Abrégé

The purpose of the present invention is to provide a stable method for manufacturing a card having multiple functions and input and output devices, the method: allowing points of contacts of a financial chip to resolve spaces between external terminals; and resolving a manufacturing problem caused by an excess or a deficiency of a filling liquid. To this end, according to the present invention, the card manufacturing method comprises the steps of: preparing a main part of a card module including, on a PCB having a circuit designed in advance, one or more chips and necessary elements thereof; bonding each corresponding point of contact of a height-compensating pad to a point of contact of a chip of the main part of the card module; molding the entire card module so as to complete the card module; laminating a front printing paper and a rear printing paper on the upper and lower sides of the card module, and upper and lower transparent sheets again on the upper and lower sides thereof; performing primary milling on the upper part of the point of contact of the chip at the width of an external terminal so as to form an external terminal loading part; and loading the external terminal on the external terminal loading part while the point of contact of the chip is electrically connected to each corresponding terminal part of the external terminal.

Classes IPC  ?

• G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
• G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré

Abrégé

The present invention provides: a metal card, which has a noncontact type card function, has at least an entire one side made from an actually thick metal plate, and is for a VVIP customer, the highest class level of customers; and a manufacturing method therefor. A metal card (100, 100', 100'') having a noncontact type card function and having at least one chip embedded therein, of the present invention, comprises: an RFIC chip module (20) for performing noncontact type card function; an inlay (40) having an antenna for directly performing a noncontact type communication of the RFIC chip module (20); a first metal layer (10, 10') having a chip module through-hole (12), into which the RFIC chip module (20) can be inserted, and an inlay loading groove (11) in which the inlay (40) can be loaded; and a second layer (60, 80) bound to a lower side of the first metal layer, wherein a slit (15, 15', 85) is formed at one side of the first metal layer (10, 10') such that the chip module through-hole (12) is to be opened to the outside thereof so as to block the conductivity of the first metal layer at the slit, the inlay (40) has a winding (42), as an antenna, wound therearound in a coil shape, and an inlay terminal (41, 41') which is electrically connected to a terminal (14, 14') of the chip module, and the coil-shaped part excluding a part formed toward the inside thereof is formed more outwardly than the chip module (20) in order to be connected to the inlay terminal (41, 41') of the antenna formed at the inlay (40).

Classes IPC  ?

• G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
• B42D 25/22 - Cartes ou structures de type feuille portant des informations caractérisées par leurs éléments d’identification ou de sécuritéLeur fabrication caractérisées par une utilisation ou une finalité particulières pour utilisation avec des accessoires spécialement conçus pour les cartes portant des informations
• B42D 25/48 - Commande du procédé de fabrication
• B42D 25/475 - Découpe de cartes

Abrégé

The present invention relates to a card using a detonator for coupling an antenna coil of a card and an IC chip contact point by inducing the detonation of the detonator, and to a method for manufacturing same. A front surface overlay sheet, a front surface printed sheet, an inlay sheet on which the antennal coil is wound, a rear surface printed sheet, and a rear surface overlay sheet are bonded in order from the top portion of the card. The antenna coil on the inlay sheet is exposed by means of digging a groove, and a terminal of the IC chip is coupled to the exposed antenna coil by means of the detonation of the detonator, thereby enhancing adhesive strength compared to existing cards, thus reducing defective cards and simplifying the manufacturing process. In addition, since harmful substances, such as lead, are not used, an environmentally friendly card can be provided.

Classes IPC  ?

• G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support