09 - Appareils et instruments scientifiques et électriques
Produits et services
Computer hardware, namely, immersion-cooled rack servers for data centers; computer hardware, namely, modular computer server systems comprised of server rack, immersion-cooled computer server, and structural parts therefor; computer hardware, namely, cooled computer server system comprised of an immersion-cooled computer server within a sealed server chassis sold together as a unit
09 - Appareils et instruments scientifiques et électriques
Produits et services
Computer hardware, namely, immersion-cooled rack servers for data centers; computer hardware, namely, modular computer server systems comprised of server rack, immersion-cooled computer server, and structural parts therefor; computer hardware, namely, cooled computer server system comprised of an immersion-cooled computer server within a sealed server chassis sold together as a unit
09 - Appareils et instruments scientifiques et électriques
Produits et services
Computer hardware, namely, immersion-cooled rack servers for data centers; computer hardware, namely, modular computer server systems comprised of server rack, immersion-cooled computer server, and structural parts therefor; computer hardware, namely, cooled computer server system comprised of an immersion-cooled computer server within a sealed server chassis sold together as a unit
7.
LIQUID SUBMERSION COOLED ELECTRONIC DEVICE WITH CLAMSHELL ENCLOSURE
Liquid submersion cooled electronic devices and systems are described that use one or more cooling liquids, for example one or more dielectric cooling liquids, to submersion cool individual electronic devices or an array of electronic devices. A clamshell or sandwich construction of the device housing is used to define a wet zone containing heat producing electronic components of the electronic device to be cooled by the dielectric cooling liquid, and a dry zone where input/output and power connectors are provided.
Liquid submersion cooled electronic devices and systems are described that use one or more cooling liquids, for example one or more dielectric cooling liquids, to submersion cool individual electronic devices or an array of electronic devices. A clamshell or sandwich construction of the device housing is used to define a wet zone containing heat producing electronic components of the electronic device to be cooled by the dielectric cooling liquid, and a dry zone where input/output and power connectors are provided.
An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.
A server system formed by a first group of liquid submersion cooled servers, which are part of one or more server module assemblies mounted on the rack. A first power shelf is mounted on the rack and is electrically connected to the first group of liquid submersion cooled servers to provide electrical power to the first group. In addition, a second group of liquid submersion cooled servers, which are part of one or more server module assemblies is also mounted on the rack below the first group. A second power shelf is mounted on the rack below the first group and below the first power shelf, and the second power shelf is electrically connected to the second group of liquid submersion cooled servers to provide electrical power to the second group.
A server system formed by a first group of liquid submersion cooled servers, which are part of one or more server module assemblies mounted on the rack. A first power shelf is mounted on the rack and is electrically connected to the first group of liquid submersion cooled servers to provide electrical power to the first group. In addition, a second group of liquid submersion cooled servers, which are part of one or more server module assemblies is also mounted on the rack below the first group. A second power shelf is mounted on the rack below the first group and below the first power shelf, and the second power shelf is electrically connected to the second group of liquid submersion cooled servers to provide electrical power to the second group.
Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 1/02 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide
Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 1/02 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide
An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.
Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.
Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.
A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.
An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.
An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.
A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.
A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.
A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an army of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 1/02 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28F 9/007 - Supports auxiliaires pour les éléments
28.
Liquid submersion cooled data storage or memory system
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 1/02 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28F 9/007 - Supports auxiliaires pour les éléments
29.
Rack mounted liquid submersion cooled electronic system
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 1/02 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28F 9/007 - Supports auxiliaires pour les éléments
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 1/02 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28F 9/007 - Supports auxiliaires pour les éléments
A fluid composition or nanofluid is described that includes a dielectric base fluid, a chemical dispersant, and nanoparticles dispersed in the dielectric fluid. The chemical dispersant is used to facilitate the nanoparticle dispersing process and also to increase the stability of the nanofluid thus produced. The nanofluid is compatible with electronics and has enhanced thermal conductivity for use in cooling electronics. Techniques are described that can be used to efficiently disperse different forms of nanoparticles into a base fluid and produce a stable nanofluid which is compatible with electronic circuitry and components.
C09K 5/00 - Substances pour le transfert de chaleur, pour l'échange de chaleur ou pour le stockage de la chaleur, p. ex. réfrigérantsSubstances pour la production de chaleur ou de froid par des réactions chimiques autres que la combustion
A fluid composition or nanofluid is described that includes a dielectric base fluid, a chemical dispersant, and nanoparticles dispersed in the dielectric fluid. The chemical dispersant is used to facilitate the nanoparticle dispersing process and also to increase the stability of the nanofluid thus produced. The nanofluid is compatible with electronics and has enhanced thermal conductivity for use in cooling electronics. Techniques are described that can be used to efficiently disperse different forms of nanoparticles into a base fluid and produce a stable nanofluid which is compatible with electronic circuitry and components.
B82Y 30/00 - Nanotechnologie pour matériaux ou science des surfaces, p. ex. nanocomposites
F28D 15/00 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations
F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes
33.
Case and rack system for liquid submersion cooling of electronic devices connected in an array
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
A liquid submersion-cooled computer that is configured to reduce physical structures passing through walls of the computer liquid-tight computer case, which eliminates the amount of sealing needed around those physical structures and reduces the number of possible fluid leakage paths from the interior of the computer that contains a cooling liquid submerging at least some of the computer components. The computer includes a mechanism to pass input/output signals into and from the computer without any physical structure extending through any of the plurality of walls. The computer also has a mechanism for wirelessly transferring power into the interior space of the computer case, and a switch that controls power in the computer without having any physical structure extending through any of the plurality of walls.
A liquid submersion cooled computer that includes a seamless, extruded main body used to form a liquid-tight case holding a cooling liquid that submerges components of the computer. By forming the main body as a seamless extrusion, the number of possible leakage paths from the resulting liquid-tight case is reduced. No seams are provided on the main body, and there are no openings through the walls of the main body, so liquid cannot leakage through the main body. Any leakage paths are limited to joints between the main body and end walls which are sealingly attached to the main body to form the liquid-tight case.
Dielectric liquid is used to cool heat generating electronic components disposed on a circuit board within a case. The liquid is poured or otherwise directed over the electronic components, with gravity assisting the liquid in flowing downward over the components, with the liquid thereafter being collected in a sump for eventual return back to the electronic components. One exemplary application of the described concepts is in cooling electronic components in computers, for example personal computers or server computers.
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
F25D 23/12 - Aménagements des compartiments annexes aux compartiments de refroidissementRéfrigérateurs combinés avec un autre appareil, p. ex. une cuisinière
F28F 7/00 - Éléments non couverts par les groupes , ou
F28D 15/00 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
38.
Case for a liquid submersion cooled electronic device
A case for a liquid submersion cooled computer includes a plurality of walls defining a liquid-tight interior space. At least a portion of one of the walls is made of a material that permits viewing of objects, for example, a motherboard, within the interior space. A removable lid closes the top of the interior space. The lid forms a liquid-tight seal with the plurality of walls, and the lid includes a sealed electrical connector fixed thereto that is configured to attach to the motherboard disposed in the interior space and to provide electrical connection between the motherboard and an exterior of the case. The case can include a drain valve for draining liquid from the case. Further, the lid can have an opening for introducing liquid into the interior space, and a handle to facilitate lifting of the lid along with the motherboard connected to the lid.
A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, thereby improving the heat transfer from heat-generating components on the circuit board. For a computer, a plurality of heat-generating components are mounted on the motherboard, including a plurality of processors, a plurality of memory cards, a plurality of graphics cards, and a plurality of power supplies. A pump for the cooling liquid can also be mounted on the motherboard.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 15/00 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations
A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 7/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations tubulaires fixes pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation
