Abrégé

A manifold is provided for distribution of dielectric coolant within a chassis, to allow the dielectric coolant to receive heat from at least one electronic component mounted within the chassis. The manifold comprises: a circuit board, having first and second opposing surfaces; and a substrate, at least partially spaced apart from the circuit board and a gap between a first surface of the circuit board and the substrate being configured to receive and contain dielectric coolant. One or more apertures are provided in the circuit board or substrate to allow dielectric coolant contained in the gap to flow across the opposing surfaces of the circuit board or substrate.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A heat exchanger is for transferring heat from first to second isolated coolant liquids and comprises: a first set of ports, for receiving and outputting the first coolant liquid; a second set of ports, for receiving and outputting the second coolant liquid; a third set of ports, for receiving and outputting the second coolant liquid, the second and third sets of ports being in communication within the heat exchanger to allow flow of the second coolant liquid therebetween; a thermal interface to transfer heat between the first coolant liquid received at the first set of ports and the second coolant liquid received at the second and/or third sets of ports; and a flow restrictor, configured adjustably or selectively to restrict flow of the second coolant liquid to and/or from the thermal interface without restricting the flow of the second coolant liquid between the second and third sets of ports.

Classes IPC  ?

• F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations
• F28F 9/02 - Boîtes de distributionPlaques d'extrémité
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Product research and development; Design and development of computer hardware; Computer technology consultancy; Consulting services in the field of computer hardware design for others; Scientific and technological services, namely, research and design in the field of liquid cooling and thermal management for computers, computer servers, and data centers

Abrégé

A system for cooling a plurality of electronic devices, having a first cooling circulatory arrangement, configured to cause a first liquid coolant to circulate between a first electronic device and a heat exchanger, wherein the first electronic device is thermally coupled to the first liquid coolant. The system also has a second cooling circulatory arrangement, configured to cause a second liquid coolant to flow through the heat exchanger, and to cause the second liquid coolant to flow through a cooling module thermally coupled to a second electronic device. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled via the heat exchanger, such that the heat exchanger is configured to transfer heat from the first liquid coolant to the second liquid coolant.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F28D 9/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes en forme de plaques ou de laminés pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation

Abrégé

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H10W 40/22 -
• H10W 40/47 -

Abrégé

A cooling module comprising a casing that defines a first internal volume. The casing comprises a first internal major surface and a second internal major surface, wherein the first internal volume is defined between the first internal major surface and the second internal major surface. The cooling module further comprises a chamber that defines a second internal volume in fluid communication with the first internal volume. At least one of the first internal major surface and the second internal major surface comprises a first cavity, and at least one of the first internal major surface and the second internal major surface further comprises a first channel connecting the first cavity to the second internal volume. The chamber extends from a region in a corner of the casing.

Classes IPC  ?

• G06F 1/20 - Moyens de refroidissement
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A heat sink for cooling a heat generating device comprises: a housing, comprising: a heat transfer block for receiving heat from the heat generating device; and side walls, extending from the heat transfer block, the heat transfer block and side walls together defining an internal volume for receiving a coolant from external the heat sink; and a plurality of heat pipes and/or vapour chambers, each heat pipe and/or vapour chamber extending from the heat transfer block within the internal volume. A cooled electronic system comprises: an electronic device that generates heat in use, heat being dissipated from the electronic device through an external surface of the electronic device; and the heat sink, having the heat transfer block mounted on the external surface of the electronic device.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Computer servers; Computers; Computer hardware; Computer monitors; Computer peripheral apparatus; Downloadable computer software applications for operating data center equipment and cooling systems therefor; Recorded computer software for operating data center equipment and cooling systems therefor; Computer peripheral devices; Cabinets adapted to hold computers; Computer hardware for cooling systems for use inside data centers for cooling computer equipment, namely, integrated circuit modules; Internal cooling fans for computers; Computer memory modules; System boards (mother cards) and processors; Data processors; Microprocessors; Signal processors; Computer accelerator board; Computer network adapters, switches, routers and hubs; Graphics cards; Computer graphics boards; Video graphics accelerator; Network routers; Wireless routers; Wide area network (WAN) routers; Electrical switches; Telecommunication switches; Temperature switches; Data access port for use with electrical control panels for connecting multiple data and electrical devices; Alarm monitoring systems; Multiplexers; Telecommunications multiplexers; Downloadable computer software applications for data analytics; Computer hardware for edge devices, namely, devices which provide an entry point into core computer networks; Downloadable cloud-computing software for operating data center equipment and cooling systems therefor; Network servers; Communications servers; Mounting racks for telecommunications hardware; Network access server hardware; Computer hardware for blade servers; Central processing unit (CPU) fans; Central processing unit (CPU) coolers; Climate control systems consisting of digital thermostats for cooling equipment, and a programmable logic controller (PLC) with input and output features for temperature and humidity, which works with a remote digital read out controller Air cooling apparatus; Cooling units for industrial purposes; Coils as parts of distilling, heating or cooling installations; Heat exchangers not being parts of machines; Heat pumps Installation and maintenance of cooling systems, racks and cabinets for computer hardware and servers Software as a service (SAAS) services featuring software for regulating the temperature of computer systems; Computer services, namely, integration of private and public cloud computing environments; Technical support services, namely, remote and on-site infrastructure management services for monitoring, administration and management of public and private cloud computing IT and application systems; Server hosting; Rental of web servers; Design, installation, updating and maintenance of computer software; Cloud computing featuring software for use in operating, and managing liquid cooling systems, temperature regulation systems and systems for recovering and reusing waste heat, all in connection with computers, computer blade servers, computer servers, computer hardware, and computer peripheral devices; Consultancy and information services relating to information technology architecture and infrastructure; Computer software consulting; Technological planning and consulting services in the field of information technology networks, multimedia equipment, computer hardware and computer software, computer and multimedia systems; Computer services, namely, cloud hosting provider services; Web site hosting services; Electronic data storage; Consulting services in the field of software as a service (SAAS)

