Abrégé

The present disclosure relates to systems, devices and methods for the enhanced efficiency of capturing agents of interest from a sample.

Classes IPC  ?

• C12N 15/10 - Procédés pour l'isolement, la préparation ou la purification d'ADN ou d'ARN

Abrégé

A member for forming a wiring includes an adhesive layer and a metal foil layer. The adhesive layer is formed from an adhesive composition including electrically conductive particles. The metal foil layer is disposed on the adhesive layer. In this member for forming a wiring, a ratio of surface roughness Rz of a first surface of the metal foil layer on a side attached to the adhesive layer with respect to an average particle diameter of the electrically conductive particles is 0.05 to 3.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal

Abrégé

This adhesive composition contains: a pyridinium salt represented by general formula (1); a cationic polymerizable compound; and a polymerization initiator, wherein the polymerization initiator contains an onium salt. An adhesive film for circuit connection contains said adhesive composition and conductive particles. This connection structure comprises: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connection section that is positioned between the first circuit member and the second circuit member, and electrically connects the first electrode and the second electrode to each other, wherein the connection section includes a cured product of the adhesive film for circuit connection.

Classes IPC  ?

• C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 11/06 - Additifs non macromoléculaires organiques
• C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
• H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
• C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

An aspect of the present disclosure relates to a polymer including a structural unit represented by the following Formula (I) and a structural unit having a carboxy group. In Formula (I), R1represents a hydrogen atom or a methyl group; M represents an alkylene group or an alkylene oxide chain; and R2 represents an alkyl group or an aryl group.

Classes IPC  ?

• C08F 220/02 - Acides monocarboxyliques contenant moins de dix atomes de carboneLeurs dérivés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

Disclosed is a film adhesive. The film adhesive comprises a thermosetting resin, a curing agent, an elastomer, and an inorganic filler having an average particle diameter of 400 nm or less. The content of the inorganic filler is 18-40% by mass relative to the total amount of the film adhesive.

Classes IPC  ?

• H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées

Abrégé

Disclosed is a film for temporary fixing, the film being used for temporarily fixing a semiconductor member and a support member. The film for temporary fixing contains carbon black and a curable resin component. In the film for temporary fixing, the content of the carbon black satisfies at least one condition among the following conditions (i) and (ii).　Condition (i): the content of the carbon black is 0.1 to 25 parts by mass with respect to 100 parts by mass of the total amount of the curable resin component.　Condition (ii): the content of the carbon black is 0.1 to 10 vol% with respect to the total amount of the film for temporary fixing.

Classes IPC  ?

• H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
• H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements

Abrégé

(X) The present invention provides a photosensitive resin composition containing an inorganic filler having a true density of 1,500 kg/m3 or less. The present invention also provides a photosensitive resin film that is formed by using the photosensitive resin composition. Additionally, the present invention provides a multilayer printed wiring board containing an interlayer insulation layer that is formed by using the photosensitive resin composition or the photosensitive resin film, and also provides a method for manufacturing the multilayer printed wiring board. Furthermore, the present invention provides a semiconductor package including the multilayer printed wiring board and a semiconductor element.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles
• G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
• G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs

Abrégé

The present invention relates to a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, (B) a (meth)acrylate compound having two or more (meth)acryloyl groups, (C) a compound having two or more ethylenically unsaturated groups which are not (meth)acryloyl, (D) a photopolymerization initiator, and (E) an organic peroxide.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles
• G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques

Abrégé

The present invention relates to: a resin composition comprising (A) a heat-curable resin, (B) a poly(phenylene ether)-based resin, (C) an alkoxysilane compound having a primary amino group, and (D) an inorganic filler; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package each obtained using the resin composition.

Classes IPC  ?

• C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
• C08J 5/04 - Renforcement des composés macromoléculaires avec des matériaux fibreux en vrac ou en nappes
• C08K 3/013 - Charges, pigments ou agents de renforcement
• C08K 5/544 - Composés contenant du silicium contenant de l'azote
• C08L 71/12 - Oxydes de polyphénylène

Abrégé

The present invention discloses a method of manufacturing an electronic component device according to an imprint method that includes: forming, on a substrate, one or more electronic components arranged on a principal surface of the substrate and a sealing structure including a curable sealing resin layer for sealing the electronic components; and pushing a mold into the sealing resin layer from a side opposite the substrate. The method includes forming multiple via holes extending in the thickness direction of the sealing resin layer, hardening the sealing resin layer, and forming multiple conductive vias that fill the multiple via holes. The one or more electronic components are arranged in one or more mounting areas on the principal surface of the substrate, some or all of the multiple via holes are arranged at intervals to form one or more rows, and each of the mounting areas is surrounded by one or more of the rows.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements

Abrégé

The present invention provides a production method for an adhesive sheet 1A for semiconductor device production that comprises a release film 2 and an adhesive film 3 that is provided on the release film 2. The production method for the adhesive sheet 1A includes a preparation step for preparing a backed laminate 8 that comprises a laminate 6 that includes a release film 2 and an adhesive film layer 5 that is provided on the release film 2 and a backing material 7 that is stuck to the release film 2 side of the laminate 6, a laminate cutting step for cutting a cut c1 into the laminate 6 along an arbitrary cutout shape, and a backing material peeling step for peeling the backing material 7 from the laminate 6. During the backing material peeling step, the portion 6A of the laminate 6 that is in the region surrounded by the cut c1 remains stuck to the backing material 7 and is removed.

Classes IPC  ?

• C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
• H01R 43/00 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

00000≤280

Classes IPC  ?

• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 11/04 - Additifs non macromoléculaires inorganiques
• C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

Disclosed is a method for manufacturing a wiring board, said method including in the following order: forming a resist layer upon a seed layer that includes a metal and is provided upon a support body; exposing the resist layer to light and developing the same so as to form, on the resist layer, a pattern including openings from which the seed layer is exposed; and forming a copper plating layer by electrolytic plating upon the seed layer exposed within the openings. The arithmetic mean roughness Ra of the surface of the seed layer on the reverse side from the support body is 0.05 μm to 0.30 μm inclusive.

Classes IPC  ?

• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal

Abrégé

The present invention provides a CMP polishing liquid that contains abrasive grains, an additive, and water. The abrasive grains contain cerium-based particles. The additive contains: (A) a 4-pyrone-based compound represented by the following general formula (1); and, (B1) a compound having a pH of 5.0 or higher in a 1 mM aqueous solution, or, (B2) a cyclic compound having at least one functional group selected from the group consisting of carboxy groups, carboxylate groups, amino groups, and hydroxy groups. The present invention provides a CMP polishing liquid that contains abrasive grains, an additive, and water. The abrasive grains contain cerium-based particles. The additive contains ethylene dinitrilotetraethanol. [In the formula, X11, X12, and X13 are each independently a hydrogen atom or a monovalent substituent.]

Classes IPC  ?

• H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe

Abrégé

Disclosed is a method for manufacturing a wiring board, said method including in the following order: forming a resist layer upon a seed layer that includes a metal and is provided upon a support body; exposing the resist layer to light and developing the same so as to form, on the resist layer, a pattern including openings from which the seed layer is exposed; and forming a copper plating layer by electrolytic plating upon the seed layer exposed within the openings. The arithmetic mean roughness Ra of the surface of the seed layer on the reverse side from the support body is 0.05 μm to 0.30 μm inclusive.

Classes IPC  ?

• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal

Abrégé

A photosensitive film which comprises (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a pyrazoline compound, and which has a thickness of 20 μm or less. A photosensitive element 1 which is provided with a supporting body 2 and a photosensitive resin layer 3 that is arranged on the supporting body 2, wherein the photosensitive resin layer 3 is the above-described photosensitive film. A method for producing a multilayer body, the method comprising: an arrangement step in which a photosensitive resin layer is arranged on a base material with use of the above-described photosensitive film or the above-described photosensitive element 1; a step in which a part of the photosensitive resin layer is photocured; and a step in which a cured product pattern is formed by removing at least a part of an uncured portion of the photosensitive resin layer.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles
• G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
• G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques

Abrégé

A polishing liquid for CMP, the polishing liquid containing abrasive grains, an additive and water, wherein: the abrasive grains contain cerium particles; and the additive contains (A1) a 4-pyrone compound represented by general formula (1) and (B) a compound having two or more nitrogen atoms, each of which is bonded with a hydroxyalkyl group. A polishing liquid for CMP, the polishing liquid containing abrasive grains, an additive and water, wherein: the abrasive grains contain cerium particles; and the additive contains (A2) picolinic acid and (B) a compound having two or more nitrogen atoms, each of which is bonded with a hydroxyalkyl group. (In the formula, each of X11, X12and X13 independently represents a hydrogen atom or a monovalent substituent.)

Classes IPC  ?

• H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe

Abrégé

This polishing liquid for CMP contains abrasive grains, an additive, and water, wherein: the abrasive grains include cerium-based particles; and the additive contains (A) a 4-pyrone-based compound represented by general formula (1), and (B1) a compound of which a 1 mM aqueous solution has a pH of at least 3.7 or (B2) a cyclic compound having at least one functional group selected from the group consisting of a carboxy group, a carboxylate group, an amino group, and a hydroxy group. This polishing liquid for CMP contains abrasive grains, an additive, and water, wherein the abrasive grains include cerium-based particles, and the additive contains a compound having at least two nitrogen atoms to which a hydroxyalkyl group is bonded. [In the formula, X11, X12, and X13 are each independently a hydrogen atom or a monovalent substituent.]

Classes IPC  ?

• H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe

Abrégé

Provided is a polishing liquid for CMP, wherein: the polishing liquid contains abrasive grains, an additive, and water; the abrasive grains contain cerium-based particles; the additive contains (A1) a 4-pyrone-based compound represented by general formula (1) and (B) saturated monocarboxylic acid; and the pH of the polishing liquid exceeds 4.0. Also provided is a polishing liquid for CMP, wherein: the polishing liquid contains abrasive grains, an additive, and water; the abrasive grains contain cerium-based particles; the additive contains (A2) picolinic acid and (B) saturated monocarboxylic acid; and the pH of the polishing liquid exceeds 4.0.　(In the formula, X11, X12, and X13 are each independently a hydrogen atom or a monovalent substituent group.)

Classes IPC  ?

• H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe

Abrégé

Provided is a polishing solution for polishing a surface to be polished containing a tungsten material. The polishing solution contains abrasive grains, an iron-containing compound, and an oxidant. The abrasive grains contain silica particles, the average particle diameter of the abrasive grains is 40-140 nm, and the silanol group density of the silica particles is 8.0 items/nm 2 or less. Provided is a polishing method that uses the polishing solution to polish the surface to be polished containing a tungsten material.

Classes IPC  ?

• H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe

Abrégé

A method for producing a highly proliferative cell, which is a method for producing a highly proliferative cell or an epiblastic progenitor cell, the method comprising (i) preparing an epiblastic cell that serves as a raw material, (ii) performing culture in a culture medium containing a low-molecular-weight signaling pathway inhibitor while bringing the inhibitor into contact with the epiblastic cell that serves as the raw material, and (iii) performing additional culture in a culture medium containing the inhibitor after the above-mentioned contact to produce a culture containing a highly proliferative cell having increased cell proliferation capability compared with the epiblastic cell that serves as the raw material; a highly proliferative cell which has the characteristic properties of an epiblastic cell and has such a proliferation capability that the number of cells after the elapse of a culture period of longer than 28 days while contacting with a low-molecular-weight signaling pathway inhibitor is more than 1.0 time the number of cells of the epiblastic cell that is cultured for the same culture period under the same culture conditions except that the cells are not in contact with the inhibitor; a cell secretion derived from the aforementioned highly proliferative cell or a highly proliferative cell produced by the highly proliferative cell production method; a cell secretion containing a specific protein and/or miRNA; a pharmaceutical composition which contains each of the cell secretions and is used for the prevention or treatment of a disorder associated with a peripheral nerve cell or a central nerve cell; and a method for depressing a sympathetic nervous system, the method comprising bringing the highly proliferative cell produced by the production method or a cell secretion secreted from the highly proliferative cell into contact with a nerve cell.

Classes IPC  ?

• C12N 5/079 - Cellules neurales
• A61K 35/30 - NerfsCerveauYeuxCellules cornéennesLiquide céphalorachidienCellules souches neuronalesCellules précurseurs neuronalesCellules glialesOligodendrocytesCellules de SchwannAstrogliesAstrocytesPlexus choroïdeTissu de moelle épinière
• A61P 25/00 - Médicaments pour le traitement des troubles du système nerveux
• A61P 25/02 - Médicaments pour le traitement des troubles du système nerveux des neuropathies périphériques
• C12N 1/00 - Micro-organismes, p. ex. protozoairesCompositions les contenantProcédés de culture ou de conservation de micro-organismes, ou de compositions les contenantProcédés de préparation ou d'isolement d'une composition contenant un micro-organismeLeurs milieux de culture

Abrégé

This method for producing a semiconductor device comprises: a step for preparing a first semiconductor chip having a first chip body, and a first insulating film and a first electrode that are provided to one surface of the first chip body; a step for preparing a second semiconductor chip having a second chip body, and a second insulating film and a second electrode that are provided to one surface of the second chip body; a step for pasting together the first insulating film of the first semiconductor chip and the second insulating film of the second semiconductor chip; a step for joining together the first electrode of the first semiconductor chip and the second electrode of the second semiconductor chip; a step for sealing in, with a sealing resin, the second semiconductor chip installed on top of the first semiconductor chip; a step for forming a via hole in a sealing body formed of the sealing resin; and a step for filling the via hole with an electroconductive material so as to be electrically connected to the first electrode and/or the second electrode.

Classes IPC  ?

• H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
• H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou

Abrégé

The polishing liquid is used to polish a tungsten material-containing surface to be polished. This polishing liquid contains abrasive grains, an iron-containing compound, and an oxidizing agent. The abrasive grains contain silica particles; the average particle size of the abrasive grains is 40-140 nm; and the silanol group density on the silica particles is not more than 8.0/nm2. The polishing method performs polishing, using the instant polishing liquid, of a tungsten material-containing surface to be polished.

Classes IPC  ?

• H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe

Abrégé

This mold release film comprises a base material layer and an adhesive layer, wherein the thickness of the adhesive layer is 4-30% of the total thickness of the base material layer and the adhesive layer, and the thickness of the base material layer is 75 μm or more.

Classes IPC  ?

• C09J 7/38 - Adhésifs sensibles à la pression
• B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
• B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
• C09J 133/04 - Homopolymères ou copolymères d'esters
• C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
• H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
• H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements

Abrégé

An electrochemical device which is provided with a positive electrode, a negative electrode and an electrolyte solution, wherein: the negative electrode contains a silicon-based active material; and the electrolyte solution contains a compound represented by formula (1).　In formula (1), each of R1to R3 independently represents a hydrogen atom or a methyl group; and X represents a divalent organic group.

Classes IPC  ?

• H01M 10/0567 - Matériaux liquides caracterisés par les additifs
• H01G 11/64 - Électrolytes liquides caractérisés par les additifs
• H01M 4/38 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'éléments simples ou d'alliages
• H01M 4/48 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques
• H01M 10/052 - Accumulateurs au lithium

Abrégé

One aspect of the present disclosure relates to a resin composition for a dicing protection layer, the resin composition containing an organic solvent and an acrylic resin having a carboxy group.

Classes IPC  ?

• H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
• C08K 5/10 - EstersÉthers-esters
• C08L 33/02 - Homopolymères ou copolymères des acidesLeurs sels métalliques ou d'ammonium
• C08L 33/06 - Homopolymères ou copolymères des esters d'esters ne contenant que du carbone, de l'hydrogène et de l'oxygène, l'oxygène, faisant uniquement partie du radical carboxyle

Abrégé

One embodiment of the present invention pertains to an organic electronics material that contains: an ionic compound containing an ammonium cation and an anion (A1) having at least two tri(fluoroaryl)borane structures; and, a charge-transporting compound having at least one polymerizable functional group.

Classes IPC  ?

• H01L 51/50 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés pour l'émission de lumière, p.ex. diodes émettrices de lumière organiques (OLED) ou dispositifs émetteurs de lumière à base de polymères (PLED)
• H01L 27/32 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
• H05B 33/10 - Appareils ou procédés spécialement adaptés à la fabrication des sources lumineuses électroluminescentes

Abrégé

A photosensitive composition comprising: a photopolymerizable compound; a hexaarylbiimidazole compound; and a compound represented by the following formula (1) wherein R 1, R 2and R 3each independently represent an alkyl group having 5 or less carbon atoms, R 4 represents a halogen atom, an alkyl group or an alkoxy group, and m and n each independently represent an integer of 0 or more.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles
• G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet

Abrégé

A photosensitive composition containing: a photopolymerizable compound; a hexaarylbiimidazole compound; and a compound represented by the following formula (1) wherein R 1, R 2and R 3each independently represent an alkyl group having 5 or less carbon atoms, R 4 represents a halogen atom, an alkyl group or an alkoxy group, and m and n each independently represent an integer of 0 or more.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles
• G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet

Abrégé

This method for manufacturing a heat insulator comprises heating, at a heating rate of X (˚C/minute), a composition for a heat insulator containing a thermosetting resin and heat expandable organic hollow particles to cure the composition for a heat insulator, wherein: the heating rate X (°C/minute) is a rate in which the difference between (i) the curing time of the thermosetting resin when the temperature is raised from 30 °C at a heating rate X (°C/minute) using a rheometer or differential scanning calorimetry and (ii) the time until the maximum expansion coefficient of the heat expandable organic hollow particles is achieved when the heat expandable organic hollow particles are heated from 30 °C at a heating rate X (°C/minute) using thermomechanical analysis is at most 5 minutes; and the heating rate X (°C/minute) is at least 20 °C/minute.

Classes IPC  ?

• C08K 7/22 - Particules expansibles, poreuses ou creuses
• C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
• C08J 9/16 - Fabrication de particules expansibles
• C08J 9/22 - Post-traitement de particules expansiblesFaçonnage d'articles en mousse
• C08J 5/12 - Fixation d'un matériau macromoléculaire préformé au même matériau ou à un autre matériau compact, tel que du métal, du verre, du cuir, p. ex. en utilisant des adhésifs
• F16L 59/00 - Isolation thermique en général

Abrégé

This resin composition comprises a thermosetting resin (A); a compound (B) that is a liquid at 25°C, has a reactive group, and has a molecular weight of not more than 1,000; and an inorganic filler (C). The resin film, multilayered printed wiring board, and semiconductor package use this resin composition.

Classes IPC  ?

• C08F 222/40 - Imides, p. ex. imides cycliques
• C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
• C08J 5/18 - Fabrication de bandes ou de feuilles
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

One aspect of the present invention relates to a heat-curable resin composition for light reflection which comprises an epoxy resin, a hardener, a benzoxazole compound having fluorescent intensity at 410-500 nm, inorganic hollow particles, and a white pigment.

Classes IPC  ?

• C08K 5/353 - Cycles à cinq chaînons
• C08K 7/24 - Particules expansibles, poreuses ou creuses inorganiques
• C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
• H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
• C08K 3/013 - Charges, pigments ou agents de renforcement

Abrégé

66 and an additive, the method comprising: a measurement step for performing 316P166 -P266 -in the second electrolyte for measurement in the 31P-NMR measurement result.

Classes IPC  ?

• H01M 10/0568 - Matériaux liquides caracterisés par les solutés
• H01M 10/0567 - Matériaux liquides caracterisés par les additifs

Abrégé

A resin composition comprising (A) a heat-curable resin, (B) a compound which is liquid at 25°C and has a reactive group and a molecular weight of 1,000 or less, and (C) an inorganic filler; a resin film obtained from the resin composition; a printed wiring board; and a semiconductor package.

Classes IPC  ?

• C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
• C08F 222/40 - Imides, p. ex. imides cycliques
• C08J 5/18 - Fabrication de bandes ou de feuilles
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

An aspect of the present disclosure relates to a method for forming a permanent resist, said method comprising: a step for forming a resin film by coating and drying, on the entire surface or a portion of the surface of a substrate, a photosensitive resin composition comprising a base polymer and a compound that has an absorption peak at 360-500 nm and emits light upon irradiation with light; a step for exposing at least a portion of the resin film; a step for forming a patterned resin film by developing the resin film after exposure; and a step for heating the patterned resin film.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles
• G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
• G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
• G03F 7/037 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyamides ou des polyimides
• G03F 7/26 - Traitement des matériaux photosensiblesAppareillages à cet effet

Abrégé

A method for producing a molded object which comprises heating a resin composition that comprises a heat-curable resin and heat-expandable organic hollow particles and thereby curing the resin composition, wherein the curing includes expanding the heat-expandable organic hollow particles by utilizing the heat of curing reaction of the heat-curable resin.

Classes IPC  ?

• C08J 9/32 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement à partir de compositions contenant des microbilles, p. ex. mousses syntactiques

Abrégé

This metal paste for bonding contains metal particles, a dispersion medium and a sintering accelerator; the metal particles include copper particles; the sintering accelerator contains a coordinating compound that has electron back donation properties; and the coordinating compound is composed of at least one compound that is selected from the group consisting of a nitrogen-containing heteroaromatic ring compound, an acetylene derivative, an ethylene derivative, an organic arsenic compound and a cyanide.

Classes IPC  ?

• B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
• B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
• B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
• H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs

Abrégé

This metal paste for joining includes metal particles, a dispersion medium, a reducing agent, and a reduction assistance agent, wherein: the metal particles contain copper particles; the reduction assistance agent includes a coordinating compound having electron reverse donation properties; the coordinating compound is at least one compound selected from the group consisting of organic phosphorous compounds and organic sulfur compounds; and a polyol-based compound is included as the reducing agent in an amount of 1.6–10 parts by mass relative to 100 parts by mass of the total mass of the copper particles.

Classes IPC  ?

• B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
• B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
• B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
• H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs

Abrégé

A resin composition comprising at least one resin selected from the group consisting of polyamides, poly(amide-imide)s, polyimides, and poly(amic acid)s, at least one solvent A having a lactone structure, and at least one solvent B compatible with the solvent A, wherein the solvent B, after having been stored for 3 hours in an environment of 30°C and 60% RH, has a water content of 2 mass% or less.

Classes IPC  ?

• C08L 77/00 - Compositions contenant des polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principaleCompositions contenant des dérivés de tels polymères
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides

Abrégé

A sound absorbing material comprising a fibre substrate having a region comprising inorganic particles, the average particle diameter of the inorganic particles being 0.1-5.0 times greater than the average fibre diameter of the fibres forming the fibre substrate.

Classes IPC  ?

• B32B 5/24 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse
• G10K 11/162 - Sélection de matériaux
• G10K 11/168 - Sélection de matériaux de plusieurs couches de matériaux différents, p. ex. sandwiches
• D06M 23/08 - Procédés dans lesquels l'agent traitant est appliqué en poudre ou sous forme granulaire

Abrégé

This solder bump formation method comprises: a step for preparing a solder bump formation member 1 having a plurality of recesses 3 and having deformation parts 6 at which constituent portions of the recesses 3 are deformable at the melting point of solder particles S1; a step for arranging the solder particles S1 held in the recesses 3 of the solder bump formation member 1 so as to oppose an electrode 22; a step for heating the electrode 22 to a temperature equal to or higher than the melting point of the solder particles S1; and a step for pressing the electrode 22 against the bump formation member 1. The solder particles S1 held in the recesses 3 are brought into contact with the electrode 22 by deforming the deformation parts 6, the solder particles S1 are transferred to the electrode 22, and a solder bump S2 is formed.

Classes IPC  ?

• H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/34 - Connexions soudées

Abrégé

A resin composition which contains: at least one resin that is selected from the group consisting of a polyamide, a polyamide-imide, a polyimide and a polyamide acid; at least one solvent A that has a lactone structure; and at least one glycol ester solvent B1 that is compatible with the solvent A. With respect to this resin composition, the (solvent A)/(solvent B1) mass ratio is from 90/10 to 75/25; and the resin contains a resin (A) which has a structural unit represented by formula (Ia) and a structural unit represented by formula (IIa), or a resin (B) which has a structural unit represented by formula (IIa) and a structural unit represented by formula (IVa).

Classes IPC  ?

• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
• C08L 77/00 - Compositions contenant des polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principaleCompositions contenant des dérivés de tels polymères
• C09D 179/08 - PolyimidesPolyesterimidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

The present invention provides an additive for electrolyte solutions, the additive improving the solubility of an electrolyte salt into a nonaqueous solvent. This additive for electrolyte solutions contains at least one compound that is selected from the group consisting of a compound represented by general formula (1) and a compound represented by general formula (2). In addition, the present invention provides an electrolyte solution that contains this additive for electrolyte solutions, a lithium salt and a nonaqueous solvent. In addition, the present invention provides an electrochemical device which comprises a positive electrode, an electrode and an electrolyte solution, wherein the electrolyte solution is the above-described electrolyte solution.

Classes IPC  ?

• H01M 10/0567 - Matériaux liquides caracterisés par les additifs
• H01G 11/64 - Électrolytes liquides caractérisés par les additifs
• H01M 10/052 - Accumulateurs au lithium

Abrégé

This adhesive film for connecting a circuit comprises: a resin component containing a thermoplastic resin, a radically polymerizable compound, and a radical polymerization initiator; and conductive particles, wherein the resin component further contains a silane coupling agent having a fluorene skeleton.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
• C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 11/06 - Additifs non macromoléculaires organiques
• C09J 11/08 - Additifs macromoléculaires
• H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

A member 1 for forming a solder bump 1 is a member that is used in the formation of a solder bump S2 on an electrode 22 of a circuit member 21, and comprises a body section 2 having a first surface 2a and a second surface 2b on the opposite side from the first surface 2a. A plurality of recessed sections 3 in which solder particles S1 are retained are provided in the first surface 2a side of the body section 2. The portion that forms the recessed sections 3, said portion including the first surface 2a, has a deformation section 6 that can deform at the melting point of the solder particles S1.

Classes IPC  ?

• H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
• H05K 3/34 - Connexions soudées

Abrégé

A photosensitive element according to the present disclosure is able to be produced by a method that comprises a step for forming a photosensitive layer on a support film with use of a photosensitive resin composition and a step for bonding the outer winding surface of a protective film, which has the shape of a roll, onto the photosensitive layer. This photosensitive element comprises: a support film; a photosensitive layer that is provided on one surface of the support film; and a protective film that is provided on a surface of the photosensitive layer, the surface being on the reverse side from the support film. The protective film has a weld line in a surface that is on the reverse side from the photosensitive layer.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles

Abrégé

A negative electrode material for lithium ion secondary batteries, the negative electrode material comprising graphite particles and a low crystallinity carbon layer that covers at least a part of the surface of each one of the graphite particles, while satisfying at least one of the requirements A to C described below. A: The histogram of R values as obtained by Raman mapping measurement has two or more peaks. B: The maximum peak dispersion in the histogram of R values as obtained by Raman mapping measurement is 2.0 or more. C: The low crystallinity carbon layer comprises two or more carbon phases that have different crystallinities.

Classes IPC  ?

• H01M 4/587 - Matériau carboné, p. ex. composés au graphite d'intercalation ou CFx pour insérer ou intercaler des métaux légers

Abrégé

The compound according to one aspect of the present invention comprises a resin composition comprising an epoxy resin and a hardener, a nonmagnetic powder, and a magnetic powder, and has a content of the magnetic powder of 94-98 mass% with respect to the whole compound and a minimum melt viscosity at 175°C of 10-220 Pa·s.

Classes IPC  ?

• H01F 1/28 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre dispersées ou suspendues dans un liant

Abrégé

This method for manufacturing a wiring board includes: a step (I) of forming an insulation material layer on a surface of a support substrate; a step (II) of forming, by electroless copper plating, a first electrically-conductive layer on a surface of the insulation material layer; a step (III) of forming a first opening through which the first electrically-conductive layer and the insulation material layer pass through; a step (IV) of forming, by electroless copper plating, a second electrically-conductive layer on a bottom face and side faces of the first opening; a step (V) of forming, on a surface of the second electrically-conductive layer, a resist pattern having a second opening in communication with the first opening; and a step (VI) of filling, by copper electroplating, the first opening and the second opening with an electrically-conductive material including copper.

Classes IPC  ?

• H01L 23/12 - Supports, p. ex. substrats isolants non amovibles

Abrégé

Provided is a bismaleimide composition including: a bismaleimide resin (A) having a structure derived from an aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and a maleic anhydride (a3); and silica particles (B) surface-treated with phenylaminosilane, in which the silica particles (B) have an average particle diameter of 100 nm or less, the silica particles (B) have an maximum aggregation particle size of 20 μm or less, and a content of the silica particles (B) is 15% by mass or less based on a total solid content of the composition.

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat

Abrégé

A method for manufacturing a wiring board according to the present disclosure includes: a step (I) for forming an insulating material layer on the surface of a support board; a step (II) for forming a first electrically conductive layer using electroless copper plating on the surface of the insulating material layer; a step (III) for forming a first opening part that passes through the first electrically conductive layer and the insulating material layer; a step (IV) for forming a second electrically conductive layer using electroless copper plating on the bottom surface and the side surface of the first opening part on the surface of the first electrically conductive layer; a step (V) for forming a resist pattern having a second opening part in communication with the first opening part on the surface of the second electrically conductive layer; and a step (VI) for filling an electrically conductive material containing copper in the first opening part and the second opening part using electrolytic copper plating.

Classes IPC  ?

• H01L 23/12 - Supports, p. ex. substrats isolants non amovibles

Abrégé

A lubricant of the present invention includes a lubricant A, which has a melting point of 60–85°C, and the ratio of particles with a particle size of 63 μm or less is at least 88 mass% with respect to the total amount of lubricant when sifted using a JIS-standard sieve.

Classes IPC  ?

• C10M 171/06 - Particules de forme ou de dimensions particulières
• B22F 3/02 - Compactage seul
• B22F 3/035 - Presses de moulage à cet effet avec une ou plusieurs parties montées de façon pivotante

Abrégé

A lubricant of the present invention includes a lubricant A, which has a melting point of 60–85°C, and a metal soap-based lubricant B, and the ratio of particles with a particle size of 63 μm or less is at least 88 mass% with respect to the total amount of the lubricant combination when sifted using a JIS-standard sieve.

Classes IPC  ?

• C10M 105/24 - Acides carboxyliques ou leurs sels comportant un seul groupe carboxyle lié à un atome de carbone acyclique ou cycloaliphatique ou à l'hydrogène
• B22F 3/02 - Compactage seul
• B22F 3/035 - Presses de moulage à cet effet avec une ou plusieurs parties montées de façon pivotante

Abrégé

A lubricant of the present invention includes a lubricant A, which has a melting point of 60–85°C, and the ratio of particles with a particle size of 63 μm or less is at least 88 mass% with respect to the total amount of the lubricant.

Classes IPC  ?

• C10M 171/06 - Particules de forme ou de dimensions particulières
• B22F 3/02 - Compactage seul
• B22F 3/035 - Presses de moulage à cet effet avec une ou plusieurs parties montées de façon pivotante

Abrégé

Provided is a prepreg obtained by impregnating a fiber base material having a thickness of 40 μm or more with a thermosetting resin composition, wherein the fiber base material has a region in which the thermosetting resin composition is impregnated and a region in which the thermosetting resin composition is not impregnated, and has a surface waviness (Wa) of 5.0 μm or less. Further, provided are a laminate plate, a metal-clad laminate plate, a printed wiring board, and a semiconductor package obtained by using the prepreg. Furthermore, provided are a method for manufacturing the prepreg and a method for manufacturing the metal-clad laminate plate.

Classes IPC  ?

• B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
• B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
• C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

Provided is a prepreg obtained by impregnating, with a thermosetting resin composition, a fiber matrix having a thickness of 40 μm or more, wherein the prepreg has an impregnated region and a non-impregnated region of the thermosetting resin composition in the fiber matrix, and has a surface waviness (Wa) of 5.0 μm or less. Also provided are: a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package, each of which is obtained using said prepreg; a method for manufacturing said prepreg; and a method for manufacturing said metal-clad laminated plate.

Classes IPC  ?

• B29B 11/16 - Fabrication de préformes caractérisées par la structure ou la composition comprenant des charges ou des agents de renforcement
• B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
• B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
• C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

Disclosed is an integrated dicing/die bonding film which comprises a base layer, one or more pressure-sensitive adhesive layers including an ultraviolet-curable pressure-sensitive adhesive layer comprising an ultraviolet-curable pressure-sensitive adhesive, and an adhesive layer in this order. The ultraviolet-curable pressure-sensitive adhesive layer included in the pressure-sensitive adhesive layers is in contact with the adhesive layer. The ultraviolet-curable pressure-sensitive adhesive comprises a (meth)acrylic resin having a functional group capable of undergoing chain polymerization and photopolymerization initiators. The ultraviolet-curable pressure-sensitive adhesive contains at least a first photopolymerization initiator and a second photopolymerization initiator, which differs from the first photopolymerization initiator in maximum-absorption wavelength in the ultraviolet region, as the photopolymerization initiators. The content of the photopolymerization initiators is 1.5 parts by mass or higher per 100 parts by mass of the whole (meth)acrylic resin.

Classes IPC  ?

• C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
• H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
• H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
• C09J 7/38 - Adhésifs sensibles à la pression

Abrégé

Disclosed is a dicing-die bonding integrated film. This dicing-die bonding integrated film comprises a dicing film that includes a base material layer and a pressure-sensitive adhesive layer composed of a UV-curable pressure-sensitive adhesive provided on the base material layer, and an adhesive layer provided on the pressure-sensitive adhesive layer of the dicing film. The adhesive force of the pressure-sensitive adhesive layer with respect to the adhesive layer, as measured at 23°C at a peel angle of 30° and a peel speed of 600 mm/min, is 15 N/25 mm or greater.

Classes IPC  ?

• C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
• H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
• H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
• H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
• C09J 7/38 - Adhésifs sensibles à la pression

Abrégé

An adhesive tape 11 is a long adhesive tape 11 comprising an adhesive layer 13 on one surface side of a substrate 12, wherein a terminal part of the adhesive tape 11 does not have the adhesive layer 13, but does have an exposed area K where a one surface 12a side of the substrate 12 is exposed, and a sticky tape piece 22 is disposed as an end mark 21 on the one surface 12a side of the substrate 12 in the exposed area K.

Classes IPC  ?

• C09J 7/38 - Adhésifs sensibles à la pression
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
• H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages

Abrégé

This method for manufacturing a semiconductor device comprises: a step for forming, on a substrate, a first organic insulating layer having a groove section; a step for forming, on the first organic insulating layer, a conductive layer composed of a conductive material so as to fill the groove section with the conductive material; a step for removing a portion of the conductive layer on the first organic insulating layer and obtaining a first wiring structure having a first wiring layer configured to include the conductive material filled in the groove section and the first organic insulating layer; a step for providing a second wiring structure having a second organic insulating layer and a second wiring layer; and a step for performing position matching so that the first wiring layer and the second wiring layer correspond to each other and pressing and stacking the first wiring structure and the second wiring structure. In the stacking step, the first wiring layer and the second wiring layer are joined and the first organic insulating layer and the second organic insulating layer are joined.

Classes IPC  ?

• H01L 23/12 - Supports, p. ex. substrats isolants non amovibles

Abrégé

A coated active material for energy storage devices that includes particles containing a substance which can absorb and release alkali metal ions, and a coating material containing cyclized polyacrylonitrile, the coated active material satisfying one or both of the following (1) and (2): (1) the yellowness, as defined by JIS K 7373:2006, of an electrolyte into which the coated active material has been immersed is no higher than 100; and (2) the haze, as defined by JIS K 7136:2000, of an electrolyte into which the coated active material has been immersed is no higher than 2.5%.

Classes IPC  ?

• H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
• H01M 4/38 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'éléments simples ou d'alliages
• H01M 10/0568 - Matériaux liquides caracterisés par les solutés

Abrégé

This heat exchanger comprises a hollow outer covering material provided with a heat medium inlet and a heat medium outlet, has, formed by the outer covering material, a first main surface, a second main surface on the opposite side from the first main surface, and a connecting part connecting the first main surface and the second main surface, and is configured so as to be capable of changing thickness by inflow of a heat medium into the outer covering material.

Classes IPC  ?

• F28F 3/12 - Éléments construits sous forme d'un panneau creux, p. ex. comportant des canaux
• F28F 21/06 - Structure des appareils échangeurs de chaleur caractérisée par l'emploi de matériaux spécifiés de matériau plastique
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

An electrode for energy storage devices, the electrode containing particles that contain a substance which is capable of absorbing and desorbing alkali metal ions, and a binder material that contains a cyclized polyacrylonitrile, while satisfying one or both of the following requirements (1) and (2). (1) The degree of yellowing set forth in JIS K 7373 (2006) of an electrolyte solution in which the electrode is immersed is 30 or less. (2) The haze set forth in JIS K 7136 (2000) of an electrolyte solution in which the electrode is immersed is 0.3% or less.

Classes IPC  ?

• H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p. ex. liants, charges

Abrégé

An electrode for energy storage devices, the electrode containing particles that contain a substance which is capable of absorbing and desorbing alkali metal ions, and a binder material that contains a cyclized polyacrylonitrile, while satisfying one or both of the following requirements (1) and (2). (1) The degree of yellowing set forth in JIS K 7373 (2006) of an electrolyte solution in which the electrode is immersed is 30 or less. (2) The haze set forth in JIS K 7136 (2000) of an electrolyte solution in which the electrode is immersed is 0.3% or less.

Classes IPC  ?

• H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p. ex. liants, charges
• H01M 10/0567 - Matériaux liquides caracterisés par les additifs

Abrégé

The present invention provides a coated active material for an energy storage device, the coated active material including: particles containing a substance that can absorb and release alkali metal ions; and a coating material containing cyclized polyacrylonitrile. The coated active material satisfies one or both of (1) and (2): (1) the yellowness, as defined by JIS K 7373:2006, of an electrolyte in which the coated active material has been immersed is 100 or less; and (2) the haze, as defined by JIS K 7136:2000, of an electrolyte in which the coated active material has been immersed is 2.5% or less.

Classes IPC  ?

• H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
• H01M 4/38 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'éléments simples ou d'alliages
• H01M 10/0567 - Matériaux liquides caracterisés par les additifs

Abrégé

The present disclosure relates to a method for selecting a photosensitive resin composition, the method comprising: a step in which a resin film is formed by applying a photosensitive resin composition onto a substrate and drying the photosensitive resin composition thereon; a step in which a cured film is obtained by subjecting the resin film to a heat treatment in a nitrogen atmosphere; and a step in which the temperature of the cured film is increased from 25°C to 300°C at a rate of 10°C/minute in a nitrogen atmosphere and the weight loss of the cured film is measured. This method for selecting a photosensitive resin composition selects a photosensitive resin composition, a cured film of which has a weight loss ratio of 1.0% to 6.0% at 300°C.

Classes IPC  ?

• H01L 21/312 - Couches organiques, p. ex. couche photosensible
• H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
• H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux

Abrégé

Provided is an underfill resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a polyether-modified silicone compound having a hydroxy group at an end of the main chain and/or in a side chain, wherein the content of the polyether-modified silicone compound is more than 0.1 mass% with respect to the total amount of underfill resin composition.

Classes IPC  ?

• C08G 59/00 - Polycondensats contenant plusieurs groupes époxyde par moléculeMacromolécules obtenues par réaction de polycondensats polyépoxydés avec des composés monofonctionnels à bas poids moléculaireMacromolécules obtenues par polymérisation de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
• H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement

Abrégé

A resin composition for underfills which comprises an epoxy resin, a hardener, an inorganic filler, and one or more silicone compounds including a polyglycerin-modified silicone compound and/or a polyester-modified silicone compound.

Classes IPC  ?

• C08G 59/00 - Polycondensats contenant plusieurs groupes époxyde par moléculeMacromolécules obtenues par réaction de polycondensats polyépoxydés avec des composés monofonctionnels à bas poids moléculaireMacromolécules obtenues par polymérisation de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
• H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement

Abrégé

This storage battery 1 comprises: an electrode group 2 configured to include a plurality of positive electrodes 10, negative electrodes 20, and separators 30; an electric tank 40 which stores the electrode group 2; a case 3 having a lid 42 which covers an opening of the electric tank 40 and is provided with a control valve 7 which can inject an electrolyte; a positive electrode pole 5a connected to the plurality of positive electrodes 10 of the electrode group 2 through a strap 4a; an electrode pole 5b connected to the negative electrodes 20 of the electrode group 2 through a strap 4b; and a shock-absorbing member 6 accommodated in the electric tank 40 and disposed above the straps 4a, 4b, wherein the shock-absorbing member 6 is located at least in a region A below the control valve 7.

Classes IPC  ?

• H01M 10/04 - Structure ou fabrication en général
• H01M 10/06 - Accumulateurs au plomb

Abrégé

This solder particle classifying method includes: a first step of forming an electric field between a first electrode 2 and a second electrode 3 which are included in an electrostatic attraction device, the first electrode 2 comprising a disposition part that has electrical conductivity or electrostatic diffusivity, the second electrode 3 comprising an insulating attraction part 4 that faces the disposition part and that is provided with a plurality of openings 10 opened to the disposition part side, whereby solder particles P disposed in the disposition part are electrostatically attracted to the attraction part 4; a second step of removing solder particles P2 attracted to a portion excluding the openings 10 of the attraction part 4; and a third step of collecting, from the attraction part 4 having been through the second step, solder particles P1 accommodated in the openings. The average particle size of the solder particles P is 10 μm or more.

Classes IPC  ?

• B03C 7/02 - Séparateurs
• B07B 13/04 - Classement ou triage des matériaux solides par voie sèche non prévu ailleursTriage autrement que par des dispositifs commandés indirectement selon la taille

Abrégé

This solder particle classifying method includes: a first step of forming an electric field between a first electrode 2 and a second electrode 3 which are included in an electrostatic attraction device, the first electrode 2 comprising a disposition part that has electrical conductivity or electrostatic diffusivity, the second electrode 3 comprising an insulating attraction part 4 that faces the disposition part and that is provided with a plurality of openings 10 opened to the disposition part side, whereby solder particles P disposed in the disposition part are electrostatically attracted to the attraction part 4; a second step of removing solder particles P2 attracted to a portion excluding the openings 10 of the attraction part 4; and a third step of collecting, from the attraction part 4 having been through the second step, solder particles P1 accommodated in the openings. The average particle size of the solder particles P is 10 μm or more.

Classes IPC  ?

• B03C 7/02 - Séparateurs
• B07B 13/04 - Classement ou triage des matériaux solides par voie sèche non prévu ailleursTriage autrement que par des dispositifs commandés indirectement selon la taille

Abrégé

This method for dispersing granular bodies is characterized by being used in an electrostatic attracting device 1 provided with: a first electrode 4 equipped with an arrangement part 2 that has electrostatic diffusivity or conductivity; and a second electrode 7 equipped with an attracting part 5 that faces the arrangement part 2, that has insulation properties, and that is provided with an opening pattern that opens toward the arrangement part side. The method is further characterized in that, by forming an electric field between the first electrode 4 and the second electrode 7, blended particles P, which are arranged on the arrangement part 2 and which are obtained by attaching to intermediate particles 10 conductive granular bodies 12 having a particle diameter smaller than that of the intermediate particles, are brought into contact with the attracting part 5, thereby causing the conductive granular bodies 12 to be accommodated in openings 72 of the attracting part.

Classes IPC  ?

• B01J 19/08 - Procédés utilisant l'application directe de l'énergie ondulatoire ou électrique, ou un rayonnement particulaireAppareils à cet usage
• B05B 5/025 - Appareillages pour délivrer le matériau, p. ex. pistolets de pulvérisation électrostatique

Abrégé

A design aid device according to an embodiment of the present invention is provided with: a data obtaining unit that obtains record data comprising a design parameter set and observation values of items of characteristics; a model constructing unit that constructs prediction models for predicting observation values in the form of probability distributions or the like on the basis of the design parameter set; a sampling unit that samples a prescribed number of points of an objective variable set with each of the prediction models; an evaluation-value calculating unit that calculates evaluation values for the individual sampling points by scalarizing vectors including, as elements thereof, the values of the individual objective variables included in the objective variable set; an acquisition-function evaluating unit that outputs an acquisition-function evaluation value on the basis of the distribution of the evaluation values for the individual sampling points; a design-parameter-set obtaining unit that obtains a design parameter set through optimization of the acquisition-function evaluation value; and an output unit that outputs a design-parameter-set candidate.

Classes IPC  ?

• G06N 20/00 - Apprentissage automatique
• G06F 30/20 - Optimisation, vérification ou simulation de l’objet conçu
• G06F 30/27 - Optimisation, vérification ou simulation de l’objet conçu utilisant l’apprentissage automatique, p. ex. l’intelligence artificielle, les réseaux neuronaux, les machines à support de vecteur [MSV] ou l’apprentissage d’un modèle
• G06F 111/06 - Optimisation multi-objectif, p. ex. optimisation de Pareto utilisant le recuit simulé, les algorithmes de colonies de fourmis ou les algorithmes génétiques

Abrégé

This LED transfer member includes, in at least a part of a surface thereof, a region in which tack strength is decreased by optical irradiation, and has a tensile strength at 50℃ of 1 MPa to 10 MPa. The LED transfer member is employed in a method for manufacturing an LED device.

Classes IPC  ?

• H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs

Abrégé

An LED transfer member according to the present invention includes on at least a part of the surface thereof a region which has reduced adhesiveness when irradiated with light. A method for producing an LED device according to the present invention uses the LED transfer member.

Classes IPC  ?

• H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs

Abrégé

A wiring substrate comprising a substrate, conductor wiring provided on the substrate, and an insulator located in at least a part of the periphery of the conductor wiring, wherein the insulator contains a magnetic material.

Classes IPC  ?

• H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
• H05K 1/02 - Circuits imprimés Détails
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

Provided is a method for producing a wiring board 100A, the wiring board 100A being provided with a substrate 10, conductive wiring 20 provided on the substrate 10, and an insulating magnetic layer 30 that comprises an insulator including a magnetic material and covers at least one of an upper surface S1 positioned on the side of the conductive wiring 20 opposite from the substrate 10 and/or a pair of side surfaces S3a, S3b positioned between the upper surface S1 and a bottom surface S2 positioned on the substrate 10 side, the method comprising a step a1 of preparing a wired substrate 50 provided with the substrate 10 and the conductive wiring 20 provided on the substrate 10, and a step a2 of forming the insulating magnetic layer 30 comprising a cured composition 35 for forming the insulating magnetic layer including a magnetic material, by covering the conductive wiring 20 with the composition 35 for forming the insulating magnetic layer and curing the composition 35 for forming the insulating magnetic layer.

Classes IPC  ?

• H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
• G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
• H05K 1/02 - Circuits imprimés Détails
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

Provided is an adhesive composition containing a polymerizable compound, a thermal polymerization initiator, and a dicarboxylic acid diester compound.

Classes IPC  ?

• C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 11/06 - Additifs non macromoléculaires organiques
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

An input data generation system 10 generates input data for machine-learning that predicts the characteristics of a material based on a plurality of raw materials including known partial structures, and comprises a processor 101, wherein the processor 101: receives at least an input of partial structure data, which specifies the known partial structure of each of the plurality of raw materials, and mixing ratio data that indicates the respective mixing ratios of the plurality of raw materials; generates, for each of the plurality of raw materials, partial structure input data D that represents the known partial structure on the basis of the partial structure data; generates synthesized input data F by summing the partial structure input data D for each of the plurality of raw materials, while reflecting the mixing ratio data pertaining to the plurality of raw materials to the partial structure input data D of the plurality of raw materials; and inputs the synthesized input data F to a machine-learning model.

Classes IPC  ?

• G16C 20/30 - Prévision des propriétés des composés, des compositions ou des mélanges chimiques
• G06N 20/00 - Apprentissage automatique

Abrégé

In the present invention, an input data generation system 10 comprises at least one processor and is for generating input data for machine learning to predict properties of materials based on raw materials of a known structure. The at least one processor: acquires partial structure data, representative of a partial structure, from a database; receives at least input of raw material structure data specifying the structures of raw materials and blending ratio data representative of the ratios of blending of the raw materials; generates partial structure input data D representative of a partial structure present in the structure of the raw materials, on the basis of the partial structure data and the raw material structure data; and causes the blending ratio data to be reflected in the partial structure input data D of the raw materials, thereby generating input data, and causes the input data to be inputted to a machine learning model.

Classes IPC  ?

• G16C 20/30 - Prévision des propriétés des composés, des compositions ou des mélanges chimiques
• G06N 20/00 - Apprentissage automatique

Abrégé

This monomer composition is for impregnating pores in a porous molded body. The molded body contains a metal powder and a heat-curable resin composition. The monomer composition contains at least one compound selected from the group consisting of acrylates having a dicyclopentane structure, acrylates having a dicyclopentene structure, methacrylates having a dicyclopentane structure, and methacrylates having a dicyclopentene structure.

Classes IPC  ?

• C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
• C08L 33/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et un seul étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
• C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
• H01F 1/059 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments Va, p. ex. Sm2Fe17N2
• C08K 3/10 - Composés métalliques

Abrégé

A polishing liquid which contains: abrasive grains containing a hydroxide of a tetravalent metal element; a polymer that comprises a structural unit represented by formula (1); and a liquid medium. (In formula (1), * represents a bonding hand.)

Classes IPC  ?

• B24B 37/00 - Machines ou dispositifs de rodageAccessoires
• H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe

Abrégé

One aspect of the present disclosure provides a CMP polishing liquid for polishing a polysilicon, the CMP polishing liquid containing abrasive grains and a cationic polymer that contains at least one polymer selected from the group consisting of a polymer A which has a main chain containing a nitrogen atom and a carbon atom, and a hydroxyl group that is bonded to the carbon atom, and an allylamine polymer B. Another aspect of the present disclosure provides a polishing method which comprises a step for polishing a material to be polished with use of the CMP polishing liquid.

Classes IPC  ?

• C09K 3/14 - Substances antidérapantesAbrasifs
• B24B 37/00 - Machines ou dispositifs de rodageAccessoires
• H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe

Abrégé

Provided are: a manufacturing method for a wiring board 100B comprising a board 10, conductor wiring 20 provided on the board 10, and an insulating magnetic layer 30 that covers at least a portion of the periphery of the conductor wiring 20 and comprises an insulator including a magnetic material; and a manufacturing method for a wiring board 100A, the method including step a1 for preparing a laminate comprising a board 10, an insulating magnetic layer 30 provided on the board 10, and a conductor layer provided on the insulating magnetic layer 30 on the opposite side of the board 10, step a2 for forming a photosensitive layer on the conductor layer side of the laminate, step a3 for forming a resist film having an opening by causing the photosensitive layer to be exposed to light in a prescribed pattern and developed, and step a4 for forming conductor wiring 20 in the conductor layer by removing a portion thereof positioned between the board 10 and the opening H1 in the resist film 8a.

Classes IPC  ?

• H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
• G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
• B32B 37/14 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
• B32B 7/025 - Propriétés électriques ou magnétiques
• H05K 1/02 - Circuits imprimés Détails
• H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

This nickel-zinc battery control method includes a constant voltage charging step for charging a nickel-zinc battery at a predetermined voltage value. The predetermined voltage value is 1.93V to 1.95V, inclusive, per unit cell. The nickel-zinc battery control method further includes a constant current charging step for charging the nickel-zinc battery at a predetermined current value and may shift to the constant voltage charging step after the inter-terminal voltage of the unit cell of the nickel-zinc battery has reached a threshold voltage in the constant current charging step. In this case, the threshold voltage is 1.93V to 1.95V, inclusive, per unit cell.

Classes IPC  ?

• H02J 7/10 - Régulation du courant ou de la tension de charge utilisant des tubes à décharge ou des dispositifs à semi-conducteurs utilisant uniquement des dispositifs à semi-conducteurs
• H01M 10/44 - Méthodes pour charger ou décharger

Abrégé

A hardener comprising a pyridinium salt, wherein the pyridinium salt has a benzyl group at the 1-position and has an electron-attracting group at the 2-position, the benzyl group having an electron-donating group; an adhesive composition comprising a pyridinium salt and a cationically polymerizable compound, wherein the pyridinium salt has a benzyl group at the 1-position and has an electron-attracting group at the 2-position, the benzyl group having an electron-donating group; and an adhesive film for circuit connection which includes an adhesive layer formed from the adhesive composition.

Classes IPC  ?

• C07F 5/02 - Composés du bore
• C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
• C08G 85/00 - Procédés généraux pour la préparation des composés prévus dans la présente sous-classe
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 11/06 - Additifs non macromoléculaires organiques
• C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
• C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
• C09K 3/00 - Substances non couvertes ailleurs
• C07D 213/61 - Atomes d'halogènes ou radicaux nitro
• C07D 213/84 - Nitriles
• H01B 1/20 - Matériau conducteur dispersé dans un matériau organique non conducteur
• C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat

Abrégé

Provided is a sound absorbing material comprising, in the following order, a protection layer, a first base material layer having a communication hole, and a second base material layer having a communication hole, the protection layer having a flexibility and toughness value of 1–75 [MPa/μm] as represented by the following formula (I).　Flexibility and toughness value = (tensile modulus [MPa] of protection layer at 25°C × Shore A hardness of protection layer) / thickness [μm] of protection layer (I)

Classes IPC  ?

• B60R 13/08 - Éléments d'isolation, p. ex. pour l'insonorisation
• G10K 11/16 - Procédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général
• G10K 11/168 - Sélection de matériaux de plusieurs couches de matériaux différents, p. ex. sandwiches

Abrégé

This magnetic powder includes: a plurality of magnetic particles comprising at least one of a permanent magnet and a soft magnetic body; a first silicon compound that covers at least a portion of the surface of the magnetic particles; and a second silicon compound that covers at least a portion of the surface of the magnetic particles. The first silicon compound includes an alkyl group and silicon bonded to the alkyl group. The second silicon compound includes an alkyl chain, silicon bonded to one end of the alkyl chain, and a glycidyl group located at the other end of the alkyl chain. The number m of carbons of the alkyl chain included in the second silicon compound is greater than the number n of carbons of the alkyl group included in the first silicon compound.

Classes IPC  ?

• B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
• B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
• B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet
• C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
• H01F 1/055 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5
• H01F 1/057 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments IIIa, p. ex. Nd2Fe14B
• H01F 1/06 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre
• H01F 1/26 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées au moyen de substances organiques macromoléculaires
• H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules

Abrégé

Provided is a negative electrode material for a lithium-ion secondary battery, the negative electrode material including a carbon material that satisfies conditions (1) and (2). (1) The D90/D10 of the particle size by volume is more than 2.0 and less than 4.3. (2) When a number of particles N having an equivalent circle diameter equal to or less than 5 μm by number among 10,000 total measured particles is divided by a specific surface area S obtained by a nitrogen adsorption test at 77 K, the value N/S is equal to or more than 750 (particles*g/cm2).

Classes IPC  ?

• H01M 4/587 - Matériau carboné, p. ex. composés au graphite d'intercalation ou CFx pour insérer ou intercaler des métaux légers
• H01M 10/0566 - Matériaux liquides

Abrégé

One aspect of the present invention provides a lithium ion secondary battery which sequentially comprises a positive electrode mixture layer, a separation membrane, and a negative electrode mixture layer in this order, wherein: the positive electrode mixture layer contains a positive electrode active material, a first lithium salt, and a first solvent; the negative electrode mixture layer contains a negative electrode active material, a second lithium salt, and a second solvent that is different from the first solvent; and the separation membrane contains a third lithium salt and a polymer that comprises, as a monomer unit, a monomer which is represented by formula (1). (In formula (1), R1represents a hydrogen atom or a methyl group; R2represents a divalent organic group; each of R3, R4and R5independently represents a hydrogen atom or a monovalent organic group; and X- represents a counter anion.)

Classes IPC  ?

• H01M 10/0569 - Matériaux liquides caracterisés par les solvants
• H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p. ex. liants, charges
• H01M 50/42 - Résines acryliques
• H01M 50/46 - Séparateurs, membranes ou diaphragmes caractérisés par leur combinaison avec des électrodes

Abrégé

This wavelength conversion member has a cured product obtained by curing a curable composition including: a fluorescent body; and a thiol compound containing a polyfunctional thiol and a monofunctional thiol, wherein a reaction rate of a thiol group of the cured product is 70-90%.

Classes IPC  ?

• G02B 5/20 - Filtres

Abrégé

The present invention provides a semiconductor encapsulation marking film, a semiconductor encapsulation release film, a semiconductor package, and a semiconductor package manufacturing method characterized by comprising two types of colored layers with different colors, one of the colored layers being a white colored layer that is stacked on an encapsulant layer surface and has a transmittance of 0.22 or less for a light with a wavelength of 1064 nm.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements

Abrégé

[Problem] To provide a production method for a genetically modified cell that does not require a mechanism for avoiding endogenous TCR interference. [Solution] A genetically modified cell comprising (i) an exogenous oligomeric polypeptide that is constituted from a variable region and a constant region, and (ii) an exogenous CD8 α-chain and β-chain polypeptide.

Classes IPC  ?

• C12N 5/10 - Cellules modifiées par l'introduction de matériel génétique étranger, p. ex. cellules transformées par des virus
• A61K 35/17 - LymphocytesLymphocytes BLymphocytes TCellules tueuses naturellesLymphocytes activés par un interféron ou une cytokine
• A61P 35/00 - Agents anticancéreux
• C07K 14/725 - Récepteurs de lymphocytes-T
• C12N 15/12 - Gènes codant pour des protéines animales

Abrégé

Disclosed is a reactive hot-melt adhesive which comprises a urethane prepolymer having structural units derived from a polyol and structural units derived from a polyisocyanate, a phenolic antioxidant, and an ultraviolet absorber. The structural units derived from a polyisocyanate include structural units derived from diphenylmethane diisocyanate.

Classes IPC  ?

• C09J 11/00 - Caractéristiques des adhésifs non prévues dans le groupe , p. ex. additifs
• C09J 11/06 - Additifs non macromoléculaires organiques
• C09J 175/04 - Polyuréthanes

Abrégé

A method for producing a culture, said method comprising: bringing adherent cells into contact with a soluble culture carrier that is larger in size than the adherent cells and thus placing the adherent cells on the surface of the soluble culture carrier; suspension-culturing in a medium the adherent cells that are placed on the surface of the soluble culture carrier; to release the adherent cells under the suspension culture from the surface of the soluble culture carrier, subjecting the soluble culture carrier to a denaturation treatment by which at least a part of the surface thereof is denatured; and, after the denaturation treatment, separating and collecting the adherent cells from the denatured soluble culture carrier that is larger in size than the adherent cells, depending on the size difference.

Classes IPC  ?

• C12N 5/02 - Propagation de cellules individuelles ou de cellules en suspensionLeur conservationMilieux de culture à cet effet
• C12N 5/071 - Cellules ou tissus de vertébrés, p. ex. cellules humaines ou tissus humains
• C12N 5/0775 - Cellules souches mésenchymateusesCellules souches dérivées du tissu adipeux

Abrégé

According to the present invention, in a semiconductor device in which a plurality of connection portions of a semiconductor chip and a plurality of connection portions of a wiring circuit board are electrically connected to each other or a semiconductor device in which a plurality of connection portions of each of a plurality of semiconductor chips are electrically connected to each other, an adhesive for a semiconductor used for sealing at least a part of the connection portions electrically connected to each other is disclosed. The adhesive for a semiconductor contains an epoxy resin, a curing agent, a thermoplastic resin, and an inorganic filler. The inorganic filler contains an inorganic filler having an average particle diameter of 100-400 nm, or exhibits at least one peak at the position of the particle diameter of 100-400nm in the particle size distribution obtained when the particle size distribution of the inorganic filler is measured by dynamic light scattering.

Classes IPC  ?

• C09J 11/04 - Additifs non macromoléculaires inorganiques
• C09J 11/06 - Additifs non macromoléculaires organiques
• C09J 11/08 - Additifs macromoléculaires
• H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
• H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
• H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
• C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif

Abrégé

An information management device according to the present invention is equipped with at least one processor and causes the at least one processor to function so as to acquire, on the basis of a first cell acquired from a cancer patient, first time information pertaining to the time required to acquire a prescribed amount of at least one specific nucleic acid and second time information pertaining to the time required to culture second cells different from the first cell until a prescribed amount is reached, and so as to associate the first time information and the second time information with attribute information of the cancer patient and store the result as individual patient information.

Classes IPC  ?

• C12M 1/00 - Appareillage pour l'enzymologie ou la microbiologie
• C12N 5/00 - Cellules non différenciées humaines, animales ou végétales, p. ex. lignées cellulairesTissusLeur culture ou conservationMilieux de culture à cet effet
• G16H 10/00 - TIC spécialement adaptées au maniement ou au traitement des données médicales ou de soins de santé relatives aux patients

Abrégé

The present disclosure relates to: a photosensitive resin film that contains a binder polymer, a photopolymerizable compound including an acrylate compound, a photopolymerization initiator, and a polymerization inhibitor, and that has a thickness of 35-300 μm; a method for forming a resist pattern using the photosensitive resin film; and a method for forming a wiring pattern.

Classes IPC  ?

• G03F 7/004 - Matériaux photosensibles
• G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques

Abrégé

One aspect of the present invention provides a lithium-ion secondary battery provided with a positive electrode mixture layer, a separation membrane, and a negative electrode mixture layer in this order. The positive electrode mixture layer contains a positive electrode active material, a first lithium salt, and a first solvent. The negative electrode mixture layer contains a negative electrode active material, a second lithium salt, and a second solvent different from the first solvent. The separation membrane contains a polymer having lithium ion conductivity, a third lithium salt, and a third solvent. The polymer is a polymer of polymerizable components that include a monomer and a thiol compound.

Classes IPC  ?

• H01M 10/0565 - Matériaux polymères, p. ex. du type gel ou du type solide

Abrégé

Disclosed is a semiconductor device production method. This semiconductor device production method comprises: a step for providing a first integrated circuit element 10 comprising a first semiconductor substrate 11 and a first wiring layer 12; a step for providing a second integrated circuit element 20 comprising a second semiconductor substrate 21 and a second wiring layer 22; a step for joining an inorganic insulation layer 13 of the first integrated circuit element 10 and an inorganic insulation layer 23 of the second integrated circuit element 20 together; and a step for joining an electrode 14 of the first integrated circuit element 10 and an electrode 24 of the second integrated circuit element 20 together. Provided to the inorganic insulation layer 13, at a position differing from the location where the electrode 14 is disposed, is an opening 15 which is recessed toward the first semiconductor substrate 11 from a joining surface 10a that joins with the inorganic insulation layer 23.

Classes IPC  ?

• H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
• H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
• H01L 21/3205 - Dépôt de couches non isolantes, p. ex. conductrices ou résistives, sur des couches isolantesPost-traitement de ces couches
• H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
• H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
• H01L 27/00 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun