A flux of the present invention is a flux used for soldering. The flux includes: at least one selected from the group consisting of a fatty alcohol having one hydroxy group and being solid at 20° C. and a fatty acid ester being solid at 20° C.; a liquid solvent having one or more and three or less hydroxy groups and being liquid at 20° C.; and a solid solvent having two or more and four or less hydroxy groups and being solid at 20° C. The flux includes no thixotropic agent or includes 20.0 mass % or less of a thixotropic agent based on the entire flux.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/362 - Emploi de compositions spécifiées de flux
The present invention provides a flux for soldering and a soldering material that are capable of suppressing a reduction in bondability and electrical reliability of a soldered joint. The flux and the soldering material contain a solvent component, a resin component, an isocyanuric acid derivative, and cellulose fibers.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Soldering paste; soldering fluxes; soldering preparations;
chemicals; soldering chemicals; industrial chemicals;
chemicals used in science; glues and adhesives for
industrial purposes; adhesives for use in industry. Solder pastes; solder alloys; solder alloys for use in
industrial welding; hard solder alloys for use in industrial
welding; soft solder alloys for use in industrial welding;
non-ferrous metals and their alloys. Chemical research; research and development services in the
field of chemistry; chemical analysis; research in the field
of welding; technological planning and technical testing,
inspection and research services in the fields of solder;
technological planning and technical testing, inspection and
research services in the fields of solder pastes;
technological planning and technical testing, inspection and
research services in the fields of solder for printed wiring
boards of nonferrous metals; technological planning and
technical testing, inspection and research services in the
fields of adhesives for use in industry; technological
planning and technical testing, inspection and research
services in the fields of adhesives for use in the
manufacture of electronic equipment; technological planning
and technical testing, inspection and research services in
the fields of adhesives for use in electronic components.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
soldering fluxes; soldering preparations; welding and brazing chemicals for industrial use; soldering chemicals; industrial chemicals; chemical preparations for scientific purposes; adhesives and glues for industrial purposes; adhesives for use in industry solder pastes; solder alloys in the form of solder wire; solder alloys in the form of solder wire for use in industrial welding; hard solder alloys for use in industrial welding; soft solder alloys for use in industrial welding; non-ferrous metals and their alloys chemical research; research and development services in the field of chemistry; chemical analysis; research in the field of welding; testing in the nature of product quality testing for others, inspection of solders for quality control purposes and scientific research services, all of the foregoing in the field of solder; testing in the nature of product quality testing for others, inspection of solders for quality control purposes and scientific research services in the field of solder pastes; testing in the nature of product quality testing for others, inspection of solders for quality control purposes and scientific research services in the field of solder for printed wiring boards of nonferrous metals
5.
FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED STRUCTURE
A flux according to the present invention is used for soldering, and contains: at least one chemical selected from the group consisting of aliphatic alcohols that has one hydroxy group and is solid at 20°C, and fatty acid esters that is solid at 20°C; a liquid solvent that has 1-3 hydroxy groups and is liquid at 20°C; and a solid solvent that has 2-4 hydroxy groups and is solid at 20°C. The flux does not contain a thixotropic agent or contains at most 20.0 mass% of a thixotropic agent with respect to the entirety of the flux.
The flux according to the present invention is intended to be used for soldering, and comprises at least one carboxylic acid selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure, at least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain having 1 to 11 carbon atoms inclusive and an imidazole derivative having a phenyl group, and at least one liquid polymerizable compound selected from the group consisting of a liquid resin and a liquid polymerizable fatty acid.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
Produits et services
Soldering paste; soldering fluxes; soldering preparations;
chemicals; soldering chemicals; industrial chemicals;
chemicals used in science; glues and adhesives for
industrial purposes; adhesives for use in industry. Solder bars; hard solder bars; soft solder bars; hard
solder; soft solder; flux cored solder; flux cored hard
solder; flux cored soft solder; solder alloys; solder alloys
for use in industrial welding; hard solder alloys for use in
industrial welding; soft solder alloys for use in industrial
welding; solder pastes; non-ferrous metals and their alloys;
iron and steel; ores of metal.
