Photonic components and systems for use in optical communication networks, namely, optical transceivers; electronic and optical communication instruments and components, namely, optical transceivers; optical apparatus, instruments and devices for measuring, interrogating and processing optical signals, namely, optical inspection apparatus and optical signal processors; systems relying on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology, namely, digital transceivers; indium phosphide-based photonic components, namely, integrated circuits; optical circuits, namely, integrated circuits; photonic integrated circuits; optical circuits with electronic circuits, namely, integrated circuits; opto-electronic integrated circuits; hybrid integrated opto-electronic circuits; monolithically integrated opto-electronic circuits; chips with photonic components, namely, semiconductors chips; optical semiconductor chips, namely, semiconductors chips; optical receivers; optical transceivers; optical transmitters; optical modulators in the nature of optical fibers; fiber-optic components, namely, optical components in the nature of optical transmitters, optical receivers, optical data links, and optical fibers; lasers for non-medical purposes; tunable lasers for non-medical purposes; optical signal detectors; high-speed optical signal detectors; optical signal sensors; optical monitoring units, namely, electronic devices for monitoring optical parameters; channel monitoring units, namely, wireless controllers to monitor optical channels; single or multi-stage Mach-Zehnder Modulators (MZM/MZI) in the nature of an optical device for controlling the amplitude of an optical wave; optical waveguide devices; arrayed waveguide gratings (AWG) in the nature of optical multiplexers; AWG multiplexers; AWG demultiplexers; optical semiconductor amplifiers; optical multiplexers; optical demultiplexers; optical gain equalizers, namely, equalizers for use in optical networks being optical apparatus; optical attenuators for attenuating optical signals in the nature of waveguides; optical switches in the nature of an optical device that switches optical signals from one channel to another; optical network routers; electric optical power devices, namely, taps; optical signal splitters for optical apparatus; fiber-optic couplers; parts and fittings for all of the aforesaid goods Manufacturing services for others of photonic integrated components, circuits and systems for use in optical communication networks; manufacturing services for others of electronic and optical communication instruments and components; manufacturing services for others of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals Consulting in the field of engineering; design, development and engineering of photonic integrated components, circuits and systems for use in optical communication networks; design, development and engineering of electronic and optical communication instruments and components; design, development and engineering of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; design and development services for packaging; engineering services in the field of opto-electronic systems, opto-electronic components, and packaging; product development and engineering services for others in the field of photonic integrated components, circuits and systems; scientific research; physics research; fiber-optic engineering research; research and development services for others in the field of photonics
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Photonic components and systems for use in optical communication networks, namely, optical transceivers; electronic and optical communication instruments and components, namely, optical transceivers; optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; systems relying on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology, namely, digital transceivers; indium phosphide-based photonic components, namely, integrated circuits; optical circuits, namely, integrated circuits; photonic integrated circuits; optical circuits with electronic circuits, namely, integrated circuits; opto-electronic integrated circuits; hybrid integrated opto-electronic circuits; monolithically integrated opto-electronic circuits; chips with photonic components, namely, semiconductors chips; optical semiconductor chips, namely, semiconductors chips; optical receivers; optical transceivers; optical transmitters; optical modulators; fiber-optic components, namely, fiber-optic transceivers; lasers for non-medical purposes; tunable lasers for non-medical purposes; optical detectors; high-speed optical detectors; optical sensors; optical monitoring units, namely, electronic devices for monitoring optical parameters; channel monitoring units, namely, wireless controllers to monitor optical channels; single or multi-stage Mach-Zehnder Modulators (MZM/MZI) in the nature of an optical device for controlling the amplitude of an optical wave; optical waveguide devices; arrayed waveguide gratings (AWG) in the nature of optical multiplexers; AWG multiplexers; AWG demultiplexers; optical semiconductor amplifiers; optical multiplexers; optical demultiplexers; optical gain equalizers, namely, equalizers for use in optical networks; optical attenuators for attenuating optical signals; optical switches in the nature of an optical device that switches optical signals from one channel to another; optical network routers; electric optical power devices, namely, taps; optical