A module includes a core substrate provided with a first surface and a second surface that define front and rear surfaces, respectively, the core substrate being provided with a through hole that connects the first surface and the second surface to each other, a redistribution layer arranged to cover the first surface and the through hole of the core substrate, a first component at least partially arranged in the inside of the through hole, and a second component mounted on a side of the second surface of the core substrate as partially being superimposed on the through hole. The first component is electrically connected to the redistribution layer. The first component is electrically directly connected to the second component in a portion where the second component is superimposed on the through hole.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
2.
RESIN COMPOSITION, RESIN SHEET, CONDUCTOR-LAYER-INCLUDED RESIN SHEET, MULTILAYER SUBSTRATE, AND METHOD FOR MANUFACTURING RESIN SHEET
A resin composition that includes: a resin component having a liquid crystal polymer as a primary component thereof; and an inorganic filler, wherein a specific surface area of the inorganic filler is 30 m2/cm3 or less, a maximum diameter of the inorganic filler is 100 μm or less, and a content of the inorganic filler is 0.1% by volume to 60% by volume.
C08G 63/06 - Polyesters dérivés soit d'acides hydroxycarboxyliques, soit d'acides polycarboxyliques et de composés polyhydroxylés dérivés des acides hydroxycarboxyliques
A method for detecting an amine compound, the method including: bringing a specimen into contact with an isothiocyanate compound having a phenanthrenequinone skeleton; and detecting a thiazole derivative formed from an amine compound contained in the specimen and the isothiocyanate compound.
G01N 21/33 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique en utilisant la lumière ultraviolette
G01N 27/48 - Systèmes utilisant la polarographie, c.-à-d. la mesure des variations d'intensité sous une tension qui varie lentement
An acoustic wave device includes a support, a piezoelectric layer including first and second main surfaces, and an IDT electrode including first and second busbar portions, and first and second electrode fingers connected to the first and second busbar portions and being interdigitated with each other. A region in which first and second electrode fingers adjacent to each other overlap each other is an intersection region. A cavity portion is provided in the support and overlaps the intersection region. At least one of the first and second busbar portions includes an outer busbar not overlapping the cavity portion, and at least one of protruding electrodes extending from the outer busbar toward the intersection region. The at least one protruding electrode overlaps an outer peripheral edge of the cavity portion.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/13 - Moyens d'excitation, p. ex. électrodes, bobines pour réseaux se composant de matériaux piézo-électriques ou électrostrictifs
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.
An acoustic wave device includes first and second acoustic wave resonators with first and second IDT electrodes on a common piezoelectric substrate. A first apodization area in the first IDT electrode includes first and second edge areas with a first center area therebetween. A second apodization area in the second IDT electrode includes third and fourth edge areas with a second center area therebetween. At least one first mass-adding film is located in at least one of the first and second edge areas and overlaps the electrode fingers of the first IDT electrode, and at least one second mass-adding film is located in at least one of the third and fourth edge areas and overlaps the electrode fingers of the second IDT electrode. A thickness of the at least one first mass-adding film is equal to a thickness of the at least one second mass-adding film.
A power factor corrector (PFC) is used to receive input power and supply power to a load via a DC/DC converter. A method of controlling a PFC is executed by a PFC controller used to control the PFC, where the PFC controller includes a voltage controller. The method includes receiving a first signal transmitted from a DC/DC controller used to control the DC/DC converter, where the first signal indicates the load, deriving a second signal based on the first signal, where the second signal is an expected output control signal of the voltage controller under the load indicated by the first signal, and configuring the voltage controller according to the second signal so as to keep an output voltage Vbulk of the PFC to the DC/DC converter stable.
H02M 1/42 - Circuits ou dispositions pour corriger ou ajuster le facteur de puissance dans les convertisseurs ou les onduleurs
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
A high frequency module includes a first reception filter, a second reception filter, a first low noise amplifier, a first inductor, a second inductor, and a mounting substrate. The first reception filter, the second reception filter, the first inductor, and the second inductor are disposed on a first main surface of the mounting substrate. When seen in plan view from a thickness direction of the mounting substrate, an outer size of the first inductor is larger than an outer size of the second inductor. The first inductor includes a first part around which part of a wire is closely wound and a second part around which a remaining part of the wire is sparsely wound. In an orthogonal direction that is orthogonal to the thickness direction, the first part of the first inductor and the first reception filter do not overlap.
A solid electrolytic capacitor that includes: an anode plate including a core portion, a porous layer having pores on at least one main surface of the core portion, and a dielectric layer on a surface of the porous layer and extending into the pores of the porous layer; and a cathode layer that includes a solid electrolyte layer on a surface of the dielectric layer. The solid electrolyte layer includes a conductive polymer layer inside the pores of the porous layer, the conductive polymer layer comprising a mixture of a conductive polymer and an insulating material. The insulating material is a material which contains an OH group, a COOH group, a CO group, or an NH2 group in a molecule, has hygroscopicity, and does not have a function as a dopant for the above-described conductive polymer.
A signal processing circuit is provided that includes a capacitor coupled to a signal line to be coupled to a sensor, and coupled in series with the sensor, and a variable resistance circuit coupled in parallel with the capacitor. The variable resistance circuit and the capacitor form a high-pass filter that allows a signal having a cutoff frequency or higher to pass through the high-pass filter. In the variable resistance circuit, a resistance value is set to a first resistance value when a target signal having a peak component on a time axis is allowed to pass through the high-pass filter, and the cutoff frequency at the first resistance value is 1/10 or less of a frequency of the peak component.
A power supply system includes: a first module including a first power amplifier; a first power line supplying power to the first module; a second power line supplying power to the first module; a first capacitance connected at one end to the first power line; a second capacitance connected at one end to the second power line; a first switch that switches between a state in which the first power line is electrically connected to the first module and a state in which the second power line is electrically connected to the first module; a second switch that can connect the second capacitance to a reference potential when the first power line is connected to the first module; and a third switch that can connect the first capacitance to a reference potential when the second power line is connected to the first module.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
12.
PULSE WAVE SIGNAL PROCESSOR, PHYSIOLOGICAL INFORMATION MEASUREMENT DEVICE, AND CONTACT-PRESSURE ABNORMALITY DETERMINATION METHOD
A pulse wave feature calculator is provided that calculates a value of a pulse wave feature based on a steepness of a rise of a pulse wave measured with a photoplethysmographic sensor. Based on the value of the pulse wave feature calculated by the pulse wave feature calculator, a contact pressure determinator determines whether a contact pressure, which is a pressure with which the photoplethysmographic sensor is pressed against a measurement site, is within a range, such as an appropriate range.
An electrode including a film having two-dimensional particles, the two-dimensional particles containing at least a metal cation and one or a plurality of layers, the layers including a layer body represented by: MmXn, wherein M is at least one Group 3 to 7 metal and contains at least a Ti atom, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, m is more than n and 5 or less; and a modifier or terminal T is present on a surface of the layer body, wherein T is at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom, the metal cation contains a Li cation, and a content of the Li cation in the two-dimensional particles is 5.4 mol or more with respect to 100 mol of the Ti atom.
This electronic component is provided with an electronic component element body, a first external electrode, and a second external electrode. The electronic component element body is provided with a plurality of internal electrodes. The first external electrode comprises a metal film that does not contain a glass component, the metal film having a surface roughness maximum value of 1.0 μm. The second external electrode is formed so as to cover the first external electrode, and includes a conductor and a resin. The electronic component element body has a first end surface and a second end surface at which the internal electrodes are exposed, and a side surface connecting the first end surface and the second end surface. The first external electrode is formed on at least the internal electrode-exposed portion and the first end surface and the second end surface to a thickness in the range of 0.5 μm to 20 μm. The first external electrode has a covering part overlapping the side surface. The length of the covering part is 50 μm or less.
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 17/28 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour appliquer les bornes
A vehicle robot R includes: a vehicle (10) including wheels (12); an angular velocity sensor; a flywheel (43); a motor (44); an auxiliary part (20) for supporting the vehicle (10) so that an inclination angle (A2) of the vehicle (10) with respect to a gravity axis (GA) is a predetermined initial inclination angle (A1); and a control device. The control device can execute standing control and fall prevention control. The standing control includes: a step in which by performing a comparison with a torque command value in an initial state, outputs a torque command value of a reverse rotation direction side; and a step for bringing the torque command value close to zero when the angular velocity is greater than or equal to a predetermined positive threshold value. The control device ends the standing control when, after the start of the standing control, the angular velocity becomes zero or less, and starts the fall prevention control.
In the present invention, an annular member with a closed or slitted ring shape has a first opening. A wiring substrate is arranged along the outer peripheral surface of the annular member so as to overlap with the first opening. A first light-emitting element and a light-receiving element are mounted in a position on the wiring substrate that overlaps with the first opening. The first light-emitting element emits light toward a space encompassed by the annular member. The light-receiving element receives light arriving from the space encompassed by the annular member. A transparent resin member continuously covers the inner peripheral surface of the annular member, the first light-emitting element, and the light-receiving element in a circumferential direction.
A61B 5/02 - Détection, mesure ou enregistrement en vue de l'évaluation du système cardio-vasculaire, p. ex. mesure du pouls, du rythme cardiaque, de la pression sanguine ou du débit sanguin
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/01 - Mesure de la température de parties du corps
A61B 5/107 - Mesure de dimensions corporelles, p. ex. la taille du corps entier ou de parties de celui-ci
A61B 5/11 - Mesure du mouvement du corps entier ou de parties de celui-ci, p. ex. tremblement de la tête ou des mains ou mobilité d'un membre
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A61B 5/16 - Dispositifs pour la psychotechnieTest des temps de réaction
A61B 5/22 - ErgométrieMesure de la force musculaire ou de la force d'un coup musculaire
Methods and devices for enhancing performance of a power splitter are presented. According to one aspect, the power splitter is realized via lumped elements that include inductively coupled coils. Values of the lumped elements are based on an equivalent circuit of the power splitter that includes a star topology provided by a mutual inductance connected to a first port of the power splitter and respective inductances of the inductively coupled coils modified by the mutual inductance connected between the mutual inductance and respective second and third ports of the power splitter. A coupling factor of the inductively coupled coils has a magnitude that is in a range from 0.15 to 0.45. The coupling factor is negative. Respective capacitors are connected to the ports of the power splitter. The respective capacitors include switchable capacitors.
H03H 7/48 - Réseaux pour connecter plusieurs sources ou charges, fonctionnant sur la même fréquence ou dans la même bande de fréquence, à une charge ou à une source commune
This acoustic wave device includes: a piezoelectric layer which has a first main surface and a second main surface on the side opposite to the first main surface; an upper electrode which is provided on the first main surface of the piezoelectric layer; a lower electrode which is provided on the second main surface of the piezoelectric layer; a support member which is disposed facing the second main surface of the piezoelectric layer and which is provided with a cavity portion in a region where at least the upper electrode and the lower electrode overlap; a counter electrode which is provided inside the cavity portion and which is disposed facing the lower electrode; and a lead-out structure which is connected to the counter electrode and which is led out to the first main surface side of the piezoelectric layer.
Provided is a multilayer ceramic capacitor 1 in which distortion in the vicinity of an interface of a terminal electrode 19 of a ceramic layer 28 is reduced. An external electrode 22 of the multilayer ceramic capacitor 1 includes a first metal grain 40. In a cross section parallel to a height direction T and a length direction L, two or more grain boundaries 46 of the first metal grain 40 are present at a junction 50 between an internal electrode 27 and the external electrode 22, and the grain size of the first metal grain 40 in which the grain boundary 46 is present in the junction 50 is 1.2 times or less of a thickness 67 in the height direction T of the internal electrode 27.
Provided is a multilayer ceramic electronic component for which it is not necessary to design the internal structure per capacitance, while suppressing an increase in capacitance and an increase in DC resistance. A multilayer ceramic electronic component 100 according to the present invention includes a multilayer ceramic capacitor and a conductor section. The multilayer ceramic capacitor is provided with: a laminate including a plurality of dielectric layers stacked on one another and including a first principal face and a second principal face that are opposite to each other in the stacking direction, a first side face and a second side face that are opposite to each other in the width direction, which is perpendicular to the stacking direction, and a first end face and a second end face that are opposite to each other in the length direction, which is perpendicular to the stacking direction and the width direction, the laminate including a first internal electrode layer exposed at the first end face and the second end face, as well as a second internal electrode layer exposed at the first side face and the second side face; a first external electrode and a second external electrode connected to the first internal electrode layer; and a third external electrode and a fourth external electrode connected to the second internal electrode layer. The conductor section is electrically connected to the first external electrode and the second external electrode and is electrically connected to neither the third external electrode nor the fourth external electrode. The DC resistance RdcA of the conductor section is smaller than the DC resistance RdcB of the multilayer ceramic capacitor, and the conductor section is a lead frame.
The present disclosure provides: a coil component that, with a simple structure, can constitute a coil having two or more turns when mounted on a substrate; and a circuit device including the coil component. A coil component (1) according to the present disclosure comprises a housing (4), a coil (L1) having a coil part (2a) that is disposed inside the housing (4) and is disposed substantially parallel to a main surface (40A), and a coil (L2) having a coil part (3a) that is disposed inside the housing (4) so that the opening of the coil (L2) overlaps the opening of the coil (L1) when viewed from the direction of the main surface (40A). The coil (L1) has a lead wire (2b) and a lead wire (2d) that are connected to the coil part (2a), the lead wires (2b, 2d) being led out from the side-surface (41) side of the housing (4) and being bent along the side-surface (41) side. The coil (L2) has a lead wire (3b) and a lead wire (3d) that are connected to the coil part (3a), the lead wires (3b, 3d) being led out from the side-surface (44) side adjacent to the side surface (41) and being bent along the side-surface (44) side.
This connector comprises a first signal terminal that includes: a mounting part at least a portion of which extends in a second direction orthogonal to a first direction; a back surface part that is continuous with the mounting part and extends in a third direction orthogonal to the first direction and the second direction; a top surface part that is continuous with the back surface part and has a first portion extending in the second direction; and a contact part that is continuous with the top surface part, is located at a position different from the back surface part in the second direction, and overlaps the back surface part when viewed in the second direction. The back surface part has a widened portion having a width in the first direction that is wider than the width of the first portion in the first direction. At least a portion of the contact part has a width in the first direction that is wider than the width of the first portion in the first direction, or at least a portion of the contact part has a length in the second direction that is longer than the thickness of the first portion in the third direction.
H01R 13/6471 - Moyens pour empêcher la diaphonie par agencement particulier des conducteurs de mise à la masse et de signaux, p. ex. GSGS [mise à la masse - signal - mise à la masse - signal]
H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires
This solid electrolyte has: a first crystallite which is formed into a primary particle and has a first crystal structure; a second crystallite which is formed into the same primary particle as the first crystallite and has a second crystal structure that is different from the first crystal structure; and an amorphous phase. The first crystallite and the second crystallite each contain lithium, the first crystal structure is a hexagonal crystal structure, the second crystal structure is an orthorhombic crystal structure, and the crystallite size of the first crystallite and the crystallite size of the second crystallite are both 50 nm or less.
H01B 1/06 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques
C01B 17/20 - Méthodes pour préparer les sulfures ou les polysulfures en général
This power amplification circuit (100) comprises: an input terminal (T1) and an output terminal (T2); a distributor (120); amplifiers (141A, 142A); a phase adjuster (143A); a substrate (241); and a substrate (242) mounted on the substrate (241). The distributor (120) is connected to the input terminal (T1) and distributes an input signal from the input terminal (T1) to a first path and a second path. The amplifier (141A) is connected to the first path of the distributor (120). The amplifier (142A) is connected to the second path of the distributor (120). The phase adjuster (143A) is connected between the output of the amplifier (141A) and the output of the amplifier (142A). The amplifiers (141A, 142A) constitute a Doherty amplifier. The output terminal (T2) is electrically connected to a connection node of the second amplifier (142A) and the phase adjuster (143A). The amplifier (141A) is a carrier amplifier and is formed on the substrate (241). The amplifier (142A) is a peak amplifier and is formed on the substrate (242). The substrate (241) is a semiconductor substrate containing a material having a Si-based base material as a main component. The substrate (242) is a semiconductor substrate containing a material having a compound of a group III element and a group V element as a main component.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 1/56 - Modifications des impédances d'entrée ou de sortie, non prévues ailleurs
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H03F 3/68 - Combinaisons d'amplificateurs, p. ex. amplificateurs à plusieurs voies pour stéréophonie
Provided is a composite substrate in which delamination at a bonding interface between a ceramic substrate and a resin substrate and the occurrence of cracks in the resin substrate are reduced. This composite substrate comprises a resin substrate 20 and a low-temperature fired ceramic 10 bonded to the resin substrate 20 in a thickness direction. The low-temperature fired ceramic 10 is a substantially rectangular parallelepiped having a first main surface 10a, a second main surface 10b facing the first main surface 10a, and side surfaces 10c connecting the first main surface 10a and the second main surface 10b. The first main surface 10a is directly bonded to the resin substrate 20, the corners from the first main surface 10a to the side surfaces 10c are rounded with a radius R1, the corners of the adjacent side surfaces 10c are rounded with a radius R2, and the radius R2 is larger than the radius R1.