8.
Solder Material and Solder Material Production Method
A method of producing a solder material is provided. The method includes mixing a flux containing a solvent, a rosin-based resin, and an activator, with aggregated cellulose. The aggregated cellulose includes massive cellulose in which fibrous cellulose having a length of from 1 μm or more to less than 1 mm, and fibrous cellulose having a length of from 1 nm or more to less than 1 μm. The resulting mixture is mixed with a solder alloy to produce a solder material.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
Produits et services
soldering paste, soldering fluxes, soldering preparations, welding and brazing chemicals, soldering chemicals, industrial chemicals, chemical preparations for scientific purposes, adhesives and glues for industrial purposes, adhesives for use in industry solder bars, hard solder bars, soft solder bars, hard solder, soft solder, flux cored solder, flux cored hard solder, flux cored soft solder, solder alloys, solder alloys for use in industrial welding, hard solder alloys for use in industrial welding, soft solder alloys for use in industrial welding, solder pastes, non-ferrous metals and their alloys, irons and steels, ores of metal
An aggregated cellulose is provided that includes massive cellulose and fibrous cellulose mixed together. The massive cellulose is fibrous and has a length of from 1 μm or more to less than 1 mm. The fibrous cellulose has a length of from 1 nm or more to less than 1 μm. The aggregated cellulose can contain from 400 ppm or more to 10,000 ppm or less of the massive cellulose. The aggregated cellulose can contain a solvent, a rosin-based resin, and an activator.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/362 - Emploi de compositions spécifiées de flux
An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.
B23K 35/363 - Emploi de compositions spécifiées de flux pour le brasage ou le soudage
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/362 - Emploi de compositions spécifiées de flux
A flux according to the present invention is a halogen-free flux used for soldering that includes: a thixotropic agent a polyamide compound in which one endothermic peak or all of endothermic peaks obtained by differential thermal analysis are observed within a range of 130 to 200° C.; and an activator comprising an isocyanuric acid derivative, in which a content of the isocyanuric acid derivative is 5.0 mass % or less based on the entire flux.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
14.
SOLDER MATERIAL AND SOLDER MATERIAL PRODUCTION METHOD
The present invention provides a solder material production method in which: a mixture is obtained by mixing a flux containing a solvent, a rosin-based resin, and an activator with a cellulose aggregate that is a mixture of a fibrous cellulose having a length of 1 μm or greater but less than 1 mm and a fibrous cellulose having a length of 1 nm or greater but less than 1 μm; and this mixture and a solder alloy are mixed to produce a solder material.
The present invention contains an aggregated cellulose which is a mixture of a fibrous cellulose having a length of not less than 1 μm but less than 1 mm and a fibrous cellulose having a length of not less than 1 nm but less than 1 μm. The present invention may contain the aggregated cellulose in an amount of 400-10,000 ppm. Alternatively, the present invention may further contain a solvent, a rosin based resin, and an activator.
A flux according to the present invention is used for soldering and comprises an unsaturated aliphatic alcohol that has one unsaturated bond, a thixotropic agent, and a solvent. The unsaturated aliphatic alcohol comprises oleyl alcohol, and the oleyl alcohol content, with reference to the flux as a whole, is 2.0-12.0 mass%.
A flux according to the present invention is a flux used for soldering that includes: a thixotropic agent including a polyamide compound that has UV absorption at the wavelength range of 240 to 500 nm in UV-visible absorption spectra; and a solvent including a glycol ether-based solvent.
B23K 35/00 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A solder alloy is used for soldering, and its chemical composition in mass % includes: 2.0 to 4.0% of Ag; 0.6 to 1.2% of Cu; 2.0 to 5.0% of Sb; 1.1 to 3.5% of In; 0 to 0.20% of Ni; 0 to 0.20% of Co; 0 to 0.05% of Ge; and balance of Sn, and impurities.
A flux according to the present invention is a halogen-free flux used for soldering, the flux containing: a thixotropic agent including a polyamide compound in which one or a plurality of endothermic peaks obtained by differential thermal analysis are all observed in the range of 130-200 °C; and an activator including an isocyanuric acid derivative, wherein the content of the isocyanuric acid derivative is at most 5.0 mass% with respect to the total amount of the flux.
The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/362 - Emploi de compositions spécifiées de flux
Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.
B23K 35/00 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A flux according to the present invention is used for soldering, and contains: a thixotropic agent which contains a polyamide compound that has UV absorption over the wavelength range of 240-500 nm in the ultraviolet absorption spectrum; and a solvent which contains a glycol ether solvent.
A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.
B23K 35/365 - Emploi de compositions non métalliques spécifiées comme enrobages, soit seules, soit liées à l'emploi de matériaux spécifiés pour le brasage ou le soudage
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
Produits et services
Chemicals for use in industry and science other than for
medical or veterinary use; chemicals for welding and
soldering purposes; chemical preparations for welding;
chemical preparations for soldering; metal tempering
preparations; chemicals for cleaning printed circuit boards;
chemicals used for anti-tarnishing, plating, soldering,
etching, stripping and deterging metal surface for use in
the manufacturing processes of electronic circuit boards;
surface active chemical agents for use in the manufacture of
detergents; soldering chemicals; soldering paste; soldering
cream; soldering fluxes; chemical preparations in the nature
of glue accelerators; chemicals for use in the manufacture
of adhesives. Solder bars; solder wire; solder foil; solder powder;
solders in the form of washer, ring, pellet, disk, or
ribbon; solders for use in industrial welding; solder paste
for use in industrial welding; solder ball for use in
industrial welding; ingot solder for use in industrial
welding; solder alloys for use in industrial welding;
solders with resin; resin core wire, namely, filamentous
solder in which resin flux is filled, for use in industrial
welding; nonferrous metals and their alloys.
The present invention includes an iodine-containing cyclic compound which has, in a single molecule, a single ring structure or a plurality of ring or a plurality of ring structures which form a fused ring. The ring of the ring structure comprises only carbon atoms, or carbon atoms, nitrogen atoms and/or oxygen atoms, iodine is bound to at least one of the atoms which constitutes the ring of the ring structure, and the ring does not contain a carboxy group.
2/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
Provided are: a flux which contains no reducing agent or no activator and does not remain on a solder joint; and a solder paste prepared using the flux. The flux according to the present invention contains: a first solvent of which the temperature at which the mass becomes zero as measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L/min. and a temperature raising rate of 10°C/min. is 180°C or higher and lower than 260°C; a second solvent of which the temperature at which the mass becomes zero as measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L/min. and a temperature raising rate of 10°C/min. is 100°C or higher and lower than 220°C; and a fatty acid amide. The content of the first solvent is smaller than that of the second solvent. The flux contains no reducing agent for reducing and removing an oxide film on the surface of a solder or no activator for improving the reducibility, and a mixture of the flux with a solder powder can be used as a solder paste.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
metal tempering preparations; chemicals for use in industry for cleaning printed circuit boards, namely, solvent type processing compositions for use in the electronics industry; chemicals for use in industry used for anti-tarnishing, plating, etching, stripping, and deterging metal surfaces for use in the manufacturing of electronic circuit boards, namely, etchants for use in the manufacture of printed circuit boards, doping compounds for use in the manufacture of printed circuit boards, chemical oxidants for use in the manufacture of printed circuits, chemical coatings used in the manufacture of printed circuit boards; surface active chemical agents for use in the manufacture of detergents; chemical preparations for use in industry in the nature of glue accelerators; chemicals for use in the manufacture of adhesives
Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
38.
SOLDER PASTE, JOINT STRUCTURE, AND METHOD FOR PRODUCING JOINT STRUCTURE
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of Bi, 2-10 mass% of In, and the balance comprising Sn and inevitable impurities, and the second metal particles are composed of a lead-free solder alloy which has a melting point of 260°C or less and contains Sn as an essential component, the content of the first metal particles in the mixed filler being 5.0-14.5 mass%.
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/28 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 950 C
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
40.
RESIN COMPOSITION FOR REINFORCEMENT AND ELECTRONIC COMPONENT DEVICE
This resin composition for reinforcement contains an epoxy compound and a curing agent, wherein the composition contains, as the epoxy compound, 25–100 mass% of a bisphenol-E epoxy resin with respect to the entire amount of the epoxy compound.
This solder alloy is used in soldering and has a chemical composition that includes, in percent by mass, 2.0-4.0% of Ag, 0.6-1.2% of Cu, 2.0-5.0% of Sb, 1.1-3.5% of In, 0-0.20% of Ni, 0-0.2% of Co, and 0-0.05% of Ge, the balance being Sn and unavoidable impurities.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
The flux according to the present invention contains at least one liquid solvent that is a liquid at normal temperature and has at least one hydroxy group, and contains at least two solid solvents that are solid at normal temperature and have at least one hydroxy group. The content of each solid solvent is less than 40 mass% with reference to the total content of the liquid solvent and the solid solvent.
It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration.Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.
The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
B23K 1/20 - Traitement préalable des pièces ou des surfaces destinées à être brasées, p. ex. en vue d'un revêtement galvanique
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B23K 1/19 - Brasage ou débrasage tenant compte des propriétés des matériaux à braser
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 37/00 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe
The present invention addresses the problem of providing a flux and a soldering material that tend not to have reduced activity at high temperatures and that are capable of suppressing migration occurrence. This flux contains an isocyanuric acid derivative having 2 or more carboxyl groups.
A flux according to the present invention contains a phosphine oxide. Accordingly, it is possible to provide a flux capable of enhancing the solder wettability, a resin-flux cored solder containing said flux, and a solder paste containing the aforementioned flux.
B23K 35/363 - Emploi de compositions spécifiées de flux pour le brasage ou le soudage
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
50.
FLUX, SOLDER COMPOSITION AND METHOD FOR PRODUCING BONDED BODY
B23K 35/363 - Emploi de compositions spécifiées de flux pour le brasage ou le soudage
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
The purpose of the present invention is to provide a solder paste flux with which it is possible to form a solder joint that produces less voids. The solder paste flux according to the present invention contains, as the main component, an organic component that comprises an aliphatic acid and an aliphatic primary amine.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
C07C 69/63 - Esters contenant des atomes d'halogène d'acides saturés
C07C 43/17 - Éthers non saturés contenant des atomes d'halogène
C07C 271/28 - Esters des acides carbamiques ayant des atomes d'oxygène de groupes carbamate liés à des atomes de carbone acycliques avec l'atome d'azote d'au moins un des groupes carbamate lié à un atome de carbone d'un cycle aromatique à six chaînons à un atome de carbone d'un cycle aromatique à six chaînons non condensé
C07C 43/176 - Éthers non saturés contenant des atomes d'halogène contenant des cycles aromatiques à six chaînons avec insaturation autre que celle des cycles aromatiques
C07C 33/42 - Alcools non saturés halogénés acycliques
C07C 69/76 - Esters d'acides carboxyliques dont un groupe carboxyle estérifié est lié à un atome de carbone d'un cycle aromatique à six chaînons
C07C 271/16 - Esters des acides carbamiques ayant des atomes d'oxygène de groupes carbamate liés à des atomes de carbone acycliques avec les atomes d'azote des groupes carbamate liés à des atomes d'hydrogène ou à des atomes de carbone acycliques à des atomes de carbone de radicaux hydrocarbonés substitués par des atomes d'oxygène liés par des liaisons simples
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
Provided is a solder alloy in which depletion of the plating layer can be effectively prevented, even under repeated contact in a molten state with a plating layer of which the primary component is Fe. This solder alloy comprises 0.01-0.1 mass% of Fe, 0.005 mass% or more but less than 0.02 mass% of Co, 0.1-4.5 mass% of Ag, 0.1-0.8 mass% of Cu, with the balance being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
Provided is flux that improves solder composition wettability during reflow, and that can suppress the concentration of residual color of an activator due to reflow. This flux contains as an activator at least one of an amine compound having at least one acetylated amino group or an amino acid compound having at least one acetylated amino group.
The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used together with a reducing gas, wherein: the solder paste contains a solder powder, a thixotropic agent that is solid at normal temperature, and a solvent; and contains no reducing agents for removing oxidized films or activators for improving reduction properties.
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B23K 3/06 - Dispositifs d'alimentation en métal d'apportCuves de fusion du métal d'apport
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
B23K 35/363 - Emploi de compositions spécifiées de flux pour le brasage ou le soudage
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
Produits et services
Chemicals which do not contain halogen compounds, for use in
industry and science other than for medical or veterinary
use; metal tempering preparations which do not contain
halogen compounds; chemicals which do not contain halogen
compounds, for cleaning printed circuit boards, namely,
solvent type processing compositions for use in the
electronics industry; chemicals which do not contain halogen
compounds, used for anti-tarnishing, plating, soldering,
etching, stripping, and deterging metal surfaces for use in
the manufacture of electronic circuit boards, namely, solder
mask, etchants for use in the manufacture of printed circuit
boards, masking compounds for use in the manufacture of
printed circuit boards, doping compounds for use in the
manufacture of printed circuit boards, chemical oxidants for
use in the manufacture of printed circuits, chemical
coatings used in the manufacture of printed circuit boards;
surface active chemical agents for use in the manufacture of
detergents which do not contain halogen compounds; soldering
paste which do not contain halogen compounds; soldering
cream which do not contain halogen compounds; soldering
fluxes which do not contain halogen compounds; chemicals for
welding and soldering purposes which do not contain halogen
compounds; chemical preparations for welding which do not
contain halogen compounds; chemical preparations for
soldering which do not contain halogen compounds; soldering
chemicals which do not contain halogen compounds. Hard or soft solder bars which do not contain halogen
compounds; solder wire which do not contain halogen
compounds; hard or soft solders containing resin which do
not contain halogen compounds; resin core wire which do not
contain halogen compounds, namely, filamentous solder in
which resin flux is filled for use in industrial welding;
non-ferrous metals and their alloys which do not contain
halogen compounds.
58.
Lead-free solder alloy, solder material and joined structure
Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
Provided is a flux activating agent containing a halogen compound represented by general formula 1 (in the formula, X1 and X2 are different halogen atoms, R1 and R2 are groups that are respectively represented by general formula -OH,-O- R3, -O-Ｃ(=O)-R４ or -O-C(=O)-NH-R５, where R1 and R2 may be the same or different groups, R3, R4 and R5 are, respectively, C1-18 aromatic hydrocarbon groups, or C1-18 aliphatic hydrocarbon groups, and R3, R4 and R5 may be the same or different groups.).
Provided is a lead-free solder alloy or the like, which contains more than 3.0 mass % but not more than 10 mass % of Sb, with the balance consisting of Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
B23K 31/00 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
B23K 35/34 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau comprenant des corps qui facilitent le travail des métaux lorsqu'ils sont chauffés
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/362 - Emploi de compositions spécifiées de flux
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
Produits et services
Chemicals for use in industry and science (other than for
medical or veterinary use); chemicals for welding and
soldering purposes; chemical preparations for welding;
chemical preparations for soldering; metal tempering
preparations; chemicals for cleaning printed circuit boards;
chemicals used for anti-tarnishing, plating, soldering,
etching, stripping and deterging metal surface for use in
the manufacturing processes of electronic circuit boards;
surface active chemical agents for use in the manufacture of
detergents; soldering chemicals; soldering paste; soldering
cream; soldering fluxes; plastic adhesives not for
stationery or household purposes; adhesives for use in
industry. Solder bars; solder wire; solder foil; solder powder;
solders in the form of washer, ring, pellet, disk, or
ribbon; solders for use in industrial welding; solder paste
for use in industrial welding; solder ball for use in
industrial welding; ingot solder for use in industrial
welding; solder alloys for use in industrial welding;
solders with resin; resin core wire, namely, filamentous
solder in which resin flux is filled, for use in industrial
welding.
63.
FLUX, SOLDER COMPOSITION AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT MOUNTING SUBSTRATE
Provided is a flux containing a hydrogenated dimer acid and at least one polybutadiene (meth)acrylate compound selected from a group comprising polybutadiene (meth)acrylate compounds represented by formula 1 and polybutadiene (meth)acrylate compounds represented by formula 2.
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
Produits et services
Chemicals for use in industry and science other than for medical or veterinary use; chemicals for welding and soldering purposes; chemical preparations for welding; chemical preparations for soldering; [ metal tempering preparations; chemicals for cleaning printed circuit boards, namely, solvent type processing compositions for use in the electronics industry; chemicals used for anti-tarnishing, plating, soldering, etching, stripping, and deterging metal surfaces for use in the manufacturing of electronic circuit boards, namely, solder mask, etchants for use in the manufacture of printed circuit boards, masking compounds for use in the manufacture of printed circuit boards, doping compounds for use in the manufacture of printed circuit boards, chemical oxidants for use in the manufacture of printed circuits, chemical coatings used in the manufacture of printed circuit boards; surface active chemical agents for use in the manufacture of detergents; ] soldering chemicals; soldering paste; soldering cream; [ soldering fluxes; ] [ plastic adhesives not for stationery or household purposes; adhesives for use in industry; ] all of which do not contain lead [ Hard or soft solder bars; ] solder wire; [ solder foil; solder powder; hard or soft solders in the form of washer, ring, pellet, disk, or ribbon; ] hard or soft solders for use in industrial welding; solder paste for use in industrial welding; [ hard or soft solder balls for use in industrial welding; gold ingot solder for use in industrial welding; ] hard or soft solder alloys for use in industrial welding; hard or soft solders containing resin; resin core wire, namely, filamentous solder in which resin flux is filled for use in industrial welding; all of which do not contain lead
The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/362 - Emploi de compositions spécifiées de flux
C22C 1/04 - Fabrication des alliages non ferreux par métallurgie des poudres
The purpose of the present invention is to provide a soldering paste that makes possible a surface mounting structure for electronic components that can withstand 1000 heat shock cycles of -40 - 150°C as required for use in the proximity of engines for vehicular applications without cracking in the solder joint parts. Flux containing an amine halogen salt and dicarboxylic acid is kneaded into a Sn-Ag-Bi-In alloy powder. As a result, a soldering paste with superior bondability and no cracking for 1000 heat shock cycles of -40 - 150°C that has long continuous printability and little occurrence of solder balls is obtained.
Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C6-C15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).
Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.
Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.
Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C6-C15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).
Provided are a low-silver lead-free solder alloy which has excellent wetting properties and excellent thermal fatigue characteristics; a solder-paste type soldering material and a flux-cored soldering material which exhibit excellent fatigue resistance; and joined products using the soldering materials. The soldering materials are characterized by being prepared either by mixing a low-silver lead-free solder alloy with a pasty flux, or by forming the solder alloy into a wire with a solid or pasty flux as the core, said low-silver lead-free solder alloy containing Cu: 0.1 to 1.5wt%, Co: 0.01 to less than 0.05wt%, Ag: 0.05 to 0.25wt%, and Ge: 0.001 to 0.008wt% with the balance being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
Disclosed is a lead-free solder paste composed of a solder powder and a flux (13) mixed with the solder powder. The solder powder is composed of a first base alloy powder (11) which is a first alloy in a powder form, and a second base alloy powder (12) which is a second alloy in a powder form having a component composition different from that of the first base alloy powder (11). The solder powder has two or more melting points.
