A self-limiting heater and method for building the self-limiting heater are disclosed. The self-limiting heater consists of a resistor and a PTC resistor coupled together in series with a power supply. Both resistive devices have good thermal coupling. The resistor has a low temperature coefficient while the resistance of the PTC resistor increases with an increase in temperature. The ohmic resistance ratio between the resistor and the PTC may be used to adjust the heater characteristics and limit the characteristic sharpness.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a substrate, and a fusible element extending between a first terminal and a second terminal, wherein the fusible element, the first terminal, and the second terminal are coupled to the substrate. The protection device may further include a cover formed over the fusible element, wherein the fusible element is positioned between the cover and the substrate.
A device assembly for surface mount devices includes a matrix of SMD skeletons and a polymeric positive temperature coefficient (PPTC) material disposed over the matrix. The matrix consists of multiple rows, with each SMD skeleton having a pair of terminals and multiple whiskers perpendicular to and between the terminals. The PPTC material connects the terminals to the whiskers.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
4.
LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE
A lead-free power semiconductor package (PSP) includes a substrate, multiple copper leads, a die, and an encapsulant. The substrate has alternating layers of copper and silicon nitride. The copper leads, which are not part of a leadframe, are connected to the substrate using active metal brazing. The die, which contains circuitry to allow the PSP to operate, is connected to the substrate using silver sintered paste. The encapsulant encases the substrate and the die with a portion of the multiple leads being outside the encapsulant.
A positive temperature coefficient (PTC) heater including a PTC layer formed of a material exhibiting a non-linear change in resistance in response to changes in temperature, an electrode layer including first and second electrodes disposed atop the PTC layer, each of the first and second electrodes including a spine and a plurality of tines extending inwardly therefrom, with the spine of the first electrode oriented parallel to the spine of the second electrode and with the tines of the first electrode disposed in an interdigitated relationship with the tines of the second electrode, an adhesive layer including first and second adhesive strips disposed atop the spines of the first and second electrodes, respectively, and a busbar layer including first and second busbars disposed atop the first and second adhesive strips, respectively, and adhered to the spines of the first and second electrodes by the first and second adhesive strips, respectively.
H05B 3/14 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
A pre-charge circuit. The precharge circuit may include a switching device for controlling a voltage to be supplied to a battery; and a heterogeneous thermistor circuit, coupled to the switching device. The heterogeneous thermistor circuit may include a negative temperature coefficient (NTC) component; and a polymer positive temperature coefficient (PPTC) component, arranged in electrical series with the NTC component and the switching device.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
Disclosed is a control circuit, for use in a solid state battery disconnect and protection system, wherein control circuit includes a high-voltage switch coupled between an electric battery and a DC link capacitor of an electric vehicle, wherein the electric vehicle is powered by the electric battery, and a control block. The control block may by operable to monitor a rate of change and a value of a current on a connection to the high-voltage switch, determine whether the rate of change of the current exceeds a first predetermined threshold and determine whether the value of the current exceeds a second predetermined threshold, and determine an overcurrent fault exists in the case that the first or second predetermined threshold is exceeded.
H02H 7/18 - Circuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour pilesCircuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour accumulateurs
H02H 1/00 - Détails de circuits de protection de sécurité
8.
ELECTRICALLY ISOLATED DISCRETE PACKAGE WITH HIGH PERFORMANCE CERAMIC SUBSTRATE
A substrate package arrangement may include a substrate that contains a ceramic body, a top metal layer, disposed on a top side of the ceramic body, and a bottom metal layer, disposed on a bottom side of the ceramic body, opposite the top surface. The substrate package arrangement may further include a lead structure, electrically connected to the top metal layer, and being electrically isolated from the bottom metal layer, wherein the substrate and lead structure are arranged in a discrete package, and wherein the ceramic body is formed of a high thermal conductivity material.
Disclosed is an adaptive pre-charge control circuit, for use in a solid state battery disconnect and protection system, wherein the adaptive pre-charge control circuit includes a high-voltage switch coupled between an electric battery and a DC link capacitor of an electric vehicle, and wherein the electric vehicle is powered by the electric battery. The control circuit may be operable to issue a pulse width modulated (PWM) signal to generate a current profile wherein every other pulse exceeds a predefined limit, monitor, during pre-charging, the current profile, and to determine an overcurrent fault exists in the case that two consecutive pulses exceed the predefined limit.
H02H 7/18 - Circuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour pilesCircuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour accumulateurs
H02H 1/00 - Détails de circuits de protection de sécurité
10.
METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR PACKAGE
A method of manufacturing a power semiconductor device in accordance with an embodiment of the present disclosure may include providing a substrate disposed atop a heatsink, electrically connecting a semiconductor die to a top surface of the substrate, disposing a thin metallic layer atop the substrate, disposing a terminal atop the thin metallic layer, and performing a welding operation wherein a laser beam is directed at a top surface of the terminal to produce a plurality of weld connections connecting the terminal to the substrate, wherein the weld connections are separated by gaps, and wherein heat generated during the welding operation melts the thin metallic layer and molten material of the thin metallic flows into the gaps.
Methods for making reverse-blocking insulated gate bipolar transistors and associated structures. A first and a second silicon wafer substrates are provided and bonded. One or more separation diffusion regions are formed in the first silicon wafer substrate. One or more front side metal-oxide semiconductor (MOS) structures are formed on a top surface of the first silicon wafer substrate. The second silicon wafer substrate layer is removed. A contact diffusion layer is formed on a bottom surface of the first silicon wafer substrate. A backside metallization layer is formed on a bottom surface of the contact diffusion layer.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/08 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode transportant le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/739 - Dispositifs du type transistor, c.à d. susceptibles de répondre en continu aux signaux de commande appliqués commandés par effet de champ
12.
HYBRID CONDUCTIVE PASTE FOR FAST-OPENING, LOW-RATING FUSES
Provided herein a circuit protection devices including a fusible element attached to a ceramic substrate, the fusible element comprising a paste including a plurality of nickel particles.
H01H 85/0445 - Construction ou structure générales de fusibles basse tension, c.-à-d. au-dessous de 1000 V, ou de fusibles pour lesquels la tension applicable n'est pas spécifiée du type rapide ou lent
A fuse holder includes a housing and a knob. The housing has a telescoping chamber designed to receive a knob terminal, where the knob terminal is adapted to receive a fuse. The knob has a neck which is inserted into the telescoping chamber to enclose the cylindrical fuse. The housing and neck are made of a polymer having a thermal conductivity in a range of 4.0 to 10 W/mK.
A fuse element includes a bridge assembly located adjacent one side of a center portion. The bridge assembly includes multiple bridges connected to a fuse terminal. Each bridge has a cross-sectional area different from each other bridge. A first bridge is adjacent the center portion and has a first cross-sectional area. A last bridge is adjacent the fuse terminal and has a second cross-sectional area greater than the first cross-sectional area.
Provided herein are approaches for improving performance of current sensors. In some embodiments, an apparatus may include a current sensor coupled to a busbar, the current sensor comprising a coil, wherein a current flowing through the busbar generates a first magnetic field detectable by the current sensor, wherein the coil is operable to generate a second magnetic field, and wherein by orienting the coil, the current sensor will receive part of the second magnetic field, superposed to the first magnetic field.
G01R 19/00 - Dispositions pour procéder aux mesures de courant ou de tension ou pour en indiquer l'existence ou le signe
G01R 15/20 - Adaptations fournissant une isolation en tension ou en courant, p. ex. adaptations pour les réseaux à haute tension ou à courant fort utilisant des dispositifs galvano-magnétiques, p. ex. des dispositifs à effet Hall
18.
ADAPTIVE PRE-CHARGE CONTROL FOR ELECTRIC VEHICLE DC LINK CAPACITOR
An adaptive pre-charge control circuit includes include a high-voltage switch and a control circuit. The high-voltage switch controls the flow of current between an electric battery and a DC link capacitor, the electric battery to supply power to an electric vehicle. The DC link capacitor is made up of a sum of individual input capacitors of multiple subunits within an electric vehicle. The control circuit sends a PWM signal to the high-voltage switch based on a difference between an electric battery voltage and a DC link capacitor voltage.
A fuse includes a fuse body, two terminals, and a termination reinforcement. The fuse body surrounds a fusible element. The first terminal is located at one end of the fuse body and the second terminal is located at the other end of the fuse body. The fusible element is mechanically connected to the first and second terminals. The termination reinforcement is located at one end of the fuse body.
H01H 85/00 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif
H01H 85/06 - Éléments fusibles caractérisés par le matériau fusible
H01H 85/08 - Éléments fusibles caractérisés par la configuration ou la forme de l'élément fusible
H01H 85/17 - Enveloppes caractérisées par leur matériau
H01H 85/175 - Enveloppes caractérisées par leur configuration ou leur forme
A fuse comprising including a housing, a fusible element disposed within the housing, first and second terminals extending from opposite ends of the fusible element and out of the housing, and a quantity of arc suppressing material disposed on the fusible element, wherein the arc suppressing material is formed of a polyamide hotmelt adhesive mixed with a flame retardant.
A battery protection device includes a Charge/Discharge Over Temperature (CDOT) device and a wireless charging coil. The CDOT device consists of a first electrode, a second electrode, and a variable resistance material. The first electrode is located on a substrate and has a first collection of fingers. The second electrode is located on the substrate and has a second collection of fingers. The first fingers and the second fingers are disposed in an interdigitated, spaced-apart relationship with one another, resulting in a gap between them that is serpentine and tortuous. The variable resistance material changes its resistance in response to a change in temperature.
A temperature sensing tape is provided and can include an insulating support structure and at least one temperature sensing element disposed on the insulating support structure wherein the at least one temperature sensing element can be formed from a single polymer mixture that includes two or more polymers, and wherein each of the two or more polymers can have a respective, different crystallinity point.
G01K 3/00 - Thermomètres donnant une indication autre que la valeur instantanée de la température
G01K 7/16 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs
G01K 11/06 - Mesure de la température basée sur les variations physiques ou chimiques, n'entrant pas dans les groupes , , ou utilisant la fusion, la congélation ou le ramollissement
23.
TEMPERATURE SENSING TAPE HAVING A TEMPERATURE SENSOR ELEMENT WITH MULTIPLE CRYSTALLIZATION POINTS
A temperature sensing tape is provided and can include an insulating support structure and at least one temperature sensing element disposed on the insulating support structure wherein the at least one temperature sensing element can be formed from a single polymer mixture that includes two or more polymers, and wherein each of the two or more polymers can have a respective, different crystallinity point.
H02H 1/00 - Détails de circuits de protection de sécurité
G01K 1/024 - Moyens d’indication ou d’enregistrement spécialement adaptés aux thermomètres pour l’indication à distance
G01K 3/00 - Thermomètres donnant une indication autre que la valeur instantanée de la température
G01K 7/16 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs
H02H 6/00 - Circuits de protection de sécurité sensibles à des changements indésirables des conditions non électriques normales de travail et utilisant des dispositifs simulateurs de l'appareil protégé, p. ex. utilisant des images thermiques
24.
ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY
An isolated packaging structure and methods thereof. The structure includes a housing having a top side and a bottom side. The housing encapsulates one or more electronic components. The structure also include one or more openings disposed in the bottom side of the housing. One or more openings are configured for exposing one or more metallized surfaces of one or more electronic components. One or more metallized surfaces are configured for coupling to one or more lead terminals.
A Power Distribution Unit (PDU) includes a cover and a base. The cover has multiple fastener receptacles and a pair of indentations located along its outer edge. The base has an opening on a short side of the PDU for receiving a cable connector and a window on a long side of the PDU, the window being secured to a second cover. The long side is perpendicular to the short side.
H02B 1/28 - EnveloppesLeurs parties constitutives ou accessoires à cet effet étanches à la poussière, aux projections, aux éclaboussures, à l'eau ou aux flammes
H02B 1/46 - BoîtiersParties constitutives ou accessoires
A fuse shield features a cylindrical body, a first cap cover, a second cap cover, and a stop region. The cylindrical body is adapted to be placed over and partially surround a cylindrical fuse. The cylindrical body is sandwiched between the first and second cap covers. The stop region is located on an edge of the first cap cover to limit rotation of the cylindrical fuse to a first degree in one direction on a flat surface.
An electrical contactor including a contactor assembly including a housing, an electromagnet coil and an electrically conductive core disposed within the housing, the core being movable relative to the coil under influence of an electromagnetic force produced by the coil, and an electrically conductive bridge connected to a lower end of the core and movable with the core, an interrupter assembly including a base located below the bridge and having a trench formed in a top surface thereof, an input bus bar and an output bus bar disposed on the base on opposing sides of the trench, and a pyrotechnic interrupter disposed within the trench. The pyrotechnic interrupter may include a plunger and pyrotechnic ignitor disposed below the plunger, wherein, when the pyrotechnic ignitor is actuated, the plunger forcibly drives the bridge away from the input bus bar and an output bus bar to break an electrical connection therebetween.
A method for producing an arc quenching fuse filler including providing a conventional fuse filler material, mixing a binder agent with the conventional fuse filler material, mixing an arc quenching promotor with the conventional fuse filler material and binder agent, and curing the binder agent, whereby granules of the arc quenching promotor are bound to granules of the conventional fuse filler material.
Provided are circuit protection devices. In some embodiments, a protection device may include a set of leads extending though a socket body, wherein the socket body includes a first side opposite a second side, and a third side opposite a fourth side, wherein the third and fourth sides extend between the first and second sides, and wherein the third side includes a thermal vent. The protection device may further include a fusible element surrounding a central shaft, wherein the fusible element is connected with the set of leads.