This acoustic wave filter device includes: a series arm resonator that is connected between an input terminal and an output terminal; a parallel arm resonator that is connected between a node, which is on a path connecting the input terminal and the output terminal, and a ground terminal; and a capacitive element that is connected between the input terminal and the output terminal, and that is connected in parallel with the series arm resonator. The acoustic wave filter device includes a plurality of series arm resonators. The capacitive element is connected in parallel to, among the plurality of series arm resonators, a series arm resonator that is connected to the input terminal.
A capacitor 1 comprises: a capacitor element 10 having an element body 11 and an external electrode 12a provided on an end surface of the element body 11; a lead-out terminal 20 electrically connected to the external electrode 12a; and an exterior case 30 in which the capacitor element 10 is housed. The exterior case 30 has a bottomed cylindrical shape having an opening part 31, and includes a bottom part 32 facing the opening part 31 in a first direction D1, and a side wall part 33 extending in the first direction D1 from the bottom part 32 toward the opening part 31. The lead-out terminal 20 is led out of the opening part 31 onto an outer surface 33a of the side wall part 33 while being bent, and extends from the opening part 31 side toward the bottom part 32 side in the first direction D1. The lead-out terminal 20 has a first surface 20a facing the outer surface 33a of the side wall part 33 in a second direction D2 perpendicular to the outer surface 33a of the side wall part 33, and a second surface 20b opposite the first surface 20a in the second direction D2. The outer surface 33a of the side wall part 33 is provided with a guard part 50 facing the second surface 20b of the lead-out terminal 20 in the second direction D2.
A capacitor module 1 comprises: a capacitor element 10 having an element body 11, a first external electrode 12a provided on a surface of the element body 11, and a second external electrode 12b provided at a position separated from the first external electrode 12a on the surface of the element body 11; a first bus bar 20a electrically connected to the first external electrode 12a; a second bus bar 20b electrically connected to the second external electrode 12b; and an insulation sheet 30 which is sandwiched between the first bus bar 20a and the second bus bar 20b and forms a laminated structure together with the first bus bar 20a and the second bus bar 20b. The first bus bar 20a has a first through-hole 21aa, and the insulation sheet 30 has a first projection part 31aa projecting on the first bus bar 20a side. The first projection part 31aa is locked in the first through-hole 21aa.
An inductor element includes an inductor wiring having an interruption portion in at least one place, a pair of external terminals that are connected to each of one side part and the other side part, which are located on both sides of the interruption portion, of the inductor wiring and that are exposed to an outside, at least one inductor variable resistance portion that is provided at the interruption portion, and at least one variable resistance terminal that is connected to the inductor variable resistance portion and that is exposed to the outside. The inductor variable resistance portion connects the one side part and the other side part, and changes a resistance value between the one side part and the other side part.
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 27/06 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration non répétitive
Methods and devices for enhancing performance of a power splitter are presented. According to one aspect, the power splitter is realized via lumped elements that include inductively coupled coils. Values of the lumped elements are based on an equivalent circuit of the power splitter that includes a star topology provided by a mutual inductance connected to a first port of the power splitter and respective inductances of the inductively coupled coils modified by the mutual inductance connected between the mutual inductance and respective second and third ports of the power splitter. A coupling factor of the inductively coupled coils has a magnitude that is in a range from 0.15 to 0.45. The coupling factor is negative. Respective capacitors are connected to the ports of the power splitter. The respective capacitors include switchable capacitors.
A bias circuit includes: a first transistor having an emitter or source from which a bias is supplied to a first amplifier; a first terminal electrically connected to a circuit that controls a bias of a predetermined amplifier; and a first inverting amplifier having a first input terminal electrically connected to the emitter or source of the first transistor and a first output terminal electrically connected to a base or gate of the first transistor and the first terminal, the first inverting amplifier inverting and amplifying a voltage supplied to the first input terminal.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
A power supply module including a substrate, an electronic component provided on an upper surface of the substrate, a lower board electrically connected with the electronic component through the substrate, and an upper board electrically connected another end of the at least one pillar opposing an end of the at least one pillar that is electrically connected with the at least one lower board, the at least one upper board being electrically connected with the substrate. A pillar extends between the lower board and the upper board. The pillar includes a first end electrically connected with the lower board and a second end electrically connected with the upper board. A magnetic material is provided around a periphery of the pillar.
An N-path filter includes N-number signal paths connected in parallel to each other between first and second input-output terminals. Each N-number signal path includes a first switch connected to the first input-output terminal to modulate an input signal, a second switch connected to the second input-output terminal to modulate the input signal in a same phase as that of the switch, and a base filter connected between the first and second switches. The first and second switches are operable to modulate the input signal in a phase of one period including different phases of the different signal paths. The base filter is a band pass filter including only passive elements.
A circuit assembly includes a first printed circuit board (PCB), a switching device located on a first side of the first PCB, a heatsink attached to a second side surface of the first PCB opposite to the first side, and an L-shaped metal plate attached to the heatsink and to the first PCB.
A semiconductor device includes: a first semiconductor element in which a plurality of transistors arranged in one direction are electrically connected in parallel, and a second semiconductor element provided in both end portions in the arrangement direction of the transistors, wherein the lower an ambient temperature is, the greater a current flowing through the second semiconductor element relatively increases.
A high frequency module includes a low noise amplifier, a switch, a first inductor, a second inductor, a first filter, and a second filter. The first inductor is connected between the low noise amplifier and an output terminal of the switch. The second inductor is connected between a path between the first inductor and the output terminal of the switch, and an input/output terminal of the switch. The switch is configured to switch between a first state where a first input terminal connected to the first filter and the output terminal are connected, and the input/output terminal and a ground terminal are connected, and a second state where a second input terminal connected to the second filter and the input/output terminal are connected.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
A radio frequency module includes a switch, first and second filters. The switch includes a common terminal and two selection terminals. A first communication path is connected to a first selection terminal. A second communication path is connected to a second selection terminal. The first filter is in the first communication path and includes first and second communication bands. The second filter is in the second communication path and includes third and fourth communication bands. At least a part of the third communication band overlaps the first communication band, but not the second communication band. The switch is switchable between first and second connections. In the first connection, the common terminal is connected to the first selection terminal. In the second connection, the common terminal is connected to the first selection terminal, and the common terminal is connected to the second the selection terminal.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
39.
SYSTEMS, DEVICES, AND METHODS FOR INTEGRATED VOLTAGE REGULATORS
Disclosed embodiments may include systems, devices and methods for fabricating high-density charge-storage devices and power conversion devices. In one embodiment, a device is disclosed, comprising an inductor. The inductor includes a first inductor surface and a second inductor surface opposite the first inductor surface. The inductor further includes a first inductor substrate including a cavity. A seed layer is formed on a bottom surface of the cavity, and a magnetic layer is formed on the seed layer. The magnetic layer includes a plurality of stacked magnetic layers separated from each other by an insulating material layer.
H02M 3/00 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu
H02M 7/00 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continuTransformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif
40.
MULTILAYER CERAMIC CAPACITOR, PRODUCTION METHOD FOR MULTILAYER CERAMIC CAPACITOR, AND PRODUCTION METHOD FOR MOUNTING STRUCTURE FOR MULTILAYER CERAMIC CAPACITOR
A multilayer ceramic capacitor (1) according to the present invention comprises a capacitor body (10), a first external electrode (20A), and a second external electrode (20B). A first principal surface (101) is on one side in the layering direction (DS) of the capacitor body (10). The first external electrode (20A) includes a first base electrode layer (21A) and a first surface electrode layer (22A). The first base electrode layer (21A) is provided on the first surface (101) so as to cover a first via conductor (13A). The first surface electrode layer (22A) directly covers the first base electrode layer (21A). The second external electrode (20B) is provided on the first principal surface (101) at a gap from the first external electrode (20A) so as to cover a second via conductor (13B). An outer surface (221A) of the first surface electrode layer (22A) extends away from the first principal surface (101) from an end edge (21AE) of the first base electrode layer (21A) on the first principal surface (101).
33, and contains a perovskite compound in which the A site is Ba. The barrier film 28 includes Ba and at least one of S and C. The barrier film 28 covers both principal surfaces 12a and 12b and both side surfaces 12c and 12d, and covers both end surfaces 12e and 12f except for an exposed surface 29 where the internal electrode layer 16 is exposed. The external electrode 24 is in contact with the internal electrode layer 16 at the exposed surface 29.
A capacitor module 1 comprises: a plurality of capacitor elements 10 each having an element body 11, a first external electrode 12a provided on one end surface of the element body 11, and a second external electrode 12b provided on the other end surface facing the one end surface of the element body 11 in a first direction D1; and a plurality of connection terminals 20 electrically connected to the plurality of capacitor elements 10. The plurality of capacitor elements 10 include a first capacitor element 10a and a second capacitor element 10b which are adjacent to each other in the first direction D1 so that the first external electrodes 12a having the same polarity face each other apart from each other. The plurality of connection terminals 20 include: a first main connection terminal 21a that is electrically connected to the first external electrode 12a of the first capacitor element 10a and the second capacitor element 10b at a position separated from the first capacitor element 10a and the second capacitor element 10b; a first sub connection terminal 22a that is electrically connected to the first main connection terminal 21a at one end side, and that is electrically connected to the first external electrode 12a of the first capacitor element 10a at the other end side; and a second sub connection terminal 22b that is electrically connected to the first main connection terminal 21a at one end side, and that is electrically connected to the first external electrode 12a of the second capacitor element 10b at the other end side. A first through hole 31a is provided at the first main connection terminal 21a. A dimension P1 of the first through hole 31a in the first direction D1 is smaller than the maximum distance Q1 in the first direction D1 between a surface 22aa on a side opposite to the second sub connection terminal 22b in the first sub connection terminal 22a and a surface 22ba on a side opposite to the first sub connection terminal 22a in the second sub connection terminal 22b, and the first sub connection terminal 22a and the second sub connection terminal 22b pass through the first through hole 31a in a state in which one end of each are in contact with each other and the other ends are separated from each other.
The present invention comprises: a dielectric substrate (Sb1); a ground electrode (GND), an unbalanced terminal (TU1), and a pair of balanced terminals including a first balanced terminal (TB1) that are provided on the dielectric substrate; a main line (ML1) in which one end (Es1) is connected to the unbalanced terminal and the other end (Ee1) is open; a first sub line (SL1) in which one end (Ee2) is connected to the first balanced terminal and the other end (Es2) is connected to the ground electrode; a first line (CL1) in which one end (Ee2) is connected to the first balanced terminal and the other end (Ec1) is open; and a second line (CL2) in which one end (Es2) is connected to the ground electrode and the other end (Ec2) is open, wherein the first sub line (SL1) is positioned between the first line (CL1) and the main line (ML1) and between the second line (CL2) and the main line (ML1), and the other end (Ec1) of the first line faces the other end (Ec2) of the second line.
H01P 5/10 - Dispositifs de couplage du type guide d'ondes destinés au couplage de lignes ou de dispositifs de différentes sortes destinés au couplage de lignes ou de dispositifs équilibrés avec des lignes ou des dispositifs déséquilibrés
H03H 7/42 - Réseaux permettant de transformer des signaux équilibrés en signaux non équilibrés et réciproquement, p. ex. baluns
Provided is a multilayer ceramic capacitor having higher moisture resistance reliability. In the multilayer ceramic capacitor 1, a difference between a first silicon concentration at an outer layer position A and a first silicon concentration at a side margin position B is 0.2-2.5 mol%, and a first silicon concentration at an origin O is from equal to or greater than the first silicon concentration at the outer layer position A to equal to or less than the first silicon concentration at the side margin position B, or is from equal to or greater than the first silicon concentration at the side margin position B to equal to or less than the first silicon concentration at the outer layer position A.
Provided is a multilayer ceramic electronic component that is configured to handle squeaking and makes it easy to distinguish a mounting surface side and a non-mounting surface side. This multilayer ceramic electronic component 10 comprises: a multilayer ceramic capacitor 10 that comprises a layered body 12 and two external electrodes 30a, 30b; a first spacer 52 that is connected to one external electrode 30a; a second spacer 54 that is connected to the other external electrode 30b; and a third spacer 56 that is provided between the first spacer 52 and the second spacer 54. The layered body 12 has a first surface 12a that is on a non-mounting surface side, and the first surface 12a is a different color from the third spacer 56.
This magnetic core comprises a core back part and a tooth part, said core back part having a front surface facing a first direction toward the rotation axis of a rotary electric machine when the magnetic core is incorporated in the rotary electric machine. The tooth part includes a tooth body part extending from the front surface in the first direction and a tooth tip part provided at the tip of the tooth body part. The tooth tip part has a back surface facing the reverse direction of the first direction. The tooth body part has an end surface that faces a second direction along the rotation axis when the magnetic core is incorporated in the rotary electric machine. The end surface has a recessed curved surface that smoothly connects the end surface to the front surface of the core back part or the back surface of the tooth tip part, and the curved surface is formed by a first curved surface formation part that is a part of the tooth body part.
A power amplification circuit (100) is provided with an input terminal (T1), an output terminal (T2), amplifiers (110, 120), a balun (140), and semiconductor substrates (241, 242). The amplifier (110) amplifies a high-frequency signal received by the input terminal (T1). The amplifier (120) further amplifies the high-frequency signal amplified by the amplifier (110). The balun (140) is connected to the amplifier (120) and converts an unbalanced line into two balanced lines. The amplifier (110) and the amplifier (120) are formed on the semiconductor substrates. One balanced line is connected to a terminal (T21) of the output terminal (T2). The other balanced line is connected to a terminal (T22) of the output terminal (T2). The frequency of the high-frequency signal to be transmitted is 100 GHz or higher. The balun (140) is formed on the semiconductor substrate (241).
H03F 1/56 - Modifications des impédances d'entrée ou de sortie, non prévues ailleurs
H01P 5/10 - Dispositifs de couplage du type guide d'ondes destinés au couplage de lignes ou de dispositifs de différentes sortes destinés au couplage de lignes ou de dispositifs équilibrés avec des lignes ou des dispositifs déséquilibrés
H03F 3/19 - Amplificateurs à haute fréquence, p. ex. amplificateurs radiofréquence comportant uniquement des dispositifs à semi-conducteurs
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H03H 7/42 - Réseaux permettant de transformer des signaux équilibrés en signaux non équilibrés et réciproquement, p. ex. baluns
The present invention provides a multilayer band-pass filter that includes at least one LC resonator inside a laminate in which a plurality of dielectric layers are stacked. The LC resonator includes a capacitor conductor pattern, a line conductor pattern, and a GND conductor pattern disposed on the surface of one of the plurality of dielectric layers, and first and second interlayer connecting conductors extending in the stacking direction. The capacitor conductor pattern and the line conductor pattern are connected by the first interlayer connecting conductor. The line conductor pattern and the GND conductor pattern are connected by the second interlayer connecting conductor. Provided that the "via length" is defined to be the length of the first interlayer connecting conductor in relation to the stacking direction and the "line length" is defined to be the length of the gap between the first interlayer connecting conductor and the second interlayer connecting conductor, the via length is greater than the line length.
H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
H01G 4/40 - Combinaisons structurales de condensateurs fixes avec d'autres éléments électriques non couverts par la présente sous-classe, la structure étant principalement constituée par un condensateur, p. ex. combinaisons RC
Provided are a lens unit, a camera module, an imaging system, and a mobile object, the lens unit having a vibration mechanism and achieving a higher degree of freedom in the mounting position to a mounting part of a vehicle. A lens unit (20) comprises: a first housing (23) in which a first lens (31) is provided; a lens barrel (22) in which lenses (32)-(36) located further toward the image side than the first lens (31) are provided, and which is provided radially inward of the first housing (23) and further toward the image side than the first lens (31); and a vibration mechanism (60) which is provided between the first housing (23) and the lens barrel (22). The first lens (31) is inserted into an opening (150a) formed in a vehicle-side mounting part (150) to which the lens unit is mounted, from the back surface side of the mounting part (150), and protrudes from the front surface of the mounting part (150). A top plate part (23b) of the first housing (23) is disposed inside the back surface of the mounting part (150).
G02B 7/02 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles
B60R 1/20 - Dispositions de visualisation en temps réel pour les conducteurs ou les passagers utilisant des systèmes de capture d'images optiques, p. ex. des caméras ou des systèmes vidéo spécialement adaptés pour être utilisés dans ou sur des véhicules
B60S 1/62 - Autres accessoires sur véhicules pour le nettoyage
G03B 15/00 - Procédés particuliers pour prendre des photographiesAppareillage à cet effet
G03B 17/08 - Corps d'appareils ou boîtiers étanches à l'eau
G03B 30/00 - Modules photographiques comprenant des objectifs et des unités d'imagerie intégrés, spécialement adaptés pour être intégrés dans d'autres dispositifs, p. ex. des téléphones mobiles ou des véhicules
H04N 23/52 - Éléments optimisant le fonctionnement du capteur d'images, p. ex. pour la protection contre les interférences électromagnétiques [EMI] ou la commande de la température par des éléments de transfert de chaleur ou de refroidissement
Provided is a multilayer ceramic capacitor in which occurrence of "singing" is suppressed and which is reduced in size and increased in capacity. This multilayer ceramic capacitor comprises a plurality of dielectric layers 20 and a plurality of inner electrode layers 30 which are alternately layered in a layering direction T, and a first side face WS1 and a second side face WS2 which face each other in a width direction W, wherein the distance L1 between the first side face WS1 and an end E1L which is the closest to the first side face WS1 of the ends of the plurality of inner electrode layers 30 on the first side face WS1 side is smaller than the distance L2 between the second side face WS2 and an end E2L which is the closest to the second side face WS2 of the ends of the plurality of inner electrode layers 30 on the second side face WS2 side, and a distance L3 which is the maximum of the distances in the width direction W between the ends of the plurality of inner electrode layers 30 in the width direction W that are side by side on the first side face WS1 side is smaller than a distance L4 which is the maximum of the distances in the width direction W between the ends of the plurality of inner electrode layers 30 in the width direction W that are side by side on the second side face WS2.
