A connection device provides electrical connection between a shielded electrical cable and a host device, such as a host printed circuit board. The connection device includes an integrated unit with a printed circuit module provided to receive the shielded electrical cable and provide connection to the signal wire and the outer shield of the cable. The connection device further includes a conducting unit with a conducting module to connect the printed circuit module to the host device.
H01R 12/53 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à des câbles à l'exclusion des câbles plats ou à rubans
H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires
H01R 13/6591 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs
2.
Electrical interposer with shielded contacts and shielding ground plane with optimized impedance response
A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.
H01R 13/6587 - Matériau de blindage entourant individuellement des contacts espacés les uns des autres ou interposé entre ces derniers pour séparer des modules de connecteurs multibroches pour montage sur des cartes de circuits imprimés
H01R 4/24 - Connexions utilisant des organes de contact pénétrant dans, ou transperçant, l'isolation ou les brins du câble
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
3.
Electrical interposer having shielded contacts and traces
A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.
H01R 13/6587 - Matériau de blindage entourant individuellement des contacts espacés les uns des autres ou interposé entre ces derniers pour séparer des modules de connecteurs multibroches pour montage sur des cartes de circuits imprimés
H01R 4/24 - Connexions utilisant des organes de contact pénétrant dans, ou transperçant, l'isolation ou les brins du câble
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members where each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members where each contact member extends away from a second end of a corresponding pitch transformation routing member. Each pitch transformation routing member includes multiple routing sections, where each routing section extends in the first direction or the second direction. In a first subset of the pitch transformation routing members, the pitch transformation routing members have routing sections with different dimensions in the first direction and the second direction.
A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.
H01R 4/66 - Connexions à la masse terrestre, p. ex. plaque de terre, piquet de terre
H01R 13/6471 - Moyens pour empêcher la diaphonie par agencement particulier des conducteurs de mise à la masse et de signaux, p. ex. GSGS [mise à la masse - signal - mise à la masse - signal]
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
H01R 13/6587 - Matériau de blindage entourant individuellement des contacts espacés les uns des autres ou interposé entre ces derniers pour séparer des modules de connecteurs multibroches pour montage sur des cartes de circuits imprimés
H01R 13/652 - Dispositions de protection par mise à la terre ou par blindage sur les dispositifs de couplage avec broche, lame ou alvéole de mise à la terre
6.
Electrical interposer having shielded contacts and traces
A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.
H01R 4/24 - Connexions utilisant des organes de contact pénétrant dans, ou transperçant, l'isolation ou les brins du câble
H01R 13/6587 - Matériau de blindage entourant individuellement des contacts espacés les uns des autres ou interposé entre ces derniers pour séparer des modules de connecteurs multibroches pour montage sur des cartes de circuits imprimés
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.
H01R 4/66 - Connexions à la masse terrestre, p. ex. plaque de terre, piquet de terre
H01R 13/6471 - Moyens pour empêcher la diaphonie par agencement particulier des conducteurs de mise à la masse et de signaux, p. ex. GSGS [mise à la masse - signal - mise à la masse - signal]
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
H01R 13/6587 - Matériau de blindage entourant individuellement des contacts espacés les uns des autres ou interposé entre ces derniers pour séparer des modules de connecteurs multibroches pour montage sur des cartes de circuits imprimés
H01R 13/652 - Dispositions de protection par mise à la terre ou par blindage sur les dispositifs de couplage avec broche, lame ou alvéole de mise à la terre
A scalable, detachable interconnect system is provided that includes a shielded-frame structure having alignment features that forms a separable interconnect assembly which can be used to electrically couple at least two semiconductor devices. The interconnect system functions to protect, secure, and align electrical contacts on a first and a second semiconductor device coupled together. In this manner, the interconnect assembly realizes an electrical-mechanical interposer system that can securely connect semiconductor devices (e.g., printed circuit boards and semiconductor device packages) together while presenting electrical optimization features such as internal ground shielding and mechanical properties such as resilience, compliance, reusability, and reliable scrub motion to remove oxide from the pads or bumps.
A testing apparatus comprises a tester base, a supporting member, a frame, one or more electrical connectors and an upper cover. Each electrical connector includes a set of contact members that are positioned on a substrate and having first and second arm portions made of an electrically conductive material. The one or more electrical connectors are mounted on top of ribs in the supporting members and each of the electrical connectors is separated from an adjacent electrical connector by a respective pair of protrusions formed on opposite sides of the frame. Each of the second arm portions of the set of contact members of each electrical connector are disposed in a respective through hole formed in a panel of the supporting member.
G01R 1/04 - BoîtiersOrganes de supportAgencements des bornes
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
H01R 33/74 - Dispositifs ayant quatre pôles ou plus
H01R 13/631 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz pour l'engagement uniquement
An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members, each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members, each contact member extends away from a second end of a corresponding pitch transformation routing member. A first subset of the pitch transformation routing members each includes a first routing section extending in a first direction and a second routing section extending in a second direction. A pitch of the first set of contact members associated with the first subset of the pitch transformation routing members is different from a pitch of the second set of contact members associated with the first subset of the pitch transformation routing members.
An electrical connector comprises a bottom assembly extending in a first direction, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in a second direction. The plurality of conductive vias extends in the second direction to penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.
An electrical connector comprises a plurality of substrates, a first plurality of spacers, a second plurality of spacers, a plurality of pitch transformation routing assemblies, and a plurality of contact assemblies. The plurality of substrates each extends along a first direction. Each of the second plurality of spacers and a respective spacer of the first plurality of spacers connect a respective substrate of the plurality of substrates to a respective adjacent substrate of the plurality of substrates. Each of the plurality of pitch transformation routing assemblies is surrounded by a corresponding substrate of the plurality of substrates, a corresponding spacer of the first plurality of spacers, a corresponding adjacent substrate of the plurality of substrates, and a corresponding spacer of the second plurality of spacers.
An electrical connector comprises a substrate, a datum reference position, a first plurality of intermediary members, and a first plurality of contact members. Each contact member has first and second arms extending away from a base towards opposite side surfaces to form a letter V with an opening facing the datum reference position. A connector array comprises one or more of the electrical connectors. A testing apparatus comprises a tester base, a supporting member, a frame, one or more of the connector arrays, and an upper cover.
G01R 1/04 - BoîtiersOrganes de supportAgencements des bornes
H01R 13/24 - Contacts pour coopération par aboutage élastiquesContacts pour coopération par aboutage montés élastiquement
H01R 33/74 - Dispositifs ayant quatre pôles ou plus
H01R 13/631 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz pour l'engagement uniquement
brevets