Provided is an electronic component testing device capable of heating or cooling an electronic component in a short time and easily adjusting temperature. The testing device 1 comprises: ductwork 37 that causes cooling water to flow therethrough; a hollow head 39 connected to the ductwork 37, for cooling using the cooling water; and a plurality of thermoelectric elements 41 that have a rear surface 41b attached to the head 39 and a front surface 41a each in contact with a plurality of IC chips C, respectively. The plurality of thermoelectric elements 41 heat or cool the IC chips C, with either the front surface 41a or the rear surface 41b thereof being a heating surface and the other out of the front surface 41a or the rear surface 41b being a cooling surface.
Provided is an electronic component testing device whereby heating or cooling of an electronic component is performed in a short time, and temperature adjustment can also be easily performed. A testing device 1 is provided with: a conduit 37 through which cooling water flows; a hollow head part 39 which is communicated with the conduit 37 and which performs cooling through use of the cooling water; and a plurality of thermoelectric elements 41, back surfaces 41b of which are attached to the head part 39, and front surfaces 41a of which are brought into contact with a plurality of IC chips C; the plurality of thermoelectric elements 41 being configured so that when the front surfaces 41a or the back surfaces 41b thereof serve as heating surfaces, the other of the front surfaces 41a and the back surfaces 41b serve as cooling surfaces, and the thermoelectric elements 41 heat or cool the IC chips C.
Provided is a heat insulating material which can prevent ingress of gas at low cost. The present invention comprises: a core material 3; first packing materials 5a, 5b which cover the core material 3, have a reduced internal pressure, and comprise a polymeric compound; and particles 7 which engage with gas-permeable gas permeation pathways 21a, 21b of the first packing materials 5a, 5b from outside the first packing materials 5a, 5b due to the difference in pressure between the inside and outside of the first packing materials 5a, 5b to prevent permeation of gas.
A heat exchanger comprises a body having a passage through which fluid to be heat-exchanged passes, a heat transfer plate conducting heat exchange relative to the fluid to be heat-exchanged through the body. The heat transfer plate is provided with a plate body having a contact face that contacts an outer surface of the body, and a plurality of wall-shaped heat conductors being protruded from the contact face of the plate body and arranged inside the body. The body is provided with a plurality of slit-shaped holes into which the plurality of wall-shaped heat conductors are inserted and fitted at positions avoiding the passage, respectively, thereby to cause the heat conductors to be arranged inside the body. Each one heat conductor is formed smaller than a hole fitted to define a gap relative to said hole fitted.
F28F 3/12 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux
F28F 3/06 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations les moyens pouvant être fixés sur l'élément
F24H 1/12 - Chauffe-eau instantanés, c.-à-d. dans lesquels il n'y a production de chaleur que lorsque l'eau s'écoule, p. ex. avec contact direct de l'eau avec l'agent chauffant dans lesquels l'eau est maintenue séparée de l'agent chauffant
F24H 9/18 - Disposition ou montage des grilles ou des éléments chauffants
The present invention provides a heat exchanger capable of appropriately performing heat exchange on a sprayed heat exchanged liquid. The heat exchanger is provided with: a heat exchange container 3 inside which heat exchange is performed; a spray nozzle 5 which sprays a heat exchanged liquid into the heat exchange container 3; an injection nozzle 7 which injects a gas onto a mist M of the sprayed heat exchanged liquid; and a discharge port 9 which is positioned on the upstream side of the injected gas and is for discharging the heat exchanged liquid.
F28D 1/06 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec canalisations d'échange de chaleur faisant partie du réservoir contenant la masse du fluide ou lui étant fixées
F28C 3/06 - Autres appareils échangeurs de chaleur à contact direct les sources de potentiel calorifique étant un liquide et un gaz ou une vapeur
F28C 3/08 - Autres appareils échangeurs de chaleur à contact direct les sources de potentiel calorifique étant un liquide et un gaz ou une vapeur avec changement d'état, p. ex. absorption, évaporation, condensation
F28D 5/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, utilisant l'effet réfrigérant de l'évaporation naturelle ou forcée
Provided is a heat exchanger capable of appropriately performing heat exchange on a sprayed liquid to be heat-exchanged. The present invention is provided with: a heat exchange container (3) which allows heat exchange to be performed therein; a spray nozzle (5) which sprays the liquid to be heat-exchanged into the heat exchange container; an injection nozzle (7) which injects a gas to a mist (M) of the sprayed liquid to be heat-exchanged; and a discharge port (9) positioned on the downstream side of the injected gas and discharging the liquid to be heat-exchanged.
F28C 3/06 - Autres appareils échangeurs de chaleur à contact direct les sources de potentiel calorifique étant un liquide et un gaz ou une vapeur
F28C 3/08 - Autres appareils échangeurs de chaleur à contact direct les sources de potentiel calorifique étant un liquide et un gaz ou une vapeur avec changement d'état, p. ex. absorption, évaporation, condensation
F28D 1/06 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec canalisations d'échange de chaleur faisant partie du réservoir contenant la masse du fluide ou lui étant fixées
F28D 5/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, utilisant l'effet réfrigérant de l'évaporation naturelle ou forcée
Provided is a heat exchanger having a structure in which a heat transfer body is fitted in a hole in a heat exchanger body, wherein the difference between the heat expansion of the heat exchanger body and the heat transfer body can be eliminated without reducing heat exchange efficiency. This heat exchanger is provided with: a body 9 having a flow channel 23 for circulating a fluid to undergo heat exchange; and a heat transfer plate 11 that performs heat exchange with the fluid via the body 9. The heat transfer plate 11 is provided with: a plate body 49 having a contact surface 49a in contact with the outer surface of the body 9; and a plurality of wall-shaped heat transfer bodies 51 that are disposed inside of the body 9 so as to protrude from the contact surface 49a of the plate main body 49. The body 9 is provided with a plurality of slit-shaped holes 25 to which the plurality of wall-shaped heat transfer bodies are respectively fitted by insertion at positions other than the position of the flow channel 23 in order to position the wall-shaped heat transfer bodies on the interior. The heat transfer bodies 51 are formed smaller than the holes 25, in which the heat transfer bodies are fitted, and a gap G1, or G2 or G3 is demarcated between the heat transfer bodies and the holes 25.
F28F 3/12 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux
F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations
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