signal splitters for optical apparatus; fiber-optic couplers; structural parts and fittings for all of the aforesaid goods Manufacturing services for others of photonic integrated components, circuits and systems for use in optical communication networks; manufacturing services for others of electronic and optical communication instruments and components; manufacturing services for others of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals Consulting in the field of engineering; design, development and engineering of photonic integrated components, circuits and systems for use in optical communication networks; design, development and engineering of electronic and optical communication instruments and components; design, development and engineering of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; design and development services for packaging; engineering services in the field of opto-electronic systems, opto-electronic components, and packaging; product development and engineering services for others in the field of photonic integrated components, circuits and systems; scientific research; physics research; fiber-optic engineering research; research and development services for others in the field of photonics
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Photonic components and systems for use in optical communication networks in the nature of optical transceivers, and parts and fittings for all the aforesaid goods; electronic and optical communication instruments and components, namely, optical transceivers, and parts and fittings for all the aforesaid goods; optical apparatus, instruments and devices for measuring, interrogating and processing optical signals, namely, optical signal processors, and parts and fittings for all the aforesaid goods; systems, consisting of digital transceivers, relying on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology, and parts and fittings for all the aforesaid goods; indium phosphide-based photonic integrated circuits, and parts and fittings for all the aforesaid goods; optical circuits, and parts and fittings for all the aforesaid goods; photonic integrated circuits, and parts and fittings for all the aforesaid goods; optical circuits with electronic circuits, and parts and fittings for all the aforesaid goods; opto-electronic integrated circuits, and parts and fittings for all the aforesaid goods; hybrid integrated opto-electronic circuits, and parts and fittings for all the aforesaid goods; monolithically integrated opto-electronic circuits, and parts and fittings for all the aforesaid goods; chips, namely semiconductor chips, with photonic components, and parts and fittings for all the aforesaid goods; optical semiconductor chips, and parts and fittings for all the aforesaid goods; optical receivers, and parts and fittings for all the aforesaid goods; optical transceivers, and parts and fittings for all the aforesaid goods; optical transmitters, and parts and fittings for all the aforesaid goods; optical modulators in the nature of optical fibers, and parts and fittings for all the aforesaid goods; lasers for use as transceiver components, and parts and fittings for all the aforesaid goods; tunable lasers for use as transceiver components, and parts and fittings for all the aforesaid goods; optical detectors, and parts and fittings for all the aforesaid goods; high-speed optical detectors, and parts and fittings for all the aforesaid goods; optical sensors, and parts and fittings for all the aforesaid goods; optical monitoring units, namely electronic devices for monitoring optical parameters, and parts and fittings for all the aforesaid goods; channel monitoring units, namely, wireless controllers to monitor optical channels, and parts and fittings for all the aforesaid goods; single and multi-stage Mach-Zehnder Modulators (MZM/MZI) for modulating the amplitude of an optical wave, and parts and fittings for all the aforesaid goods; optical waveguide devices, and parts and fittings for all the aforesaid goods; arrayed waveguide gratings (AWG); AWG multiplexers, and parts and fittings for all the aforesaid goods; AWG demultiplexers, and parts and fittings for all the aforesaid goods; optical amplifiers, and parts and fittings for all the aforesaid goods; optical multiplexers, and parts and fittings for all the aforesaid goods; optical demultiplexers, and parts and fittings for all the aforesaid goods; optical gain equalizers, and parts and fittings for all the aforesaid goods; optical attenuators, and parts and fittings for all the aforesaid goods; optical switches, and parts and fittings for all the aforesaid goods; optical network routers, and parts and fittings for all the aforesaid goods; optical power tap units for use as transceiver components, and parts and fittings for all the aforesaid goods; optical splitters for use as transceiver components, and parts and fittings for all the aforesaid goods; fiber-optic couplers, and parts and fittings for all the aforesaid goods. (1) Manufacture of photonic integrated components, circuits and communications systems, to the order and specification of others, for use in optical communication networks; manufacture of electronic and optical communication instruments and components, to the order and specification of others, for use in the fields of computer networks and mobile networking; manufacture of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals, to the order and specification of others.
(2) Consulting in the field of photonics hardware engineering; design, development and engineering of photonic integrated components, circuits and communications systems for use in optical communication networks; design, development and engineering of electronic and optical communication instruments and components in the fields of computer networking and mobile networking; design, development and engineering of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; design and development services for packaging of photonic components for optical communication; engineering services in the field of opto-electronic systems, opto-electronic components, and packaging photonic components for optical communication; product development and engineering services for others in the field of photonic integrated components, circuits and communications systems; scientific research in the field of photonics hardware; physics research; fiber-optic engineering research; research and development services for others in the field of photonics.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Photonic components and systems for use in optical communication networks; electronic and optical communication instruments and components; optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; systems relying on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology; indium phosphide-based photonic components; optical circuits; photonic integrated circuits; optical circuits with electronic circuits; opto-electronic integrated circuits; hybrid integrated opto-electronic circuits; monolithically integrated opto-electronic circuits; chips with photonic components; optical semiconductor chips; optical receivers; optical transceivers; optical transmitters; optical modulators; fiber-optic components; laser sources; tunable laser sources; optical detectors; high-speed optical detectors; optical sensors; optical monitoring units; channel monitoring units; single or multi-stage Mach-Zehnder Modulators (MZM/MZI); optical waveguide devices; arrayed waveguide gratings (AWG); AWG multiplexers; AWG demultiplexers; optical amplifiers; optical multiplexers; optical demultiplexers; optical gain equalizers; optical attenuators; optical switches; optical routers; optical power taps; optical splitters; fiber-optic couplers; parts and fittings for all of the aforesaid goods. Consulting in the field of engineering; design, development, engineering and manufacturing of photonic integrated components, circuits and systems for use in optical communication networks; design, development, engineering and manufacturing of electronic and optical communication instruments and components; design, development, engineering and manufacturing of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; design and development services for packaging; engineering services in the field of opto-electronic systems, opto-electronic components, and packaging; product development and engineering services for others in the field of photonic integrated components, circuits and systems; scientific research; physics research; fiber-optic engineering research; research and development services for others in the field of photonics.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Photonic components and systems for use in optical communication networks; electronic and optical communication instruments and components; optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; systems relying on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology; indium phosphide-based photonic components; optical circuits; photonic integrated circuits; optical circuits with electronic circuits; opto-electronic integrated circuits; hybrid integrated opto-electronic circuits; monolithically integrated opto-electronic circuits; chips with photonic components; optical semiconductor chips; optical receivers; optical transceivers; optical transmitters; optical modulators; fiber-optic components; laser sources; tunable laser sources; optical detectors; high-speed optical detectors; optical sensors; optical monitoring units; channel monitoring units; single or multi-stage Mach-Zehnder Modulators (MZM/MZI); optical waveguide devices; arrayed waveguide gratings (AWG); AWG multiplexers; AWG demultiplexers; optical amplifiers; optical multiplexers; optical demultiplexers; optical gain equalizers; optical attenuators; optical switches; optical routers; optical power taps; optical splitters; fiber-optic couplers; parts and fittings for all of the aforesaid goods. Consulting in the field of engineering; design, development, engineering and manufacturing of photonic integrated components, circuits and systems for use in optical communication networks; design, development, engineering and manufacturing of electronic and optical communication instruments and components; design, development, engineering and manufacturing of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; design and development services for packaging; engineering services in the field of opto-electronic systems, opto-electronic components, and packaging; product development and engineering services for others in the field of photonic integrated components, circuits and systems; scientific research; physics research; fiber-optic engineering research; research and development services for others in the field of photonics.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Photonic components and systems for use in optical communication networks; electronic and optical communication instruments and components; optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; systems relying on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology; indium phosphide-based photonic components; optical circuits; photonic integrated circuits; optical circuits with electronic circuits; opto-electronic integrated circuits; hybrid integrated opto-electronic circuits; monolithically integrated opto-electronic circuits; chips with photonic components; optical semiconductor chips; optical receivers; optical transceivers; optical transmitters; optical modulators; fiber-optic components; laser sources; tunable laser sources; optical detectors; high-speed optical detectors; optical sensors; optical monitoring units; channel monitoring units; single or multi-stage Mach-Zehnder Modulators (MZM/MZI); optical waveguide devices; arrayed waveguide gratings (AWG); AWG multiplexers; AWG demultiplexers; optical amplifiers; optical multiplexers; optical demultiplexers; optical gain equalizers; optical attenuators; optical switches; optical routers; optical power taps; optical splitters; fiber-optic couplers; parts and fittings for all of the aforesaid goods. Consulting in the field of engineering; design, development, engineering and manufacturing of photonic integrated components, circuits and systems for use in optical communication networks; design, development, engineering and manufacturing of electronic and optical communication instruments and components; design, development, engineering and manufacturing of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; design and development services for packaging; engineering services in the field of opto-electronic systems, opto-electronic components, and packaging; product development and engineering services for others in the field of photonic integrated components, circuits and systems; scientific research; physics research; fiber-optic engineering research; research and development services for others in the field of photonics.