An azimuth measurement device (1) comprises a first angular velocity sensor (11) that has a first detection axis (11D) extending along the horizontal direction and detects a first angular velocity with the first detection axis (11D) as the center of rotation, a rotation mechanism (13) that has a rotation axis (13R) extending along the vertical direction and rotates the first detection axis (11D) of the first angular velocity sensor (11) with a rotation axis (13R) as the center of rotation, and a second angular velocity sensor (12) that is used to correct the rotation angle (alpha) of the first detection axis (11D) in the rotation mechanism (13), the second angular velocity sensor (12) having a second detection axis (12D) extending along the vertical direction and detecting a second angular velocity having the second detection axis (12D) as the center of rotation.
G01C 17/38 - Test, étalonnage ou compensation des compas
G01C 19/00 - GyroscopesDispositifs sensibles à la rotation utilisant des masses vibrantesDispositifs sensibles à la rotation sans masse en mouvementMesure de la vitesse angulaire en utilisant les effets gyroscopiques
A filter includes a series arm resonator, parallel arm resonators, a multilayer substrate including main surfaces, a piezoelectric substrate, and a bump electrode on the piezoelectric substrate. Each of the parallel arm resonators include an IDT electrode on the piezoelectric substrate. The bump electrode is connected to the IDT electrode. The multilayer substrate includes a first planar electrode on a first of the main surfaces and bonded to the bump electrode, a second planar electrode on a second of the main surfaces and connected to a ground, and via conductors that connect the first and second planar electrodes. In a plan view of the first main surface, the bump electrode is between via conductors connected to the first planar electrode.
A method of performing a failure detection on an AC input voltage includes comparing the AC input voltage with first and second reference voltages, determining that the AC input voltage is normal, if an absolute value of the AC input voltage is greater than the first reference voltage, determining that the AC input voltage has failed, if a duration of the absolute value of the AC input voltage being less than the second reference voltage is greater than a threshold duration, and determining that the AC input voltage has failed, if the absolute value of the AC input voltage is not less than the second reference voltage and not greater than the first reference voltage, and a duration of an absolute value of a change rate of the AC input voltage being less than a voltage change rate threshold is greater than a predetermined time delay.
G01R 19/165 - Indication de ce qu'un courant ou une tension est, soit supérieur ou inférieur à une valeur prédéterminée, soit à l'intérieur ou à l'extérieur d'une plage de valeurs prédéterminée
FET designs that exhibit low leakage in the presence of the edge transistor phenomenon. Embodiments includes nFET designs in which the work function ΦMF of the gate structure overlying the edge transistors of the nFET is increased by forming extra P+ implant regions within at least a portion of the gate structure, thereby increasing the Vt of the edge transistors to a level that may exceed the Vt of the central conduction channel of the nFET. In some embodiments, the gate structure of the nFET is modified to increase or “flare” the effective channel length of the edge transistors relative to the length of the central conduction channel of the FET. Other methods of changing the work function ΦMF of the gate structure overlying the edge transistors are also disclosed. The methods may be adapted to fabricating pFETs by reversing or substituting material types.
H01L 29/10 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode ne transportant pas le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/36 - Corps semi-conducteurs caractérisés par la concentration ou la distribution des impuretés
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 29/49 - Electrodes du type métal-isolant-semi-conducteur
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
A multilayer ceramic capacitor includes a multilayer body including the dielectric ceramic layers and the internal electrode layers which are laminated, and external electrodes connected to the internal electrode layers. The multilayer body includes segregation including Si as a main component in a vicinity of an end of the internal electrode layer in a width direction. An average particle size of the dielectric particles in the vicinity of the end of the internal electrode layer in the width direction in the dielectric ceramic layer is smaller than an average particle size of a dielectric particles in a central portion of the internal electrode layer in the width direction in the dielectric ceramic layer.
An antenna module includes antenna groups, hybrid couplers, dividers, and an RFIC. The antenna group includes radiating elements. The antenna group includes radiating elements. Each hybrid coupler has input terminals and output terminals. The RFIC supplies a high frequency signal to each radiating element. Each divider splits the high frequency signal from the RFIC in two directions. The divider splits a first signal from the RFIC to the input terminal of each hybrid coupler. The divider splits a second signal from the RFIC to the input terminal of each hybrid coupler. The output terminals of the hybrid coupler are respectively connected to the radiating elements. The output terminals of the hybrid coupler are respectively connected to the radiating elements. In each hybrid coupler, a phase difference between the high frequency signals supplied to the input terminals is set to 90°.
H01Q 3/36 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier la phase par des moyens électriques avec des déphaseurs variables
H01Q 21/24 - Combinaisons d'unités d'antennes polarisées dans des directions différentes pour émettre ou recevoir des ondes polarisées circulairement ou elliptiquement ou des ondes polarisées linéairement dans n'importe quelle direction
59.
FILTER USING TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS
A bandpass filter is provided that includes a ladder filter circuit with at least one shunt transversely-excited film bulk acoustic resonators (XBAR) and at least one series XBAR. Each of the XBARs includes a diaphragm having an LN-equivalent thickness greater than or equal to 360 nm, and each of the XBARs includes a diaphragm having an LN-equivalent thickness less than or equal to 375 nm.
An electrolytic solution for a magnesium battery includes a solvent, an electrolyte salt, and an additive. The electrolyte salt includes a magnesium salt represented by Formula (1). The additive includes at least one of a first magnesium compound represented by Formula (2), a second magnesium compound represented by Formula (3), or a polycyclic aromatic hydrocarbon.
An electrolytic solution for a magnesium battery includes a solvent, an electrolyte salt, and an additive. The electrolyte salt includes a magnesium salt represented by Formula (1). The additive includes at least one of a first magnesium compound represented by Formula (2), a second magnesium compound represented by Formula (3), or a polycyclic aromatic hydrocarbon.
Mg[B(OC(R1)3)4]2 (1)
where:
each of 24 R1's is any one of hydrogen (H), fluorine (F), an alkyl group, or a fluorinated alkyl group; and
at least one of 24 R1's is either fluorine or the fluorinated alkyl group.
An electrolytic solution for a magnesium battery includes a solvent, an electrolyte salt, and an additive. The electrolyte salt includes a magnesium salt represented by Formula (1). The additive includes at least one of a first magnesium compound represented by Formula (2), a second magnesium compound represented by Formula (3), or a polycyclic aromatic hydrocarbon.
Mg[B(OC(R1)3)4]2 (1)
where:
each of 24 R1's is any one of hydrogen (H), fluorine (F), an alkyl group, or a fluorinated alkyl group; and
at least one of 24 R1's is either fluorine or the fluorinated alkyl group.
Mg[(N(Si(R2)3)2]2 (2)
where each of 12 R2's is either hydrogen or an alkyl group.
An electrolytic solution for a magnesium battery includes a solvent, an electrolyte salt, and an additive. The electrolyte salt includes a magnesium salt represented by Formula (1). The additive includes at least one of a first magnesium compound represented by Formula (2), a second magnesium compound represented by Formula (3), or a polycyclic aromatic hydrocarbon.
Mg[B(OC(R1)3)4]2 (1)
where:
each of 24 R1's is any one of hydrogen (H), fluorine (F), an alkyl group, or a fluorinated alkyl group; and
at least one of 24 R1's is either fluorine or the fluorinated alkyl group.
Mg[(N(Si(R2)3)2]2 (2)
where each of 12 R2's is either hydrogen or an alkyl group.
MG(R3)2 (3)
where each of two R3's is either hydrogen or boron hydride (BH4).
A substrate includes a core substrate that has a first surface, a second surface facing away from the first surface, and a cavity portion therein, an electronic component and a metal post that are provided in the single cavity portion, and an encapsulating material that fills the cavity portion and has a third surface close to the first surface and a fourth surface close to the second surface, in which the metal post is exposed through a third surface and a fourth surface of the encapsulating material.
A filter device is provided that includes a substrate; a piezoelectric layer coupled to the substrate either directly or via one or more intermediate layers; a first interdigital transducer (IDT) of a first bulk acoustic resonator device on the piezoelectric layer and having interleaved fingers over a first cavity the first bulk acoustic resonator device; a second IDT of a second bulk acoustic resonator device on the piezoelectric layer and having interleaved fingers over a second cavity of the second bulk acoustic resonator device; a first dielectric layer having a first thickness disposed between the interleaved fingers of the first IDT; and a second dielectric layer having a second thickness disposed between the interleaved fingers of the second IDT. The first thickness is greater than the second thickness.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 9/13 - Moyens d'excitation, p. ex. électrodes, bobines pour réseaux se composant de matériaux piézo-électriques ou électrostrictifs
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
H10N 30/87 - Électrodes ou interconnexions, p. ex. connexions électriques ou bornes
A capacitor that includes: a metal base material; a dielectric layer on the metal base material; a conductive layer on the dielectric layer; an oxide layer between the metal base material and the dielectric layer; and an oxygen barrier layer between the oxide layer and the dielectric layer, wherein the oxide layer includes: a first oxidized region containing a metal of the metal base material; and a second oxidized region containing an atom of the oxygen barrier layer and a metal of the metal base material, and a thickness of the first oxidized region is 3 nm or less and is 0% to 50% of a thickness of the second oxidized region.
An N-path filter includes first signal paths connected in parallel with each other between signal terminals and second signal paths. Each of the first signal paths includes first and second switches connected to the signal terminals, and a base filter connected between the first and second switches. Each of the second signal paths includes a third switch connected to a signal terminal. The base filter includes a series arm element including a reactance component. The first and second switches modulate an input signal with a phase that completes one cycle across the signal paths, and the third switch modulates the input signal with a phase that completes one cycle across the signal paths. A phase of a drive signal to drive the second switch is opposite to a phase of a drive signal to drive the third switch.
A three-terminal multilayer ceramic capacitor includes first to sixth extended electrode portions. The first and second extended electrode portions are connected to a first outer electrode at different portions of a first end surface. The third extended electrode portion is connected to the first outer electrode at a position spaced away from the first end surface on a second side surface. The fourth extended electrode portion is connected to a second outer electrode on a second end surface. The fifth extended electrode portion is connected to the second outer electrode at a position spaced away from the second end surface on the first side surface. The sixth extended electrode portion is connected to the second outer electrode at a position spaced away from the second end surface on the second side surface.
A tracker circuit includes a pre-regulator circuit configured to convert an input voltage into a regulated voltage using a power inductor, a switched-capacitor circuit configured to generate a plurality of discrete voltages, based on the regulated voltage, and a power modulation circuit configured to select at least one voltage from the plurality of discrete voltages and output the at least one voltage to a first output terminal. Further, the tracker circuit includes one or more bypass paths configured to bypass at least the switched-capacitor circuit and the power modulation circuit, and to provide a second supply voltage from the pre-regulator circuit to a second output terminal, the second supply voltage is output by the second output terminal.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
H03F 3/00 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
67.
TRACKER CIRCUIT, TRACKER MODULE, AND VOLTAGE SUPPLY METHOD
In an exemplary aspect, a tracker circuit is provided that includes a first switch circuit configured to generate a plurality of discrete voltages, based on an input voltage, a second switch circuit configured to select at least a first voltage from the plurality of discrete voltages as a supply voltage, a filter circuit that is connected to the second switch circuit and is configured to filter the supply voltage and generate a filtered supply voltage that is provided to an amplifier via a voltage supply path between the filter circuit and the amplifier, and a third switch circuit including a capacitor and a switch that are connected in series between a ground and the voltage supply path.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/00 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
An amplifier circuit is provided for amplifying a radio frequency signal within one frame of a radio frequency signal by using multiple discrete voltages supplied from the tracker circuit. The amplifier circuit includes a power amplifier and an RC series circuit including a resistor and a capacitor that are connected in series between the ground and a voltage supply path between the tracker circuit and the power amplifier.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/213 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
A solid electrolyte ceramic having a chemical composition represented by: AαBβDγOω wherein A represents one or more of Li, Ga, Al, Mg, Zn, and Sc, and A includes at least Li; B represents one or more of La, Ca, Sr, Ba, and lanthanoid elements, and B includes at least La; and D represents one or more of transition elements capable of being six-coordinate with oxygen and elements belonging to Groups 12 to 15; and one or more of Co, Ni, Mn, and Fe, the solid electrolyte ceramic having a garnet-type crystal structure where: 139≤Y<150 in a range of 330
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 10/0585 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure plats, c.-à-d. des électrodes positives plates, des électrodes négatives plates et des séparateurs plats
A solid electrolyte ceramic having a chemical composition represented by a specific general formula, and further including one or more transition metal elements selected from Co, Ni, Mn, and Fe, and having a garnet-type crystal structure in which a content X of Li and a content Y of D1 representing one or more elements selected from Ta, Nb, and Bi are each within specific ranges.
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
A power amplifying circuit includes an output transistor that amplifies a radio frequency signal and outputs an amplified signal, a bias circuit that supplies a bias current or voltage to the output transistor, and a bias control part connected to the bias circuit and includes a control circuit that increases the bias current or voltage when an ambient temperature is equal to or less than a predetermined value. In consecutive time periods of a first, a second, and a third time period, when output of the output transistor in the third time period is greater than output of the output transistor in the first and the second time period, the bias control part increases the bias current or voltage in the second time period as to become higher than the bias current or voltage of a case where the ambient temperature is higher than the predetermined threshold value.
A power module includes a first board comprising a first surface and a second surface opposite to each other and perpendicular to a bottom surface of the power module for mounting the power module to a circuit board, the bottom surface providing electrical connections to the circuit board, a first charge pump assembly mounted on the first surface, the first charge pump assembly comprising a first power conversion circuit configured to convert an input voltage to an output voltage, and a first vertical heatsink structure arranged adjacent to the first charge pump assembly, the first charge pump assembly being placed between the first vertical heatsink structure and the first board.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/367 - Refroidissement facilité par la forme du dispositif
Provided is a radio frequency module which may not only reduce the height of the overall module but also ensure a sufficient degree of planarity as well. In a radio frequency module, a first electronic component is disposed on a wiring board. A second electronic component is built in the wiring board. A core board has a through hole. The first electronic component is arranged on a first buildup layer to overlap with the through hole of the core board when viewed in plan in a thickness direction defined for the core board. The second electronic component is disposed inside the through hole of the core board. Thickness of the second electronic component is greater than thickness of the core board when measured in the thickness direction defined for the core board. The second electronic component is electrically connected to the first electronic component via the first buildup layer.
A winding core part includes a two-layer winding region, consisting of a first layer in which a first wire is wound around the winding core part and a second layer in which a second wire is wound around the first layer, and a non-contact winding region in which the first and second wires are wound without contacting each other. The non-contact winding region located is between the first flange part and the two-layer winding region, and the two-layer winding region includes switching parts that are for switching the axial direction positional relationship between turns of the first and second wires in the two-layer winding region and are parts in which the first and second wires cross each other. In the non-contact winding region, the first wire has a longer wire length than the second wire. The first wire has a longer coil length than the second wire through both regions.
A pressure sensor device that includes: a base substrate; a detecting element mounted on an upper surface of the base substrate and that includes a detecting portion that detects pressure; a resin package on the upper surface of the base substrate and that has an exposure hole that exposes the detecting portion, the detecting element being embedded in the resin package; and an on-off valve disposed so as to close the exposure hole, the on-off valve including: a membrane having an outer surface facing an outside of the pressure sensor device, and a communication path that is partly formed by an inner surface of the membrane and allows the detecting portion to communicate with the outside of the pressure sensor device, the inner surface being opposite the outer surface, and wherein the inner surface closes the communication path when the membrane is flexed by pressure acting upon the outer surface.
G01L 19/00 - Détails ou accessoires des appareils pour la mesure de la pression permanente ou quasi permanente d'un milieu fluent dans la mesure où ces détails ou accessoires ne sont pas particuliers à des types particuliers de manomètres
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
In a radio frequency module, a magnetic core included in an inductor is disposed inside a through hole of a core board. An axis of winding of a coil is perpendicular to a thickness direction defined for the core board. A magnetic core has a first side surface and a second side surface intersecting with the axis of winding of the coil. A first shield portion includes a first feedthrough ground via conductor provided for the core board. A second shield portion includes a second feedthrough ground via conductor provided for the core board. The first feedthrough ground via conductor and the second feedthrough ground via conductor are arranged to interpose the magnetic core between the first feedthrough ground via conductor and the second feedthrough ground via conductor in a direction aligned with the axis of winding of the coil.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 23/552 - Protection contre les radiations, p. ex. la lumière
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
In the present invention, in order to provide a multilayer ceramic capacitor with which it is possible to reduce manufacturing costs while increasing the effective area of an internal electrode that contributes to capacitance expression: first internal electrode layers (16a) and second internal electrode layers (16b) of a multilayer ceramic capacitor are exposed at a first side surface (12c) and a second side surface (12d) of a laminate (12); the first internal electrode layers (16a) have a first region (23a) along the edge on the first side surface (12c) side of the laminate (12), and a second region (25a) along the edge on the second side surface (12d) side of the laminate (12); the second internal electrode layers (16b) have a third region (23b) along the edge on the first side surface (12c) side of the laminate (12), and a fourth region (25b) along the edge on the second side surface (12d) side of the laminate (12); and a Ni-Mg-O phase is formed from the first region (23a) to the fourth region (25b).
Disclosed herein is an inductor having good electrical characteristics with low direct-current resistance without being limited by a cross-sectional size of a coil conductor. An inductor according to the present disclosure comprises: a coil conductor having a winding part obtained by winding a rectangular conductive wire having a substantially rectangular cross section orthogonal to the longitudinal direction of the conductive wire, and a pair of lead-out parts led out from the winding part; an element body containing magnetic powder and a resin and containing the coil conductor therein; and an external electrode formed on the surface of the element body and connected to the lead-out parts. The element body has two main surfaces that intersect the winding axis of the winding part of the coil conductor and face each other. The lead-out part has a lead-out region extending from the winding part toward one main surface of the element body, and an electrode connection region connected to the external electrode. The electrode connection region has a side surface exposed along one main surface of the element body, said side surface being along one short side of the rectangle formed by the cross section orthogonal to the longitudinal direction of the conductive wire. The conductor of the conductive wire is connected to the external electrode.
A charger (20) is provided with a control unit (21), a voltage measurement unit (22), and an OCV data extraction unit (25). The control unit (21) controls charging of a secondary battery (90) when the secondary battery (90) is attached to the charger (20). The voltage measurement unit measures the terminal voltage of the secondary battery (90) during charging. The OCV data extraction unit (25) extracts OCV data that can be used for analyzing the degree of deterioration of the secondary battery (90). The charger (20) has a first mode and a second mode as one cycle of charging of the secondary battery (90). In the first mode, the control unit (21) charges the secondary battery (90) with a predetermined current value. The voltage measurement unit (22) measures a terminal voltage value (α) of the secondary battery (90). The control unit (21) and the voltage measurement unit (22) transition to the second mode after the end of the first mode. In the second mode, the control unit 21 stops charging for a predetermined pause time. The voltage measurement unit (22) measures an OCV value (β) of the secondary battery (90) immediately after the lapse of the pause time. The control unit (21) and the voltage measurement unit (22) return to the first mode after the end of the second mode. The control unit (21) compares a terminal voltage value (αA) acquired by the first mode with a terminal voltage value (αB) acquired by the first mode in the previous cycle. The control unit (21) controls a first time so that the difference value between the terminal voltage value (αA) and the terminal voltage value (αB) becomes a constant value. The OCV data extraction unit (25) acquires OCV data using the OCV value (β) measured in each of a plurality of cycles.
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
G01R 31/378 - Dispositions pour le test, la mesure ou la surveillance de l’état électrique d’accumulateurs ou de batteries, p. ex. de la capacité ou de l’état de charge spécialement adaptées à un type de batterie ou d’accumulateur
G01R 31/382 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge
G01R 31/385 - Dispositions pour mesurer des variables des batteries ou des accumulateurs
G01R 31/392 - Détermination du vieillissement ou de la dégradation de la batterie, p. ex. état de santé
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
Circuits and methods for increasing the long-term reliability and performance of phase change material (PCM) switches. To overcome the effects of electromigration damage of the resistive heater(s) of a PCM switch and of the PCM itself, and thus improve long-term performance and reliability, embodiments apply an AC control pulse of equal power to a conventional DC control pulse. An embodiment encompasses a PCM switch, including a PCM region including first and second signal ports configured to be coupled to a signal source; a resistive heater adjacent the PCM region and including first and second heater control signal ports; and a source of AC control pulses coupled to the first and second heater control signal ports, the AC control pulses having a first power profile to transform the PCM region into a low resistance state and a second power profile to transform the PCM region into a high resistance state.
H03K 17/80 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs magnétiques ou diélectriques non linéaires
An electronic component is mounted on an external surface that defines a plane. The electronic component comprises at least one electronic chip housed within package. The electronic component includes one or more aligning structures, which aligning structure(s) are formed on an outer surface of the electronic component. The aligning structure(s) define at least two first aligning surface areas in a first direction and at least two second aligning surface areas in a second direction. The first aligning surface areas and the second aligning surface areas are formed and spaced from each other such that at least a rotation of the electronic component about an axis perpendicular to the plane defined by the surface is prevented, when the first aligning surface areas and the second aligning surface areas are provided against counter surfaces fixed on the surface and conforming at least partly to the form of the respective aligning surface areas.
An acoustic wave device includes a support including a space in a surface thereof, a piezoelectric layer on the surface of the support, and a functional electrode on at least one surface of the piezoelectric layer to at least partially overlap the space as viewed in a first direction. The functional electrode is an interdigital transducer electrode including first and second busbars, and first and second electrode fingers. At least one electrode finger of the first and second electrode fingers includes a portion with a width that linearly changes in a second direction. In the at least one electrode finger, when a ratio of a width at a proximal end to a minimum width between the proximal end and a distal end is 1+σ:1−σ, σ is greater than or equal to about 0.01 and less than or equal to about 0.054.
A conductive two-dimensional particle of a layered material, comprising: one or plural layers, wherein the one or plural layers include a layer body represented by: TimXn, wherein X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n and 5 or less, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom, and an atomic ratio of Al to Ti is 0 atom % to 0.10 atom %.
Novel integrated circuit environmental and temperature sensors in combination with measurement circuitry fully integrated as part of an ASIC die, which may be co-packaged with a pressure sensor integrated circuit to create a compact yet sensitive environment monitoring product. Embodiments may include one or more integrated local heating elements and control circuitry that are power supply independent, make efficient use of battery power, include an accurate in-built temperature detection capability, and provide digital close-loop control of the heating elements.
G01N 33/00 - Recherche ou analyse des matériaux par des méthodes spécifiques non couvertes par les groupes
G01K 7/20 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance linéaire, p. ex. un thermomètre à résistance de platine dans un circuit spécialement adapté, p. ex. un circuit en pont
G01L 19/00 - Détails ou accessoires des appareils pour la mesure de la pression permanente ou quasi permanente d'un milieu fluent dans la mesure où ces détails ou accessoires ne sont pas particuliers à des types particuliers de manomètres
G01N 27/22 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la capacité
H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
A wick used for heat transport, the wick including a material containing a nanofiber and/or a two-dimensional substance represented by: MQaOb, wherein M is at least one element selected from Groups 3, 4, 5, 6, or 7, Q is at least one element selected from Groups 12, 13, 14, 15, or 16, and excluding O, a is more than 0 but not more than 2, and b is more than 0 but not more than 2.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A secondary battery having higher reliability is provided. The secondary battery includes a battery device and an outer package member. The battery device includes a first electrode and a second electrode that are stacked with a separator interposed between the first electrode and the second electrode, and are wound around a winding axis extending in a first direction. The outer package member contains the battery device. The second electrode includes a second electrode current collector, an inner side second electrode active material layer, and an outer side second electrode active material layer. The second electrode current collector has an inward second electrode surface and an outward second electrode surface. The inward second electrode surface faces a side of the winding axis. The outward second electrode surface is on an opposite side to the inward second electrode surface. The inner side second electrode active material layer is provided on the inward second electrode surface. The outer side second electrode active material layer is provided on the outward second electrode surface. An area density of the outer side second electrode active material layer is higher than an area density of the inner side second electrode active material layer over a region from an inner winding side end part of the battery device to an outer winding side end part of the battery device. The inner side second electrode active material layer is opposed to the outer side second electrode active material layer with the second electrode current collector interposed between the inner side second electrode active material layer and the outer side second electrode active material layer.
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c.-à-d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 50/109 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique en forme de bouton ou plate
87.
APPARATUS AND METHODS OF FABRICATING A SWITCHED CAPACITOR CIRCUIT
Disclosed embodiments may include an apparatus including a first device layer including first switches, a second device layer including second switches, and a third device layer disposed between the first device layer and the second device layer. The third device layer includes first capacitors. The first switches and the second switches are interconnected with the first capacitors to form a switched capacitor circuit. The switched capacitor circuit is configured to transition between at least two states in response to switching of the first switches and the second switches.
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
H03H 19/00 - Réseaux utilisant des éléments différents en fonction du temps, p. ex. filtres à N voies
88.
POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHODS FOR INTEGRATED CIRCUIT PACKAGING
Disclosed embodiments may include a power converter package including devices stacked vertically. The devices include a first device and a second device. The first device includes a first switched capacitor circuit and provides first bottom bonding contacts on one surface and first top bonding contacts on another surface opposite the one surface, and one or more through-vias connecting corresponding one or more of the first bottom bonding contacts and corresponding one or more of the first top bonding contacts. The second device includes a second switched capacitor circuit and provides second bottom bonding contacts on one surface to be electrically connected to the first top bonding contacts of the first device. Input terminals of the first and switched capacitor circuits are electrically connected to each other, and output terminals of the first and switched capacitor circuits are electrically connected to each other.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
H02M 3/00 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
An acoustic wave device includes resonators including a support with a hollow portion, a piezoelectric layer, and a functional electrode. The piezoelectric layer is on one main surface of the support and includes first and second main surfaces. The functional electrode is on at least one main surface of the piezoelectric layer and partially matches the hollow portion as seen in a thickness direction of the piezoelectric layer. The resonators include first and second resonators. The functional electrode of the first resonator includes at least one pair of a first and second electrode on the same main surface of the piezoelectric layer. The functional electrode of the second resonator includes upper and lower surface electrodes on the first and second main surfaces of the piezoelectric layer.
An electrolyte including: a porous insulator having a pore; and a medium having two nitrile groups and a metal salt that are disposed in the pore, wherein the metal salt is at least one of an alkali metal salt and an alkaline earth metal salt, and a molar ratio of the medium to the metal salt (medium/metal salt) is 0.1 to 4.0.
H01M 10/056 - Accumulateurs à électrolyte non aqueux caractérisés par les matériaux utilisés comme électrolytes, p. ex. électrolytes mixtes inorganiques/organiques
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
An electrolyte including: a porous insulator having a pore; and a medium and a metal salt that are disposed in the pore, wherein the metal salt is at least one of an alkali metal salt and an alkaline earth metal salt, and a molar ratio of the medium to the metal salt (medium/metal salt) is 0.1 to 2.0.
A coil component manufacturing apparatus for winding a twisted portion of wires at a desired position of a core. A coil component manufacturing apparatus including a nozzle through which a plurality of wires can be inserted, a wire twisting mechanism that holds a core, rotates the core relative to the nozzle in a direction of twisting the wires, and forms a twisted portion in which the wires are twisted between the nozzle and the core, a wire winding mechanism that holds the core, rotates the core relative to the nozzle in a direction of winding the twisted portion is wound around the core, and winds the twisted portion around the core, and a guide member positioned closer to the core than the nozzle. The guide member guides the twisted portion to a predetermined position of the core when the twisted portion is wound around the core.
A radio frequency module includes a wiring board, a first electronic component and a second electronic component, and a third electronic component connected to a matching circuit. The wiring board includes a core board having not only a first principal surface and a second principal surface but also a through hole, a first buildup layer stacked on the first principal surface, and a second buildup layer stacked on the second principal surface. At least one of the first electronic component or the second electronic component is disposed partially inside the through hole. The third electronic component is disposed on the first buildup layer. The second electronic component is stacked on one side, where the third electronic component is located, of the first electronic component in a thickness direction defined for the core board. The second electronic component is a constituent component of the matching circuit.
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
The present invention comprises an annular base part (110), a plurality of beam parts (120), drive electrode parts (12b), and reference electrode parts (12c). Each of the plurality of beam parts (120): includes a fixed end portion (121) connected to the base part (110), and a tip portion (122) positioned closer to the center of the base part (110) on the side opposite to the fixed end portion (121); and extends from the fixed end portion (121) toward the tip portion (122). Each of the drive electrode parts (12b) is formed in the corresponding beam part (120), and is provided to apply a drive voltage to the beam part (120). Each of the reference electrode parts (12c) is formed to be separated from the corresponding drive electrode part (12b) in the corresponding beam part (120), and is provided to acquire the capacitance value of the beam part (120).
This ceramic substrate (1) is provided with: an element body (10) including a ceramic layer; at least one internal conductor (40) provided inside the element body; and a terminal electrode (20) and an insulating layer (30) provided on the outer surface of the element body. The internal conductor and the terminal electrode are electrically connected. The terminal electrode has a first electrode (21) in contact with the outer surface of the element body, and a second electrode (22) covering the surface of the first electrode. At least a part of an outer edge portion (21e) of the first electrode and a part of the outer surface of the element body are covered with the insulating layer. In the thickness direction of the element body from the outer surface side of the element body, there are overlapped portions of the first electrode (21), the insulating layer (30), and the second electrode (22) in this order. The content of the non-conductive component in the first electrode (21) is 3-40 wt%, the content of the non-conductive component in the second electrode (22) is 0-10 wt%, and the content of the non-conductive component in the first electrode (21) is higher than or equal to the content of the non-conductive component in the second electrode (22).
An antenna module (100) comprises: a substrate (131); a ground electrode (GND) that is disposed so as to face a first main surface and a second main surface of the substrate (131) which face each other; a first subarray (140) that faces the ground electrode (GND) and that is disposed further toward the first main surface than the ground electrode (GND); a power supply circuit (110) that is disposed further toward the second main surface than the ground electrode (GND); a power supply line (151) that connects the power supply circuit (110) and the first subarray (140); an external connection terminal (210); and a signal line (161) that connects the power supply circuit (110) and the external connection terminal (210), wherein the first subarray (140) is composed of a plurality of patch antennas (14), the external connection terminal (210) is disposed at a position not overlapping the first subarray (140) and the power supply circuit (110) when viewed in plan view from a first direction normal to the substrate (131), at least part of the signal line (161) is disposed between at least one of the plurality of patch antennas (14) and the ground electrode (GND) when viewed in plan view from a second direction orthogonal to the first direction, and the signal line (161) is not disposed at a position overlapping the first subarray (140) when viewed in plan view from the first direction.
This balun comprises a dielectric substrate (Sb1) having a first surface (Sf1) and a second surface (Sf2) opposing one other, a grounding electrode (Mk1) formed on the first surface, an unbalanced terminal (TU1) formed on the second surface, a pair of balanced terminals including a first balanced terminal (TB1) formed on the second surface, a main line (ML1) formed on the second surface and having one end (Es1) connected to the unbalanced terminal and another end (Ee1) open, a first sub-line (SL1) formed on the second surface and having one end (Ee2) connected to the first balanced terminal, and a second sub-line (SL2) formed on the second surface and having one end (Ee2) connected to the first balanced terminal, wherein: the first sub-line (SL1) has another end (Es2) connected to the grounding electrode (Mk1) via a first via (V1), and is disposed between the main line (ML1) and the second sub-line (SL2); and the first sub-line and the second sub-line each overlap the grounding electrode when the second surface is viewed in plan.
H01P 5/10 - Dispositifs de couplage du type guide d'ondes destinés au couplage de lignes ou de dispositifs de différentes sortes destinés au couplage de lignes ou de dispositifs équilibrés avec des lignes ou des dispositifs déséquilibrés
A multilayer ceramic capacitor includes a multilayer body, first internal electrode layers exposed at a first end surface of the multilayer body, and second internal electrode layers exposed at a second end surface of the multilayer body. The first internal electrode layers are exposed at a first lateral surface and a second lateral surface of the multilayer body. The second internal electrode layers are exposed at the first lateral surface and the second lateral surface of the multilayer body.
An electrical transformer includes a transformer core; a winding arranged around the transformer core, the winding including a primary coil and a secondary coil encased in a potting material; and a housing surrounding the transformer core and the winding. The housing includes a plurality of thermal conductors in thermal contact with the winding and/or the transformer core, and the housing including one or more open sides such that the winding is exposed.
A secondary battery is provided and includes a battery element including a positive electrode 2 and a negative electrode that are stacked with a separator 1 interposed therebetween; and an exterior body housing the battery element, and the separator 1 has two or more first recesses 10a and one or more second recesses 10b disposed between two first recesses adjacent to each other among the two or more first recesses 10a in one periphery facing region (including outer regions x and y) facing a periphery of the positive electrode.
H01M 10/0585 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure plats, c.-à-d. des électrodes positives plates, des électrodes négatives plates et des séparateurs plats
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 50/46 - Séparateurs, membranes ou diaphragmes caractérisés par leur combinaison avec des électrodes
H01M 50/463 - Séparateurs, membranes ou diaphragmes caractérisés par leur forme