Produits et services

Computer servers; Computers; Computer hardware; Computer monitors; Computer peripheral apparatus; Downloadable computer software applications for operating data center equipment and cooling systems therefor; Recorded computer software for operating data center equipment and cooling systems therefor; Computer peripheral devices; Cabinets adapted to hold computers; Computer hardware for cooling systems for use inside data centers for cooling computer equipment, namely, integrated circuit modules; Internal cooling fans for computers; Computer memory modules; System boards (mother cards) and processors; Data processors; Microprocessors; Signal processors; Computer accelerator board; Computer network adapters, switches, routers and hubs; Graphics cards; Computer graphics boards; Video graphics accelerator; Network routers; Wireless routers; Wide area network (WAN) routers; Electrical switches; Telecommunication switches; Temperature switches; Data access port for use with electrical control panels for connecting multiple data and electrical devices; Alarm monitoring systems; Multiplexers; Telecommunications multiplexers; Downloadable computer software applications for data analytics; Computer hardware for edge devices, namely, devices which provide an entry point into core computer networks; Downloadable cloud-computing software for operating data center equipment and cooling systems therefor; Network servers; Communications servers; Mounting racks for telecommunications hardware; Network access server hardware; Computer hardware for blade servers; Central processing unit (CPU) fans; Central processing unit (CPU) coolers; Climate control systems consisting of digital thermostats for cooling equipment, and a programmable logic controller (PLC) with input and output features for temperature and humidity, which works with a remote digital read out controller Air cooling apparatus; Cooling units for industrial purposes; Coils as parts of distilling, heating or cooling installations; Heat exchangers not being parts of machines; Heat pumps Installation and maintenance of cooling systems, racks and cabinets for computer hardware and servers Software as a service (SAAS) services featuring software for regulating the temperature of computer systems; Computer services, namely, integration of private and public cloud computing environments; Technical support services, namely, remote and on-site infrastructure management services for monitoring, administration and management of public and private cloud computing IT and application systems; Server hosting; Rental of web servers; Design, installation, updating and maintenance of computer software; Cloud computing featuring software for use in operating, and managing liquid cooling systems, temperature regulation systems and systems for recovering and reusing waste heat, all in connection with computers, computer blade servers, computer servers, computer hardware, and computer peripheral devices; Consultancy and information services relating to information technology architecture and infrastructure; Computer software consulting; Technological planning and consulting services in the field of information technology networks, multimedia equipment, computer hardware and computer software, computer and multimedia systems; Computer services, namely, cloud hosting provider services; Web site hosting services; Electronic data storage; Consulting services in the field of software as a service (SAAS)

Abrégé

A nozzle arrangement for cooling an electronic component. The nozzle arrangement comprises: a nozzle for discharging liquid coolant; and a mount configured to disperse the liquid coolant, the mount further configured to be coupled with the electronic component. The nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Computer servers; Computers; Computer hardware; Computer monitors; Computer peripheral apparatus; Downloadable computer software applications for operating data center equipment and cooling systems therefor; Recorded computer software for operating data center equipment and cooling systems therefor; Computer peripheral devices; Cabinets adapted to hold computers; Computer hardware for cooling systems for use inside data centers for cooling computer equipment, namely, integrated circuit modules; Internal cooling fans for computers; Computer memory modules; System boards (mother cards) and processors; Data processors; Microprocessors; Signal processors; Computer accelerator board; Computer network adapters, switches, routers and hubs; Graphics cards; Computer graphics boards; Video graphics accelerator; Network routers; Wireless routers; Wide area network (WAN) routers; Electrical switches; Telecommunication switches; Temperature switches; Data access port for use with electrical control panels for connecting multiple data and electrical devices; Alarm monitoring systems; Multiplexers; Telecommunications multiplexers; Downloadable computer software applications for data analytics; Computer hardware for edge devices, namely, devices which provide an entry point into core computer networks; Downloadable cloud-computing software for operating data center equipment and cooling systems therefor; Network servers; Communications servers; Mounting racks for telecommunications hardware; Network access server hardware; Computer hardware for blade servers; Central processing unit (CPU) fans; Central processing unit (CPU) coolers; Climate control systems consisting of digital thermostats for cooling equipment, and a programmable logic controller (PLC) with input and output features for temperature and humidity, which works with a remote digital read out controller Air cooling apparatus; Cooling units for industrial purposes; Coils as parts of distilling, heating or cooling installations; Heat exchangers not being parts of machines; Heat pumps Database management; Database management services; Information, advisory and consultancy services relating to business and management or business administration, including such services provided on line or via the internet; Business administration services; Business management; Business management in the field of electronic data centers; Outsource service provider in the field of business analytics Installation and maintenance of cooling systems, racks and cabinets for computer hardware and servers Telecommunications consultation; Advisory services relating to telecommunications; Providing co-location services for voice, video and data communications applications; Telecommunication consultation in the nature of technical consulting in the field of audio, text and visual data transmission and communication Software as a service (SAAS) services featuring software for regulating the temperature of computer systems; Computer services, namely, integration of private and public cloud computing environments; Technical support services, namely, remote and on-site infrastructure management services for monitoring, administration and management of public and private cloud computing IT and application systems; Server hosting; Rental of web servers; Design, installation, updating and maintenance of computer software; Cloud computing featuring software for use in operating, and managing liquid cooling systems, temperature regulation systems and systems for recovering and reusing waste heat, all in connection with computers, computer blade servers, computer servers, computer hardware, and computer peripheral devices; Consultancy and information services relating to information technology architecture and infrastructure; Computer software consulting; Technological planning and consulting services in the field of information technology networks, multimedia equipment, computer hardware and computer software, computer and multimedia systems; Computer services, namely, cloud hosting provider services; Web site hosting services; Electronic data storage; Consulting services in the field of software as a service (SAAS)

Produits et services

Computer servers; Computers; Computer hardware; Computer monitors; Computer peripheral apparatus; Downloadable computer software applications for operating data center equipment and cooling systems therefor; Recorded computer software for operating data center equipment and cooling systems therefor; Computer peripheral devices; Cabinets adapted to hold computers; Computer hardware for cooling systems for use inside data centers for cooling computer equipment, namely, integrated circuit modules; Internal cooling fans for computers; Computer memory modules; System boards (mother cards) and processors; Data processors; Microprocessors; Signal processors; Computer accelerator board; Computer network adapters, switches, routers and hubs; Graphics cards; Computer graphics boards; Video graphics accelerator; Network routers; Wireless routers; Wide area network (WAN) routers; Electrical switches; Telecommunication switches; Temperature switches; Data access port for use with electrical control panels for connecting multiple data and electrical devices; Alarm monitoring systems; Multiplexers; Telecommunications multiplexers; Downloadable computer software applications for data analytics; Computer hardware for edge devices, namely, devices which provide an entry point into core computer networks; Downloadable cloud-computing software for operating data center equipment and cooling systems therefor; Network servers; Communications servers; Mounting racks for telecommunications hardware; Network access server hardware; Computer hardware for blade servers; Central processing unit (CPU) fans; Central processing unit (CPU) coolers; Climate control systems consisting of digital thermostats for cooling equipment, and a programmable logic controller (PLC) with input and output features for temperature and humidity, which works with a remote digital read out controller Air cooling apparatus; Cooling units for industrial purposes; Coils as parts of distilling, heating or cooling installations; Heat exchangers not being parts of machines; Heat pumps Database management; Database management services; Information, advisory and consultancy services relating to business and management or business administration, including such services provided on line or via the internet; Business administration services; Business management; Business management in the field of electronic data centers; Outsource service provider in the field of business analytics Installation and maintenance of cooling systems, racks and cabinets for computer hardware and servers Telecommunications consultation; Advisory services relating to telecommunications; Providing co-location services for voice, video and data communications applications; Telecommunication consultation in the nature of technical consulting in the field of audio, text and visual data transmission and communication Software as a service (SAAS) services featuring software for regulating the temperature of computer systems; Computer services, namely, integration of private and public cloud computing environments; Technical support services, namely, remote and on-site infrastructure management services for monitoring, administration and management of public and private cloud computing IT and application systems; Server hosting; Rental of web servers; Design, installation, updating and maintenance of computer software; Cloud computing featuring software for use in operating, and managing liquid cooling systems, temperature regulation systems and systems for recovering and reusing waste heat, all in connection with computers, computer blade servers, computer servers, computer hardware, and computer peripheral devices; Consultancy and information services relating to information technology architecture and infrastructure; Computer software consulting; Technological planning and consulting services in the field of information technology networks, multimedia equipment, computer hardware and computer software, computer and multimedia systems; Computer services, namely, cloud hosting provider services; Web site hosting services; Electronic data storage; Consulting services in the field of software as a service (SAAS)

Abrégé

A module, used in cooling one or more heat generating components, comprises: a heat exchanger, having a plurality of ports for flow of a primary coolant carrying heat from the one or more heat generating components and for flow of a secondary coolant, the heat exchanger being configured to transfer heat from the primary coolant to the secondary coolant; and a volume compensator, fluidly coupled to the heat exchanger via one of the plurality of ports. The volume compensator has an internal volume configured to increase or decrease in size depending on pressure. A cooled electronics system comprising one more such modules is also provided.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

An apparatus and system for cooling a plurality of electronic devices (25, 26) disposed on a circuit board (1) are provided. The apparatus comprises a plurality of cold plates (7, 8), each cold plate (7, 8) having a thermal interface surface for cooling an electronic device (25, 26) thermally coupled thereto. The apparatus comprises a support frame to which each of the plurality of cold plates (7, 8) is attached, the support frame configured for attachment to the circuit board so as to hold the thermal interface surfaces of the plurality of cold plates (7, 8) in thermal contact with the plurality of electronic devices (25, 26). The support frame is arranged to hold the thermal interface surface of each of the plurality of cold plates (7, 8) at a different position relative to the support frame.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

An electronic device cooling module (1) comprises: a container (2) enclosing at least one first electronic device (5); a liquid coolant reservoir (4); and a pump (3) located within the liquid coolant reservoir (4) arranged to pump liquid coolant from said liquid coolant reservoir (4) to the at least one first electronic device (5) via a liquid coolant conduit (6) to provide cooling of the device. The liquid coolant reservoir (4) includes a heating element (7) communicably coupled to a controller (8). The controller (8) is communicably coupled to a temperature sensor (9) disposed within the liquid coolant reservoir (4).

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

An electronic device cooling module is presented. The module comprises a housing enclosing at least one first electronic device, said at least one first electronic device being in thermal contact with a first liquid coolant contained within the housing, and a second electronic device disposed on an outer surface of the housing which is electrically and/or communicatively connected to the at least one first electronic device contained within the housing. The module further comprises a thermally conductive portion included in the housing that is in thermal contact with said first liquid coolant on a first surface and that is in thermal contact with a second electronic device on a second surface, so as to transfer heat from the second electronic device to the first liquid coolant.

Classes IPC  ?

• G06F 1/20 - Moyens de refroidissement
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A pump docking assembly is configured to interconnect at least one pump with a coolant liquid flow loop. The pump docking assembly comprises: at least one pump receiving device arranged to releasably engage with the at least one pump; and a coolant liquid flow loop port connectable to the at least one pump. The at least one pump includes a liquid coolant inlet. A liquid cooling chassis housing encloses at least one electronic component and comprises a liquid coolant distribution device interconnecting a liquid coolant flow loop with the pump docking assembly.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A cooling module for cooling one or more electronic components within the cooling module, comprises: one or more electronic components; and a cooling element configured to cool the one or more electronic components by distributing liquid coolant over the one or more electronic components. The cooling element comprises: a first region configured to receive the liquid coolant from a supply of liquid coolant; a second region comprising a plurality of openings; and a weir between the first and second regions. The first and second regions and the weir are arranged above the one or more electronic components such that liquid coolant in the first region overflows over the weir and onto the plurality of openings, so as to distribute the liquid coolant over the one or more electronic components.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Computer servers; computers; computer hardware; monitors [computer hardware]; computer apparatus; computer software applications, downloadable; computer software, recorded; computer peripheral devices; cabinets adapted to hold computers, cabinets for loudspeakers, computer modules; none of the aforesaid being in relation to books or publishing; none of the aforesaid in relation to educational computer software, computer mouses. Cooling apparatus; cooling elements; heat exchangers, not parts of machines; heat pumps; cooling installations and machines; cooling appliances and installations; cooling installations for liquids. Installation of cooling systems, racks and cabinets for computer hardware and servers. Cloud computing; server hosting; rental of web servers.

