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1.
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SANGEUHHLK
Numéro de série |
98912078 |
Statut |
En instance |
Date de dépôt |
2024-12-19 |
Propriétaire |
Cui, Guoying (Chine)
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Classes de Nice ? |
25 - Vêtements; chaussures; chapellerie
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Produits et services
Boots; Footwear for men; Loafers; Pumps as footwear; Sandals; Sandals and beach shoes; Slip-on shoes; Slipovers; Sneakers; Sports shoes
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2.
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POLYSULFONAMIDE POLYMER, NEGATIVE PHOTOSENSITIVE COMPOSITION CONTAINING POLYSULFONAMIDE POLYMER AND APPLICATION THEREOF
Numéro d'application |
CN2020091094 |
Numéro de publication |
2021/232248 |
Statut |
Délivré - en vigueur |
Date de dépôt |
2020-05-19 |
Date de publication |
2021-11-25 |
Propriétaire |
CUI, Guoying (Chine)
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Inventeur(s) |
Cui, Qingzhou
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Abrégé
A polysulfonamide polymer, a negative photosensitive composition containing a polysulfonamide polymer and an application thereof. The negative photosensitive composition containing a polysulfonamide polymer consists of the following raw materials according to a certain weight ratio: the polysulfonamide polymer, a photoacid generator, a crosslinking agent, a solvent, and other components. The composition can be used to prepare a polysulfonamide cured film under a relatively low curing temperature condition (≤250°C), and the cured film can be used as a redistribution layer, an interlayer insulation buffer film, a coating or a surface protection film material.
Classes IPC ?
- C08G 75/30 - PolysulfonamidesPolysulfonimides
- G03F 7/004 - Matériaux photosensibles
- G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
- H01L 23/498 - Connexions électriques sur des substrats isolants
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3.
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POLYSULPHONAMIDE POLYMER, POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION CONTAINING POLYSULPHONAMIDE POLYMER, AND APPLICATION THEREOF
Numéro d'application |
CN2020091095 |
Numéro de publication |
2021/232249 |
Statut |
Délivré - en vigueur |
Date de dépôt |
2020-05-19 |
Date de publication |
2021-11-25 |
Propriétaire |
CUI, Guoying (Chine)
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Inventeur(s) |
Cui, Qingzhou
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Abrégé
A polysulphonamide polymer, a positive-type photosensitive composition containing a polysulphonamide polymer, and an application thereof. The positive-type photosensitive composition containing a polysulphonamide polymer consists of the following components in certain percentage by weight: a polysulphonamide polymer, a photo acid generator, a crosslinking agent, an anti-corrosion agent, a tackifier, and a solvent. A polysulphonamide polymer cured film is prepared from the composition under a low curing temperature condition (≤ 250°C). The cured film can be used as a material of a redistribution layer, an interlayer insulating buffer film, a covering coating, or a surface protection film.
Classes IPC ?
- C08G 75/30 - PolysulfonamidesPolysulfonimides
- G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
- G03F 7/09 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires
- G03F 7/04 - Chromates
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