Provided is a chip fuse using an insulated substrate such as a ceramic substrate that is no greater than 2.0 mm in length and no greater than 1.2 mm in width, capable of ensuring suppression of arc generation upon shutdown. A chip fuse 1 comprises: a fuse element 7 formed of a metal thin film on an undercoat 5 on an insulated substrate 3; an insulative first protective film 21 formed of a thick film to cover the fuse element 7; and an insulative second protective film 23 formed of a thick film to cover the first protective film 21. As a silicone rubber for forming the first protective film 21, a silicone rubber having a shear bond strength between 3.1 and 3.9 MPa inclusive, and a rubber hardness of about 66 as measured by a type A durometer is used.
H01H 85/38 - Moyens pour éteindre ou supprimer l'arc
H01H 85/046 - Fusibles sous forme de circuits imprimés
H01H 85/11 - Éléments fusibles caractérisés par la configuration ou la forme de l'élément fusible avec une zone de métal appliquée localement qui, en fondant, forme un eutectique avec le matériau principal de l'élément fusible, c.-à-d. dispositifs à effet M
Provided is a piezoelectric acoustic component with which the sound pressure difference between a first resonant frequency and an intermediate resonant frequency and the sound pressure difference between the intermediate resonant frequency and a third resonant frequency can be reduced, and furthermore with which a sound pressure of at least 80 dB can be obtained and a frequency range can, to a certain degree, be arbitrarily changed. A first and a second protruding part 14 A and 14 B, which protrude in a direction that follows an outer circumferential part of a circular piezoelectric element 15 and is separated from a first virtual line PL1 along a second virtual line PL2, are formed on a pair of long sides 13 Aa and 13 Ab of a non-fixed portion 13 of a piezoelectric acoustic element. In addition, a first and a second recessed part 14 Ca and 14 Cd and a third and a fourth recessed part 14 Cc and 14 Cb, which protrude toward the first virtual line PL1, are formed adjacent to the first and the second protruding parts 14 A, 14 B on the pair of long sides 13 Aa and 13 Ab of the non-fixed portion 13.
G10K 9/122 - Dispositifs dans lesquels le son est produit par la vibration d'un diaphragme ou un élément analogue, p. ex. cornes de brume, avertisseurs de véhicule ou vibreurs fonctionnant électriquement utilisant des moyens d'entraînement piézo-électriques
Provided is a semiconductor force sensor for which abnormalities in output are unlikely to occur even if significant static electricity is generated. Provided is a semiconductor force sensor having small fluctuations in output even with a gel-like protective agent. A semiconductor force sensor 1 has a semiconductor force sensor element 3, a sphere 5 that constitutes a force transmission means, and a case 7. The semiconductor force sensor element 3 has a diaphragm part 9 provided with a conversion unit for converting a change in force to a change in an electrical signal by using a piezoresistive effect, where at least the surface of the diaphragm part 9 is covered by a protective insulating film 11. The protective insulating film 11 is covered by an insulating gel-like protective agent 17 having penetrability determined so that a sphere 5 pushes and spreads the gel-like protective agent 17 disposed on the diaphragm part 9 such that the sphere 5 substantially comes into direct contact with a central section of the diaphragm part 9. A conductive shield layer 15 is formed on the protective insulating film 11 so as to cover an area including the conversion unit, the center of the area being the central section of the diaphragm part 9.
G01L 1/18 - Mesure des forces ou des contraintes, en général en utilisant des propriétés des matériaux piézo-résistants, c.-à-d. des matériaux dont la résistance ohmique varie suivant les modifications de la grandeur ou de la direction de la force appliquée au matériau
H01L 29/84 - Types de dispositifs semi-conducteurs commandés par la variation d'une force mécanique appliquée, p.ex. d'une pression
The present invention provides a pressure sensor device capable of preventing detachment of a layer of an adhesive for fixing a base and avoiding application of unnecessary stress on a semiconductor pressure sensor element, without enhancing the machining accuracy of each component. In a semiconductor pressure sensor element 17 provided with a diaphragm 26 and a base 28, an attaching portion 29 provided around the diaphragm 26 of the base 28 is bonded, by the adhesive, to an attachment wall portion 19 of a second case 5. A gap g is actively generated between a second annular surface S2 and the outer circumferential portion 28Aa of the bottom surface 28A of the base 28.
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
H01L 29/84 - Types de dispositifs semi-conducteurs commandés par la variation d'une force mécanique appliquée, p.ex. d'une pression
A piezoelectric sounding element includes a diaphragm made of metal and a piezoelectric element provided on at least one surface of the diaphragm. A non-fixed portion of the diaphragm includes the pair of long sides facing each other, a pair of short sides, shorter than the long sides, that face each other, and a pair of recesses, provided in the pair of long sides, that protrude so as to approach each other. The piezoelectric element is provided in a region between the pair of recesses of the diaphragm and the contour shapes of the non-fixed portion of the diaphragm and the piezoelectric element are defined so as to be symmetric with respect to a first imaginary line that bisects the pair of short sides and symmetric with respect to a second imaginary line that bisects the pair of long sides.
Provided is a network chip resistor in which the Manhattan phenomenon does not occur during soldering and a voltage dividing circuit can be configured with a single chip. A pair of thick-film terminal electrodes 2, 2 are provided on a surface 1A of an insulation substrate 1, and a thick-film intermediate electrode 3 is provided between the pair of thick-film terminal electrodes 2, 2. One or more plating layers 8 are provided on the pair of thick-film terminal electrodes 2, 2 and two sets of thin-film side electrodes 4, 4 and 5, 5, and on the thick-film intermediate electrode 3 and a pair of thin-film intermediate side electrodes 6, 6. Thin-film intermediate extension electrodes 9 are further provided which extend from the pair of thin-film intermediate side electrodes 6, 6 and which extend on a rear surface 1B of the insulation substrate 1.
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
Provided is a pressure sensor device in which an adhesive layer for fixing a pedestal does not peel off. In a semiconductor pressure sensor element 17 provided with a diaphragm 26 and a stand 28, an attaching portion 29 provided around the diaphragm 26 of the stand 28 is bonded with an adhesive which does not melt by fluid to a wall portion 19 to be attached of a second case 5. Since a pressure added to the diaphragm 26 through an inner passage of a first case 1 acts in a direction of pushing the attaching portion 29 of the pedestal 28 to the wall portion 19 to be attached of the second case 2, peeling off of the adhesive layer is prevented.
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
A capacitive gas sensor in which a second electrode layer made of a nano-carbon material entangled to be three-dimensionally reticulated and a gas-sensitive film are not separated from each other. A capacitive gas sensor includes a substrate; a first electrode layer formed on the substrate; a gas-sensitive film formed on the first electrode layer and having air permeability; and a second electrode layer formed on the gas-sensitive film to be opposed to the first electrode layer and made of a nano-carbon material entangled to be three-dimensionally reticulated. The capacitive gas sensor also includes a reinforcing resin layer having air permeability and disposed at least on the second electrode layer.
G01N 27/22 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la capacité
A pressure sensor device with good temperature characteristics. An auxiliary fluid introduction path is provided in a bottom wall portion of a first case to introduce a fluid to the vicinity of a recessed portion of the bottom wall portion where an integrated circuit with a large change in temperature characteristics is mounted such that the temperature of the integrated circuit becomes the same as or close to the temperature of the fluid.
G01L 9/02 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent en faisant usage des variations de la résistance ohmique, p. ex. de potentiomètre
G01L 19/04 - Moyens pour compenser les effets des variations de température
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
G01L 19/00 - Détails ou accessoires des appareils pour la mesure de la pression permanente ou quasi permanente d'un milieu fluent dans la mesure où ces détails ou accessoires ne sont pas particuliers à des types particuliers de manomètres
G01L 19/06 - Moyens pour empêcher la surcharge ou l'influence délétère du milieu à mesurer sur le dispositif de mesure ou vice versa
Provided is an input device which is for an electronic apparatus and does not require complicated settings, and in which erroneous determination of an input does not occur even when there is non-uniformity in the characteristics of a load sensor being used or there is a change in the ambient temperature. A trigger signal generation unit 11 of an input control unit 9 outputs a trigger signal upon detecting, as a capacitance change, the proximity of an operator's finger to an input operation panel of a capacitance panel 5 serving as a touch panel. A reference value holding unit 13 holds an output value, which is acquired from a pressure-sensitive sensor 7 when the trigger signal is generated, as a reference value for when the load is zero. When the difference between the reference value and the output value from the pressure-sensitive sensor 7 after the generation of the trigger signal is determined to be within a predetermined range of values, a determination unit 15 outputs, from a coordinate information output unit 17, coordinate information from the capacitance panel 5.
Provided is an infrared sensor device having a high detection accuracy, and a method for manufacturing the same. A cap member 10 is provided with a peripheral wall portion 12 having an opening portion 11, and an opposing wall portion 13 in which an infrared light transmitting portion 15 is provided, and has an internal space which is partitioned by means of partition walls 31, 32. A base plate 20 with sensors, and the cap member 10, are joined together by means of a solder layer 30, and the internal space is held in a state of vacuum. The base plate 20 with sensors is provided with an infrared light detecting sensor element 21 which receives infrared light IR that has been transmitted through the infrared light transmitting portion 15, and a temperature sensor element 22 and a temperature compensation sensor element 23 for temperature compensation. The partition walls 31, 32 prevent the infrared light IR that has been transmitted through the infrared light transmitting portion 15 from impinging upon the sensor elements 22, 23 for temperature compensation, but gaps g between lower edges of the partition walls 31, 32 and an upper surface of the base plate 20 with sensors allows air to circulate, and thus the infrared light detecting sensor element 21 and the sensor elements 22, 23 for temperature compensation can be placed in the same environment.
Provided is a sensor device which is capable of assuredly maintaining a vacuum state of the interior space of the device in which a sensor element is housed. A sensor-equipped substrate 20 and a cap member 10 are joined together via a solder layer 30, and the interior space is maintained at vacuum. A joining pattern 14 has formed therein land portions 14A at the central part of the four edges of a rectangular end surface 10A in a peripheral wall part 12. A non-land portion 14B, being the area other than the land portions 14A, has a width dimension W3 smaller than the maximum width dimension W2 of the land portions 14A; meanwhile, the number of the land portions and the intervals therebetween are defined such that the solder layer 30 formed by melting a plurality of solder balls 37 is made into a completely closed loop.
Provided are a piezoelectric-type flat speaker with which a higher than conventional sound pressure can be obtained in a low-frequency range, and a method of forming the same. The piezoelectric-type flat speaker is provided with: a flat plate 101, such as a flat display, of which the periphery is supported, where a plurality of piezoelectric actuators 102a, 102b, 102c, 102d are installed so as to be able to transmit vibrations to a first area R1 of the flat plate 101, and two piezoelectric actuators 103a, 103b are installed at two selected anti-node superimposed positions which are symmetric with respect to a center C of a lateral center line YL in a second area R2; and a drive circuit for generating piezoelectric vibrations by electrically driving the plurality of piezoelectric actuators. The plurality of piezoelectric actuators are respectively installed so as to be able to transmit vibrations to a plurality of selected anti-node superimposed positions selected from the plurality of anti-node superimposed positions at which the positions of the anti-nodes of a plurality of flexural vibrations, generated in the flat plate 101 when the flat plate is excited, are aligned.
Provided is a piezoelectric acoustic component with which a plurality of scales can be heard even in a noisy area. A piezoelectric sound generating element 11 is constituted by a metal vibration plate 12 and a piezoelectric element 15 provided on at least one surface of the vibration plate 12. A non-fixed part of the vibration plate 12 comprises a pair of long sides 13A that face each other and a pair of short sides 13B that face each other and are shorter than the long sides 13A, and the pair of long sides 13A have a pair of recesses 13C that are formed by a protrusion formed by the long sides rising as they approach each other. The piezoelectric element 15 is provided on a region between the pair of recesses 13C of the vibration plate 12, and the outline shape of each of the non-fixed part 13 and piezoelectric element 15 of the vibration plate 12 is set so as to be symmetrical with respect to a first virtual line PL1 that divides the pair of short sides 13B in two, and so as to be symmetrical with respect to a second virtual line PL2 that divides the pair of long sides 13A in two.
The purpose of the present invention is to reduce the reset voltage per anisotropic magnetoresistive effect element (2) in a magnetoresistive effect element unit (1). This magnetoresistive effect element unit (1) is provided with an anisotropic magnetoresistive effect element (2) and a conductor reset line (3) that passes through the center of the anisotropic magnetoresistive effect element (2) when viewed from a direction orthogonal to both the sensing direction x' and easy magnetization direction y' of the anisotropic magnetoresistive effect element (2), extends in a direction inclined from the easy magnetization direction y' so as to form an angle of 45° or less with the easy magnetization direction y', and is parallel to a plane including the sensing direction x' and easy magnetization direction y'. When viewed from a direction orthogonal to both the sensing direction x' and easy magnetization direction y', the reset line (3) has a width that covers the entirety of the anisotropic magnetoresistive effect element (2).
G01R 33/09 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs magnéto-résistifs
H01L 43/08 - Résistances commandées par un champ magnétique
Provided is a multi-stage pressure-sensitive switch capable of generating two-stage click-feelings using a pressure-sensitive resistance plate. In this multi-stage pressure-sensitive switch, a pressure-sensitive resistance plate 40 is disposed on a paired first protruding fixed contact point 28 and a second protruding fixed contact point 38, which protrude from the bottom wall of a recessed section 12 of a housing 10, and a paired first flat fixed contact point 29 and second flat fixed contact point 39, which are flush with the bottom wall. Disposed on the pressure-sensitive resistance plate 40 is a first tact plate 50 generating a click-feeling, and further disposed thereon are, sequentially, a spacer 60, a plate spring 70, a second tact plate 80, and a lid 90. While pressing down a key top 92 of the lid 90, when the pressing force reaches the magnitude of a first stage, the second tact plate 80 becomes inverted, thereby applying pressure on the pressure-sensitive resistance plate 40 and closing the electrical path between the protruding fixed contact points 28, 38. Then, when the pressing force reaches the magnitude of a second stage, the first tact plate 50 becomes inverted, thereby closing the electrical path between the pair of flat fixed contact points 29, 39. In a third stage, the magnitude of the current flowing between the pair of flat fixed contact points 29, 39 can be controlled according to the magnitude of the pressing force.
H01H 13/64 - Interrupteurs ayant un organe moteur à mouvement rectiligne ou des organes adaptés pour pousser ou tirer dans une seule direction, p. ex. interrupteur à bouton-poussoir ayant un seul élément d'actionnement dans lequel l'interrupteur a plus de deux positions électriquement distinctives, p. ex. interrupteurs, bouton-poussoir à plusieurs positions
H01H 13/48 - Dispositions à action brusque consécutive à la déformation d'éléments élastiques utilisant la déformation de ressorts à disques
H01H 13/52 - Interrupteurs ayant un organe moteur à mouvement rectiligne ou des organes adaptés pour pousser ou tirer dans une seule direction, p. ex. interrupteur à bouton-poussoir ayant un seul élément d'actionnement le contact retournant immédiatement à son état initial après suppression de la force motrice, p. ex. bouton-poussoir de sonnerie
Provided is a capacitive gas sensor wherein a gas-sensitive film will not detach from a second electrode layer having a structure in which a nanocarbon material is intertwined into a three-dimensional mesh pattern. The capacitive gas sensor is provided with a first electrode layer 5 formed on a substrate 3, an air-permeable gas-sensitive film 11 formed on the first electrode layer, and a second electrode layer 13 comprising a nanocarbon material intertwined into a three-dimensional mesh pattern and formed on the gas-sensitive film so as to face the first electrode layer 5. A reinforcing resin layer 15 having air permeability is provided at least on the second electrode layer.
G01N 27/22 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la capacité
Provided is a highly versatile current sensor with which it is possible, using a simple structure, to maintain a constant distance between a conductor and a magnetoelectric conversion element, and to cater for a difference in the diameter of the conductor. Clip members 9, 11 are disposed on both sides, with respect to the direction of current flow, of a shield case 5. The clip members 9, 11 are mounted on a housing 71 so as to clip, through a clip structure, a part of the housing 71 and a part of a cable C (conductor), and maintain a constant distance between the cable C (conductor) and the magnetoelectric conversion element 8.
G01R 15/20 - Adaptations fournissant une isolation en tension ou en courant, p. ex. adaptations pour les réseaux à haute tension ou à courant fort utilisant des dispositifs galvano-magnétiques, p. ex. des dispositifs à effet Hall
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
20.
PIEZOELECTRIC VIBRATION GENERATING DEVICE AND INSTRUMENT PROVIDED WITH PIEZOELECTRIC VIBRATION GENERATING DEVICE
Provided are: a piezoelectric vibration generating device that is finished with less manufacturing time and has a longer lifespan than the prior art, and that uses a circular vibrating plate and piezoelectric vibrating element; and an instrument provided with said piezoelectric vibration generating device. A vibrating shaft 17 is configured from a metal screw member arranged so as to pass through a third through-hole 4 provided to a vibrating plate 3, a second through-hole 13 of a piezoelectric vibrating element 15, and a first through-hole 5 of a first case half-section 7, so that a head part 17C is positioned on a side near a second case half-section 9 and a screw part 17D at the distal end extends out to the exterior of the first case half-section 7. A metal nut member 19 is fitted with the screw part 17D.
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
H01L 41/053 - Montures, supports, enveloppes ou boîtiers
H01L 41/09 - Eléments piézo-électriques ou électrostrictifs à entrée électrique et sortie mécanique
A semiconductor pressure sensor device in which the shape or the structure of a connector portion can be easily changed and which has high waterproof performance. A terminal housing and a second case are engaged with each other via an engagement structure. The terminal housing and a first case are fitted with each other via a fitting structure. Thus, the first case and the second case are fixed to each other via the terminal housing. The first case is fitted in the second case. Then, the terminal housing is fitted with the first case, and the terminal housing is engaged with the second case substantially at the same time. Through such simple process, an opening portion of the first case is covered and a connector portion configured to enable external terminals to be connected to ends, located on one side, of a plurality of lead terminals is formed.
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
Provided is a pressure sensor device having better temperature characteristics than conventional pressure sensor devices. A bottom wall portion 15 of a first case 1 is provided with an auxiliary fluid introduction path 20B for introducing a fluid to a position 15A in which an integrated circuit 24 is mounted, in the vicinity of a recessed portion 16 of the bottom wall portion 15, in such a way that the temperature of the integrated circuit 24, which has a large temperature characteristic variation, becomes the temperature of the fluid or a temperature close to the temperature of the fluid.
A force detector capable of preventing short-circuit fault between electrodes and allowing for downsizing. A prescribed region encompasses a projection region defined by projecting a deformation region of a force sensor element, which is deformed when a force transmission member applies a force to the force sensor element, onto a base substrate. A plurality of terminals are provided by four soldering land electrodes formed, respectively, at four corners of the base substrate. The soldering land electrodes are shaped such that a portion of each soldering land electrode is located within the projection region to form a soldering portion.
G01L 5/00 - Appareils ou procédés pour la mesure des forces, du travail, de la puissance mécanique ou du couple, spécialement adaptés à des fins spécifiques
G01L 1/26 - Mesures auxiliaires prises, ou dispositifs utilisés en liaison avec le mesurage des forces, p. ex. pour empêcher l'influence des composantes transversales de la force, pour empêcher la surcharge
G01L 19/00 - Détails ou accessoires des appareils pour la mesure de la pression permanente ou quasi permanente d'un milieu fluent dans la mesure où ces détails ou accessoires ne sont pas particuliers à des types particuliers de manomètres
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
G01L 1/18 - Mesure des forces ou des contraintes, en général en utilisant des propriétés des matériaux piézo-résistants, c.-à-d. des matériaux dont la résistance ohmique varie suivant les modifications de la grandeur ou de la direction de la force appliquée au matériau
Provided is a backlight module that can be manufactured lighter more cheaply than previously, and for which it is possible to obtain as much heat dissipation performance as needed. Copper foil patterns (32A and 32B) that are formed on a substrate front surface (31A) and a substrate back surface (31B) of a circuit substrate (35) include a power supply copper foil pattern (37A) that supplies power to a plurality of light-emitting elements (38), said light-emitting elements (38) being formed from light-emitting diodes (LEDs), and a heat dissipation copper foil pattern (37B) that constitutes a portion of a heat-dissipating structure. An air flow recess (54) is formed between a pair of light source array storage recesses (53) in a light guide plate back surface section (52) of a light guide plate (5), said light guide plate back surface section (52) facing the substrate front surface of the circuit substrate (35), said air flow recess (54) opening toward the substrate front surface (31A), opening toward both sides in the directions in which a pair of light source arrays (39) extend, and constituting a portion of a heat-dissipating structure. A main reflection layer (55) that reflects light into the light guide plate (5) is formed on a surface of the light guide plate back surface section (52), said surface including at least the air flow recess (54).
Provided is a piezoelectric vibration generating device that can make the frequency bandwidth of acceleration wider than was previously possible. One end 9A of a vibrating plate 9 is welded to a surface of one mount 7A. Another end 9B of the vibrating plate 9 has an extending section 9C that extends in a curving manner along an outer side surface of another stand 7B. The extending section 9C of the vibrating plate 9 is welded to the outer side surface of the stand 7B, and one section 9D of the other end 9B, the one section 9D being adjacent to the extending section 9C and facing the surface of the stand 7B, is adhered to the surface of the stand 7B with an adhesive which is not illustrated. A deforming part 19, which deforms so as to absorb stress generated by welding, is integrally provided between the other end 9B of the vibrating plate 9 and a piezoelectric vibrating element 17.
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
Provided is a force sensor unit which has a simple structure, can easily be assembled, and is easily reduced in size. A force sensor unit is provided with a barrel 10, a substrate 20 for blocking one end of the barrel 10, a force sensor 30 supported on the substrate 20, and a force transmitting mechanism for transmitting a force to the force sensor 30, the force transmitting mechanism being arranged in an internal space of the barrel 10 and comprising a contact member 40, a coil spring 50, and an operation-receiving member 60. The members arranged in sequence inside the internal space of the barrel 10 are not bonded to or engaged with each other, and besides the substrate 20, the members are only loosely fitted in the internal space of the barrel 10 and are easy to assemble, and the assembly can easily be reduced in size.
G01L 1/26 - Mesures auxiliaires prises, ou dispositifs utilisés en liaison avec le mesurage des forces, p. ex. pour empêcher l'influence des composantes transversales de la force, pour empêcher la surcharge
Provided is a capacitive humidity sensor whereby it is possible to prevent infiltration and discharge of excess moisture without forming a moisture-impermeable protective film. A first slit 4 is formed between a surrounding electrode 51 and most of a peripheral edge section of a lower electrode 31. A moisture-sensitive film pattern 7 fills the first slit 4 formed between the surrounding electrode 51 and most of the peripheral edge section of the lower electrode 31, and is provided with a second slit 8 for causing the surrounding electrode 51 to be continuously exposed, the second slit 8 being provided along the surrounding electrode 51. An upper electrode pattern 9 is formed so as to cover most of a peripheral edge section of a moisture-sensitive film 71. The upper electrode pattern 9 is formed so as to fill the second slit 8 in the moisture-sensitive film pattern 7.
G01N 27/22 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la capacité
Provided is a semiconductor pressure sensor that makes the formation and structural modification of a connector part simple and is highly water resistant. Because a terminal housing 7 and second case 5 are engaged by engagement mechanisms 9a, 9b and the terminal housing 7 and a first case 1 are fit together by fitting mechanisms 11a, 11b, the first case 1 and second case 5 are fixed to each other via the terminal housing 7. The single simple step of fitting the first case 1 into the second case 5, fitting the terminal housing 7 together with the first case 1, and roughly simultaneously engaging the terminal housing 7 with the second case 5 constructs a connector part that surrounds the opening of the first case 1 and makes it possible to connect external terminals to a plurality of other ends of lead terminals.
Provided is a force detector capable of preventing shorting between electrodes and facilitating size reduction. A projection area arrived at by projecting, onto a base substrate (22), the deformation area of a force sensor element (12) that is deformed when a force transmission member (14) transmits force to the force sensor element (12) is included in a prescribed area. A plurality of terminals comprise four soldered land electrodes (16) formed in each of four corners of the base substrate (22). The four soldered land electrodes (16) are shaped such that portions (16A) of the four soldered land electrodes (16) are within the projection area and compose a soldered portion (30a).
G01L 1/18 - Mesure des forces ou des contraintes, en général en utilisant des propriétés des matériaux piézo-résistants, c.-à-d. des matériaux dont la résistance ohmique varie suivant les modifications de la grandeur ou de la direction de la force appliquée au matériau
G01L 1/26 - Mesures auxiliaires prises, ou dispositifs utilisés en liaison avec le mesurage des forces, p. ex. pour empêcher l'influence des composantes transversales de la force, pour empêcher la surcharge
Provided is an angular velocity sensor that even when made smaller is capable of suppressing the movement of a support part resulting from the vibration of a vibrating body and suppressing Q value reduction. A vibration stabilization part (24) including a silicon plate (19) has a combined weight with a peripheral support part (7) of at least 20 times that of a weight (5). The peripheral support part (7) has an outer peripheral portion that has a rectangular contour and supports a diaphragm-shaped vibration excitation part (3, 13) having a cylindrical vibrating body (5) in a center part and an octagonal contour. The vibration stabilization part (24) is joined to the peripheral support part (7) using a silicon-based adhesive (21). The silicon plate (19) and peripheral support part (7) are joined by an adhesive of a thickness between 10 and 50 µm that becomes softer when a vibration frequency is low and harder when a vibration frequency is high.
G01C 19/56 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
Provided is a chip=shaped electric part having a simple structure and greater durability against sulfuration. A resistive layer (7) made of a material having high durability against sulfuration is connected so as to completely cover inner edges (6) of a pair of surface electrodes (3), the resistive layer (7) straddling the pair of surface electrodes (3). A surface of the resistive layer (7) is covered by an insulating protective layer (9) having a two-layer structure so as to expose both edges of the resistive layer (7) aligned in the same direction in which the surface electrodes (3) are aligned, and form exposed portions (8). A two-layer plating layer (11) is formed so as to cover portions of the surface electrodes (3) not covered by the resistive layer (7), the exposed portions (8) of the resistive layer (7), a surface of a side electrode (5), and the entire surface of a rear electrode (4).
H01C 1/146 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances l'élément résistif entourant la borne
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
Provided is a piezoelectric sound element which can easily distribute resonance while maintaining a certain degree of sound pressure. This piezoelectric sound element is provided with a vibration plate (7), and a piezoelectric element (11) which is affixed to the vibration plate (7) and which expands and contracts with the application of voltage. The contour shape of the piezoelectric element (11) has a long axis (L3) and a short axis (S3), has a pair of sides (111) extending parallel to the long axis (L3) and another pair of sides (112) continuous with the first pair of sides (111) and having a convex curved portion (116) on both ends, and is line-symmetrical about the long axis and the short axis. The ratio of the length of the short axis (S3) and the length of the long axis (L3) of contour shape of the piezoelectric element (11) is in the range of 1:1.55-1:1.75, and the radius of curvature of the convex curved portion (116) is a value in the range of 35%-50% of the length of the short axis (S3).
Provided is a piezoelectric vibration-generating device, which is capable of generating large vibrations even when made smaller and which is also long-lived. Between each of the two ends of a vibrating plate (9) that are welded to a pedestal (7) and a piezoelectric vibrating element (17), the vibrating plate is integrally provided with a deforming section (19) that is convex on one side in the thickness direction and concave on the other side in the thickness direction so as to absorb stress generated by welding. The cross-sectional shape of the deforming sections (19) exhibits an arc shape or U-shape when cut in the thickness direction.
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
H02N 2/00 - Machines électriques en général utilisant l'effet piézo-électrique, l'électrostriction ou la magnétostriction
A piezoelectric sound generating element capable of providing flatter and less fluctuated sound pressure frequency characteristics includes a diaphragm that is formed in a circular plate shape with a circular profile. A piezoelectric element is affixed to the side of a bottom wall portion of the diaphragm. The piezoelectric element has an asymmetric octagonal profile including a pair of long side portions opposing each other, a pair of short side portions opposing each other, and four connecting side portions.
G10K 9/122 - Dispositifs dans lesquels le son est produit par la vibration d'un diaphragme ou un élément analogue, p. ex. cornes de brume, avertisseurs de véhicule ou vibreurs fonctionnant électriquement utilisant des moyens d'entraînement piézo-électriques
Provided is a jumper chip part that is unlikely to fracture even when the dimensions are increased. An insulating substrate (3) is composed of a glass-epoxy substrate. A front-surface conductive layer (5) and a back-surface conductive layer (7) are composed of copper foil secured to the front surface (3a) and the back surface (3b) of the insulating substrate (3). A pair of terminal electrodes (9, 11) are formed at the end of the insulating substrate (3), and are electrically connected to the front-surface conductive layer (5) and the back-surface conductive layer (7).
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
H01C 17/06 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base
Provided is a pressure sensor module which enables the atmospheric pressure to be reliably introduced into a reference pressure chamber. Atmospheric pressure introduction passages (27, 29) are formed in the upper wall (11) of a pressure sensor module (1), and the atmospheric pressure introduction passages (27, 29) comprise: through-holes (27a, 29a) which penetrate through the upper wall (11) in the direction away from a bottom wall member (15) which is a first wall; and grooves (27b, 29b). Each of the through-holes (27a, 29a) has: one end which is open at the outer wall surface of the second upper wall portion (11b) of the upper wall (11); and the other end which is open at the inner wall surface of the first upper wall portion (11a) of the upper wall (11) and which is connected to a reference pressure chamber (S2). The grooves (27b, 29b) extend along the outer wall surface of the second upper wall portion (11b), are open at the outer wall surface and at the side surface of the second upper wall portion (11b), and are connected to the ends of the through-holes (27a, 29a).
G01L 19/00 - Détails ou accessoires des appareils pour la mesure de la pression permanente ou quasi permanente d'un milieu fluent dans la mesure où ces détails ou accessoires ne sont pas particuliers à des types particuliers de manomètres
Provided is a piezoelectric vibration device with vibrations that are easily sensed by a user and a short dissipation time for vibration. A vibration plate (1) is affixed on one end (1a). A piezoelectric oscillator (3) is formed on top of the vibration plate (1). An attachment holder (9) is affixed to the one end (1a) of the vibration plate (1) such that a terminal part (3d) of the piezoelectric oscillator (3) is left. A weight member (5) is attached to the other end (1c) of the vibration plate (1). The weight member (5) has a greater rigidity than the vibration plate (1). The natural frequency for the weight member (5) is set at three or more times the natural frequency of the vibration plate (1) on which the piezoelectric oscillator (3) is formed. The weight member (5) has a base part (5c) having a contact surface (5b) that is in contact with the vibration plate (1) and a main body part (5d) provided integrally with the base part (5c) and extending parallel to the vibration plate (1). An inclined surface (5f) is formed on a surface (5e) of the main body part (5d) that faces the vibration plate (1).
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
H02N 2/00 - Machines électriques en général utilisant l'effet piézo-électrique, l'électrostriction ou la magnétostriction
Provided is a layered piezoelectric element capable of reducing the electrostatic capacity at which a circuit is loaded, and capable of increasing the amount of amplitude per electrostatic capacity. A layered piezoelectric element (5) is formed from an upper layered body (7) in which piezoelectric ceramic layers (15A to 15D) are layered, a lower layered body (9) in which piezoelectric ceramic layers (15E to 15H) are layered, and an internal insulating layer (11) arranged between the upper layered body (7) and the lower layered body (9). The piezoelectric ceramic layers of the upper layered body (7) and the lower layered body (9) are subjected to a polarization treatment so as to bring about a reversal of the amplitude mode of the upper layered body (7) and the amplitude mode of the lower layered body (9) during driving. Only the lower layered body (9) is supported by a support plate (3). The internal insulating layer (11) is not subjected to a polarization treatment.
H01L 41/22 - Procédés ou appareils spécialement adaptés à l'assemblage, la fabrication ou au traitement de dispositifs piézo-électriques ou électrostrictifs, ou de leurs parties constitutives
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
Provided is a vibration-type angular velocity sensor that increases detection sensitivity and precision generated around the axis in a Z-axis direction and that does not cause deterioration of detection sensitivity and precision generated around the axes in an X-axis direction and a Y-axis direction. A weight (3) has a columnar shape or a conical shape. The contour shape of the outer peripheral part of a diagram (1) has a shape having a straight portion (ST) at the four corners of a rectangle. Four vibrational excitation electrodes (11) are respectively formed within four regions partitioned by first and second virtual lines (L1, L2). Four angular velocity detection electrodes (13) are respectively formed in four regions partitioned by a first virtual diagonal line (CL1) and a second virtual diagonal line (CL2).
G01C 19/56 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
H01L 41/08 - Eléments piézo-électriques ou électrostrictifs
H01L 41/09 - Eléments piézo-électriques ou électrostrictifs à entrée électrique et sortie mécanique
Provided is a piezoelectric sound element capable of flattening a sound pressure frequency property and reducing variation in the sound pressure frequency property, compared to the prior art. A diaphragm (13) is formed into a disc shape having a circular outline. The diaphragm (13) is provided by adhesion, on its bottom wall (3b) side, with a piezoelectric element (15) having an asymmetric octagonal shape comprising a pair of opposing long sides (15a), a pair of opposing short sides (15b), and four connecting sides (15c).
Provided is a piezoelectric vibration element that can obtain a vibration that is larger than conventional vibrations. A pair of extensions to which piezoelectric elements are not joined are formed at both ends in the lengthwise direction of a vibrating plate. A pair of support sections that support the pair of extensions of the vibrating plate are formed in a support body. The support sections have a pair of contact pieces that contact the front surface and back surface of the extensions and support the extensions in a manner so as to allow that extensions to oscillate centered at the section of contact with the pair of contact pieces when the piezoelectric element is expanding and contracting.
Provided is a sensor element of which the sensitivity does not vary even when applied with a large impact and even when a tilted surface for preventing a crack from forming on the boundary region between a flexible section and a plumb bob and on the boundary region between the flexible section and a support section is disposed. Also provided is a method for producing a sensor element. The thickness of the flexible section is 10µm or less. A tilted inner wall surface is formed such that the shortest distance between the end thereof that is contiguous with the flexible surface and a first virtual tubular surface containing a main inner wall surface and extending in a direction that intersects with the aforementioned end is 0.04 R to 0.16 R when R represents the maximum diameter of the main outer wall surface of the plumb bob. A tilted outer wall surface is formed such that the shortest distance between the end thereof that is contiguous with the flexible surface and a second virtual tubular surface containing the main outer wall surface and extending along the main inner wall surface is 0.02 R to 0.08 R.
G01C 19/56 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
G01P 15/09 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs piézo-électriques
H01L 29/84 - Types de dispositifs semi-conducteurs commandés par la variation d'une force mécanique appliquée, p.ex. d'une pression
H01L 41/08 - Eléments piézo-électriques ou électrostrictifs
H01L 41/18 - Emploi de matériaux spécifiés pour des éléments piézo-électriques ou électrostrictifs
H01L 41/22 - Procédés ou appareils spécialement adaptés à l'assemblage, la fabrication ou au traitement de dispositifs piézo-électriques ou électrostrictifs, ou de leurs parties constitutives
Provided is a manufacturing method of a metal oxide semiconductor material for gas sensors by which an oxide precursor and noble metal colloid particles will not readily cohere in the manufacturing process. The manufacturing process implements a precursor solution synthesis step 1 of synthesizing an oxide precursor solution in which an oxide precursor is dispersed, a pH adjustment step 3 of adjusting the pH of the oxide precursor solution, a precursor-colloid dispersion preparation step 5 of preparing an oxide precursor-noble metal colloid dispersion in which the oxide precursor and the noble metal colloid are dispersed substantially uniformly, a purifying step 7 of purifying the oxide precursor-noble metal colloid dispersion to obtain a purified oxide precursor noble metal colloid dispersion, and a freeze-drying step 11 of freeze-drying an precipitate of the purified oxide precursor-noble metal colloid dispersion.