Abrégé

A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A heat exchanger is for transferring heat from first to second isolated coolant liquids and comprises: a first set of ports, for receiving and outputting the first coolant liquid; a second set of ports, for receiving and outputting the second coolant liquid; a third set of ports, for receiving and outputting the second coolant liquid, the second and third sets of ports being in communication within the heat exchanger to allow flow of the second coolant liquid therebetween; a thermal interface to transfer heat between the first coolant liquid received at the first set of ports and the second coolant liquid received at the second and/or third sets of ports; and a flow restrictor, configured adjustably or selectively to restrict flow of the second coolant liquid to and/or from the thermal interface without restricting the flow of the second coolant liquid between the second and third sets of ports.

Classes IPC  ?

• F28D 9/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes en forme de plaques ou de laminés pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation
• F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes

Abrégé

A manifold is provided for distribution of dielectric coolant within a chassis, to allow the dielectric coolant to receive heat from at least one electronic component mounted within the chassis. The manifold comprises: a circuit board, having first and second opposing surfaces; and a substrate, at least partially spaced apart from the circuit board and a gap between a first surface of the circuit board and the substrate being configured to receive and contain dielectric coolant. One or more apertures are provided in the circuit board or substrate to allow dielectric coolant contained in the gap to flow across the opposing surfaces of the circuit board or substrate.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement
• H05K 1/02 - Circuits imprimés Détails

Produits et services

Computer servers; computers; computer hardware; monitors [computer hardware]; computer apparatus; computer software applications, downloadable; computer software, recorded; computer peripheral devices; cabinets adapted to hold computers, cabinets adapted to hold computer servers, computer modules; none of the aforesaid being in relation to books or publishing; none of the aforesaid in relation to educational computer software, computer mouses. Cooling apparatus; cooling elements; heat exchangers, not parts of machines; heat pumps; cooling installations and machines; cooling appliances and installations; cooling installations for liquids. Cloud computing; server hosting; rental of web servers; installation of computer software; computer software design; none of the aforesaid relating to book related software or publishing.

Produits et services

Computer servers; computers; computer hardware; computer monitors; computer peripheral apparatus for cooling systems comprised of computer hardware for cooling data center equipment; downloadable computer software applications for operating data center equipment and cooling systems therefor; recorded computer software for operating data center equipment and cooling systems therefor; computer peripheral devices; cabinets adapted to hold computers; cabinets for loudspeakers; computer modules for cooling systems for use inside data centers for cooling computer equipment, namely, integrated circuit modules; none of the aforesaid being in relation to books, publishing, educational computer software, or computer mouses Cooling apparatus, namely, liquid air cooling apparatus for use inside data centers for cooling computer equipment, excluding internal computer components for cooling central processing units (CPUs); cooling elements, namely, coils as parts of cooling installations; heat exchangers, not being parts of machines; heat pumps; cooling installations and machines for cooling server racks and electronic equipment within data centers, namely, cooling units for industrial purposes; cooling appliances and installations, namely, liquid immersion cooling systems for electronic equipment within data centers; cooling units for industrial purposes, namely, liquid cooling installations comprised primarily of a heat pump and an exterior water-based cooling loop, and also featuring a liquid-cooled chassis for cooling electronic components and integrated circuits, excluding internal computer components for cooling central processing units (CPUs) Installation of cooling systems, racks and cabinets for computer hardware and servers. Cloud computing, namely, software as a service (SAAS) services featuring software for regulating the temperature of computer systems; cloud computing services, namely, integration of private and public cloud computing environments; cloud computing services, namely, remote and on-site infrastructure management services for monitoring, administration and management of public and private cloud computing IT and application systems; server hosting; rental of web servers.

Abrégé

A system for cooling a plurality of electronic devices, having a first cooling circulatory arrangement, configured to cause a first liquid coolant to circulate between a first electronic device and a heat exchanger, wherein the first electronic device is thermally coupled to the first liquid coolant. The system also has a second cooling circulatory arrangement, configured to cause a second liquid coolant to flow through the heat exchanger, and to cause the second liquid coolant to flow through a cooling module thermally coupled to a second electronic device. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled via the heat exchanger, such that the heat exchanger is configured to transfer heat from the first liquid coolant to the second liquid coolant.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F28D 9/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes en forme de plaques ou de laminés pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation

Abrégé

A heat sink arrangement is provided for cooling first and second sets of electronic components positioned below the heat sink arrangement. This comprises: a first cooling element for cooling the first set of electronic components, wherein the first cooling element is a first heat sink comprising a base and a retaining wall that together define a volume for holding liquid coolant; and a second cooling element for cooling the second set of electronic components, configured to distribute liquid coolant over the second set of electronic components. The first and second cooling elements are arranged such that liquid coolant overflows from the volume of the first cooling element to the second cooling element for distribution over the second set of electronic components.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Computer servers; computers; computer hardware; computer hardware, namely, central processing unit (CPU) coolers; computer monitors; computer peripheral apparatus for cooling systems comprised of computer hardware for cooling data center equipment; downloadable computer software applications for operating data center equipment and cooling systems therefor; recorded computer software for operating data center equipment and cooling systems therefor; computer peripheral devices; cabinets adapted to hold computers; cabinets adapted to hold computer servers; computer modules for cooling systems for use inside data centers for cooling computer equipment, namely, integrated circuit modules; none of the aforesaid being in relation to books, publishing, educational computer software, or computer mouses Cooling apparatus, namely, liquid air cooling apparatus for use inside data centers for cooling computer equipment, excluding internal computer components for cooling central processing units (CPUs); cooling elements, namely, coils as parts of cooling installations; heat exchangers, not being parts of machines; heat pumps; cooling installations and machines for cooling server racks and electronic equipment within data centers, namely, cooling units for industrial purposes; cooling appliances and installations, namely, liquid immersion cooling systems for electronic equipment within data centers; Cooling units for industrial purposes, namely, liquid cooling installations comprised primarily of a heat pump and an exterior water-based cooling loop, and also featuring a liquid-cooled chassis for cooling electronic components and integrated circuits, excluding internal computer components for cooling central processing units (CPUs) Cloud computing, namely, software as a service (SAAS) services featuring software for regulating the temperature of computer systems; cloud computing services, namely, integration of private and public cloud computing environments; cloud computing services, namely, remote and on-site infrastructure management services for monitoring, administration and management of public and private cloud computing IT and application systems; server hosting; rental of web servers; Installation of computer software; Computer software design; none of the aforesaid relating to book related software or publishing