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Photonic components and systems for use in optical communication networks; electronic and optical communication instruments and components; optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; systems relying on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology; indium phosphide-based photonic components; optical circuits; photonic integrated circuits; optical circuits with electronic circuits; opto-electronic integrated circuits; hybrid integrated opto-electronic circuits; monolithically integrated opto-electronic circuits; chips with photonic components; optical semiconductor chips; optical receivers; optical transceivers; optical transmitters; optical modulators; fiber-optic components; laser sources; tunable laser sources; optical detectors; high-speed optical detectors; optical sensors; optical monitoring units; channel monitoring units; single or multi-stage Mach-Zehnder Modulators (MZM/MZI); optical waveguide devices; arrayed waveguide gratings (AWG); AWG multiplexers; AWG demultiplexers; optical amplifiers; optical multiplexers; optical demultiplexers; optical gain equalizers; optical attenuators; optical switches; optical routers; optical power taps; optical splitters; fiber-optic couplers; parts and fittings for all of the aforesaid goods. Consulting in the field of engineering; design, development, engineering and manufacturing of photonic integrated components, circuits and systems for use in optical communication networks; design, development, engineering and manufacturing of electronic and optical communication instruments and components; design, development, engineering and manufacturing of optical apparatus, instruments and devices for measuring, interrogating and processing optical signals; design and development services for packaging; engineering services in the field of opto-electronic systems, opto-electronic components, and packaging; product development and engineering services for others in the field of photonic integrated components, circuits and systems; scientific research; physics research; fiber-optic engineering research; research and development services for others in the field of photonics.
Disclosed is an optical subassembly (1) including a carrier substrate (2), a photonic integrated circuit (3) (PIC) including a first optical waveguide (4) having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system (5) including a second optical waveguide (6) having a second longitudinal central axis, a component (7) for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material (8, 9) being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than 10 μm. Also disclosed is an optical system (12) including such optical subassembly and a method of fabricating such optical subassembly.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
An optical subassembly (1) includes a photonic integrated circuit (2), an external optical system (4) and an optical interface (6) that is arranged between the PIC and the external optical system. The optical subassembly includes a third material (7) and a fourth material (8). The third material (7) at least partially fills the optical interface between the PIC and the external optical system in order to minimize contamination of any kind. The fourth material (8) being in contact at least with the third material for sealing at least the third material from ambient moisture. In this way a low-cost near-hermetic environmental protection barrier (7, 8) may be provided. An optical system (14) including the optical subassembly and a method of fabricating such an optical subassembly are also described.
An integrated photonic component (1) is provided with improved centering of an optical field image of a wavelength division multiplexing, WDM, optical output signal and a common output waveguide (8). In this way an efficient power coupling of the laser diodes of the integrated photonic component to the common output waveguide is achievable. Also provided is a photonic integrated circuit, PIC, for use in a WDM optical communication system, the PIC including the integrated photonic component. A method of improving centering of an optical field image of a WDM signal and a common output waveguide of at least one of the integrated photonic component and the PIC are also described.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H04J 14/02 - Systèmes multiplex à division de longueur d'onde
29.
Integrated photonic component and method of designing the same
An integrated photonic component (100) for polarization insensitive wavelength multiplexing includes an arrayed waveguide grating, AWG, (1) having a predetermined polarization splitting and a MZI-based polarization beam splitter (8) that is configured to compensate the predetermined polarization splitting of the AWG (1). The result is a fabrication tolerant integrated photonic component (100) that is operable over a wide number of limited bandwidth wavelength channels of a wavelength division multiplexing, WDM, system. A photonic integrated circuit, PIC, (200) for use in a WDM system is provided. The PIC (200) includes the integrated photonic component (100). A method of designing the integrated photonic component (100) is also described.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde
G02B 6/27 - Moyens de couplage optique avec des moyens de sélection et de réglage de la polarisation
a) and the conducting layer (7) at a position where the conducting layer (7) is accessible, to form an electrical connection between the substrate (1) and the membrane (51). A chip package (70) includes a housing (15) having at least one electrically conducting terminal, and an assembly (60) as mentioned. The flexible printed circuit membrane (51) is arranged for electrically connecting the substrate and the at least one terminal of the housing (15).
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
The invention relates to an optical subassembly (1) comprising a photonic integrated circuit (2), an external optical system (4) and an optical interface (6) that is arranged between the PIC and the external optical system. The optical subassembly comprises a third material (7) and a fourth material (8). The third material (7) at least partially fills the optical interface between the PIC and the external optical system in order to minimize contamination of any kind. The fourth material (8) being in contact at least with the third material for sealing at least the third material from ambient moisture. In this way a low-cost near-hermetic environmental protection barrier (7, 8) may be provided. The invention also relates to an optical system (14) comprising an optical subassembly according to the invention and to a method of fabricating such an optical subassembly.
The invention relates to an optical subassembly (1) comprising a carrier substrate(2), a photonic integrated circuit (3) (PIC) comprising a first optical waveguide (4) having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system (5) comprising a second optical waveguide (6) having a second longitudinal central axis, a component (7) for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material (8, 9) being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than10µm. The invention also relates to an optical system(12) comprising an optical subassembly according to the invention and to a method of fabricating an optical subassembly according to the invention.
The invention provides an integrated photonic component (100) for polarization insensitive wavelength multiplexing comprising an arrayed waveguide grating, AWG, (1) having a predetermined polarization splitting and a MZI-based polarization beam splitter (8) that is configured to compensate the predetermined polarization splitting of the AWG (1). The result is a fabrication tolerant integrated photonic component (100) that is operable over a wide number of limited bandwidth wavelength channels of a wavelength division multiplexing, WDM, system. The invention further provides a photonic integrated circuit, PIC, (200) for use in a WDM system. The PIC (200) comprises the integrated photonic component (100) of the invention. Furthermore, the invention provides a method of designing the integrated photonic component (100) set forth.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
The invention provides an integrated photonic component (1) with improved centering of an optical field image of a wavelength division multiplexing, WDM, optical output signal and a common output waveguide(8). In this way an efficient power coupling of the laser diodes of the integrated photonic component to the common output waveguide is achievable. The invention further provides a photonic integrated circuit, PIC, for use in a WDM optical communication system, the PIC comprising the component according to the invention. The invention further provides a method of improving centering of an optical field image of a WDM signal and a common output waveguide of at least one of the integrated photonic component and the PIC according to the invention.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
An assembly (60) comprising a substrate (1) that is provided with at least one electrical contact (3a), a flexible printed circuit membrane (51) comprising an electrically insulating film (6) and an electrically conducting layer (7) that is at least partially covering the insulating film (6).The conducting layer (7) is at least locally accessible from outside of the membrane (51).A connection means (10) is further provided for electrically connecting the at least one electrical contact (3a) and the conducting layer (7) at a position where the conducting layer (7) is accessible, to form an electrical connection between the substrate (1) and the membrane (51). A chip package (70) comprising a housing (15) having at least one electrically conducting terminal, and an assembly (60) as mentioned. The flexible printed circuit membrane (51) is arranged for electrically connecting the substrate (1) and the at least one terminal of the housing (15).
The present invention is directed to a semiconductor laser device comprising a first resonator section for resonating an optical resonator signal for providing an optical output signal at an output of said laser device, wherein said first resonator section is arranged for selectively resonating at a plurality of discrete output wavelengths, and wherein said laser device further comprises a second resonator section operatively connected to said first resonator section, said second resonator section being arranged for providing an optical feedback signal at a feedback wavelength to said first resonator section for locking said first resonator section into resonating at a selected output wavelength of said discrete output wavelengths, which selected output wavelength corresponds to said feedback wavelength for providing said optical output signal.
H01S 5/0625 - Dispositions pour commander les paramètres de sortie du laser, p. ex. en agissant sur le milieu actif en faisant varier le potentiel des électrodes dans des lasers à plusieurs sections
H01S 5/40 - Agencement de plusieurs lasers à semi-conducteurs, non prévu dans les groupes
H01S 3/082 - Structure ou forme des résonateurs optiques ou de leurs composants comprenant trois réflecteurs ou plus définissant une pluralité de résonateurs, p. ex. pour la sélection ou la suppression de modes
