01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
(1) Industrial chemicals used in metal and plastic finishing, plating, etching, and the manufacture of printed circuit boards and other electronic components
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemicals for use in industry; chemicals for use in plating
metals onto various substrates; chemical for use in
non-electrolytic nickel-plating; chemicals having a nickel
base; metal plating chemical compositions; additives for
metal plating solutions; chemical products used in
sensitizing compositions, catalysts, accelerators, etchants,
etchant neutralizers, nickel compounds and solutions;
chemicals for the preparation of photoresists; chemicals
used in baths with nickel being used to carry out nickel
plating; artificial and synthetic resins; unprocessed
plastic materials in powder, liquid or paste form; chemical
tempering and soldering preparations; adhesive substances
for industrial use.
3.
Regeneration of etch solutions containing trivalent manganese in acid media
A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
chemicals; raw chemicals; chemicals for use in plating metals onto various substrates; chemical products used in industry, especially chemicals used in non-electrolitic nickel-plating; chemical products for use in industry, all having a nickel base; metal plating solution; additives for metal plating solution; chemical products used in industry including sensitizing compositions, catalysts, accelerators, etchants, etchant neutralisers, nickel compounds and solutions; chemical materials for the preparation of photoresists; chemicals used in industry, in particular baths with nickel being used to carry out nickel plating; chemicals used in science, photography, agriculture, horticulture and forestry; artificial and synthetic resins, unprocessed plastic materials (in powder, liquid or paste form); chemical tempering and soldering preparations; adhesive substances for industrial use; chemicals used in industry; chemicals for use in industry.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
chemical compositions and solutions, all for use in chromium plating processes; chemical compounds and baths for chrome plating; chromium plating compositions and solutions; chemicals used in industry; chemicals for use in industry.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
industrial chemicals; chemicals for use in metal plating; chemical plating solutions, namely, metal plating chemical compositions; electroplating solutions, namely, chromium-free chemicals used in electroplating zinc and zinc alloys; electroplating chemical additives; chemical additives for paints and surface coatings; chemical additives for use in the production of coatings; galvanizing preparations; chemicals for the manufacture of protective coatings; chemical preparations for use in treating metal surfaces; chemicals for preventing corrosion; chemical preparations for facilitating the alloying of metals; preservatives for metals; passivating agents, namely, metallic oxides; chemical preparations for metal surface treatment, namely, preparations for passivating, cleaning, coating, descaling, anodizing metals; chemical preparations for treating, namely, passivating, cleaning, coating, descaling, anodizing metal surfaces made of zinc and zinc alloys corrosion resistant coatings; coatings for use as primers; coating materials for protection of surfaces exposed to galvanic corrosion; preservative coatings for use against corrosion; primers; conversion coating compositions, namely, anti-corrosive coatings, primers for preparing surfaces to be painted, protective coatings for metal surfaces; protective coatings for application to prepared metal substrates; conversion coatings compositions, namely, decorative or protective coatings for application to zinc, zinc-alloys, aluminum, copper, copper alloys, steel, and prepared metal substrates
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
Produits et services
Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemicals for use in etching; Chemicals for use in plate etching; Descaling preparations for industrial purposes; Descalants for industrial use; Chemicals [other than household] in liquid form for use as descalers; Acids for use in pickling; Acids for metal pickling; Pickling solutions for industrial use; Pickling solutions for use in the removal of deposits from metal; Pickling solutions for use in the removal of coatings from metals; Chemical cleaning agents for use in industrial processes; Chemicals for use in removing coatings. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Primers; Anti-corrosive agents having descaling properties; Anti-corrosive preparations. Cleaning agents for metal; Polishing preparations; Abrasives; Scouring substances; Cleaning and fragrancing preparations; Rust removing preparations.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Chemicals used in industry; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for paints and surface coatings; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint; Chromating agents; Passivating agents; Baths for galvanizing; Chemicals for use in immersion baths [other than medical or veterinary]. Paints and washes; Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-rust preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Primers; Conversion coatings [paints]; Conversion coating compositions [paints]; Lacquers and varnishes; Varnish; Lacquers for use in industry.
9.
Etching of plastic using acidic solutions containing trivalent manganese
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
04 - Huiles et graisses industrielles; lubrifiants; combustibles
Produits et services
Industrial chemicals; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for use in the production of coatings; Chemical additives for paints and surface coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint; Chemical friction reducers; Chemical additives for lubricants; Chemical additives for oils; Chemicals in the form of water soluble lubricants; Chemical substances for use as additives to industrial lubricating oils; Chemical substances for use as additives to industrial lubricating greases; Rust preventive resins of high friction coefficient; Moistening agents; Passivating agents; Chromating agents. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-corrosive preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Conversion coatings [paints]; Conversion coating compositions [paints]; Primers; Coating preparations for protection against friction. Lubricants; Industrial lubricants; Lubricants for metal working; Lubricants for metallic surfaces; Lubricants containing low friction additives; Lubricating fluids; Industrial oils and greases, lubricants; Non-chemical additives for lubricants; Non-chemical additives for oils; Oils containing rust preventing additives; Anti-seize substances [oils]; Lubricating oils containing additives which protect metal against wear by friction; Preparations for reducing sliding friction between two surfaces.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Industrial chemicals; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for paints and surface coatings; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-corrosive preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Industrial chemicals; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for paints and surface coatings; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint; Passivating agents; Chromating agents. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-corrosive preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Primers.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Industrial chemicals; Chemicals for use in metal plating; Chemical plating solutions; Plating solutions; Electroplating solutions; Electroplating additives; Chemical additives; Chemical additives for paints and surface coatings; Chemical additives for use in the production of coatings; Galvanizing preparations; Galvanising compositions; Chemical products for the manufacture of protective coatings; Chemical preparations for use in the manufacture of surface coatings; Chemicals for use in treating metal surfaces; Chemicals for preventing corrosion; Chemical preparations for facilitating the alloying of metals; Preservatives for metals [chemical]; Electrolyte solutions, other than for medical use; Coating compositions [chemicals], other than paint; Coating agents [chemicals], other than paint; Chromating agents; Passivating agents. Coatings; Corrosion resistant coatings; Coatings for use as primers; Coating materials for protection of surfaces exposed to galvanic corrosion; Corrosion (Preservatives for use against -); Anti-corrosive preparations; Preparations for the treatment of metal surfaces to resist attack by corrosion; Anti-corrosive compounds as additives to surface coatings; Additives for use in coatings; Primers; Conversion coatings [paints]; Conversion coating compositions [paints].
14.
Sealing anodized aluminum using a low-temperature nickel-free process
The inventive two-step process operates at low temperature, without any toxic heavy metals, to provide excellent sealing on anodized aluminum substrates, especially those aluminum substrates comprising silicon. The first step of the process seals the anodized surface and the second step passivates the anodized surface. The process allows for corrosion resistance in anodized aluminum and anodized aluminum alloys to be achieved that is comparable to traditional nickel based sealants, without the toxicity of nickel. The process additionally does not require any excessive temperatures, as required by hot water sealing processes. The composition used for the sealing step comprises soluble lithium ions, fluoride ions, and preferably, a complexing agent comprising phosphines, phosphonates and/or polymers of acrylic acid. The composition used for the passivation step comprises metal ions and preferably a complexing agent comprising phosphines, phosphonates and/or polymers of acrylic acid.
The inventive two-step process operates at low temperature, without any toxic heavy metals, to provide excellent sealing on anodized aluminum substrates, especially those aluminum substrates comprising silicon. The first step of the process seals the anodized surface and the second step passivates the anodized surface. The process allows for corrosion resistance in anodized aluminum and anodized aluminum alloys to be achieved that is comparable to traditional nickel based sealants, without the toxicity of nickel. The process additionally does not require any excessive temperatures, as required by hot water sealing processes. The composition used for the sealing step comprises soluble lithium ions, fluoride ions, and preferably, a complexing agent comprising phosphines, phosphonates and/or polymers of acrylic acid. The composition used for the passivation step comprises metal ions and preferably a complexing agent comprising phosphines, phosphonates and/or polymers of acrylic acid.
C23C 22/40 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 contenant des molybdates, des tungstates ou des vanadates
C23C 22/42 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 contenant des molybdates, des tungstates ou des vanadates et des phosphates
C23C 22/44 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 contenant des molybdates, des tungstates ou des vanadates et des fluorures ou des fluorures complexes
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.
C25B 9/06 - Cellules comportant des électrodes fixes de dimensions stables; Assemblages de leurs éléments de structure
C25C 1/10 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions des métaux du groupe du fer, de métaux réfractaires ou du manganèse du chrome ou du manganèse
An aqueous trivalent chromium electrolyte comprising trivalent chromium ions and amino acids that allow for producing a dark colored hue in the trivalent chromium coating which is plated on a substrate. The amino acids described herein comprise a cationic side chain and are at least essentially free of sulfur. The cationic side chain of the amino acid further comprises nitrogen. When used in the trivalent chromium electrolyte, these amino acids allow for producing significantly darker trivalent chromium deposits. The trivalent chromium electrolyte is used in a method for producing the desired dark colored hue in the trivalent chromium coating that is produced on a substrate using electrodeposition.
A method of maintaining a concentration of sulfuric acid in an electrolyte comprising manganese(III) ions in a solution of sulfuric acid. The method includes the steps of a) removing a portion of the electrolyte from the electrolytic cell to an annex tank; b) treating the removed portion of the electrolyte in the annex tank to remove moisture from the portion of the electrolyte; and c) returning the treated portion of the electrolyte to the electrolytic cell. The removed portion of the electrolyte is treated by passing a dry gas over the surface of the electrolyte in the annex tank to absorb moisture from the electrolyte and restore the concentration of sulfuric acid in the electrolyte.
C25C 1/10 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions des métaux du groupe du fer, de métaux réfractaires ou du manganèse du chrome ou du manganèse
H01M 6/50 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien, p. ex. pour le maintien de la température de fonctionnement
H01M 8/04492 - HumiditéHumidité ambianteTeneur en eau
19.
SOLUTIONS OF ORGANIC SALTS AS PRETREATMENTS FOR PLASTICS PRIOR TO ETCHING
A method of preparing a plastic substrate to accept metal plating thereon is described. The method includes the steps of pretreating the plastic substrate by contacting the plastic substrate with an aqueous electrolyte comprising an organic salt to raise the surface energy of the plastic substrate. Thereafter, the plastic substrate can be etched and metal plated.
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C23C 18/22 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
C25D 5/56 - Dépôt électrochimique sur des surfaces non métalliques de matières plastiques
20.
ELECTROLESS SILVER PLATING BATH AND METHOD OF USING THE SAME
An electroless silver plating bath and method of use is presented within. The electroless silver plating bath is designed to plate only on the desired metal substrate while preventing plating on areas other than those which are to be plated. The invention uses heavy metal based stabilizers in the electroless silver plating bath to prevent extraneous plating. The ability to control the amount of stabilizer present in the plating bath allows for elimination of extraneous plating and allows for a stable bath, The electroless silver plating bath is very stable and yet plates at an acceptable rate. The electroless silver plating bath prevents corrosion on the underlying metal that is plated on by using the stabilizers as described herein. The silver plating bath presented herein is useful for a wide variety of applications including those in electronic packaging, integrated circuits (IC) and in manufacturing of light emitting diodes (LEDs).
a method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: Formula (I) wherein R, R', R" and R'" are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or :Formula (II) wherein R, R', R" and R'" are either the same or are independently selected from C I - CI O alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non- conductive substrates for subsequent metallization steps.
A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.
C09D 181/00 - Compositions de revêtement à base de composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du soufre, avec ou sans azote, oxygène ou carboneCompositions de revêtement à base de polysulfonesCompositions de revêtement à base de dérivés de tels polymères
C25D 5/34 - Prétraitement des surfaces métalliques à revêtir de métaux par voie électrolytique
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C23C 18/22 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage
a method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: Formula (I) wherein R, R', R" and R'" are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or :Formula (II) wherein R, R', R" and R'" are either the same or are independently selected from C I - CI O alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non- conductive substrates for subsequent metallization steps.
A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative temiinal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.
An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.
C23C 18/32 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
C23C 18/54 - Dépôt par contact, c.-à-d. dépôt électrochimique sans courant
An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.
C23C 18/32 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
C23C 18/54 - Dépôt par contact, c.-à-d. dépôt électrochimique sans courant
27.
Aqueous electroless nickel plating bath and method of using the same
An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.
B05D 3/10 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par d'autres moyens chimiques
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
C23C 18/32 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux
C22C 19/03 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel
29.
ELECTROPLATING OF METALS ON CONDUCTIVE OXIDE SUBSTRATES
A method of electroplating metal onto a transparent conductive oxide layer is described. The method comprises the steps of a) electroplating a zinc or zinc oxide seed layer directly onto the transparent conductive oxide layer and thereafter, b) electroplating one or more additional metal layers over the zinc layer. The one or more additional metal layers may include a cobalt strike layer electroplated over the zinc or zinc oxide seed layer and another metal layer such as copper, electroplated over the cobalt strike layer.
A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium (III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium (III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium (III) plated layer is deposited over the nickel plated layer.
C25D 3/06 - Dépôt électrochimiqueBains utilisés à partir de solutions de chrome à partir des solutions de chrome trivalent
C25D 5/00 - Dépôt électrochimique caractérisé par le procédéPrétraitement ou post-traitement des pièces
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
31.
PASSIVATION OF MICRO-DISCONTINUOUS CHROMIUM DEPOSITED FROM A TRIVALENT ELECTROLYTE
A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium (III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium (III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium (III) plated layer is deposited over the nickel plated layer.
C25D 3/06 - Dépôt électrochimiqueBains utilisés à partir de solutions de chrome à partir des solutions de chrome trivalent
C25D 5/10 - Dépôt de plusieurs couches du même métal ou de métaux différents
C25D 5/12 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium(III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium(III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium(III) plated layer is deposited over the nickel plated layer.
An electroplating rack for supporting non-conductive substrates during an electrodeposition process is described. The electroplating rack is coated with a non-conductive material, such as a PVC plastisol. The electroplating rack is treated with a non-aqueous solution comprising a metallization inhibitor prior to the electrodeposition process to inhibit rack plate up when using etchants that do not contain chromic acid.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Industrial chemicals used in metal and plastic finishing,
plating, etching, and the manufacture of printed circuit
boards and other electronic components; chemicals used in
the manufacture of commercial and industrial printing
plates, namely, polymer compositions.
An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
37.
Etching of plastic using acidic solutions containing trivalent manganese
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.
A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
C25C 1/10 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions des métaux du groupe du fer, de métaux réfractaires ou du manganèse du chrome ou du manganèse
A method of etching a plastic part as described. The method comprises contacting the plastic part with a solution comprising manganese(III) ions and at least one acid.
A copper electrolyte comprising a copper nitrate salt is described. The electrolyte is suitable for use in a light induced plating process for metallizing contacts in a photovoltaic solar cell. A method of metallizing an electrical contact in a photovoltaic solar cell using the copper electrolyte is also described.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Industrial chemicals used in metal and plastic finishing, plating, etching, and the manufacture of printed circuit boards and other electronic components [ ; chemicals used in the manufacture of commercial and industrial printing plates, namely, polymer compositions ]
45.
Method of producing polymeric phenazonium compounds
A process of making a polymeric phenazonium compound having the general formula:
5,
y cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable as an additive in a metal plating bath comprising copper. The method includes the steps of a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced with a smaller quantity of unreacted monomer remaining in the end product than those produced using methods of the prior art.
C08G 73/06 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principale de la macromoléculePolyhydrazidesPolyamide-acides ou précurseurs similaires de polyimides
C25D 3/38 - Dépôt électrochimiqueBains utilisés à partir de solutions de cuivre
46.
ELECTROLYTIC GENERATION OF MANGANESE (III) IONS IN STRONG SULFURIC ACID
An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises ( 1 ) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.
C09K 13/12 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant des sels de métaux lourds constituant au moins 50% des composés non solvants
47.
ELECTROLYTIC GENERATION OF MANGANESE (III) IONS IN STRONG SULFURIC ACID
An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises ( 1 ) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.
A method of providing a direct electroless palladium deposit on a copper surface is described. The method comprises the steps of (a) catalyzing the copper surface by applying a pre-dip composition to the copper surface, the pre-dip composition comprising a reducing agent; and thereafter (b) contacting the catalyzed copper surface with an electroless palladium composition to deposit a layer of palladium on the copper surface.
C23C 18/54 - Dépôt par contact, c.-à-d. dépôt électrochimique sans courant
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
An aqueous conversion coating composition for treating steel substrates to provide a conversion coating thereon. The conversion coating composition comprises a) a source of aluminum ions; b) hexafluorozirconic acid or its salts; c) at least one pH adjuster; and d) optionally, a surfactant. The conversion coating composition provides a corrosion resistant coating on the metal surface and improves the adhesion of subsequently applied layers.
C23C 22/34 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 contenant des fluorures ou des fluorures complexes
C23C 22/06 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6
50.
Adhesion promoting composition for metal leadframes
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
C09J 5/02 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un traitement préalable des surfaces à joindre
C09K 13/06 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique avec une substance organique
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
A copper electroplating bath for producing copper electrodeposits is described, The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl5 aryl or atkylaryl diamine. The copper electroplating bath can be used for producing eleetroformed copper deposits having low oxygen content,
An additive for use in a wash solution of a PET recycling process is described. The PET recycling process includes the steps of sorting the scrap PET to remove other materials, granulatirsg or shredding the scrap PET to produce PET flakes, and washing the PET to remove contaminants. The wash step comprises the steps of contacting the PET flakes with a wash solution comprising: (a) an alkali hydroxide; and (b) an additive comprising: (i) at least one non-ionic surfactant; (ji) at least one catiomc surfactant; (iii) a hydrotrope; (iv) water, and (v) optionally, a solvent.
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additives to a trivalent chromium electrolyte; (c) contacting the substrate with the trivalent chromium electrolyte containing the one or more color enhancing additives to deposit trivalent chromium on the substrate; (d) measuring the color of the color-enhanced trivalent chromium deposit; (e) comparing the color of the color-enhanced chromium deposit to that of the standard; and (f) if necessary, adjusting the amount of the one or more color enhancing additives added to the trivalent chromium electrolyte if the color of the color-enhanced chromium deposit is outside of a desired optical variation from that of the standard color-enhanced chromium deposit. The color of the trivalent chromium deposit may be measured using a spectrophotometer.
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additives to a trivalent chromium electrolyte; (c) contacting the substrate with the trivalent chromium electrolyte containing the one or more color enhancing additives to deposit trivalent chromium on the substrate; (d) measuring the color of the color-enhanced trivalent chromium deposit; (e) comparing the color of the color-enhanced chromium deposit to that of the standard; and (f) if necessary, adjusting the amount of the one or more color enhancing additives added to the trivalent chromium electrolyte if the color of the color-enhanced chromium deposit is outside of a desired optical variation from that of the standard color-enhanced chromium deposit. The color of the trivalent chromium deposit may be measured using a spectrophotometer.
A method of plating a part comprised of aluminum, alloys of aluminum, magnesium or alloys of magnesium to improve the corrosion resistance of the part. The method comprises the steps of plating the part with a plating bath comprising: (i) particles selected from the group consisting of polytetrafluoroethylene (PTFE), colloidal silica, colloidal graphite, ceramics, carbon nanotubes, silicon carbide, nano-diamond, diamond and combinations of one or more of the foregoing, which have been treated with a corrosion inhibitor and are dispersed in said plating bath; and (ii) metal ions to be plated, The dispersed particles co-deposit with the plated metal.
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additives to a trivalent chromium electrolyte; (c) contacting the substrate with the trivalent chromium electrolyte containing the one or more color enhancing additives to deposit trivalent chromium on the substrate; (d) measuring the color of the color-enhanced trivalent chromium deposit; (e) comparing the color of the color-enhanced chromium deposit to that of the standard; and (f) if necessary, adjusting the amount of the one or more color enhancing additives added to the trivalent chromium electrolyte if the color of the color-enhanced chromium deposit is outside of a desired optical variation from that of the standard color-enhanced chromium deposit. The color of the trivalent chromium deposit may be measured using a spectrophotometer.
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(in) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese (II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese (III) ions, wherein the manganese (III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
59.
Etching of plastic using acidic solutions containing trivalent manganese
A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.
C25C 1/10 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions des métaux du groupe du fer, de métaux réfractaires ou du manganèse du chrome ou du manganèse
An aqueous treatment solution for increasing the cleaning capability of a treated copper surface comprising: a) an organic compound selected from the group consisting of organic acids, alcohols, ketone, nitriles and combinations of one or more of the foregoing; and b) an oxidizing agent. The aqueous treatment solution is usable in a process for metallizing the walls of holes within a printed wiring board substrate having metallic and non-metallic regions, wherein the printed wiring board is treated with a reducing agent and then contacted with an aqueous dispersion of carbonaceous particles to form a coating of the dispersion over the substrate. The process comprises the step of contacting the metallic regions of the printed wiring board substrate with the aqueous treatment solution to remove deposited carbonaceous particles therefrom. The aqueous treatment solution provides a clean copper surface while providing a low microetch rate.
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
C25C 1/10 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions des métaux du groupe du fer, de métaux réfractaires ou du manganèse du chrome ou du manganèse
C25C 7/00 - Éléments structurels, ou leur assemblage, des cellulesEntretien ou conduite des cellules
C25B 11/12 - Electrodes; Leur fabrication non prévue ailleurs caractérisées par le matériau Électrodes à base de carbone
C25B 9/06 - Cellules comportant des électrodes fixes de dimensions stables; Assemblages de leurs éléments de structure
C09K 13/04 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique
C25D 5/56 - Dépôt électrochimique sur des surfaces non métalliques de matières plastiques
63.
Method for improving plating on non-conductive substrates
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
B05D 1/18 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par immersion
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
C08J 7/18 - Modification chimique par des composés polymérisables en utilisant des ondes énergétiques ou le rayonnement de particules
B05D 3/06 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par exposition à des rayonnements
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the ekctroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs).
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
65.
TREATMENT OF PLASTIC SURFACES AFTER ETCHING IN NITRIC ACID CONTAINING MEDIA
A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.
B05D 3/04 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par exposition à des gaz
66.
Light induced plating of metals on silicon photovoltaic cells
A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact.
B05D 7/00 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
C23C 18/54 - Dépôt par contact, c.-à-d. dépôt électrochimique sans courant
An aqueous electrolytic plating solution and a method, of using the same for depositing a cobalt/nickel/phosphorus alloy on an electrically conductive substrate are provided. The aqueous electrolytic plating solution comprises: a) a source of nickel ions; b) a source of cobalt ions; c) a source of phosphite ions; d) an amino acid; and e) optionally, boric acid. The deposited cobalt/nickel/phosphorus alloy exhibits high coercivity and high remanence.
An aqueous tarnish inhibiting solution comprising a mercapto carboxylic acid find a corrosion inhibitor to produce an anti-tarnish layer on metal surfaces, such as silver plated copper leadframes and a method of using the same is pro vided. The composition provides an improved anti-tamish layer that does not affect wirebondability or the adhesion of a mold compound to a leadfrarne.
C23F 11/00 - Inhibition de la corrosion de matériaux métalliques par application d'inhibiteurs sur la surface menacée par la corrosion ou par addition d'inhibiteurs à l'agent corrosif
69.
LIGHT INDUCED PLATING OF METALS ON SILICON PHOTOVOLTAIC CELLS
A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact.
A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfations; b) a soluble salt of chloroacetic acid, acetic acid, glycolic acid, proprionic acid, benzoic acid, salicylic acid or chlorobenzoic acid; and c) at least one diol selected from the group consistmg of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. The plating bath described herein is at least substantially free of coumarm and produces desirable leveling characteristics. The bath also requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.
C25D 3/12 - Dépôt électrochimiqueBains utilisés à partir de solutions de nickel ou de cobalt
B05D 5/12 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers pour obtenir un revêtement ayant des propriétés électriques spécifiques
A method of preparing an aluminum or aluminum alloy substrate to accept an adherent coating thereon is provided. The method includes the steps of degreasing the substrate, deoxidizing the substrate, and providing a prepaint conversion coating on the degreased and deoxidized substrate. The prepaint conversion coating composition comprises i) a source of fluoride ions; ii) a source of zirconium ions; iii) an acrylic resin; and iv) an optical brightener and forms a colorless, chromium-free conversion coating on the aluminum substrate that can be observed by exposing the treated substrate to UV light.
C23C 22/56 - Traitement de l'aluminium ou des alliages à base d'aluminium
C23C 22/00 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux
73.
ADHESION PROMOTING COMPOSITION FOR METAL LEADFRAMES
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
A method of preparing an aluminum or aluminum alloy substrate to accept an adherent coating thereon is provided. The method includes the steps of degreasing the substrate, deoxidizing the substrate, and providing a prepaint conversion coating on the degreased and deoxidized substrate. The prepaint conversion coating composition comprises i) a source of fluoride ions; ii) a source of zirconium ions; iii) an acrylic resin; and iv) an optical brightener and forms a colorless, chromium-free conversion coating on the aluminum substrate that can be observed by exposing the treated substrate to UV light.
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
75.
Adhesion promoting composition for metal leadframes
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
C23F 1/00 - Décapage de matériaux métalliques par des moyens chimiques
76.
ELECTROLYTIC DISSOLUTION OF CHROMIUM FROM CHROMIUM ELECTRODES
An eleciroiytic cell for replenisHng chromium content of a trivalent chromium electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electiOde and the second electrode, In this manner, trivalent; chromium is eieetrolytically dissolved from the cliromiuni electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.
An electrolytic cell for replenishing chromium content of a trivalent chromium electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electrode and the second electrode. In this manner, trivalent chromium is electrolytically dissolved from the chromium electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.
An aqueous acidic trivalent chromium electrolyte comprising trivalent chromium ions and a complexing agent for maintaining the trivalent chromium ions in solution is provided in which the aqueous electrolyte comprises additives capable of producing a coating on a substrate having a desired dark hue. The additives typically comprise a dispersion of colloidal silica and an additional additive selected from thiocyanate ions and/or iron ions. The electrolyte is used in a method of producing the desired dark-hued decorative chromium coating on a substrate by electrodeposition.
An aqueous acidic trivalent chromium electrolyte comprising trivalent chromium ions and a complexing agent for maintaining the trivalent chromium ions in solution is provided in which the aqueous electrolyte comprises additives capable of producing a coating on a substrate having a desired dark hue. The additives typically comprise a dispersion of colloidal silica and an additional additive selected from thiocyanate ions and/or iron ions. The electrolyte is used in a method of producing the desired dark-hued decorative chromium coating on a substrate by electrodeposition,
A process of making a polymeric phenazonium compound having the general formula: Formula (I) wherein R1, R2, R4, R5, R6, R8 and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts as NH2 and is diazotized followed by polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 is a carbon in the aromatic ring, and wherein RX-N-RY represents a substituted amine, and Rx and Ry represent any combination of CH3, C2H5,:Formula (II) and hydrogen, except that Rx and RY cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be fonned in step b), whereby a polymeric phenazonium compound is produced.
C08G 63/48 - Polyesters modifiés chimiquement par estérification par des huiles d'acides gras supérieurs non saturés ou leurs acidesPolyesters modifiés chimiquement par estérification par des acides résiniques
81.
Method of producing polymeric phenazonium compounds
A process of making a polymeric phenazonium compound having the general formula:
5,
Y cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.
A process of making a polymeric phenazonium compound having the general formula:
5,
Y cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.
A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact.
B05D 5/06 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers pour obtenir des effets multicolores ou d'autres effets optiques
86.
Nano-oxide process for bonding copper/copper alloy and resin
A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
H01L 21/316 - Couches inorganiques composées d'oxydes, ou d'oxydes vitreux, ou de verres à base d'oxyde
C04B 28/36 - Compositions pour mortiers, béton ou pierre artificielle, contenant des liants inorganiques ou contenant le produit de réaction d'un liant inorganique et d'un liant organique, p. ex. contenant des ciments de polycarboxylates contenant du soufre, des sulfures ou de sélénium
C04B 37/00 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage
C08J 5/12 - Fixation d'un matériau macromoléculaire préformé au même matériau ou à un autre matériau compact, tel que du métal, du verre, du cuir, p. ex. en utilisant des adhésifs
C08J 3/09 - Production de solutions, dispersions, latex ou gel par d'autres procédés que ceux utilisant les techniques de polymérisation en solution, en émulsion ou en suspension dans des liquides organiques
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylaied alcohol surfactant; and (ill) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound, The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
B05D 1/18 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par immersion
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
C08J 7/18 - Modification chimique par des composés polymérisables en utilisant des ondes énergétiques ou le rayonnement de particules
B05D 3/06 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par exposition à des rayonnements
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
90.
SEMI-BRIGHT NICKEL PLATING BATH AND METHOD OF USING SAME
A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfateions; b) a soluble salt of chloroacetic acid, acetic acid, glycol acid or proprionic acid; and d) at least one diol selected from the group consisting of hexine diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range, it does not contain coumarin but produces desirable leveling characteristics. The bath requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.
A nickel-chromium alloy etching composition comprising sulfuric acid, a source of chloride ions, including hydrochloric acid or sodium, potassium or ammonium chloride, and a sulfur compound comprising a sulfur atom with an oxidation state between -2 to +5 such as thiosulfate, sulfide, sulfite, bisulfite, rnetabisulfite and phosphorus pentasulfide that can efficiently remove nickel-chromium alloy in the presence of copper circuits Is disclosed.
A nickel-chromium alloy etching composition comprising sulfuric acid, a source of chloride ions, including hydrochloric acid or sodium, potassium or ammonium chloride, and a sulfur compound comprising a sulfur atom with an oxidation state between −2 to +5, such as thiosulfate, sulfide, sulfite, bisulfite, metabisulfite and phosphorus pentasulfide that can efficiently remove nickel-chromium alloy in the presence of copper circuits is disclosed.
A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a chemical reducing agent. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact, without backside anodic corrosion and without the need for backside sacrificial material.
A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti -reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti -reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti-reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti-reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is elecrolessly plated.
The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is electrolessly plated.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
C23C 18/40 - Revêtement avec du cuivre en utilisant des agents réducteurs
98.
PROCESS FOR IMPROVING ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES
A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an aqueous acid post-dip composition to provide a micro-roughened surface. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.
B05D 3/10 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par d'autres moyens chimiques
99.
Process for improving adhesion of polymeric materials to metal surfaces
A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an aqueous acid post-dip composition to provide a micro-roughened surface. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.
The invention consists of a chromium electroplating solution comprising a chromium electroplating solution comprising: (1) a water soluble trivalent chromium salt; (2) at least one complexant for trivalent chromium ions; (3) a source of hydrogen ions sufficient to create a pH of from 2.8-4.2; (4) a pH buffering compound; and (5) a sulfur-containing organic compound. The chromium electroplating solution is usable in a method for producing an adherent metallic coating on a decorative article, such coating having enhanced resistance to corrosion in environments containing calcium chloride.
