A soldering device (1) comprises: a solder feeder (26) that supplies solder (27) to a soldering iron (24); a drive unit (30) that moves the soldering iron (24); and a processing unit (51) that causes the solder feeder (26) to supply a first amount of solder to a tip (24A) of the soldering iron (24), causes the drive unit (30) to move the tip (24A) of the soldering iron (24) on which the first amount of solder has been melted to a position where the tip (24A) of the soldering iron (24) comes into contact with a soldering site, and causes the solder feeder (26) to supply, at a preset supply start timing, a second amount of solder to the tip (24A) of the soldering iron (24) that has come into contact with the soldering site. The processing unit (51) determines whether or not a heat bridge has been formed due to the first amount of solder being wetted at the position where the tip (24A) of the soldering iron (24) has come into contact with the soldering site, and adjusts the supply start timing so that the second amount of solder is supplied after the processing unit (51) has determined that the heat bridge has been formed.
This soldering device (1) melts solder (27) by means of a soldering iron (24) and performs soldering. The soldering device (1) comprises a processing unit (52) that predicts a temperature change at a soldering site due to contact with the soldering iron (24), and automatically sets a timing of solder supply on the basis of the result of the temperature change prediction.
This soldering device comprises: a solder joint part-forming device that has a soldering iron and forms a solder joint part in a soldering target area; an imaging device that images the solder joint part formed in the target area from a prescribed direction; an illumination device that illuminates the solder joint part formed in the target area from the prescribed direction; and a control device. The control device: causes the imaging device to perform imaging in a state in which the illumination device is providing illumination, thereby obtaining a first image of the solder joint part; causes the imaging device to perform imaging in a state where the illumination device has stopped illuminating, thereby obtaining a second image of the solder joint part; creates a brightness difference image which indicates a difference in brightness between the first image and the second image; and makes a determination about an excess failure and/or a shortage failure of the solder joint part, on the basis of the brightness difference image.
A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.
To provide a tweezer device in which the feel of gripping a housing does not change even when the tips are adjusted in the vertical direction.
To provide a tweezer device in which the feel of gripping a housing does not change even when the tips are adjusted in the vertical direction.
A tweezer device 10 includes a housing 12 configured to change the distance between the distal end of a first housing 13 and the distal end of a second housing 12; a first socket 27 which is arranged in the first housing 13 and into which the proximal end of the first tip 1 can be inserted; a displace mechanism 34 for vertically displacing the first socket 27; and a support member 44 functioning as a rotating fulcrum of the first tip 1 so as to be displaced in the vertical direction by the displacement of the distal end of the first tip 1 whose proximal end is inserted in the first socket 27 in the vertical direction. The first housing 13 has an internal space S1 that allows displacement of the first socket 27 in the vertical direction.
B25B 9/02 - Outils de serrage tenus à la main autres que ceux prévus au groupe sans connexions coulissantes ou pivotantes, p. ex. brucelles, pincettes de cheminées
11.
CONTROL DEVICE, NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM, AND CONTROL METHOD
A control device includes an acquisition portion which acquires a detection value of a temperature detected by a detecting member, a specifying portion which specifies a temperature change trend of a solder processing portion based on history information of a detection value acquired by the acquisition portion, a setting portion which sets a number of heat pulse to be applied to a heating portion by correcting a reference value using a correction value, a control portion which controls the application of the heat pulses to the heating portion based on a setting result of the number of heat pulse by the setting portion, a storage portion which stores the history information. The setting portion sets the correction value using correction information which is different according to whether the temperature change trend is a temperature rising trend or a temperature declining trend.
A heater–sensor complex comprising: a heating wire configured to generate heat by receiving electric power supply; a lead wire which is formed from the same metal as the heating wire, is connected to a base end of the heating wire, and has a thicker diameter than the heating wire; a non-heating wire formed from a metal different from the metal forming the heating wire; and a sensor head formed from a metal different from both the metal forming the heating wire and the metal forming the non-heating wire. The sensor head has a lower thermal conductivity than the non-heating wire. The tip of the heating wire and the tip of the non-heating wire are connected to the sensor head. The heating wire and the non-heating wire conduct through at least the sensor head.
G01K 7/02 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments thermo-électriques, p. ex. des thermocouples
13.
Heater sensor complex and soldering iron tip cartridge
A heater-sensor complex 10 includes a heating wire 12, a lead wire 14 which is made from the same metal of the heating wire 12 and connected to the proximal end of the heating wire 12, the lead wire 14 having a bigger diameter than the heating wire 12, a non-heating wire 16 constituted by a different metal from the metal constituting the heating wire 12, and a sensor head 18 constituted by a metal different from the metal constituting the heating wire 12 or the metal constituting the non-heating wire 16. The sensor head 18 have a lower thermal conductivity than the non-heating wire. To the sensor head 18, the distal end of the heating wire 12 and the distal end of the non-heating wire is connected. The heating wire 12 and the non-heating wire 16 electrically conducts at least through the sensor head 18.
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Educational and instruction services, namely, conducting classes, seminars, conferences, workshops and exams in the field of soldering; providing training in the field of soldering; arranging, conducting and organization of seminars in the field of soldering Computer software design; computer programming services; maintenance of computer software; provision of information relating to computer programming, namely, computer programming of soldering apparatus
A tweezers device is provided having a first leg, a second leg, and a rotating shaft to rotatably connect the first leg and the second leg. A leaf spring biases the first leg and the second leg in a rotating direction of the rotating shaft, working to push away the end of the first leg and the second leg. An opening width-adjusting member is provided to adjust an acceptable opening width between the end of the first leg and the second leg by the rotation of a width-adjusting wheel. The width-adjusting wheel is positioned distally to the rotating shaft, and is rotatable on the axis along the opening direction of the first leg and the second leg.
B25B 9/02 - Outils de serrage tenus à la main autres que ceux prévus au groupe sans connexions coulissantes ou pivotantes, p. ex. brucelles, pincettes de cheminées
A soldering device includes: a soldering iron; a driver for moving the soldering iron; an input receiver for receiving an input of size information of a workpiece; and a controller for controlling the driver. The controller sets a coordinate of a specific position at a predetermined distance away from a soldering position based on the size information, sets, a speed of a tip at a distant position to a predetermined speed, and sets, an evacuation speed from the soldering position to the specific position to a low speed which is lower than the predetermined speed.
A work management apparatus, a work management method, and a non-transitory computer-readable storage medium storing a control program for managing a plurality of soldering works to be manually performed on a board, include: storing, in association with identification information of the board acquired by an identification information acquisition device connected to the work management apparatus, captured images of an entirety of the board and monitor information being chronologically continuous and respectively acquired by an image-capturing device and a soldering monitor device each connected to the work management apparatus in the soldering works; and chronologically displaying each of the captured images and monitor information stored in association with one piece of identification information selected from among the stored identification information of the board in a state where a capturing date and time of the captured image and an acquisition date and time of the monitor information match.
A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
Provided are an operation management device, an operation management method, and a control program for managing a plurality of soldering operations performed manually on a substrate, such that: in association with substrate identification information acquired from an identification information acquisition device connected to the operation management device, a captured image of the entirety of the substrate and monitor information acquired from an imaging device and a soldering monitor device that are connected to the operation management device are stored, the captured image and the monitor information being from during a plurality of soldering operations that are continuous in time series; and the captured image and the monitor information stored in association with one item of identification information selected from among the stored substrate identification information are displayed, in time series, so that the capture date/time of the captured image and the acquisition date/time of the monitor information are matched up.
Provided is a soldering device including: a soldering iron; a driving unit for moving the soldering iron; an input receiving unit for receiving an input of size information of a work; and a control unit for controlling the driving unit. The control unit includes a coordinate setting unit and a retraction speed setting unit. The coordinate setting unit sets the coordinate of a specific location that is a predetermined distance away from a soldering position on the basis of the size information. The retraction speed setting unit sets the speed of the iron tip at a spaced position to a predetermined speed and sets the retraction speed from the soldering position to the specific location to a speed lower than the predetermined speed.
A smartphone, tablet or mobile computer based soldering system control method and apparatus to allow a user or supervisor of users to monitor and control the operating parameters of soldering devices or measuring device. The control method and apparatus has features for cartridge management, temperature calibration and control, user performance and wireless interactive control. The control method may interactively control soldering devices connected directly to a power supply and optionally soldering device components of a soldering system that includes a control station to provide power to the soldering device.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Robots for soldering and desoldering; robots for
metalworking and painting; other industrial robots; electric
soldering apparatus and parts and accessories therefor;
electric soldering irons and parts and accessories therefor;
electric desoldering apparatus and parts and accessories
therefor; electric tools for removing electric and/or
electronic parts for electric desoldering apparatus when
desoldering; metalworking machines and tools and parts and
accessories therefor; soldering machines for semiconductor
substrates and parts and accessories therefor; desoldering
machines for semiconductor substrates and parts and
accessories therefor; semiconductor manufacturing machines
and systems and parts and accessories therefor; solder smoke
absorbers for electric soldering apparatus and electric
desoldering apparatus used for absorbing smokes when
soldering and desoldering; temperature controllers for
electric soldering apparatus and electric desoldering
apparatus used for controlling temperature when soldering
and desoldering; nitrogen generators for electric soldering
apparatus for preheating substrate and reducing soldering
defects by heated nitrogen gas flowed into soldering
apparatus and exhausted from the tip end of the soldering
apparatus; electric solder feeders for electric soldering
apparatus for feeding solders automatically when soldering. Computer software for soldering and desoldering
automatically; computer programs; pre-recorded CD-ROMs;
computer software; electronic machines, apparatus and their
parts; measuring or testing machines and instruments;
electric or magnetic meters and testers; static electrical
charge measuring apparatus; power distribution or control
machines and apparatus; rotary converters; phase modifiers;
batteries and cells.
32.
Composite soldering, de-soldering station load detection
B23K 3/03 - Fers à souderBarres à souder à chauffage électrique
G01R 19/165 - Indication de ce qu'un courant ou une tension est, soit supérieur ou inférieur à une valeur prédéterminée, soit à l'intérieur ou à l'extérieur d'une plage de valeurs prédéterminée
G01K 1/02 - Moyens d’indication ou d’enregistrement spécialement adaptés aux thermomètres
H05K 13/08 - Contrôle de la fabrication des ensembles
A soldering iron control device (100) serving to control the temperature of the tip (221) of a soldering iron and comprising the following elements: a first storage unit (110) for storing in advance a first electrical amount that is supplied to the soldering iron in an idling state in which the tip is not in contact and the temperature of the tip is maintained within a prescribed range that includes a set temperature; a measurement unit (111) that when a load state is brought about, where the temperature of the tip has fallen from the set temperature by at least a prescribed amount due to the tip making contact with a workpiece, measures a third electrical amount obtained by subtracting the first electrical amount from a second electrical amount supplied to the soldering iron in the load state; a determination unit (112) for determining whether the third electrical amount exceeds a threshold value; and a notification unit (114) for issuing an alarm when it is determined that the third electrical amount has exceeded the threshold value.
The invention is directed to embodiments of a temperature sensor for use with a temperature measuring device, for example a digital thermometer. The temperature sensor includes at least two and preferably three wires joined at a thermocouple. The temperature sensor is designed to be mounted on terminals of the digital thermometer sensor to allow precise temperature measurements for a thermal device, for example a soldering tool or de-soldering tool.
G01K 7/02 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments thermo-électriques, p. ex. des thermocouples
B23K 3/03 - Fers à souderBarres à souder à chauffage électrique
G01K 1/14 - SupportsDispositifs de fixationDispositions pour le montage de thermomètres en des endroits particuliers
H01L 35/30 - DISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS - Détails fonctionnant exclusivement par effet Peltier ou effet Seebeck caractérisés par les moyens d'échange de chaleur à la jonction
H01L 35/32 - DISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS - Détails fonctionnant exclusivement par effet Peltier ou effet Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif
G01K 1/00 - Détails des thermomètres non spécialement adaptés à des types particuliers de thermomètres
G01K 1/08 - Dispositifs de protection, p. ex. étuis
09 - Appareils et instruments scientifiques et électriques
Produits et services
(1) Robots for soldering and desoldering; robots for metalworking and painting; electric soldering machines and parts therefor; electric soldering irons and parts therefor; electric desoldering machines and parts therefor; electric tools for removing electric and electronic parts for electric desoldering machines when desoldering; metalworking machines and tools and parts therefor; soldering machines for semiconductor substrates and parts therefor; desoldering machines for semiconductor substrates and parts therefor; solder smoke absorbers for electric soldering machines and electric desoldering machines used for absorbing smokes when soldering and desoldering; temperature controllers for electric soldering machines and electric desoldering machines used for controlling temperature when soldering and desoldering; nitrogen generators for electric soldering machines for preheating substrate and reducing soldering defects by heated nitrogen gas flowed into soldering machines and exhausted from the tip end of the soldering machines; electric solder feeders for electric soldering machines for feeding solders automatically when soldering
(2) Computer software for soldering and desoldering automatically; computer programs for unified management of different types of products for the purpose of checking user operation history through data log aggregation of each product; pre-recorded CD-ROMs containing videos, instruction material, and software programs for soldering and desoldering automatically; preinstalled computer software for soldering and desoldering automatically; electronic machines, apparatus and their parts, namely, tablet computers, computers, bar code readers, electrical controllers, electronic control machines for electric soldering machines, soldering irons and desoldering machines, and computer hardware with preinstalled software for soldering and desoldering automatically; measuring or testing machines and instruments, namely, thermometers other than for medical use, voltmeters and flowmeters; rotary converters; phase modifiers
09 - Appareils et instruments scientifiques et électriques
Produits et services
Industrial robots for soldering and desoldering; industrial robots; electric soldering apparatus and structural parts therefor; electric soldering irons and structural parts therefor; electric desoldering apparatus and structural parts therefor; electric desoldering tools for removing electric and electronic parts soldered on a printed circuit board; soldering machines for semiconductor substrates and structural parts therefor; desoldering machines for semiconductor substrates and parts therefor; solder smoke absorbers being structural parts of electric soldering apparatus and electric desoldering apparatus used for absorbing smokes when soldering and desoldering; temperature controllers being structural parts of electric soldering apparatus and electric desoldering apparatus used for controlling temperature when soldering and desoldering; nitrogen generators being structural parts of electric soldering apparatus for preheating substrate and reducing soldering defects by heated nitrogen gas flowed into soldering apparatus and exhausted from the tip end of the soldering apparatus; electric solder feeders for electric soldering apparatus for feeding solders automatically when soldering Downloadable computer software for soldering and desoldering automatically; preinstalled computer software for soldering and desoldering automatically; downloadable computer programs for unified management of different types of products for the purpose of checking user operation history through data log aggregation of each product; pre-recorded CD-ROMs containing videos, instruction material, and software programs for soldering and desoldering automatically; electronic machines, apparatus and their parts, namely, tablet computers, computers, bar code readers, electrical controllers, electronic control apparatus for electric soldering apparatus, soldering irons and desoldering apparatus, and computer hardware with preinstalled software for soldering and desoldering automatically; measuring or testing machines and instruments, namely, thermometers other than for medical use, voltmeters and flowmeters; static electrical charge measuring apparatus
A handheld device for thermal cartridges which may include a wire stripping cartridge for stripping insulation from sections of an insulated electrical wire, or a thermal tweezer cartridge for de-soldering and removing electrical components, and more particularly a hand-operated electrically heated thermal devices with a replaceable cartridges.
H02G 1/12 - Méthodes ou appareils spécialement adaptés à l'installation, entretien, réparation, ou démontage des câbles ou lignes électriques pour supprimer l'isolant ou l'armature des câbles, p. ex. de leur extrémité
H05B 3/06 - Éléments chauffants combinés constructivement avec des éléments d'accouplement ou avec des supports
38.
Soldering apparatus, computer-readable medium, and soldering method
Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.
G05B 19/18 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique
G06F 30/39 - Conception de circuits au niveau physique
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.
A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.
The present application discloses a soldering apparatus including a driving portion for moving a soldering iron to perform soldering on a surface of an electronic board including soldering regions. The soldering regions have a base region and at least one replication region existing at a position different from the base region. The replication region has an arrangement pattern that is the same as an arrangement pattern of a soldering position in the base region. The soldering apparatus includes an input portion for receiving input of positional relationship data, which represents a positional relationship between the base region and the at least one replication region, and for receiving base pattern data, which represents the arrangement pattern of the soldering position in the base region. The soldering apparatus includes a controller which causes the driving portion to move the soldering iron based on the base pattern data and the positional relationship data in a soldering operation.
A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.
This soldering iron control device (100) can be electrically connected to a soldering iron (200), and controls the temperature of a bit (221) of the soldering iron (200). The soldering iron control device (100) comprises a storage unit (109b) and a measurement unit (109c). The storage unit (109b) stores in advance first electrical energy that is supplied to the soldering iron (200) in an idling state in which the bit (221) is not in contact with the workpiece and the temperature of the bit (221) is maintained within a prescribed range that includes a set temperature. The measurement unit (109c) measures third electrical energy obtained by subtracting the first electrical energy from second electrical energy that is supplied to the soldering iron (200) in a loaded state in which the bit (221) comes into contact with the workpiece to thereby lower the temperature of the bit (221) by at least a prescribed amount from the set temperature.
A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.
A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.
A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.
A soldering apparatus and method involves capturing an image of a soldering operation, and storing image data in association with that particular soldering operation. A soldering tool that is used to perform the soldering operation has a position during the soldering operation, and the image data could also be stored in association with data for that particular position. The position data could be for an operation start point and/or an operation endpoint. Associating the image data in this way could help a manufacturer investigate soldering abnormalities that might be reported after a product is shipped to a customer.
A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.
G06F 19/00 - Équipement ou méthodes de traitement de données ou de calcul numérique, spécialement adaptés à des applications spécifiques (spécialement adaptés à des fonctions spécifiques G06F 17/00;systèmes ou méthodes de traitement de données spécialement adaptés à des fins administratives, commerciales, financières, de gestion, de surveillance ou de prévision G06Q;informatique médicale G16H)
G05B 19/10 - Commande à programme autre que la commande numérique, c.-à-d. dans des automatismes à séquence ou dans des automates à logique utilisant des sélecteurs
G05B 19/042 - Commande à programme autre que la commande numérique, c.-à-d. dans des automatismes à séquence ou dans des automates à logique utilisant des processeurs numériques
B23K 1/018 - DébrasageEnlèvement de soudure fondue ou d'autres résidus
The invention is directed to a nozzle for a hot air device used in the electronic assembly industry to melt solder or heat shrink-wrap insulators. The nozzle provides a uniform temperature environment and suppresses the occurrence of local excess heating.
F24H 3/04 - Appareils de chauffage d'air à circulation forcée l'air étant en contact direct avec l'agent chauffant, p. ex. élément chauffant électrique
A static electricity dissipating resin hose according to the present invention is characterized by being configured from an inner layer that makes contact with fluid, an intermediate layer comprising two layers that are a first intermediate layer and a second intermediate layer, a reinforcing layer, and an outer layer, wherein: the inner layer is formed of a chemical-resistant resin and a conductive substance; the first intermediate layer is formed of a conductive substance and a resin having fusibility with respect to the inner layer and the second intermediate layer; the second intermediate layer is formed of a conductive substance and a resin having fusibility with respect to the first intermediate layer and the outer layer; the reinforcing layer provided between the second intermediate layer and the outer layer includes at least conductive fiber or a metal wire; and the outer layer is formed of a thermoplastic resin or elastomer. Accordingly, provided is a static electricity dissipating resin hose which has a good neutralization and is capable of safely removing static electricity generated by, for example, friction between fluid and the inner layer of the hose, which is free from risk of damage due to the influence of stray current, and which has less fluctuation in terminal-to-terminal resistance even when the length used is increased.
A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiquesDispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
F16M 11/04 - Moyens pour la fixation des appareilsMoyens permettant le réglage des appareils par rapport au banc
F16M 11/08 - Moyens pour la fixation des appareilsMoyens permettant le réglage des appareils par rapport au banc permettant la rotation autour d'un axe vertical
F16M 11/18 - Têtes des supports avec mécanisme déplaçant les appareils par rapport au banc
F16M 11/10 - Moyens pour la fixation des appareilsMoyens permettant le réglage des appareils par rapport au banc permettant la rotation autour d'un axe horizontal
F16M 11/24 - Infrastructure avec ou sans roues à hauteur ou longueur modifiables des pieds, avec utilisation possible pour le transport également
A heater cartridge comprises a heater contained within a distal section of housing pipe near a working portion, such as soldering iron tip or a blade for stripping wire. The wall thickness of the housing pipe is generally thin to limit heat transfer to a proximal section of the housing pipe near where a user's hand would be normally located. The wall thickness is thinner in a region near the heater as compared to a region expected to have a high bending moment.
H05B 6/10 - Appareils de chauffage par induction, autres que des fours, pour des applications spécifiques
B23K 3/03 - Fers à souderBarres à souder à chauffage électrique
H02G 1/12 - Méthodes ou appareils spécialement adaptés à l'installation, entretien, réparation, ou démontage des câbles ou lignes électriques pour supprimer l'isolant ou l'armature des câbles, p. ex. de leur extrémité
The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.
B23K 37/00 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe
B23K 3/03 - Fers à souderBarres à souder à chauffage électrique
G01K 7/02 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments thermo-électriques, p. ex. des thermocouples
This ink supply tube comprises an inner layer that makes contact with ink, an intermediate layer comprising at least three layers, and an outer layer, and is characterized in that: the intermediate layer includes a first intermediate layer, a second intermediate layer and a third intermediate layer; the inner layer comprises any of an ethylene-tetrafluoroethylene copolymer resin, a tetrafluoroethylene-perfluoroalkoxy alkane copolymer resin, or a modified perfluoroalkoxy resin, which have solvent resistance, oxygen barrier properties and low moisture permeability; the first intermediate layer comprises a polyamide resin, which is fusible with the inner layer or the second intermediate layer; the second intermediate layer comprises an ethylene-vinyl alcohol copolymer resin, which has oxygen barrier properties; the third intermediate layer is fusible with the second intermediate layer or the outer layer and comprises an adhesive polyolefin resin, which has low moisture permeability; and the outer layer comprises a thermoplastic resin or elastomer. Due to this configuration, the present invention provides an ink supply tube for ink jet printers, which has excellent solvent resistance and flexibility, and which is superior in terms of oxygen barrier properties and low moisture permeability.
The object of the invention is to provide a nozzle for a desoldering tool that facilitates the removal of solder from components having a large difference between the width and thickness dimensions of the solder connection. The present application discloses a nozzle for use with a desoldering tool for melting and sucking solder away. The nozzle includes a distal end surface which is heated to a temperature melting the solder. The distal end surface, as an upstream end of a molten solder suction path, defines a non-circular elongated generally oval shaped opening.
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
B23K 1/018 - DébrasageEnlèvement de soudure fondue ou d'autres résidus
A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.
A tube for supplying a UV ink of an inkjet printer, which is configured of a single resin layer or a plurality of resin layers, and which is characterized by having visible light transmissivity and light blocking properties in the ultraviolet wavelength range. Consequently, it becomes possible to provide a tube for supplying a UV ink of an inkjet printer, which is capable of visualizing the state of a UV ink within the tube, while blocking unfavorable light such as ultraviolet light in an inkjet printer that uses the UV ink.
B41J 2/01 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre
F16L 11/04 - Manches, c.-à-d. tuyaux flexibles en caoutchouc ou en matériaux plastiques flexibles
The present invention pertains to a structure for a heater/sensor sub-assembly for a soldering cartridge and solder suction cartridge of a soldering system. This structure provides high heat capacity and accurate soldering-iron-tip-temperature detection and control functions. A coil part of a heater assembly is set apart from a distal end part of the sub-assembly toward the base end side in order to place a distance between a thermocouple temperature sensor and a coil. The solder cartridge includes connector wires linking a coil wire of a heater to a connecting part between a handle and a soldering station, the connector wires varying in size and material in order to reduce the conduction of heat to the handle.
B23K 3/03 - Fers à souderBarres à souder à chauffage électrique
G01K 7/02 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments thermo-électriques, p. ex. des thermocouples
A noise suppression circuit board design to provide a power supply to an inductive heating element is disclosed. The noise suppression circuit provides a configuration for a multi-layer circuit board that has radiation noise emissions below the CISPR 11 (limits and methods of measurements of radio disturbance characteristics of industrial, scientific and medical (ISM) radio-frequency equipment) thresholds in the 30 MHz to 1 GHz frequency range.
The present invention is intended to ease the control and management of soldering devices, and enhance convenience. In accordance with the intention of the invention, a system includes a power supply unit having a connecting cable to be connected to soldering devices, a power supply portion supplying power to the soldering devices through the connecting cable, a power supply control portion to control the power supply from the power supply portion based on a temperature setting signal T(s) set in advance and a control unit that may be physically separated from the power supply unit but which inputs the temperature setting signal T(s) to the power supply control portion of the power supply unit.
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Metal junctions for pipes; Metal junctions for hoses. Pipes made of synthetic resin; Hoses made of synthetic resin; Pipes made of plastic; Hoses made of plastic; Junctions for pipes [not of metal].
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Metal junctions for pipes; Metal junctions for hoses. Pipes made of synthetic resin; Hoses made of synthetic resin; Pipes made of plastic; Hoses made of plastic; Junctions for pipes [not of metal].
80.
Process for fabricating inductive heated solder cartridge
A method or process of fabricating a solder cartridge and solder cartridge made according to the process is disclosed. The solder cartridge made according to the process provides a self-temperature regulating solder tip for an inductive current soldering station having improved heater quality and stability with reduced manufacturing costs.
A soldering assembly comprises a heater, a lock member, and a bias member. The lock member is moveable relative to the heater, includes a ramp feature, and is configured to receive a tip or a tip holder. The bias member is configured to urge movement of the lock member away from a distal segment of the heater.
A method of making a soldering tip involves heating a soldering tip cap which contains a heat-conducting material. The heating is performed with magnetic induction applied to the soldering tip cap. Inner spaces of the soldering tip cap become filled in with the heat-conducting material.
A solder handling assembly comprises a heating portion, a casing, a variable resistor, a connecting member coupled to the variable resistor, and an elastic-resilient member movable from a first state to a second state. The connecting member is rotatable relative to the casing and is configured to adjust a resistor value of the variable resistor when the connecting member is rotated relative to casing. When the elastic-resilient member is in the first state, the connecting member is prevented from rotating relative to the casing. When the elastic-resilient member is in the second state, the connecting member can be rotated relative to the casing.
An air filter assembly has a fan, pre-filter, a main filter, and a control circuit which generates various signals to the user as to when the pre-filter and the main filter should be replaced. The control circuit detects when the pre-filter should be replaced from two conditions: a first pre-filter replacement condition based decreased air flow, and a second pre-filter replacement condition based on cumulative operating time. The control circuit detects when the main filter should be replaced based on a formula containing a number of the occurrences of the first pre-filter replacement condition and a number of occurrences of the second pre-filter replacement condition. The control circuit also detects a main filter replacement condition based on cumulative operating time of main filter. The main filter can have a fuse that is blown when the main filter should be replaced.
A solder handling temperature controller comprises a body (10) of the solder handling temperature controller, a rotating shaft (77) housed in the body (10) and adapted to be rotatable about its axis, a set temperature changing means (75) adapted to change a set temperature according to a rotation angle of the rotating shaft (77), a rotary knob (20) supported by the body (10) in a rotatable manner relative to the rotating shaft (77), and a temperature lock key (40) adapted to be selectively insertable into and withdrawable from the body (10) in a position coaxial with the rotating shaft (77) and the knob (20), and, in an inserted state thereof, to mechanically couple the rotating shaft (77) and the knob (20) together to allow them to be interlockingly rotated, wherein, when the temperature lock key (40) is withdrawn from the body (10), the coupling between the rotating shaft (77) and the knob (20) is released to prohibit the change of the set temperature by the rotation of the knob (20).
A fan assembly is adjustable between two suction modes by alternating the position of the fan assembly on a flat surface, such as a table top. The fan assembly has two separate suction openings, one smaller than the other, which are selectively sealed by the flat surface. The suction openings are bounded by planar edges of an air guide that protrudes outward from a fan casing of the assembly. In one position, a first suction opening is unobstructed by the flat surface while the second suction opening is either partially obstructed or substantially sealed by the flat surface. In another position, the second suction opening is unobstructed by the flat surface while the first suction opening is substantially sealed by the flat surface.
A soldering iron system includes a power assembly that provides power to an induction heater at a variable voltage and a variable frequency. A control assembly adjusts the temperature of the heater in accordance with signals from a current detector coupled to the induction heater and a selection made by the user on an operating level selector.
A high-frequency induction heating system for a soldering iron includes a power assembly capable of supplying power with various voltages and frequencies. A control assembly supplies power to a coil with voltages including the voltage range within which the heating member reaches the Curie point and with frequencies. The temperature of the heating member is controlled by signals sent from a current detector connected to the heating member.
A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.
Disclosed is a soldering device provided with a soldering tip having a front end and rear end. A blind bore is formed at the rear end of the soldering tip. An accommodating recess is formed at the bottom of this bore. A heater is arranged in the bore. A temperature sensor that is positioned between the heater and the front end of the soldering tip is arranged in this accommodating recess. A pipe is arranged in the accommodating recess. The pipe holds the temperature sensor within the accommodating recess and ensures thermal conduction between the soldering tip and the temperature sensor.
A soldering iron stand comprises a stand base, and a soldering iron holder provided on an upper portion of the stand base and formed to have a curved surface for receiving thereon a soldering iron to be held by the stand base. The soldering iron holder has a plurality of recesses formed therein and arranged in a circumferential direction of the curved surface. Each of the recesses is provided with a heat-resistant elastic member.
In a baffle device 20 fixedly provided in an air passage of a mechanism for blowing out hot air to a solder treatment portion, vanes inclined with a predetermined inclination angle with respect to an air flow are provided substantially radially with a predetermined interval. Also, in a nozzle to be attached to the hot air blower for solder treatment, the baffle device 20 is fixedly provided in an in-nozzle air passage. Moreover, in the hot air blower for solder treatment which blows out hot air to the solder treatment portion, the baffle device 20 is fixedly provided in an in-blower air passage.
A temperature control device for handling solder comprises a body (10) of the temperature control device for handling solder (1), a rotating shaft (77) built into the body (10) and rotatable about its axis, a set temperature changing means (75) for changing the set temperature according to the rotation angle of the rotating shaft (77), a rotary knob (20) supported to body (10) so as to be rotatable about the rotating shaft (77), and a temperature lock key (40) insertable into and removable from the body (10) at a coaxial position with the rotating shaft (77) and the knob (20) and, when inserted, mechanically coupling the rotating shaft (77) and the knob (20) so that they rotate interlockingly. While the temperature lock key (40) is removed from the body (10), the coupling between the rotating shaft (77) and the knob (20) is released to thereby prohibit the change of the set temperature by the rotation of the knob (20).
This invention provides a heating apparatus for a heat shrinkable tube that, after heating a member in which a heat shrinkable tube has been installed, can prevent a deterioration in a finishing appearance and quality of the member. A heating apparatus (1) as a heating apparatus for a heat shrinkable tube comprises a heating part (9) and an individual cooling part (16). The heating part (9) heats a plurality of members, in which the heat shrinkable tube has been installed, while transferring the plurality of members. The individual cooling part (16) cools the plurality of members carried out from the heating part while holding them in such a state that the heat shrinkable tubes respectively in the members do not come into contact with each other.
B29C 63/42 - Garnissage ou gainage, c.-à-d. application de couches ou de gainages préformés en matière plastiqueAppareils à cet effet par libération de contraintes internes en utilisant des couches ou des gainages tubulaires
B65B 53/02 - Contraction des enveloppes, des réceptacles, des couvercles de réceptacles ou des éléments destinés à fixer les couvercles des réceptacles, durant ou après l'emballage par la chaleur
B65G 49/02 - Systèmes transporteurs caractérisés par leur utilisation à des fins particulières, non prévus ailleurs pour transporter des pièces à usiner dans des bains de liquide
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H01B 13/06 - Isolation des conducteurs ou des câbles