Abrégé

A heat sink for cooling a heat generating device comprises: a housing, comprising: a heat transfer block for receiving heat from the heat generating device; and side walls, extending from the heat transfer block, the heat transfer block and side walls together defining an internal volume for receiving a coolant from external the heat sink; and a plurality of heat pipes and/or vapour chambers, each heat pipe and/or vapour chamber extending from the heat transfer block within the internal volume. A cooled electronic system comprises: an electronic device that generates heat in use, heat being dissipated from the electronic device through an external surface of the electronic device; and the heat sink, having the heat transfer block mounted on the external surface of the electronic device.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A module, used in cooling one or more heat generating components, comprises: a heat exchanger, having a plurality of ports for flow of a primary coolant carrying heat from the one or more heat generating components and for flow of a secondary coolant, the heat exchanger being configured to transfer heat from the primary coolant to the secondary coolant; and a volume compensator, fluidly coupled to the heat exchanger via one of the plurality of ports. The volume compensator has an internal volume configured to increase or decrease in size depending on pressure. A cooled electronics system comprising one more such modules is also provided.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

An apparatus and system for cooling a plurality of electronic devices (25, 26) disposed on a circuit board (1 ) are provided. The apparatus comprises a plurality of cold plates (7, 8), each cold plate (7, 8) having a thermal interface surface for cooling an electronic device (25, 26) thermally coupled thereto. The apparatus comprises a support frame to which each of the plurality of cold plates (7, 8) is attached, the support frame configured for attachment to the circuit board so as to hold the thermal interface surfaces of the plurality of cold plates (7, 8) in thermal contact with the plurality of electronic devices (25, 26). The support frame is arranged to hold the thermal interface surface of each of the plurality of cold plates (7, 8) at a different position relative to the support frame.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température

Abrégé

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A housing is provided for mounting within an enclosure, for example a module for cooling electronic devices, that is arranged to contain a liquid coolant. The housing comprises: a wall structure, arranged to define a plurality of mounting chambers, each mounting chamber being configured to hold at least one respective electronic device and having a respective chamber coolant inlet for receiving liquid coolant, such that liquid coolant received through each chamber coolant inlet accumulates in the respective mounting chamber around the respective electronic device; a housing coolant inlet, for receiving liquid coolant from outside the housing; and a liquid coolant manifold, arranged to receive liquid coolant from the housing coolant inlet and provide the received liquid coolant to each of the chamber coolant inlets.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement

Abrégé

A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid communication with the first internal volume. The first and/or second internal major surface comprises a first cavity. The first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume.

Classes IPC  ?

• G06F 1/20 - Moyens de refroidissement
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Computer servers; computers; computer hardware; monitors [computer hardware]; computer apparatus; computer software applications, downloadable; computer software, recorded; computer peripheral devices; cabinets adapted to hold computers, cabinets adapted to hold electrical apparatus, computer modules; none of the aforesaid being in relation to books or publishing; none of the aforesaid in relation to educational computer software, computer mouses. Cooling apparatus; cooling elements; heat exchangers, not parts of machines; heat pumps; cooling installations and machines; cooling appliances and installations; cooling installations for liquids. Cloud computing; server hosting; rental of web servers; installation of computer software; computer software design; none of the aforesaid relating to book related software or publishing.

Abrégé

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

A cold plate is configured to use isolated primary and secondary liquid coolants and comprises: a thermally conductive body defining an internal volume and arranged for mounting with respect to an electronic device, so as to transfer heat from the electronic device to the internal volume; a coolant inlet for receiving the secondary liquid coolant into the internal volume to receive the transferred heat; and a coolant outlet for the secondary liquid coolant to flow out of the internal volume. The thermally conductive body is configured to define an external receptacle having a volume arranged to receive and retain the primary liquid coolant for heat transfer between the primary and secondary liquid coolants. The cold plate may form part of a system for cooling electronic devices.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A nozzle arrangement for cooling an electronic component. The nozzle arrangement comprises: a nozzle for discharging liquid coolant; and a mount configured to disperse the liquid coolant, the mount further configured to be coupled with the electronic component. The nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Computer servers; computers; computer hardware; computer hardware, namely, monitors; computer peripheral apparatus for cooling systems; downloadable computer software applications for operating data center equipment, including cooling systems therefor; recorded computer software for operating data center equipment, including cooling systems therefor; computer peripheral devices; cabinets adapted to hold computers; cabinets adapted to hold electrical apparatus, namely, electrical controllers for computer cooling systems for use inside data centers; computer hardware modules for use inside data centers for controlling cooling systems for computer equipment; none of the aforesaid being in relation to books, publishing, or educational computer software Cooling apparatus, namely, liquid cooling systems for use inside data centers for cooling computer equipment; cooling elements, namely, coils as parts of cooling installations; heat exchangers, not parts of machines; heat pumps; cooling installations and machines for cooling server racks and electronic equipment within data centers; cooling appliances and installations, namely, liquid immersion cooling systems for electronic equipment within data centers; liquid cooling installations comprised primarily of a heat pump and an exterior water-based cooling loop, and also featuring a liquid-cooled chassis for cooling electronic components and integrated circuits Cloud computing, namely, software as a service (SAAS) services featuring software for regulating the temperature of computer systems; cloud computing services, namely, integration of private and public cloud computing environments; cloud computing services, namely, remote and on-site infrastructure management services for monitoring, administration and management of public and private cloud computing IT and application systems; server hosting; rental of web servers; installation of computer software; computer software design; none of the aforesaid relating to book related software or publishing

Abrégé

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

A cradle (2) is provided for a power cord (1) of a kind comprising a flexible cable (9) that terminates with a rigid connector (90). The cradle (2) comprises: a front face (71) having an aperture (72) dimensioned (a) to accommodate a front portion (91) of the rigid connector (90) such that the front portion (91) of the rigid connector (90) protrudes through the aperture (72) so as to be receivable in a socket of an apparatus and (b) to abut an abutment (92) of the rigid connector (90) to prevent movement of the abutment (92) in a forward direction through the aperture (72); a rear retainer (81) adjustable relative to the front face (71) so as to accommodate the rigid connector (90) whilst restricting movement of the rigid connector (90) backwards away from the aperture (72) of the front face (71); and a lateral flange (20) configured to be adjustably attached to a rail kit (3, 4) so as to accommodate movement in a plane orthogonal to the forward direction.

Classes IPC  ?

• H05K 7/14 - Montage de la structure de support dans l'enveloppe, sur cadre ou sur bâti
• H01R 13/74 - Montage des pièces de couplage dans les ouvertures d'un panneau
• H01R 24/22 - Pièces de couplage portant des douilles, des pinces ou des contacts analogues, assujetties uniquement à un fil ou un câble avec des contacts supplémentaires de mise à la terre ou de blindage

Abrégé

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

A cold plate, comprises: a housing having a surface providing a thermal interface for cooling an electronic device; a channel within the housing proximate to the surface for a liquid coolant to flow therethough such that heat received by the thermal interface is transferred to the liquid coolant; and a coolant port extending outside the housing, for transferring liquid coolant to and/or from the channel. A cross-sectional area of an outlet from the coolant port to the channel may be no larger than that of the channel at the outlet. Pins and/or fins may be arranged within the channel adjacent to the coolant port. The coolant port may cause liquid coolant to enter and/or exit the channel in a direction perpendicular to the surface. The coolant port may comprise an independent rotating fluid connector thereby allowing adjustment in the direction of a pipe coupled to the coolant port.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A manifold is provided for distribution of dielectric coolant within a chassis, to allow the dielectric coolant to receive heat from at least one electronic component mounted within the chassis. The manifold comprises: a circuit board, having first and second opposing surfaces; and a substrate, at least partially spaced apart from the circuit board and a gap between a first surface of the circuit board and the substrate being configured to receive and contain dielectric coolant. One or more apertures are provided in the circuit board or substrate to allow dielectric coolant contained in the gap to flow across the opposing surfaces of the circuit board or substrate.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H05K 1/02 - Circuits imprimés Détails

Abrégé

A heat sink arrangement is provided for cooling first (12) and second (31a, 31b) sets of electronic components positioned below the heat sink arrangement. This comprises: a first cooling element (35) for cooling the first set of electronic components (12), wherein the first cooling element (35) is a first heat sink comprising a base (17) and a retaining wall (7) that together define a volume for holding liquid coolant; and a second cooling element (32a, 32b) for cooling the second set of electronic components (31a, 31b), configured to distribute liquid coolant over the second set of electronic components (31a, 31b). The first (35) and second (32a, 32b) cooling elements are arranged such that liquid coolant overflows from the volume of the first cooling element (35) to the second cooling element (32a, 32b) for distribution over the second set of electronic components (31a, 31b).

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A system for cooling a plurality of electronic devices, having a first cooling circulatory arrangement, configured to cause a first liquid coolant to circulate between a first electronic device and a heat exchanger, wherein the first electronic device is thermally coupled to the first liquid coolant. The system also has a second cooling circulatory arrangement, configured to cause a second liquid coolant to flow through the heat exchanger, and to cause the second liquid coolant to flow through a cooling module thermally coupled to a second electronic device. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled via the heat exchanger, such that the heat exchanger is configured to transfer heat from the first liquid coolant to the second liquid coolant.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

Devices are provided that include a device housing defining and a maximum dielectric cooling liquid level, and a dielectric cooling liquid outlet weir in the device housing from which dielectric cooling liquid exits the interior space. The cooling liquid outlet weir can set the level of the dielectric cooling liquid within the interior space and establish a volumetric rate of flow of the dielectric cooling liquid within the interior space that is needed for the cooling of heat-generating electronic components.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

A housing is provided for mounting within an enclosure, for example a module for cooling electronic devices, that is arranged to contain a liquid coolant. The housing comprises: a wall structure, arranged to define a plurality of mounting chambers, each mounting chamber being configured to hold at least one respective electronic device and having a respective chamber coolant inlet for receiving liquid coolant, such that liquid coolant received through each chamber coolant inlet accumulates in the respective mounting chamber around the respective electronic device; a housing coolant inlet, for receiving liquid coolant from outside the housing; and a liquid coolant manifold, arranged to receive liquid coolant from the housing coolant inlet and provide the received liquid coolant to each of the chamber coolant inlets.

Classes IPC  ?

• G06F 1/20 - Moyens de refroidissement
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid communication with the first internal volume. The first and/or second internal major surface comprises a first cavity. The first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement

Abrégé

A cold plate is configured to use isolated primary and secondary liquid coolants and comprises: a thermally conductive body defining an internal volume and arranged for mounting with respect to an electronic device, so as to transfer heat from the electronic device to the internal volume; a coolant inlet for receiving the secondary liquid coolant into the internal volume to receive the transferred heat; and a coolant outlet for the secondary liquid coolant to flow out of the internal volume. The thermally conductive body is configured to define an external receptacle having a volume arranged to receive and retain the primary liquid coolant for heat transfer between the primary and secondary liquid coolants. The cold plate may form part of a system for cooling electronic devices.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A nozzle arrangement for cooling an electronic component. The nozzle arrangement comprises: a nozzle for discharging liquid coolant; and a mount configured to disperse the liquid coolant, the mount further configured to be coupled with the electronic component. The nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

A cold plate, comprises: a housing having a surface providing a thermal interface for cooling an electronic device; a channel within the housing proximate to the surface for a liquid coolant to flow therethough such that heat received by the thermal interface is transferred to the liquid coolant; and a coolant port extending outside the housing, for transferring liquid coolant to and/or from the channel. A cross-sectional area of an outlet from the coolant port to the channel may be no larger than that of the channel at the outlet. Pins and/or fins may be arranged within the channel adjacent to the coolant port. The coolant port may cause liquid coolant to enter and/or exit the channel in a direction perpendicular to the surface. The coolant port may comprise an independent rotating fluid connector thereby allowing adjustment in the direction of a pipe coupled to the coolant port.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides

Abrégé

A cooling module and/or a computing system comprising cooling modules are provided. The computing system may comprise: a server rack for holding computing units at different heights; at least two cooling modules for mounting in the server rack, comprising a first housing enclosing a first computing unit. The two cooling modules may house different types of information technology equipment, but have the same height. The cooling module may containing an electronic device and liquid coolant. It may have one or more of: a sidewall with a reinforcement adaptation; an lower and/or upper wall with a central portion that is close to the opposite wall an internal surface further from its outer surface than in another portion of the internal volume; a separable lid with an overlapping ridge; and a thermally conductive component passing through a sidewall.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Computer servers; computers; computer hardware; monitors [computer hardware]; computer apparatus; computer software applications, downloadable; computer software, recorded; computer peripheral devices; cabinets adapted to hold computers; cabinets adapted to hold electrical apparatus; computer modules; electronic equipment, namely computer equipment, data processing equipment; routers; network routers; wireless routers; wide area network (WAN) routers; electrical switches; telecommunication switches; temperature switches; humidity switches; access control devices (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations); integrated access devices (IADs); multiplexers; telecommunication multiplexers; metropolitan area network (MAN) access devices; wide area network (WAN) access devices; data analytics software; edge devices, namely, devices which provide an entry point into core computer networks; cloud computing software; cloud servers; computer servers; network servers; communications servers [computer hardware]; mounting racks for telecommunications hardware; network access server hardware; computer network servers; computer servers; blade servers [computer hardware]; central processing unit [CPU] fans; central processing unit [CPU] coolers. Cooling apparatus; cooling elements (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations); heat exchangers, not parts of machines; heat pumps; cooling installations and machines; cooling appliances and installations; cooling installations for liquids. Database management; database services for business (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations); business management and administration services; operation and management of electronic data centres; outsourcing services in the field of business analytics; provision of information, consultancy and advice relating to the aforesaid. Tele-housing services (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations); advisory and consultancy services concerning telecommunications and multimedia, including specialist advice concerning location, installation and operation of communication systems and data integration with local and worldwide telecommunications infrastructures (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations). Cloud computing; server hosting; rental of web servers; installation of computer software; computer software design; consultancy and advisory services concerning information technology networks, multimedia equipment, computer hardware and computer software, computer, information technology and multimedia systems; analysis services relating to information technology networks, multimedia equipment, computer hardware and computer software, computer and multimedia systems; operation of computer and multimedia equipment for others (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations); telehousing (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations); computer and multimedia hosting services; housing and hosting of data systems (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations); hosting and maintenance of back-end server computers; edge computing services; creation of computing platforms for third parties; edge computing services, namely, centralized nodes for computer networks which enable analytics and data gathering to occur at the source of the data (term considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations); hosting of servers; rental of operating software for computer networks and servers; programming of operating software for computer networks and servers; hosting of Access Control as a Service (ACaaS) servers and software; remote server administration; electronic data storage; provision of information, consultancy and advice relating to the aforesaid; advisory and consultancy services concerning information technology.

Abrégé

An electrical interface provides electrical connections to an electronic device immersed in a fluid within a sealed tank. Electrical connections are provided on surfaces of a circuit board. First and second connection ports are mounted on a first surface for coupling with connectors. First electrical conductors are provided on the first surface, one or more connected to the first connection port and one or more connected to the second connection port. One or more second electrical conductors are on another surface, each coupled to a first electrical conductor by a via. Each via comprises a hole in the circuit board. A sealing gasket having an orifice is mounted on the circuit board, such that the first and second connection ports are accessible from the opposite side of the sealing gasket to the circuit board through the orifice. The hole of each via is covered by the sealing gasket.

Classes IPC  ?

• H05K 5/06 - Enveloppes scellées hermétiquement
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Produits et services

Computer servers; computers; computer hardware; monitors being computer hardware; computer peripheral apparatus; downloadable computer software applications for use in database management; Downloadable computer software applications for use in the management and operation of information technology systems; Downloadable facilities management software to control building environment, access and security systems; Recorded computer software for use in the management and operation of information technology systems; Recorded computer software for use in the management of cooling apparatus, namely, liquid cooling systems for use inside data centers for cooling computer equipment; computer peripheral devices; cabinets adapted to hold computers; cabinets adapted to hold electrical apparatus, namely, cooling systems for use inside data centers for cooling computer equipment; Computer memory modules; electronic equipment, namely, computer peripheral equipment; network routers; wireless routers; wide area network (WAN) routers; electrical switches; telecommunication switches; temperature switches; humidity switches; access control devices in the nature of access control and alarm monitoring systems; integrated access devices (IADs); multiplexers; telecommunication multiplexers; metropolitan area network (MAN) access devices; wide area network (WAN) access devices; Downloadable data analytics software; edge devices, namely, devices which provide an entry point into core computer networks; Downloadable cloud computing software; cloud computing servers; network servers; communications servers being computer hardware; mounting racks for telecommunications hardware; network access server hardware; computer network servers; blade servers being computer hardware; central processing unit (CPU) fans; central processing unit (CPU) coolers Cooling apparatus, namely, liquid cooling systems for use inside data centers for cooling computer equipment; heat exchangers, not being parts of machines; heat pumps; cooling installations and machines filled with a dielectric liquid for cooling server racks and electronic equipment within data centers; cooling appliances and installations, namely, liquid immersion cooling systems for electronic equipment within data centers; liquid cooling installations comprised of a liquid-cooled chassis, heat pump, and exterior water-based cooling loop for cooling electronic components and integrated circuits; the foregoing goods specifically excluding electric refrigerators Database management; database management services for business; business management and administration services; Business operation and management of electronic data centers; outsourcing services in the field of business analytics; provision of business information, consultancy and advice relating to the aforesaid Telecommunications services in the nature of tele-housing; advisory and consultancy services concerning telecommunications and communications multimedia, namely, specialist advice concerning location, installation and operation of communication systems and data integration with local and worldwide telecommunications Cloud computing services, namely, integration of private and public cloud computing environments; cloud computing services, namely, remote and on-site infrastructure management services for monitoring, administration and management of public and private cloud computing IT and application systems; server hosting; rental of web servers; installation of computer software; computer software design; consultancy and advisory services concerning information technology networks, multimedia equipment, computer hardware and computer software, computers, information technology and multimedia systems; Technical analysis services relating to information technology networks, multimedia equipment, computer hardware and computer software, computer and multimedia systems; operation of computer and multimedia equipment for others; computer and multimedia cloud hosting and online website hosting services; cloud housing and hosting of data systems; hosting and maintaining of back-end server computers; creation of computing platform for third parties; edge computing services, namely, centralized nodes for computer networks which enable analytics and data gathering to occur at the source of the data; rental of operating software for computer networks and servers; programming of operating software for computer networks and servers for others; hosting of Access Control as a Service (ACaaS) servers and software; Technical support services, namely, remote server administration; electronic data storage; provision of technical information, consultancy and advice relating to the aforesaid; Technical advisory and consultancy services concerning information technology

Abrégé

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heatis transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. Anozzle arrangementmay direct liquid coolant to abase of the heat sink.

Classes IPC  ?

• H01L 23/433 - Pièces auxiliaires caractérisées par leur forme, p. ex. pistons
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• B65B 7/00 - Fermeture des réceptacles ou récipients après remplissage
• B65B 63/08 - Dispositifs accessoires, non prévus ailleurs, opérant sur des objets ou matériaux à emballer pour échauffer ou refroidir les objets ou matériaux en vue d'en faciliter l'empaquetage
• F25D 23/12 - Aménagements des compartiments annexes aux compartiments de refroidissementRéfrigérateurs combinés avec un autre appareil, p. ex. une cuisinière
• G06F 1/20 - Moyens de refroidissement
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
• H05K 13/00 - Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques

Abrégé

A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement
• F25D 23/12 - Aménagements des compartiments annexes aux compartiments de refroidissementRéfrigérateurs combinés avec un autre appareil, p. ex. une cuisinière
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
• H05K 13/00 - Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
• B65B 7/00 - Fermeture des réceptacles ou récipients après remplissage
• B65B 63/08 - Dispositifs accessoires, non prévus ailleurs, opérant sur des objets ou matériaux à emballer pour échauffer ou refroidir les objets ou matériaux en vue d'en faciliter l'empaquetage

Produits et services

Computer servers; computers; computer hardware; monitors [computer hardware]; computer apparatus; computer software applications, downloadable; computer software, recorded; computer peripheral devices; cabinets adapted to hold computers, cabinets adapted to hold electrical apparatus, computer modules. Cooling apparatus; cooling elements; heat exchangers, not parts of machines; heat pumps; cooling installations and machines; cooling appliances and installations; cooling installations for liquids. Cloud computing; server hosting; rental of web servers; installation of computer software; computer software design.

Produits et services

Computer servers; computers; computer hardware; [ computer monitors; ] computer hardware using liquid submersion cooling technology; computer apparatus in the nature of cooling systems for computers, central processing unit (CPU) coolers, heat sinks for use in computers, heat sinks for use in electronic components and automatic liquid-flow control machines and instruments; downloadable computer software applications for use in operating and managing liquid cooling systems and temperature regulation for computers, computer blade servers, computer hardware, computer peripheral devices, and electronic equipment; computer software for use in operating and managing liquid cooling systems and temperature regulation for computers, computer blade servers, computer servers, computer hardware, and computer peripheral devices; computer peripheral devices; cabinets adapted to hold computers; cabinets adapted to hold computers and electrical apparatus in the nature of computer servers, blade servers, computer chassis, computer hardware, computer peripheral devices, electrical cables, computer cooling apparatus, and water connectors, heat exchangers and pressure pump as part of liquid cooling systems for computers and computer hardware; computer modules, namely, system boards, mother cards, and processors, data processors, data signal processors, micro-processors, signal processors, computer accelerator board, computer servers, computer network adapters, switches, routers and hubs, computer network switches, graphics cards, computer graphics boards, video graphics accelerator, and computer memory modules Liquid cooling apparatus for cooling computers, computer hardware, computer peripherals, computer servers, blade servers, and electronic equipment; cooling elements for cooling computers, computer hardware, computer peripherals, computer servers, blade servers, and electronic equipment; [ heat exchangers, not parts of machines; heat pumps; ] cooling installations and machines for cooling computers, computer hardware, computer peripherals, computer servers, blade servers, and electronic equipment; cooling appliances and installations for cooling computers, computer hardware, computer peripherals, computer servers, blade servers, and electronic equipment; cooling installations for liquids Cloud computing software for use in operating, and managing liquid cooling systems, temperature regulation systems and systems for recovering and reusing waste heat, all in connection with computers, computer blade servers, computer servers, computer hardware, and computer peripheral devices; server hosting; rental of web servers; installation of computer software; computer software design

Produits et services

Computer servers; computers; computer hardware; monitors [computer hardware]; computer apparatus; computer software applications, downloadable; computer software, recorded; computer peripheral devices; cabinets adapted to hold computers, cabinets adapted to hold electrical apparatus, computer modules. Cooling apparatus; cooling elements; heat exchangers, not parts of machines; heat pumps; cooling installations and machines; cooling appliances and installations; cooling installations for liquids. Cloud computing; server hosting; rental of web servers; installation of computer software; computer software design.

Abrégé

A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H05K 13/00 - Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
• G06F 1/20 - Moyens de refroidissement

Abrégé

A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• G06F 1/20 - Moyens de refroidissement
• F25D 23/12 - Aménagements des compartiments annexes aux compartiments de refroidissementRéfrigérateurs combinés avec un autre appareil, p. ex. une cuisinière
• H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
• H05K 13/00 - Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
• B65B 7/00 - Fermeture des réceptacles ou récipients après remplissage
• B65B 63/08 - Dispositifs accessoires, non prévus ailleurs, opérant sur des objets ou matériaux à emballer pour échauffer ou refroidir les objets ou matériaux en vue d'en faciliter l'empaquetage

Abrégé

A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A tank and a lid are configured to mate to provide a substantially airtight container for containing a processing board for a computer and a liquid. A cooling system is configured to cool the interior of the container, and a serial data connection is provided between the processing board and the exterior of the container.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage