A method for producing a predetermined breaking line in a vehicle interior trim part using a scanning laser beam and inspecting the predetermined breaking line. A transmitted part of the laser beam is detected by individual sensors of a sensor matrix at the individual holes of the predetermined breaking line and individual measurement signals are formed. At least some of these individual measurement signals are stored when a total reference signal is reached by a total measurement signal and compared with the individual reference values assigned to the processing locations. The contour and position of the predetermined breaking line produced can be evaluated from the comparison.
B23K 26/359 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface en formant une ligne ou un motif linéaire, p. ex. une ligne en pointillés d'amorce de rupture
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
G01V 8/20 - Détection, p. ex. en utilisant des barrières de lumière en utilisant plusieurs émetteurs ou récepteurs
2.
METHOD AND DEVICE FOR CREATING A PATTERN FIGURE CONSISTING OF PATTERN POINTS IN A WORKPIECE, MACHINING DEVICE, AND COMPUTER PROGRAM PRODUCT
A method for creating a pattern figure formed of pattern points, in a workpiece, using a laser device of a machining device comprises reading in first position data, which define positions of first pattern points on the workpiece, wherein the first pattern points are associated with a first portion of a polyline of the pattern figure associated with the first pattern, introduction of the first pattern points into the workpiece taking place while the machining device is located in a first position, a detection of a course of an end of the first portion of the polyline, a continuation of the course of the end of the first portion of the polyline, and an introduction of second pattern points of a second portion of the polyline into the workpiece using the continued course, while the machining device is in a second position.
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/359 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface en formant une ligne ou un motif linéaire, p. ex. une ligne en pointillés d'amorce de rupture
METHOD AND CONTROLLER FOR CONTROLLING A LASER PROCESSING PROCESS ON A SURFACE OF A WORKPIECE AND PROCESSING SYSTEM FOR PROCESSING A SURFACE OF A WORKPIECE BY MEANS OF A LASER PROCESSING PROCESS
A method for controlling a laser processing process on a surface of a workpiece. The method is implementable in conjunction with a processing system. The method includes: bringing about a relative movement between the processing head and the workpiece by the second movement device in order to arrange the processing head in a first processing field of the workpiece; triggering a recording of image data of the processing field by the optical acquisition device; correcting predefined processing coordinates using correction values in order to produce corrected processing coordinates, the correction values being determined in comparison with the predefined processing coordinates using image coordinates; controlling the laser and the first movement device using the corrected processing coordinates in order to process the processing field; and bringing about a further relative movement between the processing head and the workpiece in order to arrange the processing head in a second processing field.
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
4.
Method, device and computer program for producing a weakening line in a surface of a component
A method for producing a weakening line in a surface of a component. The method comprises a guiding step and a skipping step. In the guiding step, a removal apparatus for removing a material of the surface is guided over a plurality of segments of a predefined line-shaped contour by means of an activated laser beam in order to produce a desired wall thickness for at least one of the segments so as to produce the weakening line. In the skipping step, the segment is skipped if the segment has the desired wall thickness.
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/359 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface en formant une ligne ou un motif linéaire, p. ex. une ligne en pointillés d'amorce de rupture
B23K 101/00 - Objets fabriqués par brasage, soudage ou découpage
5.
METHOD FOR MAKING A PERFORATION LINE IN AN AIRBAG COVER
The invention relates to a method for making a perforation line in an airbag cover (1), in which method the airbag cover (1) is guided along an imaginary line (L) relative to a tool (2). In order to carry out the method, a processing beam (3.1) and a first measurement beam (4.1) are emitted, which act upon a processing site (BO) located on a side (6) of the airbag cover (1) facing toward a processing beam source (3), and a second measurement beam (5.1) is emitted, which acts upon a measurement location (MO) located on a side (7) of the airbag cover (1) facing away from the processing beam source. A first path length (a) and a second path length (b) are then determined and evaluated, the first path length (a) and the second path length (b) being used to determine a remaining residual wall thickness (RWS). The processing beam source is controlled on the basis of the determined remaining residual wall thickness (RWS).
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
B60R 21/2165 - Dispositions pour ranger les éléments gonflables non utilisés ou à l'état dégonfléAgencement ou montage des composants ou modules des coussins gonflables caractérisés par le couvercle de l'élément gonflable caractérisés par une ligne de rupture pour définir une ouverture de déploiement
6.
UNIVERSALLY USABLE DEVICE FOR PRODUCING A PREDETERMINED BREAKING LINE IN AN EQUIPMENT PART OF A VEHICLE
A universally usable device for producing a predetermined breaking line in an equipment part of a vehicle. The device includes a laser beam generator, a laser scanner and a linear or matrix-shaped first sensor arrangement with first individual sensors of an identical first sensitivity and at least one identical linear or matrix-shaped second sensor arrangement of second individual sensor, which is arranged with an offset to the first sensor arrangement of first individual sensors, and the second individual sensors have an identical second sensitivity which differs from the first sensitivity.
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/359 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface en formant une ligne ou un motif linéaire, p. ex. une ligne en pointillés d'amorce de rupture
7.
METHOD AND UNIVERSALLY USABLE DEVICE FOR PRODUCING A PREDETERMINED BREAKING LINE, AND PROCESSING SYSTEM COMPRISING SUCH A DEVICE
A method and device for producing a predetermined breaking line in a vehicle interior trim part with a scanning laser beam. An actual position of the vehicle interior trim part held in a working plane relative to a laser scanning device is detected by a camera and the actual position of the predetermined breaking line is derived. A stored desired position for a scan figure corresponding to the predetermined breaking line is corrected to an actual position, whereby the predetermined breaking line is produced at a predetermined position on the vehicle interior trim part during scanning of the scan figure. A positional shift of the scan figure becomes possible because a sensor matrix with an upstream diffuser is used, which can detect transmitted components of the laser beam independently of the position of the laser beam along the scan figure.
A method for inspecting and post-processing a workpiece having a laser-cut, closed inner contour, in which method a gripper moves a workpiece picked up in a defined manner, between a previously stored pre-defined pick-up position AP and a pre-defined first gripper position GP1, delivering the workpiece to an inspection unit, and if post-processing is required, a pre-defined second gripper position GP2, delivering the workpiece to an ejector unit.
G06T 7/64 - Analyse des attributs géométriques de la convexité ou de la concavité
G06T 1/00 - Traitement de données d'image, d'application générale
9.
METHOD AND CONTROLLER FOR CONTROLLING A LASER PROCESSING PROCESS ON A SURFACE OF A WORKPIECE AND PROCESSING SYSTEM FOR PROCESSING A SURFACE OF A WORKPIECE BY MEANS OF A LASER PROCESSING PROCESS
The invention relates to a method for controlling a laser processing process on a surface of a workpiece (X). The method is implementable in conjunction with a processing system (100) which comprises a processing head (110) with an optical acquisition device (111, 112), a laser (115) and a first movement device (114) for moving a laser beam (116) of the laser (115) relative to the workpiece (X) and comprises a second movement device (105) for moving the processing head (110) and the workpiece (X) relative to one another. The method comprises the following steps: bringing about a relative movement between the processing head (110) and the workpiece (X) by means of the second movement device (105) in order to arrange the processing head (110) in a first processing field of the workpiece (X); triggering a recording of image data of the processing field by means of the optical acquisition device (111, 112); correcting predefined processing coordinates using correction values in order to produce corrected processing coordinates, the correction values being determined in comparison with the predefined processing coordinates using image coordinates; controlling the laser (115) and the first movement device (114) using the corrected processing coordinates in order to process the processing field; and bringing about a further relative movement between the processing head (110) and the workpiece (X) in order to arrange the processing head (110) in a second processing field.
B23K 26/142 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet pour l'enlèvement de résidus
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 101/00 - Objets fabriqués par brasage, soudage ou découpage
B23K 103/00 - Matières à braser, souder ou découper
10.
METHOD, DEVICE AND COMPUTER PROGRAM FOR PRODUCING A WEAKENING LINE IN A SURFACE OF A COMPONENT
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/359 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface en formant une ligne ou un motif linéaire, p. ex. une ligne en pointillés d'amorce de rupture
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
B23K 101/00 - Objets fabriqués par brasage, soudage ou découpage
B23K 103/00 - Matières à braser, souder ou découper
11.
WELDING DEVICE FOR SIMULTANEOUSLY WELDING SOCKET JOINTS OF A PIPELINE SYSTEM MADE OF PLASTICS MATERIAL, WHICH SOCKET JOINTS COMPRISE AT LEAST ONE PIPE SECTION AND A FITTING
A welding device for simultaneously welding socket joints (0.12) of a pipeline system (0) made of plastics material, the device comprising a welding tool (1), a handling robot (9) for guiding the welding tool (1) and a clamping device (10) for holding the pipeline system (0) between the socket joints (0.12). The welding tool (1) contains a waveguide (3) that consists of two waveguide parts (3.3) which can be moved away from one another, with respect to a diagonal (5), by means of a mechanism (6), such that a spatial delimitation, specified by the opening (4) of the waveguide (3), is cancelled by opening the waveguide (3) along the diagonal (5), whereby the welding tool (1) can be guided and positioned around the individual socket joints (0.12).
The invention relates to a method for testing an airbag cover comprising a predetermined breaking line (3). The predetermined breaking line (3) is tested in that an initiator introduces energy along the predetermined breaking line (3), as a result of which sound waves (SW) are generated at the particular location to be tested. In order to test the tear resistance along the predetermined breaking line (3), an optical test signal influenced by the generated sound waves is formed and is compared with a reference signal.
B60R 21/2165 - Dispositions pour ranger les éléments gonflables non utilisés ou à l'état dégonfléAgencement ou montage des composants ou modules des coussins gonflables caractérisés par le couvercle de l'élément gonflable caractérisés par une ligne de rupture pour définir une ouverture de déploiement
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
13.
METHOD FOR PRODUCING AN AIRBAG COVER HAVING A TARGET BREAK LINE WITH A DEFINED TEAR RESISTANCE
The invention relates to a method for producing a target break line (3) with a defined tear resistance in an airbag cover (2). The target break line (3) is produced using a removal method, in which sound waves are generated along a line (L) at the respective machining location using a tool. The creation of a predefined tear resistance along the target break line (3) is controlled in that an optical control signal for controlling the removal is formed which is influenced by the sound waves.
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
B29C 59/00 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet
B60R 21/2165 - Dispositions pour ranger les éléments gonflables non utilisés ou à l'état dégonfléAgencement ou montage des composants ou modules des coussins gonflables caractérisés par le couvercle de l'élément gonflable caractérisés par une ligne de rupture pour définir une ouverture de déploiement
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 101/00 - Objets fabriqués par brasage, soudage ou découpage
H04R 23/00 - Transducteurs autres que ceux compris dans les groupes
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Machines and machine tools for material processing and
production, in particular laser material processing machines
for perforating, cutting, melting, sintering, build-up
welding, stripping, surface treatment and/or remelting by
means of laser beams; parts and accessories for the
aforesaid machines and machine tools, included in this
class. Optical devices and equipment, in particular optical and/or
opto-electronic components and systems made therefrom for
integration into laser production systems for
micromachining; software and computer hardware for
monitoring, controlling and executing processes in the
physical world, in particular for laser material processing;
artificial intelligence software and machine learning
software; scientific research and laboratory apparatus,
teaching apparatus and simulators; optical and/or
opto-electronic components and systems made therefrom for
machine tools and handling devices. Treatment of materials, namely laser material treatment for
perforating, cutting, stripping, engraving, inscribing,
marking, labelling, welding and cutting work and
micromachining. Scientific and technological services and research in the
field of technology, in particular laser material
processing; industrial analysis and research services, in
particular relating to optical and/or opto- electronic
components and systems for laser material processing;
technological consultancy relating to laser material
processing, in particular in the creation of prototypes;
engineering; technical project planning; design and
development of computer software, in particular relating to
optical and/or opto-electronic components and systems for
laser material processing.
G01N 22/00 - Recherche ou analyse des matériaux par l'utilisation de micro-ondes ou d'ondes radio, c.-à-d. d'ondes électromagnétiques d'une longueur d'onde d'un millimètre ou plus
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Machine and machine tools for material processing and production, namely, laser material processing machines for perforating, cutting, melting, sintering, build-up welding, stripping, surface treatment and remelting by means of laser beams; Parts and accessories for the aforesaid machines and machine tools, namely, industrial robots, fixation and adjustment devices, Machine tools, namely, clamps for use in the precision clamping of work pieces power supplies, electronic control devices, laser protection devices, suction tools Optical devices and equipment, namely, optical and/or opto-electronic components and systems made therefrom for integration into laser production systems for micromachining, namely, optical scanners, optical sensors, optical transmitters and receivers, lenses, optical mirrors, and optical filters; downloadable and recorded software and computer hardware for monitoring, controlling and executing processes in laser material processing; downloadable and recorded artificial intelligence software for learning and applying material-dependent laser processing parameters; Scientific research and laboratory apparatus, teaching apparatus and simulators, namely, electronic clinicians training simulators, sensing and signaling devices for measurement and quality control of materials processing by laser; Optical and/or opto-electronic components and systems made therefrom for machine tools and handling devices, namely, optical scanners, optical sensors, optical transmitters and receivers, lenses, optical mirrors, and optical filters Treatment of materials, namely, laser material treatment for perforating, cutting, stripping, engraving, inscribing, marking, labelling, welding and cutting work and micromachining Scientific and technological services, namely, research and design in the field of laser material processing; Testing, analysis, and evaluation of optical and/or opto- electronic components and systems for laser material processing to assure compliance with industry standards; technological consultancy in the field of laser material processing, in particular in the creation of prototypes; Engineering; Engineering services, particularly technical project planning; Design and development of computer software, in particular relating to optical and/or opto-electronic components and systems for laser material processing
17.
METHOD FOR PRODUCING AT LEAST ONE PATTERNED DESIGN COMPRISING A PLURALITY OF PATTERN ELEMENTS BY MEANS OF A LASER
A method for producing at least one patterned design having a plurality of pattern elements via a laser in a component that is at least partially transparent and is coated on a first surface. The component is coated on a first surface with at least one layer. The coated first surface of the component is surveyed with first co-ordinated. At least one patterned design is created with second coordinates. The second coordinates of the at least one patterned design are transformed into third coordinates. The coated first surface is irradiated with laser radiation via control coordinates. The laser radiation is measured on a second surface and the laser radiation received is compared via the sensor system with a reference value. The laser radiation is switched off when the reference value is reached.
B23K 26/359 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface en formant une ligne ou un motif linéaire, p. ex. une ligne en pointillés d'amorce de rupture
B05D 3/06 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par exposition à des rayonnements
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
18.
METHOD FOR INSPECTING AND POST-PROCESSING A WORKPIECE HAVING A LASER-CUT, CLOSED INNER CONTOUR
B23K 26/38 - Enlèvement de matière par perçage ou découpage
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B26D 5/00 - Dispositions pour manœuvrer et commander les machines ou les dispositifs de coupe, découpage, poinçonnage, perforation ou séparation autrement que par coupe
19.
Sensor device for scanning laser processing of a workpiece by means of a laser beam deflected about a pivot point
The invention relates to a sensor device for scanning laser processing of a workpiece by means of a laser beam deflected about a pivot point, said device comprising a holding device and at least two sensors, wherein the holding device is formed by a matrix- or honeycomb-shaped arrangement of sleeves, consisting of individual sleeves whose sleeve axes intersect at a point of intersection (P) outside the holding device, and the at least two sensors each being arranged in one of the sleeves such that their sensor axis coincides with the sleeve axis. The holding device advantageously is a monolithic component produced in a generative manufacturing process.
The method according to the invention makes it possible to produce actual cutting contours on tubes (R) with only rough tolerances, to which contours others of the tubes (R) can be joined and welded, wherein, as a result of the actual cutting contours being modified, the rough shape tolerance of the tubes (R) does not enter the tolerance chain, or enters the latter only a little, for the tubes (R) to be fully welded to form a tubular frame. It also allows the automated reception of only pre-oriented tubes (R) by a gripping arm and the infeed thereof to a laser cutting device.
A method for trimming a bent tube (R) along an actual cutting contour (K ACTUAL), wherein a virtual tolerance envelope (H) is calculated for the tube (R) and a laser beam cutting the actual cutting contour (K ACTUAL) is guided along a desired cutting contour (K DESIRED) related to the tolerance envelope (H), wherein the actual cutting contour (K ACTUAL) is produced as a projection of the desired cutting contour (K DESIRED) or the laser beam is guided along the corrected desired cutting contour (K DESIRED), which then corresponds to the actual cutting contour (K ACTUAL).
The method according to the invention makes it possible to produce actual cutting contours on tubes (R) with only rough tolerances, to which contours others of the tubes (R) can be joined and welded, wherein, as a result of the actual cutting contours being modified, the rough shape tolerance of the tubes (R) does not enter the tolerance chain, or enters the latter only a little, for the tubes (R) to be fully welded to form a tubular frame. It also allows the automated reception of only pre-oriented tubes (R) by a gripping arm and the infeed thereof to a laser cutting device.
The device comprises a welding unit with a tube (3), a laser radiation unit (1) radiating in direction of the tube axis (3.0), and a mandrel (4) which is connected to the tube (3) via a holding unit which is formed, e.g., by two spacer elements (5.1) and which is coaxially arranged relative to and in the tube (3). The tube (3) and the circumferential surface of the mandrel (4) are reflective of the laser radiation of the laser radiation unit (1) such that through multiple reflections between the tube (3) and the mandrel (4) the laser radiation is deflected toward the beam output-side tube end (3.2) and is shaped annularly.
B23K 26/28 - Soudage de joints continus curvilignes
B23K 26/073 - Détermination de la configuration du spot laser
B23K 33/00 - Extrémités de pièces spécialement profilées pour effectuer des assemblages brasés ou soudésRemplissage des joints continus ainsi formés
B23K 26/57 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler le faisceau laser entrant dans une face de la pièce à travailler d’où il est transmis à travers le matériau de la pièce à travailler pour opérer sur une face différente de la pièce à travailler, p. ex. pour effectuer un enlèvement de matière, pour raccorder par fusion, pour modifier ou pour reformer le matériau
B23K 26/12 - Travail par rayon laser, p. ex. soudage, découpage ou perçage sous atmosphère particulière, p. ex. dans une enceinte
25.
Welding assembly and method for producing a welding assembly
A welding assembly having a support part, of a material that is absorbent to a laser radiation, and an attachment part, with at least one collar piece that is transparent to the laser radiation. The support part and the at least one collar piece have a first joining area and a second joining area, which together form a joining region. The surface contours of the joining areas deviate from one another, and so, when the welding assembly is being joined together, the collar pieces are deformed while they come to bear closely against the support part. The attachment part is formed in such a way that it can be taken up by a receiving mandrel and positioned with respect to the support part and pressed against it by means of the receiving mandrel.
The invention relates to a method for the monitored cutting of a slug (2) out of a metal workpiece (1), in which a machining laser beam (3) is directed onto a workpiece surface (1.1) of the workpiece (1) and is guided along an actual cut contour (4), which deviates from a desired cut contour by limited tolerances, and a separating cut (5) is formed in the workpiece (1). After complete guiding along the actual cut contour (4), the machining laser beam (3) is guided along a run-out path (4.1) that extends into the inside of the actual cut contour (4). The intensity (I), detected during the method, of a reflected radiation component of the machining laser beam (3) falls discontinuously with a defined step size (hd) when the slug (2) has fallen out of the workpiece (1).
A method and device for producing a tear line on a planar workpiece by material removal by means of a pulsed laser, wherein machining cycles are preceded by a method step for generating and storing a reference signal curve which is formed by reference signals, causing the pulse amplitude of the laser pulses, via removal locations along the contour of the tear line. The achievement of a respective predetermined percentage of the reference signal or of an absolute distance from the reference signal by a measurement signal is used as the space-resolved deactivation criterion for each removal location, which measurement signal is obtained from a transmitted part of the pulse amplitude at the respective removal location.
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
B23K 26/359 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface en formant une ligne ou un motif linéaire, p. ex. une ligne en pointillés d'amorce de rupture
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 103/00 - Matières à braser, souder ou découper
28.
DEVICE FOR THE LASER TRANSMISSION WELDING OF AN ANNULAR WELD SEAM
The device contains a welding unit comprising a tube (3), a laser radiation unit (1) that emits laser radiation towards the tube axis (3.0) and a mandrel (4) that is arranged in the tube (3) coaxially with the latter and that is connected to the tube (3) by means of a retaining unit, for example formed by two spacer elements (5.1). The tube (3) and the circumferential surface of the mandrel (4) reflect the laser radiation of the laser radiation unit (1), such that the laser radiation is deflected towards the tube end (3.2) on the beam-exit-side and becomes toroidal, by multi-reflection between the tube (3) and the mandrel (4).
Welding assembly comprising a carrier part (1), of a material that is absorbent to a laser radiation, and a setting-down part (2), with at least one collar piece (2.1) of an elastic material that is transparent to the laser radiation. The carrier part (1) and the at least one collar piece (2.1) have a first joining area (1.1) and a second joining area (2.2), which together form a joining region (3). The surface contours of the joining areas (1.1, 2.2) deviate from one another, and so, when the welding assembly is being joined together, the collar pieces (2.1) are deformed while they come to bear closely against the carrier part (1). The setting-down part (2) is formed in such a way that it can be taken up by a receiving pin (5) and positioned with respect to the carrier part (1) and pressed against it by means of the receiving pin (5).
The invention relates to a mounting device for the simultaneous welding of a plurality of sensor holders (2) along a horizontal line (1.3) of a bumper (1). Said mounting device can be advantageously adapted to different dimensions of bumpers (1) and comprises per sensor holder (2) one or two freely radiating diode lasers (6) and a holding-down element (8) arranged downstream thereof in the direction of emission, which comprises a gripper (8.1) for receiving the sensor holder (2) and a holding-down element (8.2) for introducing a contact pressure, said holding-down element being permeable in partial areas for the laser radiation of the diode laser (6).
B29C 65/78 - Moyens pour la manipulation des éléments à assembler, p. ex. pour la fabrication de récipients ou d'objets creux
B60R 19/48 - Pare-chocs, c.-à-d. éléments pour recevoir ou absorber les chocs pour protéger les véhicules ou dévier les chocs provenant d'autres véhicules ou objets combinés avec d'autres dispositifs ou d'autres objets ou convertibles en ces derniers, p. ex. pare-chocs combinés avec des balais ou convertibles en lits
B29L 31/30 - Véhicules, p. ex. bateaux ou avions, ou éléments de leur carrosserie
31.
Method and apparatus for detecting and correcting a spatial position of a workpiece held in a positioning device
A method and an apparatus for detecting and correcting a spatial position of a workpiece held in a positioning device, wherein a machining head having at least one sensor and position sensor is fed into at least one measuring position. Contactless sensing of an actual position of a measuring point of the workpiece is carried out at the measuring position using the machining head and the sensed actual position is compared with an expected nominal position and deviation values between the actual position and the nominal position are ascertained. The ascertained deviation values are compared with an admissible tolerance value and the machining head is fed to a contour when the ascertained deviation is within the admissible tolerance value, or the machining head and the workpiece are oriented with respect to one another and to the contour such that a deviation of the actual position is within the admissible tolerance values following orientation.
G05B 19/402 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par des dispositions de commande pour le positionnement, p. ex. centrage d'un outil par rapport à un trou dans la pièce à usiner, moyens de détection additionnels pour corriger la position
B23Q 15/22 - Commande ou régulation de la position de l'outil ou de la pièce
G05B 19/401 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par des dispositions de commande pour la mesure, p. ex. étalonnage et initialisation, mesure de la pièce à usiner à des fins d'usinage
B23Q 17/24 - Agencements sur les machines-outils pour indiquer ou mesurer utilisant des moyens optiques
G05B 15/02 - Systèmes commandés par un calculateur électriques
32.
Process for producing a line of weakness in a cover element through removal of material
Process for producing a line of weakness in a cover element comprising at least one slit. This slit is produced through a plurality of machining cycles in which a pulsed laser beam is guided in each instance over the cover element along an imaginary line so that the energy of the laser pulses is introduced into the cover element. The slits are produced in two segments. More energy is introduced over the machining cycles in the first, comparatively short segments than in the second, comparatively long segments. The residual wall below the slits decreases with each machining cycle until the first residual wall segment thickness in the first segment is so small that energy portions transmit through the first residual wall segment and are detected by a sensor arrangement arranged downstream. Accordingly, the first residual wall segment thickness is detected, and inferences can be drawn from this about the second residual wall segment thickness.
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 103/00 - Matières à braser, souder ou découper
33.
Method and device for machining non-rotationally symmetrical workpieces by means of laser beam
A device and a method for machining workpieces (5, 6) by means of a laser beam. Said device has a delivery means (3) for delivering the workpieces (5,6) to a first machining position (8.1) and a machining means (2) which has at least one machining head (2.1) for machining of a workpiece (5,6) delivered to the first machining position (8.1). The delivery means (3) is a gripping robot with a gripping device (3.2). At least one clamping means (9,10) is disposed in order to accommodate a workpiece (5,6) delivered by the delivery means (3), wherein respective machining position is defined by each clamping means (9,10). The machining head (2.1) can be delivered to each machining position for machining of the workpieces (5,6).
B23K 37/00 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe
B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
B23Q 7/04 - Agencements pour la manipulation des pièces, spécialement combinés aux machines-outils ou disposés dans ces machines ou spécialement conçus pour être utilisés en relation avec ces machines, p. ex. pour le transport, le chargement, le positionnement, le déchargement, le triage au moyen de pinces
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 26/38 - Enlèvement de matière par perçage ou découpage
34.
METHOD AND DEVICE FOR PRODUCING DYNAMIC SCANNER FIGURES FOR PROCESSING A WORKPIECE
The invention relates to a method (530) for producing dynamic scanner figures for processing a workpiece (116), characterised by a step of reading in (532) a camera image, wherein a camera image represents a sensor signal of an image-capturing sensor and/or an information item derived from the sensor signal of the image-capturing sensor, wherein the camera image has a multiplicity of pixels, wherein the camera image represents an image of the workpiece (116), a step of determining (534) an information item about an area to be processed in the camera image, wherein the area to be processed comprises a sub-area of the pixels of the camera image, a step of preparing (536) control data using the information about the area to be processed, wherein the control data comprise at least geometric data, and a step of making available (538) the control data for actuating a workpiece-processing device (100), in particular a laser and/or a scanner and/or a laser scanner, in order to process the workpiece.
B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser
35.
METHOD AND APPARATUS FOR DETECTING AND CORRECTING A SPATIAL POSITION OF A WORKPIECE HELD IN A POSITIONING DEVICE
The invention relates to a method and an apparatus for detecting and correcting a spatial position of a workpiece (1) held in a positioning device (15), wherein a machining head (2) having at least one sensor (5) and position sensing means (17) is fed into at least one measuring position (7). Subsequently, contactless sensing of an actual position (8) of a measuring point of the workpiece (1) is carried out at the measuring position (7) using the machining head (2) and the sensed actual position (8) is compared with an expected nominal position (9) and deviation values between the actual position (8) and the nominal position (9) are ascertained. The ascertained deviation values are compared with an admissible tolerance value and the machining head (2) is fed to a contour (6) when the ascertained deviation is within the admissible tolerance value, or the machining head (2) and the workpiece (1) are oriented with respect to one another and to the contour (6) such that a deviation of the actual position (8) is within the admissible tolerance values following orientation.
B23Q 15/22 - Commande ou régulation de la position de l'outil ou de la pièce
B23Q 17/22 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer la position réelle ou désirée de l'outil ou de la pièce
G05B 19/401 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par des dispositions de commande pour la mesure, p. ex. étalonnage et initialisation, mesure de la pièce à usiner à des fins d'usinage
36.
PROCESS FOR INTRODUCING A WEAKENING LINE THROUGH MATERIAL REMOVAL ON A FIBROUS COATING MATERIAL, IN PARTICULAR NATURAL LEATHER
Process for introducing a weakening line (2) through material removal in a fibrous coating material (1), in particular natural leather, in which process a pulsed laser beam (31) is guided repeatedly in a linear manner over the rear side (12), wherein only one laser pulse is emitted for each point of impingement (24), this bringing about an introduction of energy which, at the point of impingement (24), leads to the coating material (1) being heated to a temperature above an ablation threshold and which keeps the temperature in regions of the coating material (1) adjoining the point of impingement (24) below a limit temperature.
B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B60R 21/2165 - Dispositions pour ranger les éléments gonflables non utilisés ou à l'état dégonfléAgencement ou montage des composants ou modules des coussins gonflables caractérisés par le couvercle de l'élément gonflable caractérisés par une ligne de rupture pour définir une ouverture de déploiement
37.
Apparatus for laser transmission welding, method for laser transmission welding, and a receptacle which is produced thereby and is closed by sheet
A method for producing a receptacle which is closed by a sheet by transmission laser welding, and to an apparatus suitable to carry out same. The method and the apparatus are configured in such a way that a weld seam is formed between the wall structure of the receptacle and the sheet so as to be wider than the end faces of the wall structure.
B21D 51/26 - Fabrication d'objets creux caractérisés par l'usage de l'objet de boîtes de conserve ou bidonsFermeture des boîtes de conserve ou des bidons de façon définitive
The invention relates to a device and a method for machining workpieces (5, 6) by means of a laser beam. Said device comprises a delivery means (3) for delivering the workpieces (5, 6) to a first machining position (8.1) and comprising a machining means (2) which has at least one machining head (2.1) for machining of a workpiece (5, 6) delivered to the first machining position (8.1). The delivery means (3) is a gripping robot with a gripping device (3.2). In the access region thereof a dispensing device (4) having mountings (4.1) is disposed, of which the design and dimensions of the mountings (4.1) are selected such that at least one workpiece (5, 6) is provided which is held in the mountings (4.1) positioned and oriented in a defined spatial way of the delivery means (3) for removal from the mountings (4.1). Moreover at least one clamping means (9, 10) is disposed in order to accommodate a workpiece (5, 6) delivered by the delivery means (3), wherein a respective machining position is defined by each clamping means (9, 10). The machining head (2.1) can be delivered to each machining position for machining of the workpiece (5, 6).
B23K 37/02 - Chariots pour supporter l'outillage pour souder ou découper
B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 26/38 - Enlèvement de matière par perçage ou découpage
B23K 37/047 - Déplacement des pièces pour ajuster leur position entre les étapes de brasage, de soudage ou de découpage
39.
DEVICE FOR STRUCTURING THIN-FILM SOLAR CELL MODULES IN A HIGHLY ACCURATE MANNER
The invention relates to a device for structuring thin-film solar cell modules (1) in a highly accurate manner, comprising a conveying apparatus (2) and a process unit (12), which has movable retainers (4) on a rail (5) perpendicular to the conveying direction, which retainers can be controlled independently of each other, wherein each retainer (4) bears exactly one structuring tool (3), the rail (5) can be moved perpendicularly to the conveying apparatus (2) on a main rail (10) arranged parallel to said rail, and an addition main linear drive (11) connected to the rail (5) is present so that the rail (5) can be moved along the main rail (10) across the width of an accommodated thin-film solar cell module (1).
B28D 5/00 - Travail mécanique des pierres fines, pierres précieuses, cristaux, p. ex. des matériaux pour semi-conducteursAppareillages ou dispositifs à cet effet
B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
40.
Device for simultaneously processing the circumference of a workpiece with laser beams
A device for simultaneously processing a circumference of a workpiece includes a plurality of laser-lens modules and a waveguide. The modules each include a diode laser and a lens system and is configured to emit a laser beam radially in a shared radiation plane. The waveguide includes a lower part and an upper part that together form a cavity enclosing the radiation plane. The laser-lens modules are configured so that the laser is reflected repeatedly between a bottom surface and a cover surface and propagates in an unaffected manner within the radiation plane so as to form a beam spot that strikes the workpiece with a homogeneous energy distribution. The beam spot has a height based on a distance between the surfaces and a width based on a divergence angle in the radiation plane and a distance of the module from the workpiece surface.
The invention relates to a method for producing a thin-film solar cell having a multilayered construction comprising a substrate (1), a seed layer (2) and an absorber layer (3), comprising the following steps: producing the seed layer (2) by applying an amorphous first layer of a first semiconductor material (2.1) on the substrate (1) and applying a first laser beam (4.1) to the first layer in order to crystallize said layer, producing the absorber layer (3) on the seed layer (2) by applying a second layer of a second semiconductor material (3.1) ply by ply and applying a pulsed, second laser beam 4.2 to the second layer ply by ply, wherein ply-by-ply epitaxial growth of the second layer is effected, characterized in that the ply-by-ply application is effected with a maximum of two plies and the second laser beam (4.2) has a wavelength in a range of 500 to 1100 nm and a pulse duration in the range of 300 to 1200 ns. The invention furthermore relates to a device for carrying out the method according to the invention.
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
H01L 31/0392 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur structure cristalline ou par l'orientation particulière des plans cristallins comprenant des films minces déposés sur des substrats métalliques ou isolants
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
H01L 31/036 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur structure cristalline ou par l'orientation particulière des plans cristallins
The present invention relates to a system for spot welding with a laser beam (6) in which the laser beam (6) passes through a tube (3) and impinges on the components (7.1, 7.2) to be welded together. The cross section of the laser beam (6) is formed by reflections inside the tube, and the distribution of the radiation intensity is homogenized across the cross section of the beam. At the same time, the tube (3) exerts a contact force (F) on the components (7.1, 7.2) that are to be welded together. Using a plurality of laser beams (6), to each of which a tube (3) is dedicated downstream, it is possible to create a simple and robust, component-specific system by means of which several or all weld spots can be simultaneously produced so as to conjoin the two components (7.1, 7.2).
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser
The invention relates to a device for producing thin-layer solar cell modules (2), particularly those having a prescribed transparency. The device particularly comprises a galvanometer-controlled mirror system (4), by means of which a laser beam can be directed at a thin layer solar cell module (2) held and transported in a holding and transport device (1) so that the axis of the mirror system (4) is perpendicular to the surface of the thin layer solar cell module (2), wherein the mirror system (4) is advantageously disposed in the transport plane of the holding and transport device (1).
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
B23K 37/047 - Déplacement des pièces pour ajuster leur position entre les étapes de brasage, de soudage ou de découpage
B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
C03C 17/00 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement
C03C 23/00 - Autres traitements de surface du verre, autre que sous forme de fibres ou de filaments
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
The invention relates to a method for restructuring a semiconductor layer (2) with a multiplicity of lasers (18, 20, 22) which are arranged next to one another and, by means of respectively assigned beam shaping optics (46, 48, 50), project on the semiconductor layer (2) laser lines (8, 10, 12) arranged next to one another, with marginal regions (15, 17) and inner overlapping regions (14, 16), wherein at least the overlapping regions (14, 16) are projected completely and on passive regions (14, 16) of the semiconductor layer (2) in which the semiconductor layer is removed in a following processing step, and relates to a laser system for carrying out the method.
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
H01L 21/20 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale
H01L 21/268 - Bombardement par des radiations ondulatoires ou corpusculaires par des radiations d'énergie élevée les radiations étant électromagnétiques, p. ex. des rayons laser
The system comprises a buckling arm robot with a robot frame (1) and an articulated arm (2) and a fiber optic cable (5) which is connected to one end of the articulated arm (2) and through which a laser beam (11) with a beam axis (10) is coupled into the articulated arm (2) in the direction of a first axis of the articulated arm (2). The fiber optic cable (5) is indirectly connected to the stationary end of the articulated arm (2) via an alignment unit (6) which comprises a collimating lens system (13) and at least two alignment mirrors (12.1, 12.2), each of which mirrors can swivel about at least one axis of rotation and move along at least one axis of translation, with the axes of rotation and the axes of translation being disposed at right angles to each other so that the beam axis (10) of the laser beam (11) can be made to coincide with the optical axis (4).
B23K 26/14 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet
46.
Method of manufacturing of an at least two-part interior lining component of an automotive vehicle, with integrated airbag cover, and interior lining component of an automotive vehicle
An interior lining component of an automotive vehicle and method of making same having a support layer and a decorative layer. The decorative layer is joined, either indirectly via an intermediate layer or directly, to the support layer. A series of alternating slits and bridging elements are formed in the support layer along a desired predefined tear seam line. Blind holes of a predefined residual wall thickness and/or microperforation holes extend into the decorative layer along the predefined tear seam line in the region of the bridging elements and in the region of the slits so that the spacing between the holes in the slit regions is narrower than the spacing in the bridging element regions.
B60R 21/20 - Dispositions pour ranger les éléments gonflables non utilisés ou à l'état dégonfléAgencement ou montage des composants ou modules des coussins gonflables
47.
Flat panel OLED device having deformable substrate
A flat panel OLED device including a transparent deformable substrate having first and second sides and defining a predetermined illumination region and a non-illumination region; a moisture-sensitive OLED disposed over the first side of the transparent substrate within the illumination region and means for applying electrical signals to the OLED which causes the OLED to produce light and heat; a protective layer disposed over the OLED; a flexible encapsulating foil disposed over the protective layer, but not attached thereto, and which dissipates the heat and sealingly connected to the substrate in the non-illumination region; and a rigid chassis structure operatively associated with the transparent deformable substrate for providing rigidity to the transparent deformable substrate.
The invention is directed to an apparatus for cutting material by means of a milling cutter and laser radiation. The apparatus comprises a milling unit, a work spindle, a milling cutter, a laser, deflecting elements, focusing optics, and a work table. According to the invention, a workpiece can be milled and lasered simultaneously or successively at the same cutting location in that the laser beam is coupled into a channel coaxial to the mill axis.
B23P 23/00 - Machines ou agencements de machines réalisant des combinaisons déterminées de différentes opérations d'usinage, non couverts par une seule autre sous-classe
B23K 26/38 - Enlèvement de matière par perçage ou découpage
49.
Method for generating a predetermined break line in a multilayer airbag cover using a laser
The invention is directed to a method for introducing a predetermined break line in a multilayer airbag covering with a carrier layer, a supporting layer and a decorative layer by a laser. In order to prevent an undesirable burning of the supporting layer over a large area as a result of the occurring combustion gases, it is suggested that the carrier material is ablated by a width that is greater than the diameter of the impinging beam to facilitate the escape of the combustion gases.
B60R 21/20 - Dispositions pour ranger les éléments gonflables non utilisés ou à l'état dégonfléAgencement ou montage des composants ou modules des coussins gonflables
50.
METHOD FOR SEVERING BRITTLE FLAT MATERIALS BY LASER BEAM, WITH TRACES PRODUCED PRIOR TO SEPARATION
The arrangement relates to a method for severing brittle flat materials, for example made of glass, ceramic, silicon, gallium arsenide or sapphire, in which the material is heated below the melting temperature by means of a laser (7) along desired separating lines (5) and is quenched by a following coolant jet (7), so that a thermally induced difference in mechanical stress brings about severing of the material, wherein traces are formed in the flat material in advance along the separating lines, so that the flat material has a lower breaking stress along the traces than in the unworked flat material, and the separation with the laser takes place along these traces.
B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
B23K 26/14 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet