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
Disclosed is a posture determination device that can easily determine posture without complicated calculations. Acceleration compositions (Gx to Gz) in normalized first to third axes directions output from a three-axis acceleration sensor (1) are input into first to third judgment units (5 to 9). The first judgment unit (5) judges which of the following ranges the first axis direction component (Gx) is in: Gx< -0.5, -0.5≦Gx<0, 0≦Gx<0.5, or 0.5≦Gx. The second judgment unit (7) judges which of the following ranges the second axis direction component (Gy) is in: Gy< -0.5, -0.5≦Gy<0, 0≦Gy<0.5, or 0.5≦Gy. The third judgment unit (9) judges which of the following ranges the third axis direction component (Gz) is in: Gz< -0.5, -0.5≦Gz<0, 0≦Gz<0.5, or 0.5≦Gz. Outputs from the first to third judgment units (5 to 9) are input into the posture determination unit (11) and the posture determination unit (11) judges the posture of a supporting body to which the three-axis acceleration sensor (1) is fixed.
Provided is a chip fuse which includes a fuse element that can be fused at a low temperature without fail. Surface electrodes are formed on a surface of an insulating substrate (1), and an Ni-P-Fe layer (15) is formed by plating so as to overlap the surface electrodes (3). An Sn layer (17) is formed by plating on the Ni-P-Fe layer (15). The Sn layer (17) is coated with an overcoat constituted of an insulating resin material.
H01H 85/11 - Éléments fusibles caractérisés par la configuration ou la forme de l'élément fusible avec une zone de métal appliquée localement qui, en fondant, forme un eutectique avec le matériau principal de l'élément fusible, c.-à-d. dispositifs à effet M
C22C 19/03 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
C25D 7/00 - Dépôt électrochimique caractérisé par l'objet à revêtir
H01H 85/046 - Fusibles sous forme de circuits imprimés
48.
MANUFACTURING METHOD FOR SENSOR ELEMENT EQUIPPED WITH PZT FILM
Disclosed is a manufacturing method for a sensor element equipped with a PZT film, that forms a good quality, and substantially homogenous PZT film. The method forms a lower electrode E0 on a surface of one side of an SOI substrate 31 having a thickness of 550 µm or more. A PZT film 37 is formed on the lower electrode E0 when the SOI substrate 31 is heated from a surface side of another side of the SOI substrate 31. A predetermined PZT film pattern 19 is formed by implementing an etching process on the PZT film 37. An upper electrode E1 is formed with a predetermined pattern that opposes the lower electrode E0 on the PZT film pattern 19. A polishing process is implemented on a surface of another side of the SOI substrate 31 thereby thinning the thickness of the SOI substrate 31 to a predetermined thickness to effectively develops a characteristic of the PZT film pattern 19. Thereafter, a flexible portion 11 is formed having flexibility by implementing an etching process on a surface of another side of the SOI substrate 31.
H01L 41/22 - Procédés ou appareils spécialement adaptés à l'assemblage, la fabrication ou au traitement de dispositifs piézo-électriques ou électrostrictifs, ou de leurs parties constitutives
G01P 9/04 - en utilisant des dispositifs sensibles à la rotation avec des masses vibrantes, p.ex. diapason
H01L 41/08 - Eléments piézo-électriques ou électrostrictifs
H01L 41/18 - Emploi de matériaux spécifiés pour des éléments piézo-électriques ou électrostrictifs
Provided is a force detector such that variation in detection accuracy is not increased even when the overall dimensions of the force detector are decreased. A soldering part (17), which is made from a solderable material, is provided on an outer wall of a bottom wall part (1) of a case body (4). The soldering part (17) is provided at a position facing a pressure transmitting member (11). The soldering part (17) has a size completely facing a semiconductor force sensor element across the bottom wall part (1).
G01L 1/26 - Mesures auxiliaires prises, ou dispositifs utilisés en liaison avec le mesurage des forces, p. ex. pour empêcher l'influence des composantes transversales de la force, pour empêcher la surcharge
Provided is a chip fuse wherein a fuse element composed of metal resinate reliably melts when excess current passes through. Surface electrodes (3) and an undercoating (13) are formed on the surface of a chip-shaped substrate (1), and a thick-film fuse element (17) composed of metal resinate is formed on the surface electrodes (3) and the undercoating (13). The thick-film fuse element is coated with an overcoating composed of an insulation resin material having a firing temperature lower than the firing temperature of the metal resinate.
Disclosed are a gas sensor element that is capable of reducing deformations in sensitive parts that are caused by stress and a production method therefor. The surface (3A) of a support body (3), which is equipped with a cavity (7) provided with an opening (5), is provided with a base insulating layer (9) that houses a heater wiring pattern (19) and is provided with a fixed section (15) that is fixed to the surface (3A) of the support body (3) and a non-fixed section (17) that is positioned above the opening (5). An electrode wiring pattern (27) and a sensitive membrane (31) are formed on the center part (21) of the non-fixed section (17) of the base insulating layer (9). The non-fixed section (17) forms the center part (21) and a plurality of connecting parts (23) that connect the center part (21) and the fixed section (15). The four connecting parts (23) are formed from base parts (33) and extending parts (35). The base parts (33) of the connecting parts (23) are formed so as to extend along the edge (5A) of the opening (5). The extending parts (35) are formed so as to extend from the base parts (33) towards the center part (21) and connect to the center part (21). The connecting parts (23) are formed in a manner such that the maximum width dimension (W1) of the base part (33) is larger than the maximum width dimension (W2) of the extending part (35).
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de l'absorption d'un fluideRecherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
52.
ACCELERATION SENSOR MODULE HAVING POSTURE DETERMINATION FUNCTION
Provided is an acceleration sensor module having a posture determination function by which a posture of a device to which the module is attached can be easily detected at a comparatively low cost. A X-axis acceleration level assessment unit (9) assesses whether a X-axis acceleration signal output from a three-axis acceleration sensor (3) is a value equal to or larger than a predetermined positive threshold level (+VRx), a value equal to or lower than a predetermined negative threshold level (-VRx), a value between the positive threshold level (+VRx) and the 0 level, or a value between the 0 level and the negative threshold level (-VRx). Further, a Y-axis acceleration level assessment unit (11) performs a similar assessment regarding a Y-axis acceleration signal output from the three-axis acceleration sensor (3). A posture assessment unit (13) assesses a rotation posture around the Z-axis of the device to which the three-axis acceleration sensor (3) is attached, on the basis of the assessment results of the X-axis acceleration level assessment unit (9) and the Y-axis acceleration level assessment unit (11).
G01P 15/18 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération dans plusieurs dimensions
G03B 17/00 - Parties constitutives des appareils ou corps d'appareilsLeurs accessoires
H04N 5/232 - Dispositifs pour la commande des caméras de télévision, p.ex. commande à distance
53.
BASE BODY FOR GAS SENSOR AND METHOD FOR MANUFACTURING THE BASE BODY
Provided is a base body for a gas sensor, by which heat conductivity of a heat resistive element to a catalyst sintered layer, compensating sintered layer or sensitive membrane is sufficiently improved, while maintaining breaking resistance of an insulating substrate. Circular recessed sections (19a, 19b) with opened tops are respectively formed on the portions where a gas detecting heat resistive element (11) and a compensating heat resistive element (13) are formed in an upper layer (19) of an insulating substrate (9). With the presence of the recessed sections (19a, 19b), the thickness of the insulating substrate (9) portions where the gas detecting heat resistive element (11) and the compensating heat resistive element (13) are formed is reduced to be smaller than that of a circumferential section (19c).
G01N 27/16 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps chauffé électriquement dépendant de variations de température produite par l'oxydation par combustion ou catalyse d'un matériau de l'espace environnant à tester, p. ex. d'un gaz
54.
MANUFACTURING METHOD FOR METAL OXIDE SEMICONDUCTOR MATERIAL FOR GAS SENSOR
Provided is a manufacturing method for a metal oxide semiconductor material for gas sensors with which a metal oxide precursor and noble metal colloid particles will not readily cohere in the manufacturing process. A precursor solution synthesis step (1) to synthesize an oxide precursor solution in which an oxide precursor is dispersed, a pH preparation step (3) to adjust the pH of the oxide precursor solution, a precursor-colloid dispersion preparation step (5) to prepare an oxide precursor-noble metal colloid dispersion in which the oxide precursor and the noble metal colloid are dispersed approximately uniformly, a cleaning step (7) to clean the oxide precursor-noble metal colloid dispersion and obtain a purified oxide precursor-noble metal colloid dispersion, and a freeze drying step (11) to freeze-dry the precipitate of the purified oxide precursor-noble metal colloid dispersion.
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de l'absorption d'un fluideRecherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
C01G 15/00 - Composés du gallium, de l'indium ou du thallium
C01G 55/00 - Composés du ruthénium, du rhodium, du palladium, de l'osmium, de l'iridium, ou du platine
Disclosed is a biaxial angular velocity sensor having good detection sensitivity and making it possible to stably fix an oscillator. The biaxial angular velocity sensor comprises an oscillator (3) made of a nonpiezoelectric material, a drive electro-mechanical energy conversion element (23) and detection electro-mechanical energy conversion element (25) provided in the oscillator (3), a plurality of drive electrodes (27) provided for the drive electro-mechanical energy conversion element (23), and a plurality of detection electrodes (29) provided for the detection electro-mechanical energy conversion element (25). The oscillator (3) is constituted from a central portion (5) located in the center of the oscillator and eight 1st to 8th arm portions (7) to (21). The end portions located on the opposite side to the central portion (5) of the 5th to 8th arm portions (15) to (21) are fixed.
G01C 19/56 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
G01P 9/04 - en utilisant des dispositifs sensibles à la rotation avec des masses vibrantes, p.ex. diapason
56.
DISPLAY DEVICE COMPRISING TOUCH PANEL AND PIEZOELECTRIC ACTUATOR
Provided is a display device comprising a touch panel, on which a piezoelectric actuator is easily mounted, and the piezoelectric actuator for use in the display device. A support structure for supporting a piezoelectric actuator (3) on the surface of a circuit substrate (5) is constituted by a pair of conductive support members (13A, 13B) composed of a conductive form. The piezoelectric actuator (3) comprising the pair of conductive support members (13A, 13B) is placed on a predetermined position of the circuit substrate (5). The pair of conductive support members (13A, 13B) is connected to a pair of output electrodes (5A, 5B) of the circuit substrate (5). The piezoelectric actuator (3) is mounted on the circuit substrate (5).
Provided is a chip-like electric component, such as a chip resistor, which is easily manufactured even without increasing cost and eliminates cracks and breakage of an insulating substrate. A pair of surface electrodes (21, 23) are formed such that the thickness increases from a resistive layer (13) toward a pair of ends (30) of an insulating substrate (29) positioned in a direction where the pair of surface electrodes (21, 23) are arranged. A plating accumulating section (S) is formed between the surface electrodes (21, 23) and the insulating protection layer (15). At the time of forming one or more plating layers (33), a plating metal is accumulated in the plating accumulating section (S), and steps formed between the soldering electrode sections (21, 23, 27, 33) and the insulating protection layer (15) can be made small to a certain extent by the plating layer (33).
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
H01C 1/012 - MontageSupport l'élément de base s'étendant le long de la résistance pour la rendre rigide ou la renforcer
H01C 17/06 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base
Provided is a heater for sensor element, which has excellent adhesion to a silicon substrate even when the heater is heated at a prescribed temperature. A base substrate (2) is formed on a silicon substrate (1), a titanium thin film layer (9) is formed on the base substrate (2), a tantalum thin film layer (11) is formed on the thin film layer (9), and a platinum thin film layer (13) is formed on the tantalum thin film layer (11). The thickness of the titanium thin film layer (9) and that of the tantalum thin film layer (11) are those that do not permit titanium and the like in the titanium thin film layer (9) to diffuse in the tantalum thin film layer (11) and tantalum and the like in the tantalum thin film layer (11) do not diffuse in the platinum thin film layer (13) when the heater for the sensor element is used under heat generating conditions at a prescribed temperature.
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de l'absorption d'un fluideRecherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
G01N 27/00 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques
59.
SENSING SENSOR AND MANUFACTURING METHOD OF THE SAME
A sensing sensor in which the difference between the contour shape of an occupied part occupied by a pair of thin-film counter electrodes and that occupied by a sensing film is reduced, and in which precision in the detection by the sensing sensor if prevented from varying. One thin-film counter electrode (3) out of the pair of thin-film counter electrodes (3, 5) is formed arcuately along a virtual ring form CA. The other thin-film counter electrode (5) is surrounded by the one thin-film counter electrode (3), and positioned at the center section of the virtual ring form CA. At the center of the other thin-film counter electrode (5), a hole part (5b) is formed through the other thin-film counter electrode (5).
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de l'absorption d'un fluideRecherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
A connector for circuit board interconnection capable of easily aligning the pitch between conductive paths with the pitch between electrodes of a circuit board is provided. The connector for circuit board interconnection comprises a rectangular-parallelepiped-shaped connection element (9) in which a plurality of conductive paths are provided on a rectangular-parallelepiped-shaped insulating base at insulation intervals and a connector housing (11) which is mounted on a first circuit board (1) and contains the rectangular-parallelepiped-shaped connection element (9). The connector housing (11) allows the conductive path portion of the rectangular-parallelepiped-shaped connection binder (9) to be electrically connected to a first connection electrode provided on the first circuit board (1), receives the board portion in which a second connection electrode of a second circuit board (5) is provided, and brings the conductive path portion of the rectangular-parallelepiped-shaped connection binder (9) into contact with the second connection electrode thereof.
H01R 12/62 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés rigides ou à des structures similaires
H01R 43/00 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques
A connector for interconnecting circuit boards in which electric elements for protection are not required to be mounted individually on the circuit boards. A rectangular parallelepiped connection piece (9) with an electric component is contained in a connector housing (11). The rectangular parallelepiped connection piece (9) with an electric component comprises a plurality of first conduction path portions (17a) and a plurality of second conduction path portions (17b) provided on a rectangular parallelepiped insulating substrate (13), and a plurality of electric elements (19) electrically connected in series with the first conduction path portions (17a) and the second conduction path portions (17b). The connector housing (11) has such a structure as permitting the first conduction path portions (17a) to be electrically connected with a plurality of first connection electrodes (3) provided on a first circuit board (1), and bringing a plurality of second connection electrodes (7) provided on a second circuit board (5) into contact with the second conduction path portions (17b).
H01R 13/66 - Association structurelle avec des composants électriques incorporés
H01R 31/06 - Pièces intermédiaires pour joindre deux pièces de couplage, p. ex. adaptateur
H01R 43/00 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques
A waterproof push button switch that does not need resin covering up to a height hiding a split connection area in the direction of height of case of waterproof push button switch, and that attains waterproofing of the split connection area. Interstices (55,57) extending from the opening portion of base case fitting compartment (37) to annular watertight seal part (51) and completely surrounding the periphery of the watertight seal part (51) are provided between the circumferential wall part (7b) of base case (7) and second tubular wall part (9b) of cover case (9) and between facing plane (41) of the cover case (9) and waterproof seal member (11). The thickness dimension of the interstice (55) is determined so as to allow the resin having entered from the opening portion (37a) of the base case fitting compartment (37) into the interstice (55) to penetrate to the watertight seal part (51) by surface tension.
It is possible to provide an on-surface mounting variable resistor which can cope with a user request for the front and the rear terminal of an insulating substrate. The variable resistor includes: an insulating base (1) having a variable resistor pattern (3) and electrode patterns (5,5); resistor end terminal fittings (7,7) connected to the electrode patterns (5,5); a conductive slider (15) having a sliding contact (15c) sliding on the variable resistor pattern (3); and an intermediate terminal (17) having a rear intermediate terminal fitting portion (17a) and making an electric connection to the conductive slider (15). The intermediate terminal (17) has an extending conductor portion (17c) and a rear intermediate terminal fitting portion (17a) arranged as a unitary block with the extending conductor portion (17c). The extending conductor portion (17c) has a front intermediate terminal fitting portion (17d) positioned between the resistor end terminal fittings (7,7) and arranged as a unitary block with the extending conductor portion (17c).
A variable resistor in which the contact portion of a contactor piece does not bounce to vary the resistance inadvertently, and the real contact area at the contact portion becomes very large. One or more contact pieces (7) each having a face extending in the direction intersecting the direction from the tip (7a) of a contactor (9) toward the held portion (7b) as a tip end face (7f), and a corner portion (7k) formed as a contact portion (7s) between the tip end face (7f) and a side face (7g) continuous to the tip end face (7f) and opposing a resistor (5) are provided. Furthermore, a holder having a structure for holding the held portion (7b) of the contactor (9) such that the side face (7g) opposing the resistor (5) of one or more contact pieces (7) does not touch the surface of the resistor (5) but only the corner portion (7k) touch the surface of the resistor (5), and the side face of the contactor (9) opposing the resistor (5) inclines to the surface of the resistor (5) is provided.
A variable resistor in which the contact portion of a contactor can be brought into contact with a resistor with a pressure within a proper range over a long period by using a contactor containing carbon fibers. The held portion (7b) of the contactor (9) is held by means of a holder (17) such that the tip portion of the contactor (9) containing carbon fibers is brought into contact with the surface of the resistor (5). The contactor (9) has rigidity high enough not to bend during slide operation. The holder (17) is provided with a leaf spring (25) for urging the contactor (9) toward the surface of the resistor (5) separately from the contactor (9).
A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.
G01B 7/16 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer les déformations dans un solide, p. ex. au moyen d'une jauge de contrainte à résistance
67.
SEMICONDUCTOR SENSOR AND METHOD OF PRODUCING SENSOR BODY FOR SEMICONDUCTOR SENSOR
A semiconductor sensor having a reduced thickness and a method of producing a sensor body for the semiconductor sensor. The length (L1) in the direction in which the center line (C) of a portion at which a weight section (5) and an additional weight section (3) are joined is set less than the length (L2) in the direction in which the center line (C) of a support section (7) extends. The weight section (5) and the additional weight section (3) are received in a space (15) surrounded by the support section (7). The weight section (5) and the additional weight section (3) are formed in dimensions and shapes that enable them to move in the space (15).
G01P 15/02 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie
H01L 29/84 - Types de dispositifs semi-conducteurs commandés par la variation d'une force mécanique appliquée, p.ex. d'une pression
09 - Appareils et instruments scientifiques et électriques
Produits et services
Variable electric resistors; Fixed electric resistors; Chips electric resistors; High voltage electric resistors; High frequency electric resistors; Terminations, namely, electric resistors installed at wiring terminals; Attenuator; Printed hybrid integrated circuits; Circuit boards; Electric switches; Electric sensor device for detecting humidity; Electric sensor device for detecting temperature; Electric sensor device for detecting pressure; Electric sensor device for detecting force; Electric sensor device for detecting acceleration; Electric sensor device for detecting gas; [ Pyroelectric infrared motion sensors; Voltage controlled oscillators; Crystal oscillators; Crystal units, namely, crystal oscillators used to generate a reference signal, typically used in a CPU; ] [ Monolithic crystal filters, namely, filters using a crystal unit to remove a signal having a particular frequency; Saw filters, namely, electronic components used to filter a signal, using surface acoustic waves; ] [ Piezoelectric ceramic transformers; ] Piezoelectric receivers for use in cordless and cellular phones; Piezoelectric loudspeaker; Buzzers; Piezoelectric diaphragms used in electronic machines and apparatus; [ Varistors; ] Electric fuses; [ Electrical connectors; Potentiometer; ] Conductors; [ Electron beam tubes; ] Semiconductor devices; Thermistor; [ Cinematographic machines and apparatus; ] [ Rotary converters; Batteries and cells; Electric wires and cables; Electric flat irons; Electric hair-curlers; Electric buzzers; Magnetic cores; Resistance wires; Electrodes; Fire engines; ] [ Cigar lighters for automobiles; Gloves for protection against accidents; Dust masks; Gas masks; Welding masks; Fireproof garments; ] [ Consumer video games; Electronic circuits and CD-ROMs recorded programs for hand-held games with liquid crystal displays; Slot machines; ] [ Protective helmets for sports; Metronomes; Slide-rules; Exposed cinematographic films; ] [ Exposed slide films ] [ ; Slide film mounts ]
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Electric and/or electronic apparatus and instruments; variable resistors, fixed resistors, chip resistors, high voltage resistors, high frecuency resistors; printed hybrid integrated circuits, circuits boards; electric wires, electric cables, switches; electric and/or electronic apparatus and instruments for measuring, namely electric sensor device for detecting humidity, electric sensor device for detecting temperature, electric sensor device for detecting pressure, pyroelectric infrared sensors, 3 axis acceleration sensors; voltage controlled oscillators, crystal oscillators; crystal units; monolithic crystal filters, SAW filters; piezoelectric ceramic transformers, piezoelectric receivers, piezoelectric sounders, piezoelectric speakers, piezoelectric diaphragms; varistors, high voltage functional units. Soldering electronic components to a circuit board; printing circuits on a circuit board and printing resistors on a circuit board; assembling electronic components/instruments and their parts/fittings; all these services effected for the account of another person. Scientific and industrial research in the field of electronics and electronic components; reliability testing of electronic components; designing and developing electronic components; computer programming.
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Electric and/or electronic apparatus and instruments; variable resistors, fixed resistors, chip resistors, high voltage resistors, high frecuency resistors; printed hybrid integrated circuits, circuits boards; electric wires, electric cables, switches; electric and/or electronic apparatus and instruments for measuring, namely electric sensor device for detecting humidity, electric sensor device for detecting temperature, electric sensor device for detecting pressure, pyroelectric infrared sensors, 3 axis acceleration sensors; voltage controlled oscillators, crystal oscillators; crystal units; monolithic crystal filters, SAW (Surface Acoustic Wave) filters; piezoelectric ceramic transformers, piezoelectric receivers, piezoelectric sounders, piezoelectric speakers, piezoelectric diaphragms; varistors, high voltage functional units. Soldering electronic components to a circuit board; printing circuits on a circuit board and printing resistors on a circuit board; assembling electronic components/instruments and their parts/fittings; all these services effected for the account of another person. Scientific and industrial research in the field of electronics and electronic components; reliability testing of electronic components; designing and developing electronic components; computer programming.