A fuse holder includes a movable tab, a base, and a cover. A stud is affixed to the movable tab and secures a terminal of a bolt-down fuse. A second stud is affixed to the base and secures a second terminal of the bolt-down fuse. The base has a channel into which the movable tab is slidably inserted. The cover connects to the base and is located over the stud and the second stud.
A fuse includes multiple stacked layers, a first terminal, and a second terminal. The first terminal is connected to one end of a fusible element and the second terminal is connected to the other end. The stacked layers include first and second intermediate layers and a special layer. The first intermediate layer, which has a centrally disposed opening, is stacked on the first terminal and the second terminal. The second intermediate layer, also having a centrally disposed opening is stacked above the first intermediate layer, and the centrally disposed openings define a chamber above the fusible element. The special layer is located between the first intermediate layer and the second intermediate layer and includes one or more geometric elements. The geometric elements divide the chamber into two sub-chambers, the first sub-chamber being above the second sub-chamber.
A fuse includes multiple stacked layers, a first terminal, and a second terminal. The first terminal is connected to one end of a fusible element and the second terminal is connected to the other end. The stacked layers include first and second intermediate layers and a special layer. The first intermediate layer, which has a centrally disposed opening, is stacked on the first terminal and the second terminal. The second intermediate layer, also having a centrally disposed opening is stacked above the first intermediate layer, and the centrally disposed openings define a chamber above the fusible element. The special layer is located between the first intermediate layer and the second intermediate layer and includes one or more geometric elements. The geometric elements divide the chamber into two sub-chambers, the first sub-chamber being above the second sub- chamb er.
A substrate assembly may include a power substrate, a chip, a clip, and a trimetal. The power substrate has a first direct copper bonded (DCB) surface connected to a ceramic tile. The chip is soldered onto the first DCB surface. The clip is attached to the power substrate and has a foot at one end and a recessed area at the other, opposite end. The foot is connected to the power substrate. The trimetal has a base, a trapezoid structure, and a clip portion. The base is soldered to the chip. The trapezoid structure is located above the base. The clip portion is located above the trapezoid structure and includes a projecting area. The recessed area of the clip fits into the projecting area of the trimetal.
An active/passive fuse module including a fuse having an electrically insulating fuse body, first and second endcaps disposed on opposing ends of the fuse body, a fusible element extending through the fuse body between the first endcap and the second endcap, and an arc quenching material disposed within the fuse body and surrounding the fusible element. The fuse module further includes a pyrotechnic interrupter (PI) coupled to the fuse body, the PI having a housing defining a shaft, a piston disposed within the shaft, a drive pin extending from the piston into the fuse body, the drive pin terminating in a cutter disposed adjacent the fusible element, and a pyrotechnic ignitor disposed within the shaft above the piston configured to detonate upon receiving an initiation signal from a controller, whereby the piston and the drive pin are forcibly driven through the shaft causing the cutter to separate the fusible element.
A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion to connect to an external device and a bottom portion to fit into the cavity.
A power semiconductor device package. The package may include a baseplate that has a plurality of through holes. The package may also include an insulating body, affixed to a top side of the baseplate The insulating body may include a main portion, to enclose a set of semiconductor devices therein, and a plurality of locking structures, the plurality of locking structures disposed along a lower periphery of the main portion, and integrally formed within the insulating body, wherein the plurality of locking structures extend through the baseplate.
A fuse includes a stack, a flattened wire, and a terminal. The stack has multiple layers arranged to form steps. The stack has an upper stack with layers of a first size and a lower stack with layers of a second, larger size. The flattened wire is located between the upper stack and the lower stack. The terminal is connected to the flattened wire and includes multiple surfaces to cover the steps at one end of the stack.
A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.
C09D 177/00 - Compositions de revêtement à base de polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principaleCompositions de revêtement à base de dérivés de tels polymères
H01H 85/143 - Contacts électriquesFixation d'éléments fusibles sur de tels contacts
B05D 5/12 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers pour obtenir un revêtement ayant des propriétés électriques spécifiques
A chip fuse includes a first terminal disposed on a first end of a fuse element array and a second terminal disposed on a second end of the fuse element array opposite the first end. The fuse element array includes multiple layers disposed in a stacked arrangement, each layer including a first terminal portion disposed within the first terminal, a second terminal portion disposed within the second terminal, a first fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion, and a second fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion. The first fuse element portion is adjacent the second fuse element portion.
A fuse holder includes a movable tab, a base, and a cover. A stud is affixed to the movable tab and secures a terminal of a bolt-down fuse. A second stud is affixed to the base and secures a second terminal of the bolt-down fuse. The base has a channel into which the movable tab is slidably inserted. The cover connects to the base and is located over the stud and the second stud.
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
H01H 85/20 - Socles pour supporter le fusibleLeurs pièces détachées
42.
Solid state relay harvesting power from load by measuring zero crossing
A relay circuit, including a solid state relay switch, connected to a first relay line and to a charging capacitor, and connected to a second relay line. The relay circuit may also include a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may include a voltage detection circuit, having an input coupled to an output of the charging capacitor, and having an output arranged to generate a LOW voltage signal when a voltage level of the charging capacitor is below a low threshold value. The solid state relay control circuit may also include a zero crossing circuit, coupled to the first relay line and the second relay line, and having an output to generate a clock signal when a zero crossing event takes place between the first relay line and the second relay line.
H03K 19/20 - Circuits logiques, c.-à-d. ayant au moins deux entrées agissant sur une sortieCircuits d'inversion caractérisés par la fonction logique, p. ex. circuits ET, OU, NI, NON
43.
Solid state relay harvesting power from load by measuring stored energy
A relay circuit may include a solid state relay switch, coupled to an external voltage line and to an charging capacitor; and a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may be arranged to: turn the solid state relay switch to an OFF state when a capacitor voltage of the charging capacitor falls below a low threshold value; and change the solid state relay switch from the OFF state to an ON state when the capacitor voltage increases above a high threshold value.
H03K 17/687 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
H01H 47/00 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné
H02H 3/08 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à une surcharge
H02H 3/10 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à une surcharge sensibles de plus à quelque autre condition électrique anormale
H02H 3/20 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à un excès de tension
H03K 17/06 - Modifications pour assurer un état complètement conducteur
H03K 19/20 - Circuits logiques, c.-à-d. ayant au moins deux entrées agissant sur une sortieCircuits d'inversion caractérisés par la fonction logique, p. ex. circuits ET, OU, NI, NON
44.
High breaking capacity fuse with fire-extinguishing pads
A high breaking capacity fuse including an electrically insulating fuse body, a fusible element extending through the fuse body, an electrically conductive first terminal connected to a first end of the fusible element, an electrically conductive second terminal connected to a second end of the fusible element, and a first fire extinguishing pad and a second fire extinguishing disposed within the fuse body and sandwiching the fusible element therebetween, each of the first and second fire extinguishing pads formed of a polymeric substrate and a plurality of microcapsules embedded in the polymeric substrate, the plurality of microcapsules filled with an arc-quenching liquid.
A fuse including a fuse body having first and second end faces at opposing first and second longitudinal ends thereof, each of the first and second end faces having at least one notch formed therein, a fusible element extending through the fuse body and having a first end bent over the first end face and disposed within the at least one notch in the first end face and a second end bent over the second end face and disposed within the at least one notch in the second end face, and a first endcap disposed on the first longitudinal end of the fuse body and a second endcap disposed on the second longitudinal end of the fuse body, wherein the first and second endcaps flatly abut the first and second end faces without interference from the fusible element.
A fuse assembly includes a housing and a wound wire operable as a fusible element. The housing has a cavity for the fusible element. The fusible element is formed by coating a wire with enamel and wrapping the wire around a core to produce enamel-coated wound wire. The enamel-coated wound wire is attached to the housing. The core is etched away until the core is dissolved and the enamel is stripped away.
A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. The PPTC device may include a PPTC body; a first electrode disposed on a first surface of the PPTC body and a second electrode disposed on a second surface of the PPTC body, opposite the first electrode. The PPTC body may include a polymer matrix; and a conductive filler, disposed in the polymer matrix. The conductive filler may include a tungsten carbide component comprising at least 30 volume percent of the PPTC body; and a carbon component, wherein a total volume fraction of the conductive filler comprises between forty volume percent and sixty five volume percent of the PPTC body.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances
48.
Fuse with compartmentalized body and parallel fuse elements
A fuse including a fuse body having a base with a central portion and first and second sidewalls, the central portion having first and second fastening holes formed therethrough, a mid-body disposed atop the central portion and having first and second troughs formed in a top surface thereof and separated by a partition wall, the mid-body further having first and second through holes formed therethrough, and a cover disposed atop the mid-body and having a central portion and first and second sidewalls, the central portion having first and second fastening bosses extending therefrom and through the first and second through holes of the mid-body and the first and second fastening holes of the base, and a conductive portion including first and second terminal portions connected by parallel first and second fuse members disposed within the first and second troughs of the mid-body and separated by the partition wall.
A battery master disconnect switch includes a front panel and a back panel. The front panel has a selector knob for selecting between multiple positions. The back panel has a primary terminal, a secondary terminal, and an auxiliary terminal. The primary terminal is for connection, using a first cable, to a primary battery. The secondary terminal is for connection, using a second cable, to a secondary battery. The auxiliary terminal is for enabling a device. The device receives power for any of the positions of the selector knob. The battery master disconnect switch can present a voltage for the primary, the secondary, or both the primary and secondary batteries.
H01H 19/14 - Organes moteurs, p. ex. bouton rotatif
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
A stud assembly is assembled by inserting a sphere into a cavity of a stud, where the cavity is cylindrical in shape, inserting a neck of a rivet into the cavity until the neck touches the sphere, and press-fitting the rivet into the cavity until the neck melds with the sphere.
F16B 19/10 - Rivets creuxRivets en plusieurs morceaux fixés par action mécanique
51.
Automobile rain and temperature sensor module comprising a compound providing a thermally conductive medium between the cover of a housing and a temperature sensing element
A rain and temperature sensing module including a housing having a cover plate formed of a transparent material, a printed circuit board disposed within the housing and having a light emitter, a light receiver, and a temperature sensing element disposed thereon, a transparent compound disposed within the housing and covering the light emitter, the light receiver, and the temperature sensing element, the transparent compound filling a space between the printed circuit board and the cover plate, wherein the transparent compound has a refractive index that is substantially equal to a refractive index of the cover plate, and wherein the transparent compound provides a thermally conductive medium between the cover plate and the temperature sensing element.
B60S 1/08 - Essuie-glaces ou analogues, p. ex. grattoirs caractérisés par l'entraînement entraînés électriquement
B60R 11/00 - Autres aménagements pour tenir ou monter des objets
G01K 7/02 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments thermo-électriques, p. ex. des thermocouples
G01K 7/16 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs
G01K 13/00 - Thermomètres spécialement adaptés à des fins spécifiques
52.
THERMAL PROTECTION DEVICE TO WITHSTAND HIGH VOLTAGE
A thermal protection device, comprising: a first PTC device, arranged in a PTC circuit, and having a first input side, coupled to an input path of the PTC circuit, and having a first output side, coupled to an output path of the PTC circuit; a second PTC device, arranged in the PTC circuit, and having a second input side, coupled to the input path of the PTC circuit, and having a second output side, coupled to the output path of the PTC circuit; and a thermal link having a third input side, coupled to the first output side of the first PTC device and the second output side of the second PTC device, via the output path of the PTC circuit.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H05B 3/14 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
09 - Appareils et instruments scientifiques et électriques
Produits et services
Thermal sensing device, namely sensors for measuring temperature, for use in electronics and circuit protection devices; temperature sensors; circuit over-temperature protector devices
09 - Appareils et instruments scientifiques et électriques
Produits et services
Thermal sensing device, namely, sensors for measuring temperature, for use in electronics and circuit protection devices; temperature sensors; circuit over-temperature protector devices
A fuse assembly includes a fuse element, a first terminal, a second terminal, a socket, and a capsule. The fuse element is disposed between first and second end bells. The first terminal includes a first bell portion, a first socket portion, and a first capsule portion, the first bell portion being connected to the first end bell. The second terminal includes a second bell portion, a second socket portion, and a second capsule portion, the second bell portion being connected to the second end bell. The first socket portion and the second socket portion are integrated through the socket. The first capsule portion and the second capsule portion are integrated through the capsule. The socket is seated atop the capsule to create an interior chamber inside which the fuse element is disposed.
H01H 85/43 - Moyens pour laisser échapper ou absorber les gaz libérés par l'arc de fusion ou pour libérer l'excès de pression causé par l'échauffement
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif Détails
H01H 85/143 - Contacts électriquesFixation d'éléments fusibles sur de tels contacts
H01H 85/175 - Enveloppes caractérisées par leur configuration ou leur forme
H01H 85/20 - Socles pour supporter le fusibleLeurs pièces détachées
A fuse assembly includes a fuse element and a terminal vent channel. The fuse element is located between a first terminal and a second terminal. The fuse element breaks in response to an overcurrent event. The terminal vent channel is located in the first terminal and provides a path for the outgassing of debris during the overcurrent event.
An electrical device assembly and method to attach an isolated single stud fuse assembly to an electrical device are disclosed. The electrical device assembly consists of multiple studs, one or more of which is replaced with the isolated single stud fuse. A conductive copper landing zone receives an electrically isolated steel stud. When the landing pad assembly is orbital riveted into a plastic housing of the electrical device, the stud is locked into the housing permanently. Electrical devices such as disconnect switches and power distribution modules, both of which include multiple studs, are good candidates for being adapted with the single stud fuse assembly.
H01H 85/20 - Socles pour supporter le fusibleLeurs pièces détachées
H01H 85/143 - Contacts électriquesFixation d'éléments fusibles sur de tels contacts
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
H01H 11/00 - Appareillages ou procédés spécialement adaptés à la fabrication d'interrupteurs électriques
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif Détails
H01H 89/00 - Combinaisons de plusieurs types d'interrupteurs électriques, de relais, de sélecteurs et de dispositifs de protection d'urgence, non couvertes par un des autres groupes principaux de la présente sous-classe
A relay circuit, including a solid state relay switch, connected to a first relay line and to a charging capacitor, and connected to a second relay line. The relay circuit may also include a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may include a voltage detection circuit, having an input coupled to an output of the charging capacitor, and having an output arranged to generate a LOW voltage signal when a voltage level of the charging capacitor is below a low threshold value. The solid state relay control circuit may also include a zero crossing circuit, coupled to the first relay line and the second relay line, and having an output to generate a clock signal when a zero crossing event takes place between the first relay line and the second relay line.
H03K 19/20 - Circuits logiques, c.-à-d. ayant au moins deux entrées agissant sur une sortieCircuits d'inversion caractérisés par la fonction logique, p. ex. circuits ET, OU, NI, NON
59.
TEMPERATURE-SENSING TAPE BASED UPON BIMETAL SWITCH, AND METHOD OF TEMPERATURE CONTROL
A temperature-sensing tape including a flexible, electrically insulating substrate, a plurality of temperature-sensing elements disposed on the substrate, wherein a temperature-sensing element includes a bimetallic switch.
H02H 7/18 - Circuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour pilesCircuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour accumulateurs
60.
Protection device including multi-plane fusible element
Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a substrate and a fusible element coupled to the substrate, wherein the fusible element may include a first end opposite a second end, and wherein the first and second ends wrap around the substrate. The fusible element may further include a central section comprising a plurality of segments connected end-to-end in a continuous arrangement between the first and second ends, wherein a first set of segments of the plurality of segments extends along a first plane, and wherein a second set of segments of the plurality of segments extends along a second plane, different than the first plane.
A magnetic sensing system includes a sensor and three magnets. The sensor is located within an appliance housing, the appliance having three moving components. The first magnet is disposed in a first orientation adjacent the first moving component, with the position of the first magnet changing in concert with movement of the first moving component. The second magnet is disposed in a second orientation adjacent the second moving component, with the position of the second magnet changing in concert with movement of the second moving component. The third magnet is disposed in a third orientation adjacent the third moving component, with the position of the third magnet changing in concert with movement of the third moving component. The sensor detects displacement of the first moving component, the second moving component, or the third moving component.
G01R 33/09 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs magnéto-résistifs
G01R 33/07 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs à effet Hall
62.
PPTC HEATER AND MATERIAL HAVING STABLE POWER AND SELF-LIMITING BEHAVIOR
A polymer positive temperature coefficient (PPTC) material may include a polymer matrix, the polymer matrix defining a PPTC body; and a graphene filler component, disposed in the polymer matrix, wherein the graphene filler component comprises a plurality of graphene particles aligned along a predetermined plane of the PPTC body.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
H05B 3/14 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
Provided herein is are quick-assembly plug connectors. In some embodiments, an assembly may include a body, and a contact carrier within the body, the contact carrier including a main body including a plurality of openings each operable to receive a contact, and a plurality of legs extending from the main body, each of the plurality of legs coupled with the body.
H01R 13/639 - Moyens additionnels pour maintenir ou verrouiller les pièces de couplage entre elles après l'engagement
H01R 13/506 - SoclesBoîtiers composés de différentes pièces assemblées par enclenchement réciproque des pièces
H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes
H01R 13/629 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz
Provided herein is a fuse assembly including an anti-rotation device. In some embodiments, the fuse assembly may include a fusible device connected to a conductive component, wherein the conductive component is operable to connect to a terminal of a power source and a securement device coupled to the fusible device. The securement device may include a body including a recess operable to receive the fusible device and a support post extending from the body, wherein the support post is operable to engage the power source to reduce rotation of the securement device and the fusible device relative to the power source.
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif Détails
A semiconductor device substrate assembly may include a first substrate, comprising: a first insulator plate; and a first patterned metal layer, disposed on the first insulator plate, wherein the first insulator plate comprises a first material and a first thickness. The assembly may include a second substrate, comprising: a second insulator plate; and a second patterned metal layer, disposed on the second insulator plate, wherein the second insulator plate comprises the first material and the first thickness. The assembly may also include a third substrate, disposed between the first substrate and the second substrate, comprising: a third insulator plate; and a third patterned metal layer, disposed on the third insulator plate, wherein the third insulator plate comprises a second material and a second thickness, wherein at least one of the second material and the second thickness differs from the first material and the first thickness, respectively.
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
66.
Circuit protection device with PTC device and backup fuse
A circuit protection device including a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a quantity of solder disposed on a dielectric chip and having a melting temperature that is higher than a trip temperature of the PTC device, wherein the a surface of the dielectric chip exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the surface to create a galvanic opening in the backup fuse.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01C 1/08 - Dispositions de réfrigération, de chauffage ou de ventilation
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif Détails
Circuitry and techniques for providing a bidirectional switch in devices for overcurrent protection and voltage protection are disclosed herein. In one embodiment, a circuit may include a first reverse-blocking insulating gate bipolar transistor (IGBT), having a first gate terminal, first collector terminal and a first emitter terminal. The circuit may include a second reverse-blocking IGBT, having a second gate terminal, a second collector terminal, electrically coupled to the first emitter terminal, and a second emitter terminal, electrically coupled to the first collector terminal. As such the first IGBT and the second IGBT may define a first current path, extending from the first collector to the second emitter; and a switch control circuit, coupled to send a control signal to at least one of: the first gate terminal and the second gate terminal, during an overcurrent event.
H02H 3/18 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à l'inversion de courant continu
H02H 1/00 - Détails de circuits de protection de sécurité
A polymeric positive temperature coefficient (PPTC) tank heater features a first conductive region, a heater body, and a second conductive region, forming a sandwich. The first conductive region includes a first conductive surface connected to a first lead and a second conductive surface connected to a second lead. The heater body is a PPTC polymer matrix including a conductive filler and a semi-crystalline polymer. The sandwich includes multiple heating elements connected in series and each heating element supplies a different resistance.
F02M 31/20 - Appareils pour le traitement thermique de l'air comburant, du combustible ou du mélange air-combustible pour refroidir
H05B 3/20 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes
H05B 3/78 - Dispositions pour le chauffage spécialement adaptées au chauffage par immersion
F24H 1/18 - Appareils de chauffage à accumulation d'eau
F02M 25/025 - Appareils spécifiques conjugués aux moteurs pour ajouter des substances non combustibles ou de petites quantités de combustible secondaire, à l’air comburant, au combustible principal ou au mélange air-combustible ajoutant une émulsion d'eau et de combustible, de l'eau ou de la vapeur ajoutant de l'eau
F02M 25/028 - Appareils spécifiques conjugués aux moteurs pour ajouter des substances non combustibles ou de petites quantités de combustible secondaire, à l’air comburant, au combustible principal ou au mélange air-combustible ajoutant une émulsion d'eau et de combustible, de l'eau ou de la vapeur ajoutant de l'eau dans l'admission de charge
F02M 25/03 - Appareils spécifiques conjugués aux moteurs pour ajouter des substances non combustibles ou de petites quantités de combustible secondaire, à l’air comburant, au combustible principal ou au mélange air-combustible ajoutant une émulsion d'eau et de combustible, de l'eau ou de la vapeur ajoutant de l'eau dans les cylindres
Devices herein may include conductor lines connected between a power supply and load, each of the conductor lines coupled to an AC contactor and a contactor control circuit, wherein the contactor control circuit is operable to open and close one or more contactors of the AC contactor. The devices may further include a current transformer coupled to the conductor lines, the current transformer operable to output a secondary current corresponding to a primary current magnitude of an electrical current not flowing to the load, wherein the AC contactor is connected between the power supply and the load. Devices may further include a zero cross detection circuit operable to generate an interrupt at each of a plurality of zero crossings for a microprocessor, and determine whether to open the one or more contactors of the AC contactor in a predetermined optimum interval calculated with respect to the zero crossing points.
H02H 3/16 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à un courant de défaut à la terre ou à la masse
H02H 1/00 - Détails de circuits de protection de sécurité
Devices herein may include conductor lines connected between a power supply and load, each of the conductor lines coupled to an AC contactor and a contactor control circuit, wherein the contactor control circuit is operable to open and close one or more contactors of the AC contactor. The devices may further include a current transformer coupled to the conductor lines, the current transformer operable to output a secondary current corresponding to a primary current magnitude of an electrical current not flowing to the load, wherein the AC contactor is connected between the power supply and the load. Devices may further include a zero cross detection circuit operable to generate an interrupt at each of a plurality of zero crossings for a microprocessor, and determine whether to open the one or more contactors of the AC contactor in a predetermined optimum interval calculated with respect to the zero crossing points.
H01H 83/02 - Interrupteurs de protection, p. ex. disjoncteur ou relais de protection actionné par des conditions électriques anormales autres que seulement les courants excessifs actionnés par courant de défaut à la terre
H02H 3/14 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à la présence d'une tension sur les pièces normalement au potentiel de la terre
H03K 17/13 - Modifications pour commuter lors du passage par zéro
71.
Single bolt fuse assembly with an electrically isolated bolt
A single bolt fuse assembly and method to connect a single bolt fuse to a circuit or device are disclosed. The single bolt fuse assembly enables the single bolt fuse to be used on any electrical device having a hole suitable for receiving a threaded shaft and connectable to a circuit or device that electrically connects to a female battery or power cable. The apparatus includes a separate high-conductive metal terminal that mates with the stud that mechanically attaches the fuse between the electrical devices. The stud is insulated to avoid becoming part of the electrical circuit and to ensure proper operation of the fuse. By mechanically attaching the stud to the metal terminal, the stud is unlikely to get separated from the fuse.
H01H 85/20 - Socles pour supporter le fusibleLeurs pièces détachées
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
H01R 13/68 - Association structurelle avec des composants électriques incorporés avec fusible incorporé
A novel reed switch is disclosed. The reed switch features three-part blades, where a web portion of each blade is bent relative to the lead portion, the bend angle being adjustable. When the blades are sealed into the glass enclosure, a gap between adjacent contacts of each blade does not change once the molten glass of the enclosure cools and hardens, ensuring that the pull-in sensitivity of the reed switch is reliable during manufacture. The bend between the web portion and the lead portion may be simple or complex.
A reed switch including a cylindrical enclosure with two ends, a first blade and a second blade is disclosed. The first blade has a first lead, a first web, and a first contact, and the first web is bent at a first angle as compared to the first lead. The second blade has a second lead, a second web, and a second contact, and the second web is bent at a second angle as compared to the second lead. The first contact is disposed adjacent to the second contact with a gap between them.
H01H 1/66 - Contacts scellés dans une enveloppe à vide ou remplie de gaz, p. ex. contacts à lames magnétiques
H01H 11/00 - Appareillages ou procédés spécialement adaptés à la fabrication d'interrupteurs électriques
H01H 36/00 - Interrupteurs actionnés par la variation du champ magnétique ou champ électrique, p. ex. par le changement de la position relative d'un aimant et d'un interrupteur, par écran
H01H 51/28 - Relais dont l'armature et les contacts se trouvent dans une enveloppe scellée, à l'extérieur de laquelle est disposée la bobine de commande, p. ex. contact entraîné par un ressort à lames ou une tige magnétiques
A novel electrical box to house one or more ISO micro relays, is adapted to support IP67 and IP69K Ingress Protection ratings. The housing of the electrical box is molded with blade sockets that correspond to blade positions of the ISO micro relay. The housing is also molded with terminal seats and cylindrical openings which vary, depending on the blade socket, enabling terminals of different sizes, orientations, and positions relative to the respective blades, to be easily inserted into the back of the housing. The resulting position of the terminals ensures that electrical connections to the ISO micro relay are made and ingress protection of components inside the electrical box is ensured.
H01R 33/76 - Supports avec alvéoles, pinces ou contacts analogues, adaptés pour l'engagement axial par glissement, avec des broches, lames ou contacts analogues disposés parallèlement sur la pièce complémentaire, p. ex. support pour tube électronique
H02B 1/28 - EnveloppesLeurs parties constitutives ou accessoires à cet effet étanches à la poussière, aux projections, aux éclaboussures, à l'eau ou aux flammes
H02B 1/48 - Montage de dispositifs à l'intérieur de ces boîtiers
H01R 33/88 - Dispositifs de couplage spécialement conçus pour supporter un appareil et munis d'une pièce de couplage assurant la fonction de support et la connexion électrique par l'intermédiaire d'une pièce complémentaire qui est structurellement associée à l'appareil, p. ex. supports de lampesLeurs pièces détachées adaptés pour un fonctionnement simultané avec plusieurs pièces complémentaires identiques
A novel heater is disclosed for a temperature sensitive actuator. The heater is a polymeric positive temperature coefficient (PPTC) device consisting of conductive filler and semi-crystalline polymer. The PPTC heater is strategically designed to have a predetermined self-regulation temperature suited to whatever application utilizes the heater. Physical characteristics of the PPTC heater, such as gap width and thickness, enable the current flow through the heater to be strategically controlled.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances
H01B 1/04 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement soit de compositions à base de carbone-silicium, soit de carbone soit de silicium
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
76.
Overcurrent protection by depletion mode MOSFET or JFET and bi-metallic temperature sensing switch in mini circuit breaker
A miniature circuit breaker for providing short circuit and overload protection is disclosed herein. The miniature circuit breaker features a field effect transistor (FET), which may be a depletion mode metal oxide semiconductor FET (D MOSFET), a junction field-effect transistor (JFET), or a silicon carbide JFET, the FET being connected to a bi-metallic switch, where the bi-metallic switch acts as a temperature sensing circuit breaker. In combination, the D MOSFET and bi-metallic switch are able to limit current to downstream circuit components, thus protecting the components from damage.
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H02H 9/00 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion
H02H 9/08 - Limitation ou suppression des courants de défaut à la terre, p. ex. bobine Petersen
H03K 17/687 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
77.
Two-piece fuse endbell with pre-cast/pre-molded alignment slots and optional interface crush ribs
A novel fuse assembly design utilizes a fuse body, a single-piece terminal assembly and a two-piece endbell. The terminal assembly is disposed within the fuse body and includes first and second opposing surfaces with a fuse element extending between a first terminal and a second terminal. The endbell, to be connected to the fuse body, includes first and second endbell portions. Formed within the first endbell portion is a first receptacle and extending from the first endbell portion is a first protrusion. Formed within the second endbell portion is a second receptacle and extending from the second endbell portion is a second protrusion. When the two endbell portions are fastened to one another with the terminal assembly sandwiched between them, the first protrusion engages the second receptacle and the second protrusion engages the first receptacle.
A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, and electrically conductive first and second leads connected to the first and second electrodes, respectively, wherein the first and second electrodes are formed of a material having a melting point greater than 1100 degrees Celsius.
A fuse housing for safe outgassing of a fuse is disclosed. The fuse housing features labyrinth walls disposed at opposing sides of the fuse housing. The labyrinth walls feature serpentine paths for the flow of outgassing material. At an end of the serpentine paths which is farthest away from a fuse element are vent channels. The vent channels are narrower in depth than that of the serpentine paths of the labyrinth walls, facilitating a suctioning effect during outgassing. Conductive material deposits along the serpentine paths so that the fuse maintains a high OSR rating. By directing and controlling the outflow of gases, the fuse housing is able to reduce the temperature of the gases produced. The fuse housing is also able to reduce the physical and observable effects of outgassing.
A novel busbar, suitable for low-power applications, features a u-shaped extension having a male terminal that fits into and establishes electrical connection with a standard female terminal. The housing of an electrical box including the busbar is modified to receive the female terminal in such a way that Ingress Protection ratings of IP67 and IP69K are maintained within the electrical box. The busbar is not riveted to a thicker busbar terminating with a stud and lug nut, as in legacy configurations, thus being simpler and cheaper to manufacture. The female terminal, once connected to the busbar, is removable by inserting a tool into a dedicated opening within the housing.
H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes
H01R 25/16 - Rails ou barres omnibus pourvus de plusieurs points de connexion pour pièces complémentaires
H01R 11/09 - Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p. ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par le câble et possédant des moyens pour faciliter la connexion électrique avec quelqu'autre fil, borne, ou organe conducteur, répartiteurs caractérisés par le type des emplacements de connexion sur l'élément individuel ou par le type des connexions entre les emplacements de connexion et les organes conducteurs les emplacements de connexion étant identiques
81.
METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR PACKAGE
A method to connect power terminals to substrates within semiconductor packages is disclosed. The power terminal connection method minimally adapts the power terminal so that laser treatment can be used to connect the power terminal to the substrate. The power terminal may be adapted in a variety of ways, such that an interface between the power terminal and the substrate may be transformed (melted with consecutive rapid solidification) by the laser device, allowing the power terminal to be connected to the substrate.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/498 - Connexions électriques sur des substrats isolants
82.
Protection device with laser trimmed fusible element
Provided are trimmed parallel element protection devices. Some protection devices may include a substrate and first and second terminals at opposite ends of the substrate. The protection devices may further include a first fusible and a second fusible element extending between the first and second terminals, wherein at least one of the first and second fusible elements includes a trimmed portion.
Provided are waveguide sensors and position sensing systems. In some embodiments, a position sensing system may include a waveguide configured to receive and transmit a pulse, and a magnet moveable relative to the waveguide. The waveguide may include a first core layer and a second core layer, a magnetic layer between the first and second core layers, and a conductive winding around the first core layer, the second core layer, and the magnetic layer. The position sensing system may further include a first substrate layer above the conductive winding and a second substrate layer below the conductive winding.
G01D 5/12 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques
H01P 3/02 - Guides d'ondesLignes de transmission du type guide d'ondes à deux conducteurs longitudinaux
84.
PTC device with integrated fuses for high current operation
A circuit protection device including a PTC device having a PTC element, first and second electrodes disposed on opposing first and second surfaces of the PTC element, respectively, first and second chip fuses disposed on the first and second electrodes, respectively, the second chip fuse electrically connected in series with the PTC device, and the first chip fuse electrically in connected parallel with the PTC device and the second chip fuse, the first chip fuse having a lower electrical resistance than the PTC element when the PTC element is in a non-tripped state, wherein a fusible element of the first chip fuse has a first melting temperature and is configured to carry a current higher than the PTC element can carry without tripping, and wherein a fusible element of the second chip fuse has a second melting temperature that is greater than the first melting temperature.
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif Détails
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01H 85/20 - Socles pour supporter le fusibleLeurs pièces détachées
A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.
A single bolt fuse assembly and method to connect a single bolt fuse to a circuit or device are disclosed. The single bolt fuse assembly enables the single bolt fuse to be used on any electrical device having a hole suitable for receiving a threaded shaft and connectable to a circuit or device that electrically connects to a female battery or power cable. The apparatus includes a separate high-conductive metal terminal that mates with the stud that mechanically attaches the fuse between the electrical devices. The stud is insulated to avoid becoming part of the electrical circuit and to ensure proper operation of the fuse. By mechanically attaching the stud to the metal terminal, the stud is unlikely to get separated from the fuse.
H01H 85/20 - Socles pour supporter le fusibleLeurs pièces détachées
H01R 13/68 - Association structurelle avec des composants électriques incorporés avec fusible incorporé
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
A novel heater is disclosed for a temperature sensitive actuator. The heater is a polymeric positive temperature coefficient (PPTC) device consisting of conductive filler and semi-crystalline polymer. The PPTC heater is strategically designed to have a predetermined self-regulation temperature suited to whatever application utilizes the heater. Physical characteristics of the PPTC heater, such as gap width and thickness, enable the current flow through the heater to be strategically controlled.
H01B 1/04 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement soit de compositions à base de carbone-silicium, soit de carbone soit de silicium
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
88.
Automobile antenna assembly with integrated photo radiation intensity sensor
An automobile antenna assembly including a housing adapted for installation on a roof of an automobile, the housing having a base portion and a fin portion extending from the base portion, a radio antenna disposed within the fin portion, and a photo radiation intensity sensor disposed within the base portion, the photo radiation intensity sensor including a first light detecting element located on a first side of the fin portion and a second light detecting element located on a second side of the fin portion opposite the first side, wherein at least a portion of the base portion is translucent for allowing light to be received by the first and second light detecting elements, the fin portion providing a light barrier between the first light detecting element and the second light detecting element.
A novel heater is disclosed for a temperature sensitive actuator. The heater is a polymeric positive temperature coefficient (PPTC) device consisting of conductive filler and semi-crystalline polymer. The PPTC heater is strategically designed to have a predetermined self-regulation temperature suited to whatever application utilizes the heater. Physical characteristics of the PPTC heater, such as gap width and thickness, enable the current flow through the heater to be strategically controlled.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01B 1/04 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement soit de compositions à base de carbone-silicium, soit de carbone soit de silicium
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances
90.
Semiconductor device having junction termination structure and method of formation
A power semiconductor device may include a junction termination region, bounded by a side edge of a semiconductor substrate. The junction termination region may include a substrate layer of a first dopant type, a well layer of a second dopant type, a conductive trench assembly having a first set of conductive trenches, in the junction termination region, and extending from above the substrate layer through the well layer; and a metal layer, electrically connecting the conductive trench assembly to the well layer. The metal layer may include a set of inner metal contacts, electrically connecting a set of inner regions of the well layer to a first set of trenches of the conductive trench assembly; and an outer metal contact, electrically connecting an outer region of the well layer to a second set of conductive trenches of the conductive trench assembly, wherein the outer region borders the side edge.
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/739 - Dispositifs du type transistor, c.à d. susceptibles de répondre en continu aux signaux de commande appliqués commandés par effet de champ
A polymeric positive temperature coefficient (PPTC) tank heater features a first conductive region, a heater body, and a second conductive region, forming a sandwich. The first conductive region includes a first conductive surface connected to a first lead and a second conductive surface connected to a second lead. The heater body is a PPTC polymer matrix including a conductive filler and a semi-crystalline polymer. The sandwich includes multiple heating elements connected in series and each heating element supplies a different resistance.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances
H01B 1/04 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement soit de compositions à base de carbone-silicium, soit de carbone soit de silicium
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
A power control switch assembly. The assembly may include a thyristor device, where the thyristor device includes a first device terminal, a second device terminal, and a gate terminal> The assembly may include a negative temperature coefficient (NTC) device, electrically coupled to the gate terminal of the thyristor device on a first end, and electrically coupled to the first device terminal of the thyristor device on a second end, wherein the NTC device is thermally coupled to the thyristor device.
H03K 17/60 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors bipolaires
A fuse including a fuse body having a main body portion formed of a dielectric material, a plurality of arc chambers formed in the main body portion, the arc chambers arranged in a matrix configuration, a conductor extending through the main body portion and intersecting the arc chambers, the conductor having bridge portions disposed within the arc chambers, the bridge portions being mechanically weaker than other portions of the conductor and configured to melt and separate upon the occurrence of an overcurrent condition in the fuse.
H01H 85/38 - Moyens pour éteindre ou supprimer l'arc
H01H 85/56 - Dispositifs de protection dans lesquels le fusible est porté, tenu ou retenu par un organe intermédiaire ou auxiliaire pouvant être détaché du socle, ou utilisé comme sectionneur l'organe intermédiaire ou auxiliaire comportant des contacts latéraux pour être embroché dans le socle, p. ex. porte-fusible à pont
Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a fuse assembly having a fusible link extending between a first lead end and a second lead end, and a first lead extending from the first lead end and a second lead extending from the second lead end. The protection device may further include a body including a first section coupleable with a second section, wherein the first and second sections define a central cavity housing the fusible link. The first section may include an interior face operable to engage an opposite interior face of the second section, an engagement member extending away from the interior face towards the second section, and an engagement channel adjacent the engagement member, the engagement channel operable to receive a corresponding engagement member of the second section.
H01H 37/76 - Élément de contact actionné par fusion d'une matière fusible, actionné par combustion d'une matière combustible ou par explosion d'une matière explosive
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif Détails
95.
ARC QUENCHING FUSE FILLER FOR CURRENT LIMITING FUSES
A method for producing an arc quenching fuse filler including providing a conventional fuse filler material, mixing a binder agent with the conventional fuse filler material, mixing an arc quenching promotor with the conventional fuse filler material and binder agent, and curing the binder agent, whereby granules of the arc quenching promotor are bound to granules of the conventional fuse filler material.
B32B 37/04 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par la fusion partielle d'au moins une couche
B32B 37/06 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par le procédé de chauffage
A pPTC heating device having areas with different power densities distributed over the surface of the device. The device is constructed using a base layer composed of a pPTC material having a layer of sectioned conductive plates disposed over and under the layer of pPTC such as to control the path of the current through the device, thereby controlling resistance of the device and the power density of the device.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H05B 3/14 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
Provided herein is an improved bi-stable relay. In some embodiments, the bi-stable relay assembly may include a housing, and a core assembly within the housing. The core assembly may include a coil support structure, a first coil and a second coil along a central section of the coil support structure, a first magnet at a first end of the coil support structure, a second magnet at a second end of the coil support structure, and a first electromagnetic shell component and a second electromagnetic shell component each extending between the first and second magnets.
H01H 47/22 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné pour l'alimentation de la bobine du relais en courant d'excitation
Provided herein are methods for an improved bi-stable relay. In some embodiments, a method may include providing a core assembly within a housing, the core assembly comprising a plunger extending through a coil support structure. The method may further include winding a first coil and a second coil about a central section of the coil support structure, providing a first magnet and a first ferromagnetic plate at a first end of the coil support structure, and providing a second magnet and a second ferromagnetic plate at a second end of the coil support structure. In some embodiments, the method may further include activating the first coil or the second coil to move the plunger between a first position and a second position, wherein in the first position a circuit formed by a set of contacts is closed, and wherein in the second position the circuit is open.
H01H 47/22 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné pour l'alimentation de la bobine du relais en courant d'excitation
H01H 49/00 - Appareils ou procédés spécialement adaptés à la fabrication de relais ou d'éléments de relais
Provided herein are coil support structures and methods of retaining a printed circuit board assembly (PCBA) of a relay. In some embodiments, a bi-stable relay assembly may include a coil support structure, having a central section extending between a first end section and a second end section, and set of biasable fasteners extending from the first end section and the second end section, wherein each of the set of biasable fasteners includes a sloped engagement surface and a retention slot. The coil support structure may further include a PCBA coupled to the first and second end sections of the coil support structure, wherein the coil support structure extends within the retention slot of each of the set of biasable fasteners.
H01H 47/22 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné pour l'alimentation de la bobine du relais en courant d'excitation
H01H 50/64 - Dispositions d'entraînement entre en élément mobile de circuit magnétique et un contact
100.
Ultra-low clamping voltage surge protection module using depletion mode MOSFET
An ultra-low clamping voltage Surge Protection Module (SPM) is disclosed which utilizes a depletion mode MOSFET (D MOSFET). The SPM may be part of a circuit or a device and includes a primary protection stage and a secondary protection stage, with the D MOSFET being connected between the two stages. The SPM may include a single D MOSFET, dual D MOSFETs, or multiple D MOSFETs and the primary and secondary protection stages may be implemented with a number of different components. The SPM using D MOSFET(s) exhibits improved surge protection over circuits using inductors.
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
H02H 9/00 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
